CN211999541U - Flame-retardant low-heat-conductivity foamed polypropylene plate - Google Patents
Flame-retardant low-heat-conductivity foamed polypropylene plate Download PDFInfo
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- CN211999541U CN211999541U CN201820039620.XU CN201820039620U CN211999541U CN 211999541 U CN211999541 U CN 211999541U CN 201820039620 U CN201820039620 U CN 201820039620U CN 211999541 U CN211999541 U CN 211999541U
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Abstract
The utility model discloses a fire-retardant low heat conduction's foaming polypropylene panel, foaming polypropylene panel comprises foaming polypropylene granule, foaming polypropylene granule includes the outer wall and is located a large amount of obturator in the outer wall, the downthehole nonflammable gas that all packs of obturator have, the rate of obturator in the foaming polypropylene granule is more than 90%. The utility model discloses a fire-retardant low heat conduction's foaming polypropylene board adjusts its outer wall thickness and obturator structure through the modification of foaming polypropylene granule, makes it have low coefficient of heat conductivity and excellent fire resistance.
Description
Technical Field
The utility model relates to a building material field especially relates to a foaming polypropylene board of fire-retardant low heat conduction.
Background
Polypropylene is now increasingly used in different fields due to its excellent mechanical strength, heat resistance, chemical resistance, machinability, cost balance and recyclability. The expanded polypropylene retains the above-mentioned excellent properties and has additional excellent characteristics such as cushioning properties and heat insulating properties. The excellent performance of the flame retardant is used as a packaging material, a structural material, a heat insulating material and the like in different applications, but the flame retardant has high heat conductivity, poor flame retardant performance and low safety.
SUMMERY OF THE UTILITY MODEL
In order to solve the technical problem, the utility model provides a fire-retardant low heat conduction's foaming polypropylene board adjusts its inner structure through the modification of foaming polypropylene granule, makes it have low coefficient of heat conductivity and excellent fire resistance.
The utility model discloses a fire-retardant low heat conduction's expanded polypropylene panel, expanded polypropylene panel comprises expanded polypropylene granule, expanded polypropylene granule includes the outer wall and is located a large amount of obturator in the outer wall, the downthehole nonflammable gas that all packs of obturator have, the rate of obturator in the expanded polypropylene granule is more than 90%.
The application discloses fire-retardant low heat conduction's foaming polypropylene board is formed by a large amount of foaming polypropylene through heating pressurization outer wall fusion bonding in the mould, through the quantity and the size of control obturator such as temperature, pressure when controlling the foaming. The application discloses foaming polypropylene granule has the closed porosity more than 90%, and the downthehole nonflammable gas that all fills of closed has improved the flame retardant efficiency of foaming polypropylene panel and has reduced coefficient of heat conductivity.
Further, the particle size of the expanded polypropylene particles is 3-5mm, the wall thickness of the outer wall is 2-4 μm, the inner diameter of the closed cell is 12-25 μm, and the distance between the closed cells is 1-10 μm.
The wall thickness of the outer wall is thicker than that of the conventional material in the foamed polypropylene of the technical scheme, so that the performance of the inner closed hole is more stable, the inner diameter of the closed hole is larger, the quantity of the nonflammable gas is stored in the closed hole, and the performance of reducing the heat conductivity coefficient is realized.
Further, the expanded polypropylene particles have an expansion ratio of 30 to 60 times.
The foaming expansion rate of the foaming polypropylene particles is higher than that of conventional products, the increase of the inner diameter of closed pores is promoted, the amount of non-flammable gas stored in the closed pores is more, and the heat conductivity coefficient is lower.
Further, the foaming temperature of the expanded polypropylene particles is 140-180 ℃.
The foaming temperature limited by the technical scheme is beneficial to the structural molding of the foaming polypropylene particles, and the closed cell rate is improved, so that the foaming polypropylene particles have more and larger closed cells.
Furthermore, the temperature for melting and bonding the expanded polypropylene particles is 140-200 ℃, and the pressure is 10-30 atmospheric pressures.
The melt bonding temperature and pressure defined by the technical scheme are suitable for the condition of completing the melt bonding of the expanded polypropylene particles.
Furthermore, a flame retardant is added into the expanded polypropylene particles.
