CN212108612U - Floor heating device - Google Patents
Floor heating device Download PDFInfo
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- CN212108612U CN212108612U CN202020603725.0U CN202020603725U CN212108612U CN 212108612 U CN212108612 U CN 212108612U CN 202020603725 U CN202020603725 U CN 202020603725U CN 212108612 U CN212108612 U CN 212108612U
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Abstract
The utility model discloses a warm up device relates to and warms up heat transfer technical field. This floor heating device includes: the heat insulation plate comprises a heat insulation plate body, a temperature adjusting pipe and a heat conduction layer, wherein a mounting groove is formed in the heat insulation plate body, the heat conduction layer comprises a first heat conduction layer and a second heat conduction layer, the first heat conduction layer is arranged on the surface of the heat insulation plate body, the mounting groove is formed in the heat insulation plate body, the temperature adjusting pipe is arranged in the mounting groove, the second heat conduction layer is arranged on the first heat conduction layer and the temperature adjusting pipe, and the first heat conduction layer and the second heat conduction layer jointly and completely wrap. Because first heat-conducting layer and second heat-conducting layer wrap the pipe that adjusts the temperature jointly completely, increased the area of contact between heat-conducting layer and the pipe that adjusts the temperature to improve the heat transfer efficiency between heat-conducting layer and the pipe that adjusts the temperature, the part that the heat-conducting layer contacted with the pipe that adjusts the temperature can be fast evenly with the heat conduction that the pipe that adjusts the temperature gived off to whole heat-conducting layer, and then make floor heating device have higher heat conduction efficiency.
Description
Technical Field
The utility model relates to a warm up heat transfer technical field, especially relate to a warm up device.
Background
The geothermal heating is called low-temperature floor radiation heating for short, floor heating for short, and is a heating mode that hot water with the temperature not higher than 60 ℃ is used as a heating medium and circularly flows in a temperature adjusting pipe to heat the ground, and the ground supplies heat to the indoor in a radiation and convection conduction mode. Compared with an overground radiator set adopting a convection heat transfer mode for heat supply, the geothermal heating has the characteristics of high comfort level, energy conservation and small occupied indoor space, and therefore, the geothermal heating has wide development and application prospects.
Geothermal heating needs to lay ground heating installation in the below ground, and wherein, ground heating installation generally includes heat insulating board, the pipe and the heat-conducting layer of adjusting the temperature, as shown in fig. 1, has seted up mounting groove 11 on the heat insulating board, and the pipe that adjusts the temperature sets up in mounting groove 11, and the heat-conducting layer setting is seted up the one side of mounting groove 11 on the heat insulating board, and the heat-conducting layer contacts with the pipe that adjusts the temperature, and the pipe that adjusts the temperature leads the heat to ground.
The general temperature-adjusting pipe needs to be laid in a heat-insulating plate in a winding manner, and accordingly, as shown in fig. 1, a winding mounting groove 11 matched with the shape of the temperature-adjusting pipe is formed on the heat-insulating plate. Traditional heat-conducting layer is metal foil or non-metal foil, and general heat-conducting layer tiling is seted up mounting groove 11 at the heat insulating board on the surface, and the heat-conducting layer only contacts with the global top of the pipe that adjusts the temperature, and area of contact is less, and the space that exists between the pipe and the heat-conducting layer that adjust the temperature is too big, leads to adjusting the temperature to lead to heat transfer efficiency between pipe and the heat-conducting layer lower, and then leads to floor heating device heat conduction efficiency.
Therefore, there is a need for a floor heating apparatus that solves the above problems.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a ground heating device, this ground heating device have higher heat conduction efficiency.
To achieve the purpose, the utility model adopts the following technical proposal:
a floor heating device, the floor heating device comprising:
the heat insulation plate is provided with an installation groove;
the heat insulation plate comprises a heat insulation plate and a temperature adjusting pipe, wherein the heat insulation plate is provided with a mounting groove, the temperature adjusting pipe is arranged in the mounting groove, and the temperature adjusting pipe is arranged in the mounting groove;
the second heat conduction layer is arranged on the first heat conduction layer and the temperature adjusting pipe, and the first heat conduction layer and the second heat conduction layer completely wrap the temperature adjusting pipe together.
