CN211938057U - Device for improving silver melting yield of small-size board and large copper panel - Google Patents
Device for improving silver melting yield of small-size board and large copper panel Download PDFInfo
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- CN211938057U CN211938057U CN201922063678.5U CN201922063678U CN211938057U CN 211938057 U CN211938057 U CN 211938057U CN 201922063678 U CN201922063678 U CN 201922063678U CN 211938057 U CN211938057 U CN 211938057U
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Abstract
The utility model provides a device for improving the silver melting yield of small-size plates and large copper panels. The device for improving the silver melting yield of the small-size plate and the large copper panel comprises a cleaning box; the cleaning cavity is formed in the cleaning box; the arc-shaped water guide groove is formed in the inner wall of the bottom of the cleaning cavity; the drain pipe is fixedly arranged at the bottom of the cleaning box; the feeding hole is formed in the inner wall of one side of the cleaning cavity; the discharge hole is formed in the inner wall of one side, far away from the feed inlet, of the cleaning cavity; the water channel is arranged on the inner wall of the bottom of the discharge hole, and a water outlet of the water channel is communicated with the cleaning cavity; a water diversion device. The utility model provides an improve device of small-size board, big copper face board silvering yield has convenient to use, space utilization efficiency height, the effectual advantage of dust clearance.
Description
Technical Field
The utility model relates to a preparation technical field especially relates to a device of improvement small-size board, big copper panel silvering yield.
Background
The PCB board is also called as printed circuit board, is the supplier of electrical connection of electronic components, and its design is mainly the layout design, and the main advantages of using the circuit board are that it can greatly reduce the error of wiring and assembling, and can raise automation level and production labor rate, and its manufacturing process is complex, and it mainly includes inner layer resisting agent-etching-resisting agent stripping-oxidation treatment-pressing-drilling-etching glue/copper-melting-electroplating-outer layer resisting agent-etching-resisting agent stripping-green paint-forming-detection-chemical silver, in which the chemical silver is mainly used for delaying the oxidation of copper on the PCB board in the course of use.
However, the PCB has a complicated process and a high cost, and once the silvering yield is low, a large amount of property loss is caused, and factors influencing the silvering yield are that the PCB is mostly contaminated with dust and impurities and fingerprints adhered to the PCB in the previous production process, and manual removal is difficult.
Therefore, there is a need to provide a new device for improving the yield of silver on small-sized board and large copper panel.
SUMMERY OF THE UTILITY MODEL
The utility model provides a technical problem provide a convenient to use, space utilization efficiency is high, the effectual device of improvement small-size board, big copper panel silver-colored yield of dust clearance.
In order to solve the technical problem, the utility model provides an improve device of small-size board, big copper panel silvering yield includes: a cleaning tank; the cleaning cavity is formed in the cleaning box; the arc-shaped water guide groove is formed in the inner wall of the bottom of the cleaning cavity; the drain pipe is fixedly arranged at the bottom of the cleaning box; the feeding hole is formed in the inner wall of one side of the cleaning cavity; the discharge hole is formed in the inner wall of one side, far away from the feed inlet, of the cleaning cavity; the water channel is arranged on the inner wall of the bottom of the discharge hole, and a water outlet of the water channel is communicated with the cleaning cavity; the water diversion device is arranged on the cleaning box; the water inlet device is arranged on the cleaning tank; and the transmission feeding device is arranged on the cleaning box.
Preferably, the water diversion device comprises a first transmission rod, a fixing part, a plurality of fan blades and a first motor, wherein the first transmission rod is rotatably installed on the inner wall of the top of the cleaning cavity, the top end of the first transmission rod extends to the outside of the cleaning box, the fixing part is fixedly installed at the bottom end of the first transmission rod and a plurality of fan blades are fixedly installed on the fixing part and are distributed in a circular array, the first motor is fixedly installed at the top of the cleaning box, and the output rod of the first motor is fixedly connected with the top end of the first transmission rod.
Preferably, water installations includes first water pipe, two second water pipes, inlet tube, water pump and the pipe that absorbs water, first water pipe fixed mounting be in on the inner wall in washing chamber, two the equal fixed mounting of second water pipe be in wash on the inner wall in chamber, two the second water pipe all with first water pipe fixed connection, inlet tube fixed mounting be in the top of first water pipe, the inlet tube runs through wash the top inner wall in chamber, water pump fixed mounting be in wash one side of case, the end of intaking of inlet tube with the top delivery port fixed connection of water pump, the pipe fixed mounting that absorbs water the water pump is kept away from wash one side water inlet department of case.
