CN211929464U - Large-size silicon wafer texturing bearing device - Google Patents

Abstract

The utility model provides a jumbo size silicon chip system fine hair bears device, including side lever subassembly and sill bar subassembly the side lever subassembly with the sill bar subassembly is between them: one of the two is wound with a first tooth groove, and the other is wound with a second tooth groove; or both the first tooth grooves are wound; or the first tooth grooves are wound; the first tooth grooves and the second tooth grooves are arranged along the side rod assembly and the bottom rod assembly in the length direction and are arranged towards the axis of the silicon wafer. The bearing device of the utility model can ensure that the silicon wafers are stably placed without adhesion, no liquid remains, the texturing uniformity of the silicon wafers is ensured, and the texturing effect is good; meanwhile, the probability of pressure basket alarming and machine fault shutdown can be effectively reduced, normal operation of the machine is guaranteed, production efficiency is high, universality is wide, structural design is simple, the silicon wafer distinguishing effect is good, and the silicon wafer distinguishing method is irrelevant to the size and the shape of a silicon wafer.

Description

Large-size silicon wafer texturing bearing device

Technical Field

The utility model belongs to solar energy level silicon chip making herbs into wool auxiliary device field especially relates to a jumbo size silicon chip making herbs into wool bears device.

Background

The process of texturing the solar-grade cell silicon wafer is to place the silicon wafer in a bearing device, remove a mechanical damage layer on the surface of the silicon wafer by utilizing alkaline corrosion in a texturing groove and form a pyramid-shaped textured surface. Along with the development of a photovoltaic market, the existing small-size silicon wafer has small effective area and low battery conversion rate, cannot meet the requirements of the market on reduction of production cost of a solar cell module and high power and high conversion rate, the size of the silicon wafer of a shingled battery is increased to increase a bearing device for placing the silicon wafer during texturing, the bearing device is simply increased along with the increase of the area of the large-size silicon wafer, the stability and the weight of the bearing device for placing the silicon wafer are correspondingly increased, the clamping stability of the silicon wafer cannot be ensured by using the existing clamping groove structures embedded in the side rods and the bottom rod, and the silicon wafer is easy to shake; the fragments are easy to generate; because the size area of the silicon wafer is large, the silicon wafer is easy to stick in the middle area once the silicon wafer is shaken, so that the texturing is not uniform, the texturing quality is unqualified, the conversion efficiency of the silicon wafer is seriously influenced, and the power of the assembly is low. Simultaneously, the draw-in groove of the embedded setting of side lever and low pole piles up liquid easily for the silicon chip is close to draw-in groove position and has remained liquid, causes the silicon chip edge effect of making herbs into wool poor, and the whole quality of silicon chip is influenced.

Chinese patent CN 208580719U-a trough type velvet making and discharging device, discloses a plurality of groups of velvet making and discharging devices for distinguishing left and right mounting plates, so that a manipulator can extract a velvet making basket in the correct direction, thereby reducing the probability of occurrence of basket pressing alarm and machine failure shutdown. The utility model provides an utilize different colours to spray about the mounting panel, or set up the sign the same with about the mounting panel in place, or add the sensor on about the mounting panel, all be the weight that directly or indirectly increases blowing device itself, and along with the increase of texturing time and the washing away of liquid stream, the differentiation sign that these add can drop or be out of order, can't accurately distinguish, lead to still can't effectively reducing the probability that basket was reported to the police and board trouble shut down, low in production efficiency and manufacturing cost are high.

SUMMERY OF THE UTILITY MODEL

In order to solve at least one technical problem in the prior art, the utility model provides a large-size silicon wafer texturing bearing device, which has simple structure, stable placement of the silicon wafer without adhesion and liquid residue, ensures the texturing uniformity of the silicon wafer, and has good texturing effect; meanwhile, the probability of pressure basket alarming and machine failure shutdown can be effectively reduced, normal operation of the machine is guaranteed, production efficiency is high, universality is wide, structural design is simple, the size and the shape of the silicon wafer are irrelevant, and distinguishing effect is good.

In order to solve the technical problem, the utility model discloses a technical scheme is:

a large size silicon wafer texturing carrier comprising a side bar assembly and a bottom bar assembly, in both of which:

one of the two is wound with a first tooth groove, and the other is wound with a second tooth groove;

or both the first tooth grooves are wound;

or the first tooth grooves are wound;

the first tooth grooves and the second tooth grooves are arranged along the side rod assembly and the bottom rod assembly in the length direction and are arranged towards the axis of the silicon wafer.