Preferably, the floor heating device further comprises:
the vapor chamber is arranged above the second heat conduction layer, and the lower surface of the vapor chamber is in contact with the upper surface of the second heat conduction layer.
Preferably, the upper surface of the second heat conducting layer is planar.
Preferably, the compressive strength of the soaking plate is not lower than 100 kPa.
Preferably, the floor heating device further comprises:
the reflecting film is arranged between the first heat conduction layer and the heat insulation plate.
Preferably, the thickness of the first heat conducting layer ranges from 0.5mm to 1 mm.
Preferably, the thickness of the second heat conducting layer on the first heat conducting layer is in the range of 0.5mm-1 mm.
Preferably, the thermal conductivity of the first thermally conductive layer is not less than 35W/(m × K).
Preferably, the thermal conductivity of the second thermally conductive layer is not less than 35W/(m × K).
Preferably, the heat insulation board is a polystyrene foam board.
The beneficial effects of the utility model reside in that:
the utility model provides a floor heating device, because first heat-conducting layer and the common complete cladding of second heat-conducting layer temperature regulation pipe have increased the area of contact between heat-conducting layer and the temperature regulation pipe to improve the heat transfer efficiency between heat-conducting layer and the temperature regulation pipe, the heat conduction that the part of heat-conducting layer and the temperature regulation pipe contacted can be fast with the heat conduction that the temperature regulation pipe gived off to whole heat-conducting layer evenly, and then make floor heating device have higher heat conduction efficiency.
Drawings
Fig. 1 is a schematic view of a partial structure of a floor heating device in the prior art;
fig. 2 is the embodiment of the utility model provides a floor heating device's schematic structure diagram.
1-a heat insulation plate; 11-mounting grooves; 2-a temperature adjusting pipe; 3-heat conducting layer; 31-a first thermally conductive layer; 32-a second thermally conductive layer; 4-soaking plate.
Detailed Description
In order to make the technical problem solved by the present invention, the technical solution adopted by the present invention and the technical effect achieved by the present invention clearer, the technical solution of the present invention will be further explained by combining the drawings and by means of the specific implementation manner.
In the description of the present invention, unless expressly stated or limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, e.g., as meaning permanently connected, detachably connected, or integral to one another; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
In the description of the present embodiment, the terms "upper", "lower", "right", etc. are used in an orientation or positional relationship based on that shown in the drawings only for convenience of description and simplicity of operation, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used only for descriptive purposes and are not intended to have a special meaning.
An embodiment of the utility model provides a floor heating device, as shown in fig. 2, this floor heating device includes heat insulating board 1, temperature adjusting pipe 2 and heat-conducting layer 3. Wherein, the heat insulating board 1 is used for the separation to adjust the temperature the heat of pipe 2 and to the below ground transmission, the mounting groove 11 has been seted up on the heat insulating board 1, adjust the temperature pipe 2 and set up in mounting groove 11, heat-conducting layer 3 includes first heat-conducting layer 31 and second heat-conducting layer 32, first heat-conducting layer 31 sets up on the heat insulating board 1 sets up the mounting groove 11 on the surface (this surface includes the internal surface of mounting groove 11), second heat-conducting layer 32 sets up on first heat-conducting layer 31 and adjust the temperature pipe 2, and second heat-conducting layer 32 and first heat-conducting layer 31 wrap up adjust the temperature.
Because first heat-conducting layer 31 and second heat-conducting layer 32 wrap temperature adjusting pipe 2 jointly completely, increased the area of contact between heat-conducting layer 3 and the temperature adjusting pipe 2 to improve the heat transfer efficiency between heat-conducting layer 3 and the temperature adjusting pipe 2, the part of heat-conducting layer 3 that contacts with temperature adjusting pipe 2 can be fast evenly with the heat conduction to whole heat-conducting layer 3 that the temperature adjusting pipe 2 gived off, and then make floor heating device have higher heat conduction efficiency.
