CN212030792U - Steel rail stress change monitoring and compensating module - Google Patents

Steel rail stress change monitoring and compensating module Download PDF

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Publication number
CN212030792U
CN212030792U CN202021051637.0U CN202021051637U CN212030792U CN 212030792 U CN212030792 U CN 212030792U CN 202021051637 U CN202021051637 U CN 202021051637U CN 212030792 U CN212030792 U CN 212030792U
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chip
pin
temperature acquisition
tantalum capacitor
capacitor
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李志广
蔡小勇
宁寰宇
陈超
雷杨
沈奇昌
都丽娟
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Shenyang Railway Signal Co Ltd
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Shenyang Railway Signal Co Ltd
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Abstract

The utility model discloses a rail stress variation monitoring compensation module, include: the temperature acquisition device comprises a main body structure, a double-shaft strain gauge, a temperature acquisition chip and an isolation circuit; the major structure adopts the steel preparation with the same material of rail, through in thin copper sheet deformation after welded fastening to gathering node box, the biax foil gage closely pastes in the first mounting groove of major structure, install in the second mounting groove of major structure after the temperature acquisition chip welding is on first circuit board, electric isolation circuit respectively with temperature acquisition chip and biax foil gage are connected. The monitoring compensation module has good anti-interference capability, low failure rate and high reliability.

