CN212086748U - Server cabinet heat dissipation system - Google Patents
Server cabinet heat dissipation system Download PDFInfo
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- CN212086748U CN212086748U CN201922230806.0U CN201922230806U CN212086748U CN 212086748 U CN212086748 U CN 212086748U CN 201922230806 U CN201922230806 U CN 201922230806U CN 212086748 U CN212086748 U CN 212086748U
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 25
- 238000001816 cooling Methods 0.000 claims abstract description 35
- 239000004065 semiconductor Substances 0.000 claims abstract description 33
- HEZMWWAKWCSUCB-PHDIDXHHSA-N (3R,4R)-3,4-dihydroxycyclohexa-1,5-diene-1-carboxylic acid Chemical compound O[C@@H]1C=CC(C(O)=O)=C[C@H]1O HEZMWWAKWCSUCB-PHDIDXHHSA-N 0.000 claims description 9
- 239000003990 capacitor Substances 0.000 claims description 9
- 238000004146 energy storage Methods 0.000 claims description 9
- 238000010248 power generation Methods 0.000 claims description 8
- 230000000087 stabilizing effect Effects 0.000 claims description 6
- 230000007547 defect Effects 0.000 abstract description 3
- 230000004044 response Effects 0.000 abstract description 3
- 238000006243 chemical reaction Methods 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 3
- 230000006641 stabilisation Effects 0.000 description 3
- 238000011105 stabilization Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000005265 energy consumption Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000002918 waste heat Substances 0.000 description 2
- 238000004378 air conditioning Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
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Abstract
The utility model provides a server rack cooling system, the utility model discloses a to conventional fan cooling server rack introduction semiconductor thermoelectric generation cooling system, utilize semiconductor thermoelectric generation piece with CPU's heat conversion electric energy, be the power supply of semiconductor thermoelectric generation fan again, dispel the heat to server fin and the inside air of server, there are server fan cooling group and semiconductor thermoelectric generation cooling system simultaneously in the server, both collaborative work, effectively solve the server heat dissipation and rely on server fan cooling group to carry out radiating limitation completely, the power loss of server fan cooling group has been reduced, compensate the poor defect of semiconductor thermoelectric generation piece dynamic response, carry out reutilization to used heat, practice thrift the electric energy, and the heat-radiating efficiency is improved.
Description
Technical Field
The utility model relates to a server heat dissipation technical field, especially a server rack cooling system.
Background
Along with the development of novel internet technologies such as cloud computing, AI intelligence, big data, higher requirement has been put forward to the performance of server, promotes server power and server density greatly under this kind of high requirement, and then brings thermal increase and radiating degree of difficulty.
In order to ensure the normal operation of the server, the server needs to be cooled. Usually, an air convection heat dissipation mode is adopted, and the heat generated by devices is taken away by utilizing the air flow generated by a high-speed fan, so that the air temperature in the server is reduced, and the normal long-time work of the server is guaranteed. The server mainly comprises a Central Processing Unit (CPU), a radiator is arranged at the top end of the CPU, a server fan radiating group is arranged at the tail end of the server, and heat of radiating fins on the CPU and other heating devices is taken away through air flow brought by the server fan radiating group.
However, the heat taken away by the server in the manner of obtaining the air convection heat dissipation is waste heat which is not utilized, and the waste heat needs to be cooled again by an air conditioning system of an external server room, which indirectly causes additional electric energy consumption.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a server rack cooling system, aim at solving among the prior art server heat dissipation and have the problem that used heat can not the reutilization lead to the energy consumption to increase, realize carrying out reutilization to used heat, practice thrift the electric energy, improve the radiating efficiency.
In order to achieve the above technical purpose, the utility model provides a server rack cooling system, the system includes:
the temperature difference power generation module and the temperature difference power generation cooling fan module are arranged on the heat sink;
the hot end of the thermoelectric generation module is arranged at the bottom of a CPU radiating fin, the cold end of the thermoelectric generation module is arranged on a server radiating pipe base, and the thermoelectric generation radiating fan module is arranged on the radiating pipe base;
the electric energy for driving the thermoelectric generation cooling fan module to work comes from the electric energy generated by the temperature difference between the hot end and the cold end of the thermoelectric generation module.