Preferably, transmission material feeding unit includes a plurality of second transfer line, a plurality of guide pulley, the first belt pulley of a plurality of, second motor, second belt pulley and belt, a plurality of the second transfer line is all rotated and is installed wash on the both sides inner wall in chamber, a plurality of the both ends of second transfer line all extend to wash outside the case, a plurality of second belt pulley fixed mounting is respectively in wherein one end of a plurality of second transfer line, second motor fixed mounting be in wash one side of case, the second motor is located the below of the first belt pulley of a plurality of, second belt pulley fixed mounting be in on the output shaft of second motor, the belt cover establish a plurality of first belt pulley with on the second belt pulley.
Preferably, a first through hole is formed in the inner wall of the top of the cleaning cavity, a first bearing is fixedly mounted in the first through hole, and the inner ring of the first bearing is fixedly sleeved on the first transmission rod.
Preferably, a plurality of spray heads are fixedly mounted at the bottoms of the first water pipe and the two second water pipes.
Preferably, a plurality of second through holes are formed in the inner walls of the two sides of the cleaning cavity, second bearings are fixedly mounted in the second through holes, and inner rings of the second bearings are fixedly sleeved on the second transmission rods respectively.
Preferably, a water outlet is formed in the inner wall of the bottom of the arc-shaped water guide groove and communicated with the water discharge pipe.
Preferably, a plurality of balls are embedded on the inner wall of the bottom of the discharge hole.
Preferably, the cleaning box is far away from one side fixed mounting of feed inlet has the fan, the bottom air outlet department fixed mounting of fan has the tuber pipe, the wind channel has been seted up on the top inner wall of discharge gate, the air-out end of tuber pipe with the air inlet end fixed connection in wind channel.
Compared with the prior art, the utility model provides an improve device of small-size board, big copper panel silvering yield has following beneficial effect:
the utility model provides a device for improving the silver-melting yield of small-size boards and large copper panels, when the PCB needs to be cleaned, a first motor, a second motor and a water pump are simultaneously started, at the moment, the PCB is fed through a feed inlet, materials are placed on a guide wheel, at the moment, the second motor rotates to drive a second belt wheel to rotate, the second belt wheel drives a first belt wheel to rotate through a belt, the first belt wheel drives a second transmission rod to rotate, the second transmission rod drives the guide wheel to rotate, the guide wheel drives the PCB to feed, simultaneously, the water pump sucks water through a water suction pipe and feeds water through a water inlet pipe, the pure water is separated in a first water pipe and a second water pipe, a plurality of spray heads spray water simultaneously, at the moment, the first motor rotates to drive a first transmission rod to rotate, the first transmission rod drives a fixing part to rotate, the fixing part drives a plurality of fan blades to rotate at high speed to separate the pure water, the mode, and the cleaning efficiency of the pure water is improved, the used pure water is discharged through the arc-shaped water guide groove and the water discharge pipe, and the cleaned PCB is discharged through the discharge hole.
Drawings
Fig. 1 is a schematic front view of a cross-sectional structure of a first embodiment of an apparatus for improving the silver-plating yield of small-sized boards and large copper panels provided by the present invention;
fig. 2 is a schematic side sectional structural view of the first embodiment of the present invention;
fig. 3 is a side view of a first embodiment provided by the present invention;
fig. 4 is a schematic winding diagram of a belt according to a first embodiment of the present invention;
fig. 5 is a schematic side sectional view of a second embodiment of the present invention.
Reference numbers in the figures: 1. the cleaning box comprises a cleaning box body, 2, a cleaning cavity, 3, an arc-shaped water guide groove, 4, a water discharge pipe, 5, a feed inlet, 6, a discharge hole, 7, a water channel, 8, a first transmission rod, 9, a fixing piece, 10, fan blades, 11, a first motor, 12, a first water pipe, 13, a second water pipe, 14, a water inlet pipe, 15, a water pump, 16, a water suction pipe, 17, a second transmission rod, 18, a guide wheel, 19, a first belt pulley, 20, a second motor, 21, a second belt pulley, 22, a belt, 23, a fan, 24, an air pipe, 25 and an air channel.
