CN211891499U

CN211891499U - Semiconductor wafer cutting equipment

Info

Publication number: CN211891499U
Application number: CN201922491390.8U
Authority: CN
Inventors: 张树凡; 朱水明
Original assignee: Shenzhen He Li Xin Electronic Equipment Co ltd
Current assignee: Shenzhen He Li Xin Electronic Equipment Co ltd
Priority date: 2019-12-30
Filing date: 2019-12-30
Publication date: 2020-11-10
Anticipated expiration: 2029-12-30

Abstract

The utility model discloses a cutting equipment of semiconductor wafer, which comprises a mounting platform, wafer cutting mechanism, the tight rotary mechanism of wafer clamp, wafer bearing positioning mechanism, the articulated seat of cutting mechanism, the cutting mechanism articulated shaft, cutting mechanism swing cylinder, the cylinder connector, wafer cutting mechanism includes cutting mechanism mounting bracket and cutting driving motor, cutter installation axle, cutting driving motor's output is provided with cutting initiative synchronizing wheel, the one end of cutter installation axle is provided with cutting driven synchronizing wheel, around being equipped with the cutting hold-in range between cutting initiative synchronizing wheel and the cutting driven synchronizing wheel, the other end of cutter installation axle is provided with the cutter mounting disc, install the wafer cutter on the cutter mounting disc, cutting driving motor accessible cutting initiative synchronizing wheel, cutting driven synchronizing wheel and cutting hold-in range drive wafer cutter rotate. The semiconductor wafer cutting equipment has the advantages of simple structure, stable and reliable performance, low implementation cost, high cutting efficiency, convenience for automatic popularization, good safety and the like.

Description

Semiconductor wafer cutting equipment

Technical Field

The utility model relates to a cutting mechanism, especially a cutting equipment of semiconductor wafer.

Background

Cutting equipment is a common equipment applied to various construction and production fields. In the field of semiconductor wafer cutting, the existing cutting equipment generally has the defects of complex structure, low automation degree and the like due to the limitation of structure or design, so that the cutting efficiency is further low, and the labor cost is high; in addition, because the existing cutting equipment needs a plurality of processes of manual participation, the potential safety hazard is inevitably increased.

Therefore, the present invention is directed to provide a new technical solution to solve the existing technical drawbacks.

SUMMERY OF THE UTILITY MODEL

In order to overcome the not enough of prior art, the utility model provides a cutting equipment of semiconductor wafer has solved the degree of automation that prior art exists and has hanged down, cut inefficiency, the cost of labor is high, the potential safety hazard technical defect such as big.

The utility model provides a technical scheme that its technical problem adopted is:

a semiconductor wafer cutting device comprises a mounting platform, a wafer cutting mechanism, a wafer clamping and rotating mechanism and a wafer bearing and positioning mechanism, wherein the wafer cutting mechanism is arranged on the mounting platform through a cutting mechanism hinged seat and a cutting mechanism hinged shaft, the bottom of the mounting platform is hinged with a cutting mechanism swinging cylinder, the output end of the cutting mechanism swinging cylinder is hinged and connected with the rear end of the wafer cutting mechanism through a cylinder connector, the wafer cutting mechanism comprises a cutting mechanism mounting frame arranged on the cutting mechanism hinged shaft, a cutting driving motor arranged on the cutting mechanism mounting frame and a cutter mounting shaft, the output end of the cutting driving motor is provided with a cutting driving synchronizing wheel, one end of the cutter mounting shaft is provided with a cutting driven synchronizing wheel, and a cutting synchronizing belt is wound between the cutting driving synchronizing wheel and the cutting driven synchronizing wheel, the other end of cutter installation axle is provided with the cutter mounting disc, install the wafer cutter on the cutter mounting disc, cutting driving motor accessible cutting initiative synchronizing wheel, cutting driven synchronizing wheel and cutting hold-in range drive the wafer cutter and rotate.

As a further improvement of the technical scheme, the cutting driving motor is installed on the cutting mechanism installation frame through the cutting motor flange seat, and the cutter installation shaft is installed on the cutting mechanism installation frame through the cutter installation shaft flange seat.

As a further improvement of the above technical scheme, the bottom of the cutting mechanism mounting rack is provided with a hinged shaft fixing seat, the hinged shaft of the cutting mechanism is fixed on the hinged shaft fixing seat through a fixing pin, and the hinged shaft of the cutting mechanism is installed on the hinged seat of the cutting mechanism through a hinged shaft bearing and a hinged shaft bearing seat.

As a further improvement of the technical scheme, a cutter protective cover is arranged on the side part of the cutting mechanism mounting frame and used for shielding the upper part of the wafer cutter.

