CN212136270U - Low inductance power capacitor - Google Patents
Low inductance power capacitor Download PDFInfo
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- CN212136270U CN212136270U CN202020631488.9U CN202020631488U CN212136270U CN 212136270 U CN212136270 U CN 212136270U CN 202020631488 U CN202020631488 U CN 202020631488U CN 212136270 U CN212136270 U CN 212136270U
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Abstract
The utility model provides a low inductance power capacitor, this low inductance power capacitor includes: the capacitor comprises a capacitor core, a first bus bar and a second bus bar; the capacitor core is provided with a first end face and a second end face which are opposite; the first busbar is arranged on the first end face in a stacked mode and connected with the first end face, and a first leading-out terminal is arranged on the first busbar; the second busbar is overlapped on the first busbar and is connected with the second end face through a plurality of copper strips, a second leading-out terminal is arranged on the second busbar, and the plurality of copper strips are distributed at intervals along the circumferential direction of the capacitor core; an insulating layer is arranged between the first busbar and the second busbar for insulation, and the first leading-out terminal penetrates through the insulating layer to extend outwards and is flush with the second leading-out terminal. Therefore, the inductance is effectively reduced, the inductance value can be effectively reduced to be within 10nH, and further, a large-size low-inductance capacitor can be manufactured, and the performance requirement of a high-power converter can be met.
Description
Technical Field
The utility model relates to a technical field of condenser, in particular to low inductance power capacitor.
Background
With the increasing market demand for high-power converters, higher output current, higher output power and higher power density are required for the IGBT power units serving as the conversion tasks. In order to satisfy these performances of the high-power converter, the self-inductance of the dc support capacitor in the inverter is required to be as small as possible. The higher the switching frequency of the converter is, the higher the output current is, the higher the change rate of the current is; the larger the voltage induced on the dc bus bar. According to the formula, u-L-di/dt shows that the induction voltage of the converter under the conditions of large output current and high switching frequency is greatly reduced by improving the inductance value of the capacitor.
The capacitor core of the high-power electronic thin-film capacitor commonly used in the market at present adopts non-inductive winding, the self-inductance of the capacitor core group is extremely small, and the inductance of the core is difficult to reduce. The large core capacitor is formed by welding copper strip busbars, the self-inductance of the capacitor core is small, and the inductance of the whole capacitor mainly depends on the busbar and the copper strip inductance. However, the inductance of the busbar copper strip structure of the capacitor in the related art is still high.
SUMMERY OF THE UTILITY MODEL
The present invention aims at solving at least one of the technical problems in the above-mentioned technology to a certain extent. Therefore, an object of the present invention is to provide a low inductance power capacitor.
To achieve the above object, the present invention provides in one aspect a low inductance power capacitor, comprising:
the capacitor comprises a capacitor core, a first connecting piece and a second connecting piece, wherein the capacitor core is provided with a first end face and a second end face which are opposite;
the first busbar is arranged on the first end face in an overlapping mode and connected with the first end face, and a first leading-out terminal is arranged on the first busbar;
the second busbar is arranged on the first busbar in an overlapping mode and is connected with the second end face through a plurality of copper strips, a second leading-out terminal is arranged on the second busbar, and the copper strips are distributed at intervals along the circumferential direction of the capacitor core;
an insulating layer is arranged between the first busbar and the second busbar for insulation, and the first leading-out terminal penetrates through the insulating layer to extend outwards and is flush with the second leading-out terminal.
According to the utility model discloses a low inductance power capacitor, will just, the negative pole is drawn forth female row and is superposed about a terminal surface of condenser core, keep apart through insulating and carry out stack processing, offset current is through female parasitic inductance who arranges the positive and negative pole and produce, the copper strips dispersion overall arrangement who arranges is introduced to another terminal surface of condenser core simultaneously to effectively reduce the inductance, inductance value can effectively reduce within 10nH, and then can produce the condenser of the low inductance of jumbo size, can satisfy high power converter's performance requirement.
In addition, according to the present invention, the low inductance power capacitor provided by the above embodiments may further have the following additional technical features:
according to the utility model discloses an embodiment, the current direction of copper strips with the current direction of condenser core is opposite. Therefore, mutual inductance between the two can be counteracted, and inductance is reduced.
According to the utility model discloses an embodiment, the quantity of first leading-out terminal is two at least, the quantity of second leading-out terminal is two at least, the quantity of first leading-out terminal with the quantity of second leading-out terminal is the same.
According to the utility model discloses an embodiment, first leading-out terminal with the second leading-out terminal is two copper posts, and four copper post polarity central symmetry distribute and two copper post polarities at diagonal angle are the same. Whereby the inductance can be further reduced.
According to the utility model discloses an embodiment, the insulating layer extends to the metal spraying face of capacitor core is in order to incite somebody to action the copper strips insulates with the metal spraying face.
According to the utility model discloses an embodiment, first female arranging with female the arranging of second is red copper material.
According to the utility model discloses an embodiment, the copper strips is red copper material.
According to the utility model discloses an embodiment, the condenser core is formed by the metallized film winding.