Detailed Description
The present invention will be further described with reference to the accompanying drawings and embodiments.
The first embodiment:
referring to fig. 1-4, an apparatus for improving the yield of silver plating on small-sized boards and large copper panels includes: a cleaning tank 1; the cleaning cavity 2 is arranged on the cleaning box 1; the arc-shaped water chute 3 is formed in the inner wall of the bottom of the cleaning cavity 2; the drain pipe 4 is fixedly arranged at the bottom of the cleaning box 1; the feeding hole 5 is formed in the inner wall of one side of the cleaning cavity 2; the discharge port 6 is formed in the inner wall of the side, far away from the feed port 5, of the cleaning cavity 2; the water channel 7 is formed in the inner wall of the bottom of the discharge hole 6, and a water outlet of the water channel 7 is communicated with the cleaning cavity 2; the water diversion device is arranged on the cleaning tank 1; the water inlet device is arranged on the cleaning tank 1; and the transmission feeding device is arranged on the cleaning box 1.
The water diversion device comprises a first transmission rod 8, a fixing part 9, a plurality of fan blades 10 and a first motor 11, wherein the first transmission rod 8 is rotatably installed on the inner wall of the top of the cleaning cavity 2, the top end of the first transmission rod 8 extends to the outside of the cleaning cavity 1, the fixing part 9 is fixedly installed at the bottom end of the first transmission rod 8 and a plurality of the fan blades 10 are fixedly installed on the fixing part 9 and distributed in a circular array, the first motor 10 is fixedly installed at the top of the cleaning cavity 1, and the output rod of the first motor 10 is fixedly connected with the top end of the first transmission rod 8.
Water installations includes first water pipe 12, two second water pipes 13, inlet tube 14, water pump 15 and absorbs water pipe 16, first water pipe 12 fixed mounting be in on the inner wall of washing chamber 2, two the equal fixed mounting of second water pipe 13 wash on the inner wall of chamber 2, two second water pipe 13 all with first water pipe 12 fixed connection, inlet tube 14 fixed mounting be in the top of first water pipe 12, inlet tube 14 runs through wash the top inner wall of chamber 2, water pump 15 fixed mounting be in wash one side of case 1, inlet tube 14 intake end with the top delivery port fixed connection of water pump 15, it installs to absorb water pipe 16 fixed mounting water pump 15 is kept away from wash one side water inlet department of case 1.
The transmission feeding device comprises a plurality of second transmission rods 17, a plurality of guide wheels 18, a plurality of first belt pulleys 19, a second motor 20, a second belt pulley 21 and a belt 22, the second transmission rods 17 are all rotatably installed on the inner walls of the two sides of the cleaning cavity 2, the two ends of the second transmission rods 17 extend to the outside of the cleaning box 1, the second belt pulleys 19 are respectively and fixedly installed at one ends of the second transmission rods 17, the second motor 20 is fixedly installed on one side of the cleaning box 1, the second motor 20 is located below the first belt pulleys 19, the second belt pulleys 21 are fixedly installed on the output shaft of the second motor 20, and the belt 22 is sleeved on the first belt pulleys 19 and the second belt pulleys 21.
A first through hole is formed in the inner wall of the top of the cleaning cavity 2, a first bearing is fixedly mounted in the first through hole, and the inner ring of the first bearing is fixedly sleeved on the first transmission rod 8.
The bottom of the first water pipe 12 and the bottom of the two second water pipes 13 are fixedly provided with a plurality of spray heads.
A plurality of second through holes are formed in the inner walls of the two sides of the cleaning cavity 2, second bearings are fixedly mounted in the second through holes, and inner rings of the second bearings are fixedly sleeved on the second transmission rods 17 respectively.
And a water outlet is formed in the inner wall of the bottom of the arc-shaped water guide groove 3 and communicated with the water discharge pipe 4.