Preferably, the thermoelectric generation module is a semiconductor thermoelectric generation sheet.
Preferably, the thermoelectric generation radiator fan module includes wire, super capacitor energy storage module, DCDC voltage stabilizing module, fan and fin, the wire is used for connecting semiconductor thermoelectric generation piece and super capacitor energy storage module, and super capacitor energy storage module is connected to DCDC voltage stabilizing module input again, and DCDC voltage stabilizing module output is connected to the fan.
The effects provided in the contents of the present invention are only the effects of the embodiments, not all the effects of the present invention, and one of the above technical solutions has the following advantages or advantageous effects:
compared with the prior art, the utility model discloses a to conventional fan cooling server rack introduction semiconductor thermoelectric generation cooling system, utilize semiconductor thermoelectric generation piece with CPU's heat transformation electric energy, be the power supply of semiconductor thermoelectric generation fan again, dispel the heat to server fin and the inside air of server, there are server fan cooling group and semiconductor thermoelectric generation cooling system simultaneously in the server, both collaborative work, effectively solve the server heat dissipation and rely on server fan cooling group to carry out radiating limitation completely, the power loss of server fan cooling group has been reduced, compensate the poor defect of semiconductor thermoelectric generation piece dynamic response, carry out reutilization to used heat, save the electric energy, and the heat dissipation efficiency is improved.
Drawings
Fig. 1 is a schematic diagram of a system architecture of a server cabinet heat dissipation system provided in an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a thermoelectric generation heat dissipation fan module provided in an embodiment of the present invention.
Detailed Description
In order to clearly illustrate the technical features of the present invention, the present invention is explained in detail by the following embodiments in combination with the accompanying drawings. The following disclosure provides many different embodiments, or examples, for implementing different features of the invention. In order to simplify the disclosure of the present invention, the components and arrangements of specific examples are described below. Furthermore, the present invention may repeat reference numerals and/or letters in the various examples. This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. It should be noted that the components illustrated in the figures are not necessarily drawn to scale. Descriptions of well-known components and processing techniques and processes are omitted so as to not unnecessarily limit the invention.
The following describes a server cabinet heat dissipation system provided by an embodiment of the present invention in detail with reference to the accompanying drawings.
As shown in fig. 1, the utility model discloses a server rack cooling system, the system includes:
the temperature difference power generation module and the temperature difference power generation cooling fan module are arranged on the heat sink;
the hot end of the thermoelectric generation module is arranged at the bottom of a CPU radiating fin, the cold end of the thermoelectric generation module is arranged on a server radiating pipe base, and the thermoelectric generation radiating fan module is arranged on the radiating pipe base;
the electric energy for driving the thermoelectric generation cooling fan module to work comes from the electric energy generated by the temperature difference between the hot end and the cold end of the thermoelectric generation module.
The embodiment of the utility model provides an in, the preferred semiconductor thermoelectric generation piece of thermoelectric generation module.
The embodiment of the utility model provides an in server cooling system increases semiconductor thermoelectric generation cooling system on the basis of original server fan cooling group, constitutes the return circuit through setting up two kinds of different conductors, if the temperature that two nodes are located is different, will have the electromotive force to exist in the return circuit, forms the electric current.
Install semiconductor thermoelectric generation piece hot junction in CPU's fin bottom, semiconductor thermoelectric generation piece cold junction is installed on server cooling tube base, cooling tube base top is semiconductor thermoelectric generation radiator fan module, the mechanical energy of semiconductor thermoelectric generation radiator fan module comes from the electric energy of semiconductor thermoelectric generation piece, the inside heat of server is taken away in the rotation through the fan, also dispel the heat and cool down to the self fin of semiconductor thermoelectric generation radiator fan module simultaneously, guarantee the temperature difference of semiconductor thermoelectric generation piece cold junction temperature and hot junction temperature, make the semiconductor thermoelectric generation piece be in and last the generating state.
As shown in fig. 2, the thermoelectric generation cooling fan module includes a wire, a super capacitor energy storage module, a DCDC voltage stabilization module, a fan and a heat sink, the wire is used for connecting the semiconductor thermoelectric generation chip and the super capacitor energy storage module, the super capacitor energy storage module is connected to the input end of the DCDC voltage stabilization module, the output end of the DCDC voltage stabilization module is connected to the fan, and the fan airflow deviates from the heat sink and takes away the heat of the heat sink.
