CN212013177U

CN212013177U - Printed circuit board structure

Info

Publication number: CN212013177U
Application number: CN202020921659.1U
Authority: CN
Inventors: 潘倩倩
Original assignee: Semiconductor Integrated Display Technology Co Ltd
Current assignee: Semiconductor Integrated Display Technology Co Ltd
Priority date: 2020-05-27
Filing date: 2020-05-27
Publication date: 2020-11-24
Anticipated expiration: 2030-05-27

Abstract

The utility model discloses a printed circuit board structure, its characterized in that: including first circuit board and locate the second circuit board on it, first circuit board includes first circuit board body and locates the pad on it, the second circuit board includes second circuit board body and detin pad, detin pad is located the pad top, the pad is including the first pad and the second pad of locating both sides, and locate the third pad and the fourth pad at both ends, detin pad include with first detin pad and the second detin pad that first pad and second pad correspond respectively, detin pad still include with third detin pad and the fourth detin pad that third pad and fourth pad correspond respectively. The utility model discloses printed circuit board structure, simple structure can satisfy multi-direction encapsulation requirement, and the suitability is good, effectively avoids even tin and short circuit, has stronger practicality and better application prospect.

Description

Printed circuit board structure

Technical Field

The utility model belongs to the technical field of the circuit board, more specifically say, relate to a printed circuit board structure.

Background

With the continuous improvement of the integration level of the electronic device process, the requirements on the packaging of the components are higher and higher. And as electronic equipment becomes smaller and smaller, a smaller component packaging assembly is required to be manufactured, the PIN pitch of the connector becomes smaller and smaller, a tin connection phenomenon is often generated at the tail end of the device when the device passes through wave soldering in the SMT process, and in order to avoid the defect, a virtual bonding pad, namely a tin removal bonding pad, needs to be added at the tail part of the device to pull and melt tin, so that the tin connection phenomenon is avoided. Because the soldering direction is uncertain, the existing circuit board can not well meet the requirement of multidirectional packaging, and the use is limited.

SUMMERY OF THE UTILITY MODEL

The utility model aims at solving the problem that prior art exists, provide a simple structure, can satisfy multi-direction encapsulation requirement, the suitability is good, effectively avoids the printed circuit board structure of even tin and short circuit.

In order to realize the purpose, the utility model discloses the technical scheme who takes does: the printed circuit board structure provided is characterized in that: including first circuit board and locate the second circuit board on it, first circuit board includes first circuit board body and locates the pad on it, the second circuit board includes second circuit board body and detinning pad, detinning pad is located the pad top, the pad is including the first pad and the second pad of locating both sides, and locate the third pad and the fourth pad at both ends, detinning pad include with first detinning pad and the second detinning pad that first pad and second pad correspond respectively, detinning pad still include with third detinning pad and the fourth detinning pad that third pad and fourth pad correspond respectively, first detinning pad and second detinning pad extend to the outside of keeping away from the center respectively, third detinning pad and fourth detinning pad extend to the both ends of keeping away from the center respectively.

In order to make the above technical solution more detailed and concrete, the present invention further provides the following preferable technical solution to obtain satisfactory practical effect:

the detinned bonding pad is of a waist-shaped structure.

And two ends of the detinned bonding pad are semicircular, and the radius of the semicircle is the same as that of the bonding pad.

The detinned pad length is twice the pad diameter.

Compared with the prior art, the utility model, have following advantage: the utility model discloses printed circuit board structure, simple structure can satisfy multi-direction encapsulation requirement, and the suitability is good, effectively avoids even tin and short circuit, has stronger practicality and better application prospect.

Drawings

The contents of the drawings and the reference numerals in the drawings of the present specification will be briefly described as follows:

fig. 1 is a schematic diagram of a first circuit board structure of the present invention;

fig. 2 is a schematic diagram of a second circuit board structure of the present invention;

fig. 3 is a schematic diagram of the structure of the printed circuit board of the present invention.

Labeled as: 1. the soldering terminal comprises a first circuit board, 11, a first circuit board body, 12, a first bonding pad, 13, a second bonding pad, 14, a third bonding pad, 15, a fourth bonding pad, 2, a second circuit board, 21, a second circuit board body, 22, a first tin-removing bonding pad, 23, a second tin-removing bonding pad, 24, a third tin-removing bonding pad, 25 and a fourth tin-removing bonding pad.

Detailed Description

The following description of the embodiments of the present invention will be made in detail with reference to the accompanying drawings.