A plurality of balls are embedded on the inner wall of the bottom of the discharge port 6
In this embodiment: when the PCB needs to be cleaned, the first motor 11, the second motor 20 and the water pump 15 are started simultaneously, the PCB is fed through the feed inlet 5, the material is placed on the guide wheel 18, the second motor 20 rotates to drive the second belt wheel 21 to rotate, the second belt wheel 21 drives the first belt wheel 19 to rotate through the belt 22, the first belt wheel 19 drives the second transmission rod 17 to rotate, the second transmission rod 17 drives the guide wheel 18 to rotate, the guide wheel 18 drives the PCB to feed, meanwhile, the water pump 15 sucks water through the water suction pipe 16 and feeds water through the water inlet pipe 14, pure water is separated in the first water pipe 12 and the second water pipe 13, a plurality of nozzles spray water simultaneously, the first motor 11 rotates to drive the first transmission rod 8 to rotate, the first transmission rod 8 drives the fixing part 9 to rotate, the fixing part 9 drives a plurality of fan blades 10 to rotate at a high speed to separate the pure water, and the use of the pure water can be reduced, and the cleaning efficiency of the pure water is improved, the used pure water is discharged through the arc-shaped water guide groove 3 and the water discharge pipe 4, and the cleaned PCB is discharged through the discharge hole 6.
Compared with the prior art, the utility model provides an improve device of small-size board, big copper panel silvering yield has following beneficial effect:
through wasing case 1, wash chamber 2, arc guiding gutter 3, drain pipe 4, feed inlet 5, discharge gate 6, water course 7, first transfer line 8, mounting 9, flabellum 10 and 11 cooperations of first motor, break up the pure water, improve the coverage, through first water pipe 12, second water pipe 13, inlet tube 14, water pump 15 and the pipe 16 that absorbs water cooperatees and provide the pure water, through second transfer line 17, guide pulley 18, first belt pulley 19, second motor 20, the cooperation of second belt pulley 21 and belt 22 carries out the pay-off to equipment.
Second embodiment:
based on the device for improving the silver-melting yield of the small-size board and the large copper panel provided by the first embodiment of the application, the second embodiment of the application provides another device for improving the silver-melting yield of the small-size board and the large copper panel. The second embodiment is merely a preferred way of the first embodiment, and the implementation of the second embodiment does not affect the implementation of the first embodiment alone.
The second embodiment of the present invention will be further explained with reference to the drawings and the embodiments.
Referring to fig. 5, the device for improving the silver-plating yield of the small-sized board and the large-copper panel further includes a fan 23, the fan 23 is fixedly installed on one side of the cleaning box 1 far away from the feed port 5, an air pipe 24 is fixedly installed at an air outlet at the bottom of the fan 23, an air duct 25 is formed in the inner wall of the top of the discharge port 6, and an air outlet end of the air pipe 24 is fixedly connected with an air inlet end of the air duct 25.
In this embodiment, when the PCB board is through the ejection of compact of discharge gate 6, start fan 23 this moment, wind-force that fan 23 produced enters into wind channel 25 through tuber pipe 24, because wind channel 25 and discharge gate 26 are linked together, so wind channel 25 can carry out the preliminary treatment to remaining water stain on the PCB board this moment, and later stage is dried more conveniently.
The above only is the embodiment of the present invention, not limiting the scope of the present invention, all the equivalent structures or equivalent processes of the present invention are used in the specification and the attached drawings, or directly or indirectly applied to other related technical fields, and the same principle is included in the protection scope of the present invention.
Claims (10)
1. The utility model provides an improve device of small-size board, big copper panel silvering yield which characterized in that includes:
a cleaning tank;
the cleaning cavity is formed in the cleaning box;
the arc-shaped water guide groove is formed in the inner wall of the bottom of the cleaning cavity;
the drain pipe is fixedly arranged at the bottom of the cleaning box;
the feeding hole is formed in the inner wall of one side of the cleaning cavity;
the discharge hole is formed in the inner wall of one side, far away from the feed inlet, of the cleaning cavity;
the water channel is arranged on the inner wall of the bottom of the discharge hole, and a water outlet of the water channel is communicated with the cleaning cavity;
the water diversion device is arranged on the cleaning box;
the water inlet device is arranged on the cleaning tank;
and the transmission feeding device is arranged on the cleaning box.
2. The device for improving the silver deposition yield of the small-sized plates and the large-copper-face plates according to claim 1, wherein the water distribution device comprises a first transmission rod, a fixing member, a plurality of fan blades and a first motor, the first transmission rod is rotatably installed on the inner wall of the top of the cleaning cavity, the top end of the first transmission rod extends out of the cleaning box, the fixing member is fixedly installed at the bottom end of the first transmission rod, the plurality of fan blades are all fixedly installed on the fixing member, the plurality of fan blades are distributed in a circular array, the first motor is fixedly installed at the top of the cleaning box, and an output rod of the first motor is fixedly connected with the top end of the first transmission rod.