The flame retardant is added in the foamed polypropylene particles in the technical scheme, so that the flame retardant property of the board made of foamed polypropylene is further improved, and the application range is expanded.
The utility model discloses a fire-retardant low heat conduction's foaming polypropylene board adjusts its outer wall thickness and obturator structure through the modification of foaming polypropylene granule, makes it have low coefficient of heat conductivity and excellent fire resistance.
Drawings
FIG. 1 is a schematic structural diagram of a flame-retardant low thermal conductivity foamed polypropylene sheet according to this embodiment;
FIG. 2 is a schematic structural diagram of the expanded polypropylene particles of this embodiment.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
As shown in the figures 1 and 2, in the foamed polypropylene sheet with flame retardance and low thermal conductivity of the embodiment, the foamed polypropylene sheet 1 is formed by stacking a large number of foamed polypropylene particles 2, heating and pressurizing the stacked foamed polypropylene particles, and then melting and bonding the stacked foamed polypropylene particles with the temperature of 140-, the inner diameter of the closed pores 4 is 7-20 μm, and the distance between the closed pores 4 and the closed pores 4 is 1-10 μm.
The wall thickness and the closed cell structure of the outer wall of the flame-retardant low-thermal-conductivity foamed polypropylene plate are adjusted through modification of the foamed polypropylene particles, so that the flame-retardant low-thermal-conductivity foamed polypropylene plate has a low thermal conductivity coefficient and excellent flame retardance.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (4)
1. The flame-retardant low-heat-conductivity foamed polypropylene board is characterized in that: the foamed polypropylene plate is composed of foamed polypropylene particles, the foamed polypropylene particles comprise an outer wall and a large number of closed pores positioned in the outer wall, non-flammable gas is filled in the closed pores, and the closed pore rate in the foamed polypropylene particles is more than 90%; the particle size of the foamed polypropylene particles is 3-5mm, the wall thickness of the outer wall is 2-4 microns, the inner diameter of the closed hole is 12-25 microns, and the distance between the closed holes is 1-10 microns.
2. The flame-retardant low-thermal-conductivity foamed polypropylene sheet material as claimed in claim 1, wherein: the expanded polypropylene particles have a foaming expansion ratio of 30 to 60 times.
3. The flame-retardant low-thermal-conductivity foamed polypropylene sheet material as claimed in claim 1, wherein: the foaming temperature of the expanded polypropylene particles is 140-180 ℃.
4. The flame-retardant low-thermal-conductivity foamed polypropylene sheet material as claimed in claim 1, wherein: the temperature for fusing and bonding the expanded polypropylene particles is 140-200 ℃, and the pressure is 10-30 atmospheric pressures.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820039620.XU CN211999541U (en) | 2018-01-10 | 2018-01-10 | Flame-retardant low-heat-conductivity foamed polypropylene plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820039620.XU CN211999541U (en) | 2018-01-10 | 2018-01-10 | Flame-retardant low-heat-conductivity foamed polypropylene plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211999541U true CN211999541U (en) | 2020-11-24 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820039620.XU Active CN211999541U (en) | 2018-01-10 | 2018-01-10 | Flame-retardant low-heat-conductivity foamed polypropylene plate |
Country Status (1)
| Country | Link |
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| CN (1) | CN211999541U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112608555A (en) * | 2020-12-14 | 2021-04-06 | 金发科技股份有限公司 | Foaming agent master batch and preparation method thereof |
| CN116960546A (en) * | 2023-09-13 | 2023-10-27 | 湖北祥源高新科技有限公司 | Organic silicon foaming material and battery module comprising same |
-
2018
- 2018-01-10 CN CN201820039620.XU patent/CN211999541U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112608555A (en) * | 2020-12-14 | 2021-04-06 | 金发科技股份有限公司 | Foaming agent master batch and preparation method thereof |
| CN112608555B (en) * | 2020-12-14 | 2022-05-10 | 金发科技股份有限公司 | Foaming agent master batch and preparation method thereof |
| CN116960546A (en) * | 2023-09-13 | 2023-10-27 | 湖北祥源高新科技有限公司 | Organic silicon foaming material and battery module comprising same |
| CN116960546B (en) * | 2023-09-13 | 2024-01-30 | 湖北祥源高新科技有限公司 | Organic silicon foaming material and battery module comprising same |
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