As a further improvement of the above technical scheme, the tight rotary mechanism of wafer clamp includes a rotatory installation section of thick bamboo, rotary driving motor and the speed reducer of direct or indirect on mounting platform, rotatory sleeve is installed through the rotation bearing to the inside of rotatory installation section of thick bamboo, rotary driving motor's output is connected to the input of speed reducer, the output of speed reducer is provided with rotatory initiative synchronizing wheel, rotatory driven synchronizing wheel is installed to rotatory telescopic one end, around being equipped with rotatory hold-in range between rotatory initiative synchronizing wheel and the rotatory driven synchronizing wheel, the fixed wafer clamping device that is provided with in rotatory sleeve front end, rotatory driving motor accessible speed reducer, rotatory initiative synchronizing wheel, rotatory driven synchronizing wheel and rotatory hold-in range drive rotatory sleeve and wafer clamping device and rotate.

As the further improvement of above-mentioned technical scheme, wafer bearing positioning mechanism includes the bearing location platform, the last movable sleeve of bearing location platform is equipped with spacing bolt, the lower tip threaded connection of spacing bolt in on the mounting platform, the part cover that lies in between mounting platform and the bearing location bench wall surface on the spacing bolt is equipped with the elastic support spring, the fixed bearing positioning seat that is provided with on the bearing positioning platform, the last inverted triangle-shaped bearing positioning groove that has of bearing positioning seat.

As a further improvement of the technical scheme, the wafer cutting device further comprises a product returning mechanism, and the product returning mechanism is used for pushing the cut wafer out of the device.

As a further improvement of the technical scheme, the mounting platform is further provided with a cutting scrap downward-leaking through groove, and the bottom of the cutting scrap downward-leaking through groove is provided with a cutting scrap collecting device.

The utility model has the advantages that: the utility model provides a cutting equipment of semiconductor wafer, this kind of cutting equipment of semiconductor wafer are provided with wafer cutting mechanism, the tight rotary mechanism of wafer clamp and wafer bearing positioning mechanism, through wafer cutting mechanism, the tight rotary mechanism of wafer clamp and wafer bearing positioning mechanism can realize the automatic cutting work of wafer, can have effectively to promote cutting efficiency when using, have greatly reduced cost of labor and workman's intensity of labour, have reduced artifical participation's process, have further promoted the security.

In a word, the cutting equipment for the semiconductor wafer solves the technical defects of low automation degree, low cutting efficiency, high labor cost, large potential safety hazard and the like in the prior art.

Drawings

The present invention will be further explained with reference to the drawings and examples.

FIG. 1 is a schematic assembly view of the present invention;

FIG. 2 is a schematic view of another angle of the present invention;

fig. 3 is an assembly diagram of the wafer cutting mechanism of the present invention;

fig. 4 is a structural exploded view of the wafer cutting mechanism of the present invention;

fig. 5 is an assembly schematic view of the wafer clamping and rotating mechanism of the present invention;

fig. 6 is an assembly schematic diagram of the middle wafer bearing and positioning mechanism of the present invention.

Detailed Description

The conception, the specific structure, and the technical effects produced by the present invention will be clearly and completely described below in conjunction with the embodiments and the accompanying drawings to fully understand the objects, the features, and the effects of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all embodiments, and other embodiments obtained by those skilled in the art without inventive labor based on the embodiments of the present invention all belong to the protection scope of the present invention. In addition, all the connection/connection relations referred to in the patent do not mean that the components are directly connected, but mean that a better connection structure can be formed by adding or reducing connection auxiliary components according to specific implementation conditions. The technical features of the present invention can be combined interactively without conflicting with each other, as shown in fig. 1 to 6.

The cutting equipment of the semiconductor wafer comprises a mounting platform 1, a wafer cutting mechanism 2, a wafer clamping and rotating mechanism 3 and a wafer bearing and positioning mechanism 4, wherein the wafer cutting mechanism 2, the wafer clamping and rotating mechanism 3 and the wafer bearing and positioning mechanism 4 are arranged on the mounting platform 1, the wafer cutting mechanism 2 is hinged and mounted on the mounting platform 1 through a cutting mechanism hinged seat 11 and a cutting mechanism hinged shaft 21, the bottom of the mounting platform 1 is hinged and mounted with a cutting mechanism swinging cylinder 5, the output end of the cutting mechanism swinging cylinder 5 is hinged and connected to the rear end of the wafer cutting mechanism 2 through a cylinder connector 51, the wafer cutting mechanism 2 comprises a cutting mechanism mounting frame 22 mounted on the cutting mechanism hinged shaft 21, a cutting driving motor 23 and a cutter mounting shaft 24 which are arranged on the cutting mechanism mounting frame 22, the output end of the cutting driving motor 23 is provided with a cutting driving synchronizing wheel 251, and one end of the, a cutting synchronous belt 253 is wound between the cutting driving synchronous wheel 251 and the cutting driven synchronous wheel 252, a cutter mounting disc is arranged at the other end of the cutter mounting shaft 24, a wafer cutter 26 is mounted on the cutter mounting disc, and the cutting driving motor 23 can drive the wafer cutter 26 to rotate through the cutting driving synchronous wheel 251, the cutting driven synchronous wheel 252 and the cutting synchronous belt 253.