Further, first tooth's socket is mutually independent and is interrupted logical groove that the first tooth platform that sets up formed, first tooth platform side is the toper structure just the toper generating line is the pitch arc, first tooth platform root thickness is greater than its top thickness.

Further, the angle corresponding to the radian of the root part of the first tooth table is not less than 30 degrees and not more than 90 degrees.

Furthermore, the second tooth socket is a through groove formed by a second tooth table which is staggered and arranged independently, the side surface of the second tooth table is of a fan-shaped structure, and the fan-shaped cambered surface of the second tooth table is arranged back to back.

Further, the second gear table is arranged along the axis of the side rod assembly or the bottom rod assembly towards two sides; the thickness of the root part of the second tooth table is larger than that of the top part of the second tooth table.

Further, the first tooth table spacing is the same as the second tooth table spacing; the first and second tooth table heights are both greater than the first tooth table spacing.

Further, the first tooth table and the second tooth table are both vertically arranged in the axial direction of the side rod assembly or the bottom rod assembly.

Furthermore, the pressing rod is further included, and a plurality of first tooth grooves are wound on the axial outer wall of the pressing rod.

Further, still including arranging in the side lever subassembly with the end plate subassembly at bottom bar subassembly both ends the end plate subassembly up end is equipped with the recess, the recess with depression bar looks adaptation.

Furthermore, a plurality of through holes are formed in the two ends of the end plate assembly, and the through holes are not equal in number and are formed in the two ends of the end plate assembly.

Compared with the prior art, the bearing device designed by the utility model can ensure the stability of placing the silicon wafers, and the silicon wafers can not be bonded adjacently, and meanwhile, the clamping grooves contacted with the silicon wafers can not have liquid residue for storage, thereby ensuring the uniformity of silicon wafer texturing, having good texturing effect and high working efficiency; meanwhile, under the condition that the strength of the end plates of the bearing device is not changed, through holes with different numbers are designed on the end plates on the two sides and used as marks for distinguishing the end plates on the two sides, the whole weight of the bearing device can be reduced, the probability of pressure basket alarming and machine fault shutdown can be effectively reduced along with the prolonging of the texturing time, the normal operation of a machine is guaranteed, the production efficiency is high, the universality is wide, the structural design is simple, the size and the shape of a silicon wafer are irrelevant, and the distinguishing effect is good.

Drawings

Fig. 1 is a schematic structural diagram of a carrying device according to a first embodiment of the present invention;

fig. 2 is an enlarged view of a portion a of the first tooth space according to an embodiment of the present invention;

FIG. 3 is a schematic cross-sectional view of a first tooth table and side bar of an embodiment of the present invention;

fig. 4 is a schematic cross-sectional view of a second tooth table and bottom bar of an embodiment of the present invention;

fig. 5 is a schematic structural diagram of a compression bar according to an embodiment of the present invention;

fig. 6 is a schematic structural view of a left end plate according to an embodiment of the present invention;

fig. 7 is a schematic structural view of a right side end plate according to an embodiment of the present invention;

fig. 8 is a schematic structural view of a left end plate according to another embodiment of the present invention;

fig. 9 is a schematic structural diagram of a carrying device according to a second embodiment of the present invention;

fig. 10 is a schematic structural diagram of a carrying device according to a third embodiment of the present invention;

fig. 11 is a schematic structural diagram of a bearing device according to a fourth embodiment of the present invention.

In the figure:

100. side bar assembly 110, side bar 120, first tooth slot

130. First tooth table 200, bottom rod assembly 210 and bottom rod

220. Second tooth space 230, second tooth platform 300 and compression bar

400. End plate assembly 410, left end plate 411, through hole

412. Through hole 420, right end plate 421, through hole

430. Groove 440 and clamping groove

Detailed Description

According to the solar photovoltaic use characteristics, in order to maximally utilize the splicing area of the auxiliary materials (component glass), the battery silicon wafer is generally designed into a square structure. In order to improve the effective area of the silicon wafer and the conversion rate of the battery, the size of the texturing silicon wafer is gradually changed from 100-125mm with small size to 200-210mm with large size, accordingly, a bearing device suitable for the large-size texturing silicon wafer needs to be designed, the silicon wafer can be stably placed, the silicon wafer can be prevented from being adhered and pasted due to the increase of the area of the silicon wafer, no liquid residue exists, meanwhile, the end plates on two sides can be distinguished, the texturing quality of the silicon wafer is guaranteed, the texturing effect is improved, the production efficiency is high, and the production cost is reduced.