According to the utility model discloses an embodiment, the condenser core with first female arranging with connecting position between the copper strips is soldering or heavy current welding.
According to the utility model discloses an embodiment, the condenser core includes a plurality of cores, and a plurality of cores stack or nested setting and pass through metal or alloy welding between the two adjacent cores.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
Fig. 1 is a schematic structural diagram of a low inductance power capacitor according to an embodiment of the present invention;
fig. 2 is a top view of a low inductance power capacitor according to one embodiment of the present invention;
fig. 3 is a bottom view of a low inductance power capacitor according to one embodiment of the present invention;
fig. 4 is a side view of a low inductance power capacitor according to one embodiment of the present invention;
description of reference numerals:
a low-inductance power capacitor 1;
a capacitor core 100, a first end face 101, a second end face 102;
a first busbar 200 and a first leading-out terminal 201;
a second busbar 300 and a second leading-out terminal 301;
a copper strip 400;
an insulating layer 500.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary and intended to be used for explaining the present invention, and should not be construed as limiting the present invention.
In order to better understand the above technical solutions, exemplary embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the invention are shown in the drawings, it should be understood that the invention can be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the invention to those skilled in the art.
The implementation of a low inductance power capacitor according to the present invention is described in detail below with reference to fig. 1-4.
According to the embodiment of the utility model provides a low inductance power capacitor 1, it includes that condenser core 100, first female row 200 and the female row 300 of second are arranged.
Specifically, the capacitor core 100 has a first end face 101 and a second end face 102 opposed to each other; the first busbar 200 is arranged on the first end face 101 in a stacked mode and connected with the first end face 101, and a first leading-out terminal 201 is arranged on the first busbar 200; the second busbar 300 is overlapped on the first busbar 200 and is connected with the second end surface 102 through a plurality of copper strips 400, a second leading-out terminal 301 is arranged on the second busbar 300, and the plurality of copper strips 400 are distributed at intervals along the circumferential direction of the capacitor core 100; an insulating layer 500 is arranged between the first busbar 200 and the second busbar 300 for insulation, and the first leading-out terminal 201 penetrates through the insulating layer 500 to extend outwards and is flush with the second leading-out terminal 302.
Wherein, it is understood that the first end face 101 may be an upper end face of the capacitor core 100, and the second end face 102 may be a lower end face of the capacitor core 100; the first end face 101, the first busbar 200 and the second busbar 300 are sequentially stacked from bottom to top.
Therefore, according to the utility model discloses a power capacitor 1, female total two of arranging, above that each distributes and have the leading-out terminal, wherein the female terminal 200 setting of arranging of first wherein has laid insulating layer 500 on the up end of condenser core 100, and the female row 300 of second is folded on insulating layer 500 to connect the female row 300 of second through a plurality of copper strips 400 one end, the lower terminal surface of condenser core 100 is connected to the other end, makes two female two leading-out terminals of arranging flush and relative position fixed. Thus, the inductance of the capacitor core 100 is small, and the inductance of the copper tape 400 is reduced because of the parallel connection relationship although the single inductance is not small. The inductance of the busbar can be regarded as that the bottom circular busbar inductance and the leading-out terminal inductance are connected in series, the bottom circular busbar is large in diameter, small in thickness and small in inductance value, the positive and negative poles of the leading-out terminal are on the same plane, the inductance is mutually offset, the inductance is reduced integrally, the inductance is effectively reduced, the inductance value can be effectively reduced to be within 10nH, a capacitor with large size and low inductance can be manufactured, and the performance requirement of a high-power converter can be met.
In some examples, the direction of current flow for copper tape 400 is opposite to the direction of current flow for capacitor core 100. Although the current flow through each copper strip 400 is co-directional, since the plurality of copper strips 400 are spaced apart, the self-inductance caused by the mutual inductance between the copper strips 400 is not increased much, and the direction of the current flow through the copper strips 400 is opposite to the direction of the current flow through the capacitor core 100, thereby canceling the mutual inductance therebetween and further reducing the inductance.
In some examples, the number of the first outgoing terminals 201 is at least two, the number of the second outgoing terminals 301 is at least two, and the number of the first outgoing terminals 201 is the same as the number of the second outgoing terminals 301. Thus, the inductance can be further reduced by connecting at least two lead-out terminals in parallel on the same electrode.
Optionally, the first leading-out terminal 201 and the second leading-out terminal 301 are both two copper cylinders, and polarities of the four copper cylinders are distributed in a central symmetry manner, and polarities of two diagonal copper cylinders are the same. Whereby the inductance can be further reduced.
In some examples, insulation layer 500 extends to the gold sprayed surface of capacitor core 100 to insulate copper tape 400 from the gold sprayed surface. Therein, it is understood that the copper strip 400 is vertically disposed, and the top and the bottom thereof are bent to form a connecting portion for connecting the second busbar 300 and the second end face 102, respectively. At the first end face, the capacitor core 100 is provided with a gold-sprayed surface from which the copper tape 400 is insulated by extending the insulating layer 500.