Preferably, the cutting driving motor 23 is mounted on the cutting mechanism mounting frame 22 through a cutting motor flange seat 231, and the cutting knife mounting shaft 24 is mounted on the cutting mechanism mounting frame 22 through a cutting knife mounting shaft flange seat 241.

Preferably, the bottom of the cutting mechanism mounting frame 22 is provided with a hinge shaft fixing seat 27, the cutting mechanism hinge shaft 21 is fixed on the hinge shaft fixing seat 27 through a fixing pin 211, and the cutting mechanism hinge shaft 21 is installed on the cutting mechanism hinge seat 11 through a hinge shaft bearing 212 and a hinge shaft bearing seat 213.

Preferably, a cutter shield 261 is disposed at a side of the cutting mechanism mounting frame 22, and the cutter shield 261 is used for shielding the upper part of the wafer cutter 26.

Preferably, the wafer clamping and rotating mechanism 3 comprises a rotary mounting cylinder 31 directly or indirectly arranged on the mounting platform 1, a rotary driving motor 32 and a speed reducer 33, a rotary sleeve 34 is arranged in the rotary mounting cylinder 31 through a rotary bearing, the output end of the rotary driving motor 32 is connected to the input end of a speed reducer 33, the output end of the speed reducer 33 is provided with a rotary driving synchronizing wheel 351, one end of the rotary sleeve 34 is provided with a rotary driven synchronizing wheel 352, a rotary synchronous belt 353 is wound between the rotary driving synchronous wheel 351 and the rotary driven synchronous wheel 352, the front end of the rotating sleeve 34 is fixedly provided with a wafer clamping device 36, and the rotating driving motor 32 can drive the rotating sleeve 34 and the wafer clamping device 36 to rotate through the speed reducer 33, the rotating driving synchronizing wheel 351, the rotating driven synchronizing wheel 352 and the rotating synchronous belt 353.

Preferably, the wafer bearing and positioning mechanism 4 includes a bearing and positioning table 41, a limiting bolt 42 is movably sleeved on the bearing and positioning table 41, the lower end of the limiting bolt 42 is in threaded connection with the mounting platform 1, an elastic supporting spring 43 is sleeved on the limiting bolt 42 and is positioned between the bottom wall surfaces of the mounting platform 1 and the bearing and positioning table 41, a bearing and positioning seat 44 is fixedly arranged on the bearing and positioning table 41, and an inverted triangle bearing and positioning groove 441 is formed in the bearing and positioning seat 44.

Preferably, a product reject mechanism 6 is further included, said product reject mechanism 6 being adapted to push the cut wafers out of the apparatus.

Preferably, the mounting platform 1 is further provided with a cutting scrap downward-leaking through groove, and the bottom of the cutting scrap downward-leaking through groove is provided with a cutting scrap collecting device.

When the utility model is implemented specifically, a wafer to be cut is put into the wafer clamping and rotating mechanism 3 and is clamped for waiting for processing, and after the equipment starts to work, the wafer clamping and rotating mechanism 3 drives the wafer to rotate, forwards conveys a preset length and positions the wafer on the wafer bearing and positioning mechanism 4; after the wafer is conveyed in place, the cutting mechanism swinging cylinder 5 drives the wafer cutting mechanism 2 to swing and enables the wafer cutter 26 to reach the position for cutting the wafer, in the process, the cutting driving motor 23 can drive the wafer cutter 26 to rotate through the cutting driving synchronizing wheel 251, the cutting driven synchronizing wheel 252 and the cutting synchronizing belt 253 and realize the cutting work on the wafer, after the cutting is finished, the cutting driving motor 23 stops, and the cutting mechanism swinging cylinder 5 drives the wafer cutting mechanism 2 to reset; after the wafer cutting mechanism 2 is reset, the wafer which is cut off by the product material returning mechanism 6 is sent out of the equipment. So far, the wafer cutting process is accomplished in proper order, and the automatic cutting just can constantly be realized to above-mentioned process of constantly circulating, has advantages such as cutting efficiency height, degree of automation height, security height.

While the preferred embodiments of the present invention have been described, the present invention is not limited to the above embodiments, and those skilled in the art can make various equivalent modifications or substitutions without departing from the spirit of the present invention, and such equivalent modifications or substitutions are intended to be included within the scope of the present invention as defined by the appended claims.