The present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.

The first embodiment is as follows:

the embodiment provides a large-size silicon wafer texturing bearing device, as shown in fig. 1, which comprises a side rod assembly 100, a bottom rod assembly 200 and an end plate assembly 300 arranged at two ends of the side rod assembly 100 and the bottom rod assembly 200, wherein the side rod assembly 100 comprises a plurality of side rods 110, the bottom rod assembly 200 comprises a plurality of bottom rods 210, the end plate assembly 400 comprises a left end plate 410 and a right end plate 420, wherein the outer walls of the side rods 110 are wound with first tooth sockets 120, the outer walls of the bottom rods 210 are wound with second tooth sockets 220, and the first tooth sockets 120 and the second tooth sockets 220 are respectively arranged side by side along the axial length directions of the side rods 110 and the bottom rods 210 and are both arranged towards the axial direction of silicon wafers.

Because the silicon chip area is great, the silicon chip of vertical placing teaches its matte effect, for guaranteeing the silicon chip is vertical places the even of atress, on two sides in the load-bearing device, need a set of side lever 110 that the counterpoint set up at least, the bottom is equipped with two symmetries at least and the sill bar 210 that sets up side by side. Specifically, in the present embodiment, two sets of side rods 110 and two bottom rods 210 are provided, and the structural distribution of the side rods 110 and the bottom rods 210 can be determined according to the side length of the silicon wafer, which is not particularly limited herein.

As shown in fig. 2, the first tooth spaces 120 are mutually independent and are formed by the first tooth platforms 130 which are discontinuously arranged, the first tooth spaces are uniformly distributed in the length direction of the side bars 110, and the average level faces the middle vertical axis direction of the silicon wafer, namely, the first tooth spaces 120 on all the side bars 110 are horizontally arranged, meanwhile, the first tooth spaces 120 in the side bars 110 which are oppositely arranged at two sides are oppositely arranged along the aligning direction of the silicon wafer and are oppositely arranged from top to bottom, and the first tooth spaces 120 in the side bars 110 which are arranged at the same side are vertically arranged, so that the silicon wafer is more easily clamped and fixed by the first tooth spaces 120 which are arranged in the structure, and the stability of the silicon wafer is ensured.

Specifically, as shown in fig. 3, as can be seen from the structure that the first tooth platform 130 is matched with the side bar 110, the side surface of the first tooth platform 130 is of a conical structure, the conical generatrix is an arc line, the thickness of the root part of the first tooth platform 130 is greater than the thickness of the top part of the first tooth platform, and accordingly, the width of the gap between the cross section of the first tooth socket 120 and the side close to the side bar 110 gradually increases from narrow to wide, which not only facilitates the insertion and the taking of the silicon wafer, but also increases the area of the fixed contact between the silicon wafer and the first tooth socket 120, and increases the stability. First tooth table 130 all is perpendicular to side lever 110's axis direction setting, the tooth pitch is the same and mutual independence sets up, and then make first tooth's socket 120 lead to the groove for the smooth clearance that sets up along side lever 110's outer wall, make the making herbs into wool liquid difficult at first tooth's socket 120 storage like this, also difficult storage making herbs into wool liquid between first tooth's socket 120 and silicon chip simultaneously, and then can guarantee that the silicon chip is close to the effect of making herbs into wool of side lever 110 one side, make the whole making herbs into wool of silicon chip even and the uniformity good.

Further, the angle theta corresponding to the root radian of the first tooth table 130 is not smaller than 30 degrees and not larger than 90 degrees, because if the angle theta corresponding to the root radian is smaller than 30 degrees, the contact area of the whole first tooth table 130 and the side surface of the silicon wafer is small, the stability of placing the silicon wafer can be reduced, the silicon wafer placing and clamping is unstable, and the risk of shaking the silicon wafer is improved. Therefore, preferably, the angle θ corresponding to the radian of the root of the first tooth table 130 is not less than 30 °, so that not only the contact area between the root and the side bar is increased, but also the connection strength between the first tooth table 130 and the side bar 110 is high, and the contact area between the first tooth table 130 and the side face of the silicon wafer is increased, thereby maximally improving the stability of the silicon wafer placed in the first tooth groove 120, ensuring the clamping strength of the silicon wafer in texturing placement, reducing the probability of fragments generated by shaking, and improving the safety of the silicon wafer placement.