Description

Steel rail stress change monitoring and compensating module
Technical Field
The utility model belongs to the technical field of rail stress detects, a rail stress variation monitoring compensation module is related to.
Background
The steel rail stress variation monitoring and compensating module is used as a part of a railway steel rail stress detection device and is used for compensating test parameters, so that test data are more accurate. The compensation module adopts steel materials which are the same as the steel rail as a main body structure, and the temperature change coefficient of the compensation module is the same as that of the steel rail.
The currently used steel rail stress change monitoring and compensating module has the following problems:
1. the temperature acquisition chip of the compensation module is not isolated, and the CPU is easy to crash under the condition of external interference.
2. The compensation module is not provided with an independent protection circuit, and is easily influenced by static electricity and external interference in the using process, so that the fault rate is high.
3. The temperature acquisition chip is sensitive to temperature, and is easy to damage due to overhigh temperature during welding.
4. Considering from the manufacturing process, the temperature acquisition chip is a plug-in component, a lead needs to be welded, and the temperature acquisition chip is directly lap-welded on a chip pin, so that the reliability is poor.
5. The temperature acquisition chip is high in size, and special treatment is required to be carried out on the box body.
Therefore, it is necessary to improve the existing compensation module in terms of improving the anti-interference capability of the product, improving the processing manufacturability, improving the measurement accuracy, improving the product quality, and the like.
SUMMERY OF THE UTILITY MODEL
The problem to be solved by the utility model is to provide a steel rail stress variation monitoring and compensating module which can improve the anti-interference ability of products, improve the processing manufacturability and improve the product quality.
The utility model relates to a rail stress variation monitoring compensation module, include: the temperature acquisition device comprises a main body structure, a double-shaft strain gauge, a temperature acquisition chip and an isolation circuit; the major structure adopts the steel preparation with the same material of rail, through in thin copper sheet deformation after welded fastening to gathering node box, the biax foil gage closely pastes in the first mounting groove of major structure, install in the second mounting groove of major structure after the temperature acquisition chip welding is on first circuit board, electric isolation circuit respectively with temperature acquisition chip and biax foil gage are connected.
The utility model discloses an among the rail stress variation monitoring compensation module, the temperature acquisition chip adopts DS18B20U + integrated circuit chip, sets up surge protector at the VCC port and the data port of temperature acquisition chip.
The utility model discloses an among the rail stress variation monitoring compensation module, isolating circuit includes: the device comprises an ADUM1250ARZ chip, an IF0303XT-1WR3 chip, a first ferrite bead, a second ferrite bead, a third ferrite bead, a fourth ferrite bead, a fifth ferrite bead, a first tantalum capacitor, a second tantalum capacitor, a third tantalum capacitor, a fourth capacitor, a fifth capacitor, a sixth capacitor, an inductor and a resistor; a first transient suppression diode is connected between a GND pin and a DQ pin of the temperature acquisition chip, a second transient suppression diode is connected between a VVD pin and a DQ pin of the temperature acquisition chip, and a third transient suppression diode is connected between the VVD pin and the GND pin of the temperature acquisition chip;
a GND pin of the temperature acquisition chip is connected with a cathode of a third tantalum capacitor through a first ferrite bead, a VVD pin of the temperature acquisition chip is connected with an anode of the third tantalum capacitor through the third ferrite bead, and the third tantalum capacitor is connected with a fourth capacitor in parallel; two 0V pins of the F0303XT-1WR3 chip are connected with the negative electrode of the third tantalum capacitor, and the positive V pins of the IF0303XT-1WR3 chip are connected with the negative electrode of the third tantalum capacitor0The pin is connected with the anode of the third tantalum capacitor; v of IF0303XT-1WR3 chipinThe pin and the GND pin are respectively and correspondingly connected with the anode and the cathode of the second tantalum capacitor, the cathode of the second tantalum capacitor is connected with the cathode of the first tantalum capacitor, and the anode of the second tantalum capacitor is connected with the anode of the first tantalum capacitor through an inductor; master control in positive electrode connection collection node box of first tantalum capacitorThe negative electrode of the first tantalum capacitor is connected with the grounding end of the main control circuit;
the GND pin of the temperature acquisition chip is connected with the GND of the ADUM1250ARZ chip through a first ferrite bead2Pin, VDD pin of temperature acquisition chip is connected with V of ADUM1250ARZ chip through third ferrite magnetic beadDD2A DQ pin of the temperature acquisition chip is connected with the SDA of the ADUM1250ARZ chip through a second ferrite bead2Pin, V of ADUM1250ARZ chipDD2Pin and SDA2Connection resistance between pins, VDD2Pin and GND2A sixth capacitor is connected between the pins; GND of ADUM1250ARZ chip1The pin is connected with the grounding end of the main control circuit in the acquisition node box, and the V of the ADUM1250ARZ chipDD1The pin is connected with a power supply of the main control circuit; v of the ADUM1250ARZ chipDD1Pin and GND1A fifth capacitor is connected between the pins; SDA of ADUM1250ARZ chip1The pin is a temperature acquisition output end connected to the temperature acquisition end of the main control circuit; two output ends of the double-shaft strain gauge are respectively connected to a strain acquisition end of the main control circuit through a fourth ferrite bead and a fifth ferrite bead.
The utility model discloses an among the rail stress variation monitoring compensation module, power supply isolation circuit and signal isolation circuit set up in gathering the node box on the second circuit board.
The utility model discloses a be used for rail stress variation monitoring compensation module to have following beneficial effect at least:
1. the utility model discloses a monitoring compensation module has increased power isolation circuit, signal isolation circuit, improves the interference killing feature of module.
2. The utility model discloses the temperature acquisition chip with original cartridge structure is changed to the paster encapsulation and is gathered the chip to weld on thin printing board, improve the manufacturability, be favorable to batch production.
3. The utility model discloses increase surge protector, electrostatic protection device, greatly reduced on the temperature acquisition chip and cause equipment trouble probability because external disturbance.
4. The external lead is welded on the thin printed board, so that the heat damage of the chip caused by the direct welding of the lead on the pin of the temperature acquisition core is avoided. Meanwhile, the welding of the lead is more reliable and efficient. Strain acquisition adopts the biax foil gage, can realize two directions strain change and gather.