Alternatively, copper strip 400 is a red copper material. Of course, in other examples, the copper strip 400 may be made of a metal or alloy material with high conductivity.
Optionally, the first busbar 200 and the second busbar 300 are made of red copper material. Of course, in other examples, the first busbar 200 and the second busbar 300 may also be made of metal or alloy material with higher conductivity.
In addition, the capacitor core 100 may be wound of a metallized film so that the inductance of the capacitor core itself is small. Or the core structure can also comprise a plurality of cores which are overlapped or arranged, and two adjacent cores are welded by metal or alloy.
In some examples, the connection points between the capacitor core 100 and the first busbar 200 and the copper strips 400 are soldered or welded with a high current. That is, the connection portion of the capacitor core 100 and the copper strip 400, the connection portion of the capacitor core 100 and the first busbar 200, the connection portion of the second busbar 300 and the copper strip 400, the connection portion of the first busbar 200 and the first lead-out terminal 201, and the connection portion of the second busbar 300 and the second lead-out terminal 301 are all connected by soldering or high-current welding.
In some examples, the power capacitor 1 may or may not use an end cap, when using an end cap, the purpose is to position four leading-out terminals, and to fix the distance between the terminals, the relative positions of the terminals and the housing mounting holes, and the heights of the terminals relative to the housing edges; for example, the end cap is cross-shaped (if the number of terminals is increased, the structure is adjusted accordingly), each branch is provided with a through hole for positioning a copper column, the through holes are symmetrically distributed, the copper columns led out by the two transverse through holes are one pole, and the copper columns led out by the two vertical through holes are the other pole. If the end cover is not used, the tool is used for positioning when the product is packed and encapsulated, and the product is disassembled after being solidified.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and to simplify the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above should not be understood to necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples described in this specification can be combined and combined by those skilled in the art.
Although embodiments of the present invention have been shown and described, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and that variations, modifications, substitutions and alterations can be made to the above embodiments by those of ordinary skill in the art without departing from the scope of the present invention.
Claims (10)
1. A low inductance power capacitor, comprising:
the capacitor comprises a capacitor core, a first connecting piece and a second connecting piece, wherein the capacitor core is provided with a first end face and a second end face which are opposite;
the first busbar is arranged on the first end face in an overlapping mode and connected with the first end face, and a first leading-out terminal is arranged on the first busbar;
the second busbar is arranged on the first busbar in an overlapping mode and is connected with the second end face through a plurality of copper strips, a second leading-out terminal is arranged on the second busbar, and the copper strips are distributed at intervals along the circumferential direction of the capacitor core;
an insulating layer is arranged between the first busbar and the second busbar for insulation, and the first leading-out terminal penetrates through the insulating layer to extend outwards and is flush with the second leading-out terminal.
2. A low inductance power capacitor as claimed in claim 1, wherein the direction of current flow of said copper tape is opposite to the direction of current flow of said capacitor core.
3. The low inductance power capacitor as claimed in claim 1, wherein the number of the first outgoing terminals is at least two, the number of the second outgoing terminals is at least two, and the number of the first outgoing terminals is the same as the number of the second outgoing terminals.
4. The low inductance power capacitor of claim 3, wherein the first outgoing terminal and the second outgoing terminal are both two copper cylinders, four copper cylinders have polarities distributed centrosymmetrically, and two diagonal copper cylinders have the same polarity.
5. A low inductance power capacitor as claimed in claim 1, wherein said insulating layer extends to the gold sprayed surface of said capacitor core to insulate said copper tape from the gold sprayed surface.
6. The low inductance power capacitor according to any one of claims 1-5, wherein the first busbar and the second busbar are a copper material.
7. A low inductance power capacitor as claimed in any one of claims 1-5, wherein said copper tape is a copper material.
8. A low inductance power capacitor as claimed in claim 1, wherein said capacitor core is wound from a metallized film.
9. The low inductance power capacitor of claim 1, wherein the connection between said capacitor core and said first busbar and said copper strips is by soldering or high current welding.
10. A low inductance power capacitor as claimed in claim 1, wherein said capacitor core comprises a plurality of cores, said plurality of cores being stacked or nested and two adjacent cores being welded together by a metal or alloy.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020631488.9U CN212136270U (en) | 2020-04-23 | 2020-04-23 | Low inductance power capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020631488.9U CN212136270U (en) | 2020-04-23 | 2020-04-23 | Low inductance power capacitor |
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| CN212136270U true CN212136270U (en) | 2020-12-11 |
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| CN202020631488.9U Active CN212136270U (en) | 2020-04-23 | 2020-04-23 | Low inductance power capacitor |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116798773A (en) * | 2023-08-10 | 2023-09-22 | 上海工程技术大学 | Annular distribution core low inductance capacitor |
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2020
- 2020-04-23 CN CN202020631488.9U patent/CN212136270U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116798773A (en) * | 2023-08-10 | 2023-09-22 | 上海工程技术大学 | Annular distribution core low inductance capacitor |
| CN116798773B (en) * | 2023-08-10 | 2024-03-29 | 上海工程技术大学 | Annular distribution core low inductance capacitor |
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