Further, as shown in fig. 2, the second tooth socket 220 is a gap through slot formed by a plurality of second tooth platforms 230 arranged in a staggered manner, the second tooth sockets 220 are radially arranged around the outer wall of the bottom rod 210 and are perpendicular to the axis of the bottom rod 210, and all the second tooth sockets 220 on the bottom rod 210 arranged side by side are vertically arranged upwards. On each bottom rod 210, the second tooth platforms 230 are respectively arranged along the length axis of the bottom rod 210 in a staggered and uniform manner towards two sides of the axis, the side edges of the second tooth platforms 230 can be arranged in a staggered and overlapped area, or arranged along the length axis of the bottom rod 210 in a staggered and staggered manner, in this embodiment, the side edges of the second tooth platforms 230 are arranged along the length axis of the bottom rod 210 in a flush manner, and the width of the adjacent second tooth platforms 230 is distributed along the length direction of the diameter of the bottom rod 210. The second tooth spaces 230 on the adjacent bottom rods 210 are symmetrically arranged relative to the length center line of the bearing device, the second tooth spaces 220 formed by the structure can increase the clamping density of the silicon wafers, further improve the balance degree of the placement of the silicon wafers on the bottom rods 210, meanwhile, the second tooth spaces 220 which are staggered and symmetrically arranged can further increase the stability of the vertical placement of the silicon wafers, and the second tooth spaces 210 designed by the structure also furthest reduce the number of the second tooth spaces 230 and further reduce the residue of the texturing liquid on the second tooth spaces 220.

As shown in fig. 4, the side surface of the second tooth table 230 is a fan-shaped structure, one side of the second tooth table is arranged around the outer wall of the bottom rod 210, the width of the side is the radius of the bottom rod 210, the other side of the second tooth table is arranged perpendicular to the outer wall of the bottom rod 210, and the fan-shaped arc surface of the adjacent second tooth table 210 is arranged back to back. The thickness of the root of the second tooth table 230 is greater than the thickness of the top of the second tooth table, so that the stability of connection between the second tooth table 230 and the bottom rod 210 can be ensured, the clamping strength of the second tooth groove 220 and the silicon wafer can be further ensured, and the stability of placing the silicon wafer can be improved. The second tooth socket 220 formed by the second tooth platforms 230 arranged in a staggered and crossed manner reduces the arrangement density of the second tooth platforms 230 to the maximum extent on the premise of ensuring the stability of the placement of the silicon wafer, thereby not only reducing the connection area in contact with the silicon wafer, but also reducing the contact area between the second tooth platforms 230 and the bottom rod 220, and further reducing the overall weight of the bottom rod assembly 200.

The pitch of the second tooth platform 230 is the same as the pitch of the first tooth platform 120, that is, the pitch of the second tooth slot 220 is the same as the pitch of the first tooth slot 120, and the height of the first tooth platform 120 and the height of the second tooth platform 220 are both greater than the pitch of the first tooth platform 120. The first tooth grooves 120 and the second tooth grooves 220 are correspondingly arranged, and the first tooth grooves 120 and the second tooth grooves 220 with two different structures are matched together, so that the vertically placed silicon wafer is well clamped and high in stability, and the silicon wafer is not easy to shake in the texturing process; meanwhile, the tooth grooves which are uniformly arranged at intervals can further prevent adjacent silicon wafers from being adhered, so that the texturing uniformity of the silicon wafers can be ensured, and the fragment rate of the silicon wafers can be further reduced; the first tooth grooves 120 and the second tooth grooves 220 which are respectively arranged on the outer walls of the side rods 110 and the bottom rods 210 are smooth through grooves, so that the texturing liquid can be completely flowed out, and is not easy to store in the first tooth grooves 120 and between the first tooth grooves 120 and the silicon wafer, and further the texturing effect of the silicon wafer close to one side of the side rods 110 is uniform and consistent with the texturing effect of the whole silicon wafer, the integral texturing effect of the silicon wafer is protected, and the working efficiency is improved.

In this embodiment, a plurality of sections of the first tooth grooves 130 and the second tooth grooves 230 which are correspondingly arranged up and down can be distributed on the side bars 120 and the bottom bar 210 to meet the requirements of placing different silicon wafers, the middle connection position is set to be vacant, and can also be marked by a scale partition (omitted in the figure), the number of the first tooth grooves 130 and the number of the second tooth grooves 230 on each section can be the same or different, and the arrangement is within the protection scope of the present application according to the requirements.