Specifically, the mounting groove 11 is formed in the upper surface of the heat insulation plate 1, the opening of the mounting groove 11 is upward, and the heat insulation plate 1 has the effect of blocking heat, so that the heat emitted downwards by the heat conduction layer 3 is blocked by the heat insulation plate 1, the heat conduction layer 3 is prevented from transmitting part of heat to the ground below to cause heat loss of the part of heat, and the heat of the heat conduction layer 3 can be transmitted only along the heat conduction layer 3 and to the upper side of the heat conduction layer 3. It should be noted that the heat insulation board 1 may be a polystyrene foam board, or may be a plate made of other materials, as long as the heat insulation board 1 can prevent heat from being transferred to the ground.
In addition, in order to further obstruct the heat from transferring to the ground surface and improve the utilization efficiency of the floor heating device to the heat emitted by the temperature adjusting pipe 2, the floor heating device further comprises a reflecting film (not shown in fig. 2). The reflective film is laid on the surface of the heat insulation board 1 provided with the mounting groove 11, the reflective film is located between the first heat conduction layer 31 and the heat insulation board 1, and the reflective film is used for reflecting heat. Most of heat that heat-conducting layer 3 gived off downwards can receive the reflection of reflectance coating and upwards transmit, has avoided the thermal loss of this part, has improved floor heating device's heat utilization ratio. The reflective film may be a bubble mat aluminized reflective film or a specular reflective film, and is not limited herein.
Preferably the thickness of the first layer 31 is in the range 0.5mm to 1mm, preferably 0.8 mm. If the thickness of the first heat conduction layer 31 is larger than 1mm, the heat conduction time is increased, and the heat conduction efficiency of the floor heating device is reduced; if the thickness of the first heat conduction layer 31 is smaller than 0.5mm, the processing difficulty of the first heat conduction layer 31 is increased, the processed first heat conduction layer 31 is easily discontinuous, the defective rate is increased, and the production cost of the floor heating device is increased.
Further, the thickness of the second layer 32 above the first layer 31 is in the range of 0.5mm to 1mm, preferably 0.8 mm. If the thickness of this part second heat-conducting layer 32 is greater than 1mm, can increase the heat conduction time, cause floor heating device heat conduction efficiency to reduce. If the thickness of the second heat conduction layer 32 is smaller than 0.5mm, the processed second heat conduction layer 32 is easily discontinuous, the defective rate is increased, and the production cost of the floor heating device is increased.
Note that, in order to allow the heat conductive layer 3 to conduct heat quickly, the heat conductivity of the first heat conductive layer 31 is not less than 35W/(m × K), and the heat conductivity of the second heat conductive layer 32 is not less than 35W/(m × K).
In addition, the floor heating device also comprises a soaking plate 4. The lower surface of the soaking plate 4 is in contact with the upper surface of the second heat conductive layer 32. Through setting up soaking board 4 in second heat-conducting layer 32 top, avoided making heat-conducting layer 3 receive the extrusion because of floor heating device receives the extrusion or strikes, lead to the degree of consistency of heat-conducting layer 3 to be destroyed, also avoided simultaneously that temperature adjusting pipe 2 receives the extrusion or strikes and take place to damage, guarantee that heat-conducting layer 3 conducts to the heat of soaking board 4 more even of transmission on soaking board 4 for floor heating device dispels the heat more evenly.
In order to ensure good compression resistance of the soaking plate, the compression strength of the soaking plate 4 is not lower than 100 kPa. Specifically, the soaking plate 4 may be a aventurine plate, a calcium silicate plate, a fiber plate, or a gypsum plate, and is not limited thereto.
In order to uniformly conduct the heat of the second heat conduction layer 32 to the soaking plate 4, the surface of the second heat conduction layer 32 contacting with the soaking plate 4 is a plane.
The heat transfer process of the floor heating device in this embodiment is as follows:
the heat that the pipe 2 gived off adjusts the temperature conducts to the heat-conducting layer 3 with the part that adjusts the temperature pipe 2 and contact, then the heat-conducting layer 3 with the part that adjusts the temperature pipe 2 and contact with the heat conduct heat to whole heat-conducting layer 3 fast evenly, heat-conducting layer 3 with heat conduction to soaking plate 4, the heat evenly spreads then conduction to ground on soaking plate 4.