5. The main structure adopts the welding fixation after the deformation of the thin copper sheet, so that the sensing module can not be loosened and influenced by external force, and the measurement precision is guaranteed. And the height of the chip circuit is reduced and cannot exceed the upper edge of the sensing module groove, so that the installation of the compensation module is facilitated.
Drawings
Fig. 1 is a schematic view of a rail stress variation monitoring and compensating module according to the present invention;
fig. 2 is the connection circuit diagram of the dual-axis strain gauge, the temperature acquisition chip and the isolation circuit of the present invention.
Detailed Description
The utility model discloses mainly realize measuring temperature and meeting an emergency to be applied to railway rail stress detection device, with install and measure the adjacent bridge arm on the Wheatstone bridge is received together to the foil gage in the rail, constitute the half-bridge, be arranged in eliminating the influence of temperature-force among the strain measurement, realize system test parameter temperature compensation.
As shown in fig. 1, the utility model discloses a rail stress variation monitoring compensation module, include: the temperature measurement device comprises a main body structure 1, a biaxial strain gauge 2, a temperature acquisition chip U1 and an isolation circuit. Main part structure 1 the main part structure adopts the steel preparation with the same material of rail, and welding fixation is in gathering the node box after the deformation through thin copper sheet. Biax foil gage 2 closely pastes in the first mounting groove of major structure 1, install in the second mounting groove of major structure 1 after the welding of temperature acquisition chip U1 is on first circuit board, electric isolation circuit respectively with the temperature acquisition chip is connected with the biax foil gage.
During specific implementation, the temperature acquisition chip U1 adopts a DS18B20U + integrated circuit chip, adopts a single-wire bus to transmit data, realizes temperature acquisition, and sets a surge protection device at a VCC port and a data port of the temperature acquisition chip U1.
As shown in fig. 2, a power VCC of the main control circuit in the isolation circuit is connected to the DC/DC power isolation module through the pi-type filter circuit, and supplies a 3.3V power to the temperature acquisition chip, thereby achieving isolation from the power VCC of the control circuit. The isolation voltage is not less than 1500V. Signals of the temperature acquisition chip and the biaxial strain gauge pass through the ferrite bead FB1-FB5 to filter high-frequency noise and absorb electrostatic pulses, and then pass through the signal isolation chip to realize signal isolation. The method specifically comprises the following steps: ADUM1250ARZ chip U2, first ferrite bead FB1, second ferrite bead FB2, third ferrite bead FB3, fourth ferrite bead FB4, fifth ferrite bead FB5, IF0303XT-1WR3 chip DY1, first tantalum capacitor C1, second tantalum capacitor C2, third tantalum capacitor C3, fourth capacitor C4, fifth capacitor C5, sixth capacitor C6, inductor L1 and resistor R1.
A first transient suppression diode TVS1 is connected between a GND pin and a DQ pin of the temperature acquisition chip U1, a second transient suppression diode TVS2 is connected between a VVD pin and a DQ pin of the temperature acquisition chip U1, and a third transient suppression diode TVS3 is connected between the VVD pin and the GND pin of the temperature acquisition chip U1.
A GND pin of the temperature acquisition chip U1 is connected with a cathode of a third tantalum capacitor C3 through a first ferrite bead FB1, a VVD pin of the temperature acquisition chip U1 is connected with an anode of a third tantalum capacitor C3 through a third ferrite bead FB3, and the third tantalum capacitor C3 is connected with a fourth capacitor C4 in parallel; two 0V pins of F0303XT-1WR3 chip DY1 are connected with the negative electrode of third tantalum capacitor C3 and + V pins of IF0303XT-1WR3 chip DY10The pin is connected with the anode of a third tantalum capacitor C3; v of IF0303XT-1WR3 chip DY1inThe pin and the GND pin are respectively and correspondingly connected with the anode and the cathode of a second tantalum capacitor C2, the cathode of the second tantalum capacitor C2 is connected with the cathode of a first tantalum capacitor C1, and the anode of the second tantalum capacitor C2 is connected with the anode of a first tantalum capacitor C1 through an inductor L1; the positive electrode of the first tantalum capacitor C1 is connected with a power supply VCC of a main control circuit in the collection node box, and the negative electrode of the first tantalum capacitor C1 is connected with the ground terminal GND1 of the main control circuit;
the GND pin of the temperature acquisition chip is connected with the GND of the ADUM1250ARZ chip through a first ferrite bead FB12The pin, VDD pin of the temperature acquisition chip is connected with ADUM1250ARZ core through a third ferrite bead FB3V of the sheetDD2A DQ pin of the temperature acquisition chip is connected with the SDA of the ADUM1250ARZ chip through a second ferrite bead FB22Pin, V of ADUM1250ARZ chipDD2Pin and SDA2Inter-pin connection resistance R1, VDD2Pin and GND2A sixth capacitor C6 is connected among the pins; GND of ADUM1250ARZ chip1The pin is connected with the grounding end of the main control circuit in the acquisition node box and the V of the ADUM1250ARZ chipDD1The pin is connected with a power supply of the main control circuit; v of ADUM1250ARZ chipDD1Pin and GND1A fifth capacitor C5 is connected among the pins; SDA of ADUM1250ARZ chip1The pin is a temperature acquisition output end connected to the temperature acquisition end of the main control circuit; two output ends of the biaxial strain gauge are respectively connected to a strain acquisition end of the main control circuit through a fourth ferrite bead FB4 and a fifth ferrite bead FB 5.
In specific implementation, the main structure 1 is made of the same material as the rail, and the long side direction is required to be consistent with the extending direction of the rail. The power isolation circuit and the signal isolation circuit are arranged in the acquisition node box on the second circuit board and are connected with the double-shaft strain gauge 2 and the temperature acquisition chip U1 through the cable 3. The double-shaft strain gauge adopts a waterproof strain gauge for monitoring transverse and longitudinal strains of the compensation module.
The utility model discloses the function of realization includes:
1. the main structure is arranged in the collection node box and is in close contact with the steel rail, and the main structure is used for detecting the temperature change of the steel rail.
2. And detecting the strain change of the compensation module.
3. The method is used for temperature compensation of the steel rail stress monitoring equipment.
4. Temperature acquisition power isolation and signal isolation.
5. The module has surge and electrostatic protection functions.
The above description is only for the preferred embodiment of the present invention, and is not intended to limit the spirit of the present invention, and any modifications, equivalent replacements, improvements, etc. within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (4)