Further, the silicon wafer texturing machine further comprises a pressing rod 300, as shown in fig. 5, a plurality of first tooth grooves 120 are wound on the axial outer wall of the pressing rod 300, the first tooth grooves 120 on the pressing rod 300 are arranged corresponding to the first tooth grooves 120 on the vertically arranged side rods 110 and the second tooth grooves 220 on the bottom rod 210, and the pressing rod 300 is matched with a groove 430 arranged on the upper end face of the end plate assembly 400 and used for pressing a silicon wafer to prevent the silicon wafer from being impacted by water flow to be separated from the tooth grooves and clamped in the texturing process.

As shown in fig. 6 and 7, the left end plate 410 and the right end plate 420 are provided with a groove 430 at the same position on the upper end surface for fitting with the pressing rod 300. In order to ensure that the positions of the left end plate 410 and the right end plate 420 can be distinguished without changing the shape structures of the left end plate 410 and the right end plate 420, a plurality of through holes with different shapes can be respectively arranged on the left end plate 410 and the right end plate 420, and the number of the through holes on the left end plate 410 and the right end plate 420 is different from each other, so that the positions of the left end plate 410 and the right end plate 420 can be ensured to be distinguished. In this embodiment, two through holes are selected to be formed in the left end plate 410, a through hole 411 with a large aperture is formed in the middle of the left end plate, and three through holes 412 are uniformly formed on the circumference concentric with the through hole 411; the right end plate 420 is provided with only through holes 421 at the same positions as the through holes 411, and the through holes 411, 412 and 411 may be circular, triangular or polygonal, as long as the left end plate 410 and the right end plate 420 can be distinguished. This set up different quantity through-hole structure as distinguishing the sign at both sides end plate, not only can alleviate and bear the holistic weight of device, but also can effectively reduce the probability that basket was reported to the police and the board trouble was shut down along with the extension of flocking time, guarantee board normal operating, production efficiency is high, and the universality is wide, and structural design is simple, and is irrelevant with the size and the shape of silicon chip, distinguishes effectually.

For a square silicon wafer, the height of the groove 430 of the left end plate 410 and the right end plate 420 is the same as the height of the two slots 440 for the robot to grasp and fit and disposed on the two sides of the groove 430, as shown in fig. 6 and 7.

In order to further save silicon wafer texturing time and improve texturing efficiency, a square silicon wafer can be divided into two parts, and two identical rectangular silicon wafers are cut for texturing, under the condition that the integral matching structure of the original bearing device is not changed greatly, the positions of the side rod assembly 100 and the bottom rod assembly 200 are only required to be correspondingly adjusted relative to the size of the rectangular silicon wafer, then the positions of the clamping grooves 440 in the left end plate 410 and the right end plate 420 can be correspondingly lowered downwards, the height of the grooves 430 is increased, the rectangular silicon wafers can be textured, other structures are not changed, the structure of the left end plate 410 is shown in fig. 8, and the structure diagram of the right end plate 420 is omitted.

Example two:

as shown in fig. 9, compared with the first embodiment, the greatest difference between the first embodiment and the second embodiment is that the side bar assembly 100 is wound with the second tooth groove 220, the lower bar assembly 200 is wound with the first tooth groove 120, and the bearing device of the structure is formed by the second tooth groove 220 horizontally aligned on the side surface and the first tooth groove 120 vertically upward arranged on the bottom surface cooperating together to form a slot for placing a silicon wafer, so as to ensure stable clamping of the vertically placed silicon wafer, prevent the silicon wafer from shaking, and prevent the adjacent silicon wafers from adhering to each other, thereby not only ensuring the texturing uniformity of the silicon wafer, but also further reducing the fragment rate of the silicon wafer; first tooth's socket 120 and the second tooth's socket 220 logical groove of smooth design can make the system fine hair liquid completely flowed out, avoids having liquid to remain the storage, and then can make the effect of making fine hair that the silicon chip is close to side lever 110 one side evenly unanimous with the effect of whole silicon chip system fine hair, and the whole effect of making fine hair of protection silicon chip improves work efficiency.

Example three:

as shown in fig. 10, compared with the first embodiment, the biggest difference between the first embodiment and the second embodiment is that the first tooth spaces 120 are wound on the side bar assemblies 100 and the lower bar assemblies 200, so that the areas of the silicon wafers contacting with the first tooth spaces 120 are increased, the silicon wafers can be placed more stably, the yield of the silicon wafers can be further improved due to the stable placement of the silicon wafers, the probability of bonding the silicon wafers can be reduced, the texturing effect of the silicon wafers can be improved, and the texturing quality can be ensured.