The above description is only for the preferred embodiment of the present invention, and for those skilled in the art, there are variations on the detailed description and the application scope according to the idea of the present invention, and the content of the description should not be construed as a limitation to the present invention.
Claims (10)
1. The utility model provides a floor heating device which characterized in that, floor heating device includes:
the heat insulation plate (1) is provided with a mounting groove (11);
the temperature adjusting pipe (2) and the heat conducting layer (3), wherein the heat conducting layer (3) comprises a first heat conducting layer (31) and a second heat conducting layer (32), the first heat conducting layer (31) is arranged on the surface, provided with the mounting groove (11), of the heat insulating plate (1), and the temperature adjusting pipe (2) is arranged in the mounting groove (11) provided with the first heat conducting layer (31);
the second heat conducting layer (32) is arranged on the first heat conducting layer (31) and the temperature adjusting pipe (2), and the first heat conducting layer (31) and the second heat conducting layer (32) completely wrap the temperature adjusting pipe (2) together.
2. The floor heating apparatus of claim 1, further comprising:
the vapor chamber (4) is arranged above the second heat conduction layer (32), and the lower surface of the vapor chamber (4) is in contact with the upper surface of the second heat conduction layer (32).
3. A floor heating device as claimed in claim 2, characterized in that the upper surface of the second heat conducting layer (32) is plane.
4. Floor heating according to claim 3, characterized in that the compressive strength of the soaking plate (4) is not lower than 100 kPa.
5. The floor heating apparatus of claim 1, further comprising:
a reflective film disposed between the first thermally conductive layer (31) and the thermal shield (1).
6. A floor heating device as claimed in claim 1, characterized in that the thickness of the first heat conducting layer (31) ranges from 0.5mm to 1 mm.
7. A floor heating device as claimed in claim 1, characterized in that the thickness of the second heat conducting layer (32) on the first heat conducting layer (31) is in the range of 0.5-1 mm.
8. A floor heating device according to claim 1, characterized in that the thermal conductivity of the first heat conducting layer (31) is not less than 35W/(m x K).
9. A floor heating device as claimed in claim 1, characterized in that the thermal conductivity of the second heat conducting layer (32) is not less than 35W/(m x K).
10. A floor heating device as claimed in claim 1, characterized in that the heat insulation board (1) is a polystyrene foam board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020603725.0U CN212108612U (en) | 2020-04-21 | 2020-04-21 | Floor heating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020603725.0U CN212108612U (en) | 2020-04-21 | 2020-04-21 | Floor heating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN212108612U true CN212108612U (en) | 2020-12-08 |
Family
ID=73640298
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020603725.0U Active CN212108612U (en) | 2020-04-21 | 2020-04-21 | Floor heating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN212108612U (en) |
-
2020
- 2020-04-21 CN CN202020603725.0U patent/CN212108612U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Hebei Chunyuan new clean heating technology Co.,Ltd. Assignor: Shengchun Radiator Co.,Ltd. Contract record no.: X2022990000706 Denomination of utility model: A floor heating device Granted publication date: 20201208 License type: Common License Record date: 20220923 Assignee: Hebei Sanofi heating equipment Co.,Ltd. Assignor: Shengchun Radiator Co.,Ltd. Contract record no.: X2022990000705 Denomination of utility model: A floor heating device Granted publication date: 20201208 License type: Common License Record date: 20220923 Assignee: Hebei Shengli Casting Co.,Ltd. Assignor: Shengchun Radiator Co.,Ltd. Contract record no.: X2022990000707 Denomination of utility model: A floor heating device Granted publication date: 20201208 License type: Common License Record date: 20220923 |
|
| EE01 | Entry into force of recordation of patent licensing contract | ||
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: HEBEI CHUNFENG HEATING EQUIPMENT CO.,LTD. Assignor: Shengchun Radiator Co.,Ltd. Contract record no.: X2022980018249 Denomination of utility model: A floor heating device Granted publication date: 20201208 License type: Common License Record date: 20221017 |
|
| EE01 | Entry into force of recordation of patent licensing contract |