Claims

1. Cutting equipment of semiconductor wafer, its characterized in that: comprises a mounting platform (1) and a wafer cutting mechanism (2), a wafer clamping and rotating mechanism (3) and a wafer bearing and positioning mechanism (4) which are arranged on the mounting platform (1), wherein the wafer cutting mechanism (2) is hinged and mounted on the mounting platform (1) through a cutting mechanism hinged seat (11) and a cutting mechanism hinged shaft (21), the bottom of the mounting platform (1) is hinged and mounted with a cutting mechanism swinging cylinder (5), the output end of the cutting mechanism swinging cylinder (5) is hinged and connected with the rear end of the wafer cutting mechanism (2) through a cylinder connector (51), the wafer cutting mechanism (2) comprises a cutting mechanism mounting frame (22) mounted on the cutting mechanism hinged shaft (21) and a cutting driving motor (23) and a cutter mounting shaft (24) which are arranged on the cutting mechanism mounting frame (22), the output end of the cutting driving motor (23) is provided with a cutting driving synchronizing wheel (251), the one end of cutter installation axle (24) is provided with cutting driven synchronizing wheel (252), around being equipped with cutting hold-in range (253) between cutting initiative synchronizing wheel (251) and the cutting driven synchronizing wheel (252), the other end of cutter installation axle (24) is provided with the cutter mounting disc, install wafer cutter (26) on the cutter mounting disc, cutting driving motor (23) accessible cutting initiative synchronizing wheel (251), cutting driven synchronizing wheel (252) and cutting hold-in range (253) drive wafer cutter (26) and rotate.

2. The apparatus for dicing a semiconductor wafer according to claim 1, characterized in that: the cutting driving motor (23) is installed on the cutting mechanism installation frame (22) through a cutting motor flange seat (231), and the cutting knife installation shaft (24) is installed on the cutting mechanism installation frame (22) through a cutting knife installation shaft flange seat (241).

3. The apparatus for dicing a semiconductor wafer according to claim 1, characterized in that: cutting mechanism mounting bracket (22) bottom is provided with articulated shaft fixing base (27), cutting mechanism articulated shaft (21) are fixed through fixed pin (211) on articulated shaft fixing base (27), install cutting mechanism articulated shaft (21) through articulated shaft bearing (212) and articulated shaft bearing frame (213) on the articulated seat of cutting mechanism (11).

4. The apparatus for dicing a semiconductor wafer according to claim 1, characterized in that: the cutting mechanism mounting frame (22) lateral part is provided with cutter protection casing (261), cutter protection casing (261) are used for sheltering from wafer cutter (26) upper portion.

5. The apparatus for dicing a semiconductor wafer according to claim 1, characterized in that: the wafer clamping and rotating mechanism (3) comprises a rotating installation cylinder (31), a rotating driving motor (32) and a speed reducer (33) which are directly or indirectly arranged on an installation platform (1), wherein a rotating sleeve (34) is installed inside the rotating installation cylinder (31) through a rotating bearing, the output end of the rotating driving motor (32) is connected to the input end of the speed reducer (33), a rotating driving synchronous wheel (351) is arranged at the output end of the speed reducer (33), a rotating driven synchronous wheel (352) is installed at one end of the rotating sleeve (34), a rotating synchronous belt (353) is arranged between the rotating driving synchronous wheel (351) and the rotating driven synchronous wheel (352) in a winding mode, a wafer clamping device (36) is fixedly arranged at the front end of the rotating sleeve (34), and the rotating driving motor (32) can pass through the speed reducer (33), the rotating driving synchronous wheel (351), The driven rotating synchronous wheel (352) and the rotating synchronous belt (353) drive the rotating sleeve (34) and the wafer clamping device (36) to rotate.

6. The apparatus for dicing a semiconductor wafer according to claim 1, characterized in that: wafer bearing positioning mechanism (4) are including bearing location platform (41), the movable sleeve is equipped with stop bolt (42) on bearing location platform (41), the lower tip threaded connection of stop bolt (42) in mounting platform (1) is last, and the part cover that lies in between mounting platform (1) and bearing location platform (41) diapire face on stop bolt (42) is equipped with elastic support spring (43), fixed bearing location seat (44) that is provided with on bearing location platform (41), inverted triangle shape bearing location recess (441) has on bearing location seat (44).

7. The apparatus for dicing a semiconductor wafer according to any one of claims 1 to 6, wherein: the wafer cutting machine is characterized by further comprising a product returning mechanism (6), wherein the product returning mechanism (6) is used for pushing the cut wafer out of the equipment.

8. The apparatus for dicing a semiconductor wafer according to claim 7, wherein: the mounting platform (1) is further provided with a cutting scrap downward-leaking through groove, and a cutting scrap collecting device is arranged at the bottom of the cutting scrap downward-leaking through groove.