Example four:

as shown in fig. 11, compared with the first embodiment, the greatest difference between the first embodiment and the second embodiment is that the second tooth grooves 220 are wound on the side bar assembly 100 and the lower bar assembly 200, and this structure ensures that the silicon wafer and the second tooth grooves 220 are integrally and stably matched under the condition that the clamping point of the silicon wafer and the second tooth grooves 220 is not changed, so as to reduce the contact area between the second tooth table 230 and the side bar 120 and the bottom bar 220, thereby reducing the overall weight of the bearing device; when guaranteeing that the silicon chip is placed stably, the fragmentation rate of the silicon chip can be further reduced, and the probability of silicon chip bonding can be reduced, thereby guaranteeing the texturing effect of the silicon chip and improving the production efficiency.

The utility model provides a large-size silicon wafer texturing bearing device, which can ensure the stability of placing silicon wafers, can not be adjacently bonded, and can not leave liquid in a clamping groove contacted with the silicon wafers for storage, thereby ensuring the uniformity of silicon wafer texturing, having good texturing effect and high working efficiency; meanwhile, under the condition that the strength of the end plates of the bearing device is not changed, through holes with different quantities are designed in the end plates on the two sides and used as marks for distinguishing the end plates on the two sides, the overall weight of the bearing device can be reduced, the probability of pressure basket alarming and machine fault shutdown can be effectively reduced along with the prolongation of the texturing time, the normal operation of a machine is guaranteed, the production efficiency is high, the universality is wide, the structural design is simple, and the distinguishing effect is good.

The embodiments of the present invention have been described in detail, and the description is only for the preferred embodiments of the present invention, and should not be construed as limiting the scope of the present invention. All the equivalent changes and improvements made according to the application scope of the present invention should still fall within the patent coverage of the present invention.

Claims (10)

1. A large-size silicon wafer texturing bearing device is characterized by comprising a side rod assembly and a bottom rod assembly, wherein in the side rod assembly and the bottom rod assembly:

one of the two is wound with a first tooth groove, and the other is wound with a second tooth groove;

or both the first tooth grooves are wound;

or the first tooth grooves are wound;

the first tooth grooves and the second tooth grooves are arranged along the side rod assembly and the bottom rod assembly in the length direction and are arranged towards the axis of the silicon wafer.

2. The large-size silicon wafer texturing bearing device according to claim 1, wherein the first tooth spaces are through grooves formed by first tooth platforms which are arranged intermittently and independently from each other, the side surfaces of the first tooth platforms are of a conical structure, the conical generatrix is an arc line, and the thickness of the root parts of the first tooth platforms is larger than that of the top parts of the first tooth platforms.

3. The large-size silicon wafer texturing bearing device according to claim 2, wherein the radian of the root of the first tooth table corresponds to an angle not less than 30 degrees.

4. The large-size silicon wafer texturing bearing device according to claim 2 or 3, wherein the second tooth spaces are through grooves formed by second tooth platforms which are staggered and arranged independently, the side surfaces of the second tooth platforms are of fan-shaped structures, and the fan-shaped cambered surfaces of the adjacent second tooth platforms are arranged in a back-to-back mode.

5. The large-size silicon wafer texturing bearing device according to claim 4, wherein the second gear racks are arranged along the axes of the side bar assemblies or the bottom bar assemblies towards two sides; the thickness of the root part of the second tooth table is larger than that of the top part of the second tooth table.

6. The large-size silicon wafer texturing bearing device according to claim 5, wherein the first tooth stage pitch is the same as the second tooth stage pitch; the first and second tooth table heights are both greater than the first tooth table spacing.

7. The large-size silicon wafer texturing bearing device according to claim 6, wherein the first tooth table and the second tooth table are vertically arranged in the axial direction of the side bar assembly or the bottom bar assembly.

8. The large-size silicon wafer texturing bearing device according to any one of claims 2 to 3 and 5 to 7, further comprising a pressing rod, wherein the axial outer wall of the pressing rod is wound with a plurality of first tooth grooves.

9. The large-size silicon wafer texturing bearing device according to claim 8, further comprising end plate assemblies arranged at two ends of the side rod assemblies and the bottom rod assemblies, wherein grooves are formed in the upper end faces of the end plate assemblies and are matched with the pressing rods.

10. The large-size silicon wafer texturing bearing device according to claim 9, wherein a plurality of through holes are formed at both ends of the end plate assembly, and the number of the through holes formed at both ends of the end plate assembly is different.

Images