1. A rail stress variation monitoring and compensating module is characterized by comprising: the temperature acquisition device comprises a main body structure, a double-shaft strain gauge, a temperature acquisition chip and an isolation circuit; the major structure adopts the steel preparation with the same material of rail, through in thin copper sheet deformation after welded fastening gathers node box, the biax foil gage closely pastes in the first mounting groove of major structure, install in the second mounting groove of major structure after the temperature acquisition chip welding is on first circuit board, isolating circuit respectively with temperature acquisition chip and biax foil gage are connected.
2. A steel rail stress variation monitoring and compensating module as claimed in claim 1, wherein the temperature acquisition chip is a DS18B20U + integrated circuit chip, and surge protection devices are arranged at a VCC port and a data port of the temperature acquisition chip.
3. A rail stress variation monitoring and compensation module according to claim 1, wherein the isolation circuit comprises: the device comprises an ADUM1250ARZ chip, an IF0303XT-1WR3 chip, a first ferrite bead, a second ferrite bead, a third ferrite bead, a fourth ferrite bead, a fifth ferrite bead, a first tantalum capacitor, a second tantalum capacitor, a third tantalum capacitor, a fourth capacitor, a fifth capacitor, a sixth capacitor, an inductor and a resistor; a first transient suppression diode is connected between a GND pin and a DQ pin of the temperature acquisition chip, a second transient suppression diode is connected between a VVD pin and a DQ pin of the temperature acquisition chip, and a third transient suppression diode is connected between the VVD pin and the GND pin of the temperature acquisition chip;
a GND pin of the temperature acquisition chip is connected with a cathode of a third tantalum capacitor through a first ferrite bead, a VVD pin of the temperature acquisition chip is connected with an anode of the third tantalum capacitor through the third ferrite bead, and the third tantalum capacitor is connected with a fourth capacitor in parallel; two 0V pins of the F0303XT-1WR3 chip are connected with the negative electrode of the third tantalum capacitor, and the positive V pins of the IF0303XT-1WR3 chip are connected with the negative electrode of the third tantalum capacitor0The pin is connected with the anode of the third tantalum capacitor; v of IF0303XT-1WR3 chipinPin and GND pin are respectively pairedThe anode and the cathode of the second tantalum capacitor are connected, the cathode of the second tantalum capacitor is connected with the cathode of the first tantalum capacitor, and the anode of the second tantalum capacitor is connected with the anode of the first tantalum capacitor through an inductor; the positive electrode of the first tantalum capacitor is connected with a power supply of a main control circuit in the acquisition node box, and the negative electrode of the first tantalum capacitor is connected with the grounding end of the main control circuit;
the GND pin of the temperature acquisition chip is connected with the GND of the ADUM1250ARZ chip through a first ferrite bead2Pin, VDD pin of temperature acquisition chip is connected with V of ADUM1250ARZ chip through third ferrite magnetic beadDD2A DQ pin of the temperature acquisition chip is connected with the SDA of the ADUM1250ARZ chip through a second ferrite bead2Pin, V of ADUM1250ARZ chipDD2Pin and SDA2Connection resistance between pins, VDD2Pin and GND2A sixth capacitor is connected between the pins; GND of ADUM1250ARZ chip1The pin is connected with the grounding end of the main control circuit in the acquisition node box, and the V of the ADUM1250ARZ chip DD1The pin is connected with a power supply of the main control circuit; v of the ADUM1250ARZ chip DD1Pin and GND1A fifth capacitor is connected between the pins; SDA of ADUM1250ARZ chip1The pin is a temperature acquisition output end connected to the temperature acquisition end of the main control circuit; two output ends of the double-shaft strain gauge are respectively connected to a strain acquisition end of the main control circuit through a fourth ferrite bead and a fifth ferrite bead.
4. A rail stress variation monitoring and compensation module according to claim 1, wherein the isolation circuit is on the second circuit board and is disposed in the collection node box.
CN202021051637.0U 2020-06-10 2020-06-10 Steel rail stress change monitoring and compensating module Active CN212030792U (en)

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Application Number Priority Date Filing Date Title
CN202021051637.0U CN212030792U (en) 2020-06-10 2020-06-10 Steel rail stress change monitoring and compensating module

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Application Number Priority Date Filing Date Title
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113739925A (en) * 2021-06-17 2021-12-03 北京源仿科技有限公司 Online temperature detection of transformer substation and emulation auxiliary assembly

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113739925A (en) * 2021-06-17 2021-12-03 北京源仿科技有限公司 Online temperature detection of transformer substation and emulation auxiliary assembly
CN113739925B (en) * 2021-06-17 2024-04-05 北京源仿科技有限公司 Online temperature detection and simulation auxiliary equipment of transformer substation

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