The printed circuit board structure of the present invention, as shown in fig. 1, 2 and 3, includes a first circuit board 1 and a second circuit board 2 disposed thereon. The first circuit board 1 includes a first circuit board body 11 and pads provided thereon (as shown in fig. 1); the second circuit board 2 includes a second circuit board body 21 and a detinned pad (shown in fig. 2) provided above the pad (shown in fig. 3). The utility model discloses in, the pad is including first pad 12 and the second pad 13 of locating both sides, and locate the third pad 14 and the fourth pad 15 at both ends, detin pad includes the first detin pad 22 and the second detin pad 23 that correspond respectively with first pad 12 and second pad 13, detin pad still includes the third detin pad 24 and the fourth detin pad 25 that correspond respectively with third pad 14 and fourth pad 15, first detin pad 22 and second detin pad 23 extend to the outside from the center respectively, third detin pad 24 and fourth detin pad 25 extend to the both ends from the center respectively.

In the present invention, as shown in fig. 2, the detinning pad has a waist-shaped structure. The two ends of the detinning bonding pad are semicircular, the radius of the semicircular is the same as that of the bonding pad, and the length of the detinning bonding pad is twice of the diameter of the bonding pad. The structure can well avoid the problem of tin connection.

The utility model relates to a printed circuit board structure with detinning pad, detinning pad an organic whole sets up on ordinary pad, and first circuit board 1 includes first circuit board body 11 to and set up the pad on first circuit board body 11. Four-directional detinned pads are designed for different soldering directions. No matter from which direction when welding components and parts, unnecessary soldering tin on the pad can directly flow into detinning pad and carry out detinning to reach better detinning effect, avoided the even tin between the welding connector pin, short circuit problem, improved printed circuit board and crossed the yield of board soldering tin, saved printed circuit board's overall arrangement space simultaneously, improved printed circuit board's high density overall arrangement ability.

The utility model discloses in, detinning pad sets up on ordinary pad, and ordinary pad intersects with the coincidence of detinning pad medial extremity to extend to the outside, set up along keeping away from ordinary pad direction.

In the utility model, the detinning bonding pad is arranged into a long waist structure; as shown in fig. 2, the diameter of the pad is a, the length of the detinned pad 222 is b, and b is 2a, so that the problem of tin connection can be completely avoided by lengthening the detinned pad to 2 a; FIG. 3 shows, the arrow direction indicates the PCB-passing direction;

the utility model discloses in, this kind of arrangement structure's printed circuit can not consider wave-soldering and cross the board direction, can both reach detinning's effect, and the suitability is better. The detinning pad structure of waist type structure sets up, can be so that soldering tin can flow along two straight line limits when passing through detinning pad, the contact with tin of bigger area to reach better detinning effect.

The utility model discloses this kind of printed circuit board structure, when welding components and parts, unnecessary soldering tin can directly flow into detinning pad on the pad and carry out the detinning to reach better detinning effect, avoided the even tin between the welding connector pin, short circuit problem, guaranteed once to weld the quality, can avoid welding the quality hidden danger that brings because of the secondary, improved printed circuit board and crossed the yield of board soldering tin.

The utility model discloses printed circuit board structure, simple structure can satisfy multi-direction encapsulation requirement, and the suitability is good, effectively avoids even tin and short circuit, has stronger practicality and better application prospect.

The present invention has been described above with reference to the accompanying drawings, but the present invention is not limited to the above-mentioned embodiments, and various insubstantial improvements or direct applications to other applications can be achieved by using the method and technical solution of the present invention, which all fall within the protection scope of the present invention.

Claims

1. A printed circuit board structure characterized by: including first circuit board and locate the second circuit board on it, first circuit board includes first circuit board body and locates the pad on it, the second circuit board includes second circuit board body and detinning pad, detinning pad is located the pad top, the pad is including the first pad and the second pad of locating both sides, and locate the third pad and the fourth pad at both ends, detinning pad include with first detinning pad and the second detinning pad that first pad and second pad correspond respectively, detinning pad still include with third detinning pad and the fourth detinning pad that third pad and fourth pad correspond respectively, first detinning pad and second detinning pad extend to the outside of keeping away from the center respectively, third detinning pad and fourth detinning pad extend to the both ends of keeping away from the center respectively.

2. A printed circuit board structure according to claim 1, characterized in that: the detinned bonding pad is of a waist-shaped structure.

3. A printed circuit board structure according to claim 2, characterized in that: and two ends of the detinned bonding pad are semicircular, and the radius of the semicircle is the same as that of the bonding pad.

4. A printed circuit board structure according to claim 3, characterized in that: the detinned pad length is twice the pad diameter.