When the server is started, the server fan heat dissipation group is firstly opened and is in a normal rotating speed state, so that the heat dissipation conditions of heating devices such as a CPU (central processing unit) and the like are ensured, and the basic operating environment temperature of the server is good.
When the server runs to the CPU, the heat productivity is high, the temperature difference between the hot end and the cold end of the semiconductor thermoelectric generation sheet is enough to enable the semiconductor thermoelectric generation sheet to generate electricity and enable the fan to rotate, the fan can drive the air in the server to flow after rotating, the interior of the server is cooled, and the fan heat dissipation group of the server enters a low-rotation-speed state or a stop state at the moment, so that the loss of an input power supply is reduced.
If the server generates heat temporarily or suddenly seriously and the heat dissipation capacity of the temperature difference power generation heat dissipation fan module to the server is insufficient, the server fan heat dissipation group enters a normal rotating speed state or a high speed state from a low-speed running state or a stop state, so that the server is ensured to work normally under the condition of sudden temperature rise; if the server is changed to normal due to temporary or sudden heating, the server fan heat dissipation set enters a low-speed state or a stop state from a normal-speed state or a high-speed state.
When the server is shut down, the server fan heat dissipation group enters a low-speed running state, the semiconductor thermoelectric generation piece gradually enters a power generation stopping state due to the fact that the CPU stops generating heat and the temperature difference between the cold end and the hot end is reduced, and when the temperature of the server is reduced to the safe environment temperature or the server fan heat dissipation group runs for a preset delay time, the server fan heat dissipation group also enters a stop state.
The embodiment of the utility model provides a through to conventional fan cooling server rack introduction semiconductor thermoelectric generation cooling system, utilize semiconductor thermoelectric generation piece to turn into the electric energy with CPU's heat, be semiconductor thermoelectric generation fan power supply again, dispel the heat to server fin and the inside air of server, there are server fan cooling group and semiconductor thermoelectric generation cooling system simultaneously in the server, both collaborative work, effectively solve the server heat dissipation and rely on server fan cooling group to carry out radiating limitation completely, the power loss of server fan cooling group has been reduced, compensate the poor defect of semiconductor thermoelectric generation piece dynamic response, carry out reutilization to used heat, the electric energy is saved, and the heat dissipation efficiency is improved.
The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, as any modifications, equivalents, improvements and the like made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.
Claims (2)
1. A server cabinet heat dissipation system, the system comprising:
the temperature difference power generation module and the temperature difference power generation cooling fan module are arranged on the heat sink;
the hot end of the thermoelectric generation module is arranged at the bottom of a CPU radiating fin, the cold end of the thermoelectric generation module is arranged on a server radiating pipe base, and the thermoelectric generation radiating fan module is arranged on the radiating pipe base;
the thermoelectric generation radiator fan module includes wire, super capacitor energy storage module, DCDC voltage stabilizing module, fan and fin, the wire is used for connecting semiconductor thermoelectric generation piece and super capacitor energy storage module, and super capacitor energy storage module is connected to DCDC voltage stabilizing module input again, and DCDC voltage stabilizing module output is connected to the fan.
2. The server cabinet cooling system of claim 1, wherein the thermoelectric generation module is a semiconductor thermoelectric generation sheet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922230806.0U CN212086748U (en) | 2019-12-12 | 2019-12-12 | Server cabinet heat dissipation system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922230806.0U CN212086748U (en) | 2019-12-12 | 2019-12-12 | Server cabinet heat dissipation system |
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| Publication Number | Publication Date |
|---|---|
| CN212086748U true CN212086748U (en) | 2020-12-04 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922230806.0U Active CN212086748U (en) | 2019-12-12 | 2019-12-12 | Server cabinet heat dissipation system |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118131873A (en) * | 2024-04-29 | 2024-06-04 | 苏州元脑智能科技有限公司 | Outdoor server heat abstractor and outdoor server |
-
2019
- 2019-12-12 CN CN201922230806.0U patent/CN212086748U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118131873A (en) * | 2024-04-29 | 2024-06-04 | 苏州元脑智能科技有限公司 | Outdoor server heat abstractor and outdoor server |
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