3. The device for improving the silver-plating yield of the small-sized plate and the large copper panel as claimed in claim 1, wherein the water inlet device comprises a first water pipe, two second water pipes, a water inlet pipe, a water pump and a water suction pipe, the first water pipe is fixedly installed on the inner wall of the cleaning cavity, the two second water pipes are fixedly connected with the first water pipe, the water inlet pipe is fixedly installed at the top of the first water pipe, the water inlet pipe penetrates through the inner wall of the top of the cleaning cavity, the water pump is fixedly installed at one side of the cleaning box, the water inlet end of the water inlet pipe is fixedly connected with the water outlet at the top of the water pump, and the water suction pipe is fixedly installed at the water inlet at the side of the water pump far away from the cleaning box.
4. The apparatus for improving the silver-plating yield of small-sized board and large-copper panel according to claim 1, it is characterized in that the transmission feeding device comprises a plurality of second transmission rods, a plurality of guide wheels, a plurality of first belt pulleys, a second motor, a second belt pulley and a belt, the plurality of second transmission rods are rotatably arranged on the inner walls of the two sides of the cleaning cavity, two ends of the plurality of second transmission rods extend to the outside of the cleaning box, the plurality of second belt pulleys are respectively and fixedly arranged at one end of the plurality of second transmission rods, the second motor is fixedly arranged on one side of the cleaning box and is positioned below the plurality of first belt pulleys, the second belt pulley is fixedly arranged on an output shaft of the second motor, and the belt is sleeved on the first belt pulleys and the second belt pulley.
5. The apparatus according to claim 2, wherein a first through hole is formed in an inner wall of a top of the cleaning chamber, a first bearing is fixedly installed in the first through hole, and an inner ring of the first bearing is fixedly sleeved on the first transmission rod.
6. The device for improving the silver coating yield of the small-sized plates and the large-copper panels as claimed in claim 3, wherein a plurality of nozzles are fixedly mounted at the bottoms of the first water pipe and the two second water pipes.
7. The apparatus for improving the silver-plating yield of small-sized plates and large-copper panels as claimed in claim 4, wherein a plurality of second through holes are formed on the inner walls of the two sides of the cleaning chamber, second bearings are fixedly mounted in the second through holes, and the inner rings of the second bearings are respectively fixedly sleeved on the second transmission rods.
8. The device for improving the silver-melting yield of the small-sized plates and the large-copper-faced plates as claimed in claim 1, wherein a water outlet is formed on the inner wall of the bottom of the arc-shaped water chute and is communicated with the water drain pipe.
9. The apparatus as claimed in claim 1, wherein a plurality of balls are embedded in the inner wall of the bottom of the discharge hole.
10. The device for improving the silver dissolving yield of the small-sized plates and the large-copper-face plates according to claim 1, wherein a fan is fixedly installed on one side, away from the feeding hole, of the cleaning box, an air pipe is fixedly installed at an air outlet at the bottom of the fan, an air channel is formed in the inner wall of the top of the discharging hole, and the air outlet end of the air pipe is fixedly connected with the air inlet end of the air channel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922063678.5U CN211938057U (en) | 2019-11-26 | 2019-11-26 | Device for improving silver melting yield of small-size board and large copper panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922063678.5U CN211938057U (en) | 2019-11-26 | 2019-11-26 | Device for improving silver melting yield of small-size board and large copper panel |
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| CN211938057U true CN211938057U (en) | 2020-11-17 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201922063678.5U Active CN211938057U (en) | 2019-11-26 | 2019-11-26 | Device for improving silver melting yield of small-size board and large copper panel |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111014134A (en) * | 2019-11-26 | 2020-04-17 | 奥士康科技股份有限公司 | Device for improving silver melting yield of small-size board and large copper panel |
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2019
- 2019-11-26 CN CN201922063678.5U patent/CN211938057U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111014134A (en) * | 2019-11-26 | 2020-04-17 | 奥士康科技股份有限公司 | Device for improving silver melting yield of small-size board and large copper panel |
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