CN211868630U - Film pasting equipment - Google Patents

Film pasting equipment Download PDF

Info

Publication number
CN211868630U
CN211868630U CN202020233984.9U CN202020233984U CN211868630U CN 211868630 U CN211868630 U CN 211868630U CN 202020233984 U CN202020233984 U CN 202020233984U CN 211868630 U CN211868630 U CN 211868630U
Authority
CN
China
Prior art keywords
film
substrate
holes
area
bearing table
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202020233984.9U
Other languages
Chinese (zh)
Inventor
翟东
赵长征
侯俊
李应鑫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hefei Visionox Technology Co Ltd
Original Assignee
Hefei Visionox Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hefei Visionox Technology Co Ltd filed Critical Hefei Visionox Technology Co Ltd
Priority to CN202020233984.9U priority Critical patent/CN211868630U/en
Application granted granted Critical
Publication of CN211868630U publication Critical patent/CN211868630U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Landscapes

  • Laminated Bodies (AREA)

Abstract

The application discloses film sticking equipment which comprises a first bearing table, a second bearing table and a substrate carrying mechanism, wherein the first bearing table is used for bearing a main body part of a film to be stuck; the second bearing table is positioned at one end of the first bearing table and is used for bearing one side edge part of the film to be attached; the substrate carrying mechanism is used for carrying a substrate to be coated with a film; the second bearing table is of a flat plate structure, and is provided with a plurality of through holes which are used for connecting vacuum equipment so as to adsorb the film to be laminated by using vacuum acting force; and/or the substrate carrying mechanism is of a flat plate structure, and a plurality of through holes are formed in the substrate carrying mechanism and used for being connected with vacuum equipment so as to adsorb the substrate to be coated by utilizing vacuum acting force. Through the mode, the warping rate of the film layer after film pasting can be reduced.

Description

Film pasting equipment
Technical Field
The application relates to the technical field of display, in particular to film sticking equipment.
Background
In the process of manufacturing a flexible display panel, a product generally needs to be subjected to film pasting, and if a display substrate after a packaging process needs to be subjected to a process protective film pasting. However, under the influence of the attaching process or the attaching equipment, the attached protective film is easy to warp, the warp degree is usually between 2mm and 10mm, and the warp of more than 5mm easily causes the vacuum adsorption downtime of the downstream process equipment, thereby affecting the productivity.
SUMMERY OF THE UTILITY MODEL
The main technical problem who solves of this application provides a pad pasting equipment, can reduce the perk camber of rete behind the pad pasting.
In order to solve the technical problem, the application adopts a technical scheme that: the film sticking equipment comprises a first bearing table, a second bearing table and a substrate carrying mechanism, wherein the first bearing table is used for bearing a main body part of a film to be stuck; the second bearing table is positioned at one end of the first bearing table and is used for bearing one side edge part of the film to be attached; the substrate carrying mechanism is used for carrying a substrate to be coated with a film; the second bearing table is of a flat plate structure, and is provided with a plurality of through holes which are used for connecting vacuum equipment so as to adsorb the film to be laminated by using vacuum acting force; and/or the substrate carrying mechanism is of a flat plate structure, and a plurality of through holes are formed in the substrate carrying mechanism and used for being connected with vacuum equipment so as to adsorb the substrate to be coated by utilizing vacuum acting force.
The second bearing table comprises a corner area, a film tearing mechanism supporting area and a central adsorption area, wherein a plurality of first through holes are formed in the corner area, a plurality of second through holes are formed in the film tearing mechanism supporting area, and a plurality of third through holes are formed in the central adsorption area; the aperture of the second through hole is larger than that of the third through hole, and the aperture of the third through hole is larger than that of the first through hole.
The edge angle area is two bevel angle areas which are respectively arranged adjacent to the edge angle of the end part of the second bearing table, the bevel edge of each bevel angle area faces the first bearing table, and the plurality of first through holes are arranged in the bevel angle areas in an array mode; the film tearing mechanism supporting areas are two, each film tearing mechanism supporting area is respectively adjacent to the corner area and the central adsorption area, the shape of each film tearing mechanism supporting area is matched with the shape of each corner area and the shape of each central adsorption area, and the plurality of second through holes are arrayed in the film tearing mechanism supporting areas; the central adsorption area is the middle area of the second bearing table adjacent to the two support areas of the film tearing mechanism, and the plurality of third through holes are arranged in the central adsorption area in an array mode.
Wherein, the diameter of the first through hole is 1.2-1.6 mm, the diameter of the second through hole is 2.9-3.2 mm, and the diameter of the third through hole is 1.8-2.3 mm.
The substrate carrying mechanism is provided with a plurality of adsorption units in an array arrangement mode, each adsorption unit comprises three fourth through holes, and the three fourth through holes are arranged in a triangular mode.
Wherein, the diameter of the fourth through hole is 2.4-3.0 mm.
The carrying mechanism comprises at least two groups of oppositely arranged flat plate structures, and the two groups of oppositely arranged flat plate structures are combined to form a rectangular space in a surrounding mode.
Wherein, the second plummer and/or transport mechanism are the dull and stereotyped structure of silica gel material.
The film sticking equipment further comprises a film tearing mechanism and a sticking mechanism, wherein the film tearing mechanism is used for tearing the protective layer of the film to be stuck; the laminating mechanism is used for laminating the film to be laminated with the substrate to be laminated; the second plummer can provide the support for dyestripping mechanism, and can move first plummer relatively to give laminating mechanism to give the abdication.
Wherein, the substrate to be pasted with the film is a flexible substrate.
The beneficial effect of this application is: be different from prior art's condition, this application can make and wait to laminate film and/or the base plate vacuum adsorption power that receives more even through designing into dull and stereotyped structure with second plummer and/or base plate plummer, prevents to lead to rete and/or base plate fold because of the atress is inhomogeneous, is favorable to improving rete and/or base plate surface smoothness, prevents the pad pasting back rete warpage.
Drawings
FIG. 1 is a schematic structural diagram of a film carrier stage of a film laminating apparatus according to an embodiment of the present disclosure;
FIG. 2 is a schematic diagram illustrating an effect of placing a film to be attached on a film carrier in an embodiment of the present disclosure;
FIG. 3 is a schematic view of another effect of placing a film to be attached on a film carrier in an embodiment of the present disclosure;
fig. 4 is a schematic structural view of a substrate conveyance mechanism of a film laminating apparatus according to an embodiment of the present application;
FIG. 5 is a schematic view illustrating a process of transferring a substrate by the substrate transfer mechanism according to the embodiment of the present application;
FIG. 6 is a schematic view of a process for laminating a film layer according to an embodiment of the present disclosure;
fig. 7 is a schematic diagram of the yield of the substrate film in the embodiment of the present application.
Detailed Description
In order to make the purpose, technical solution and effect of the present application clearer and clearer, the present application is further described in detail below with reference to the accompanying drawings and examples.
The application provides a pad pasting equipment can improve the roughness of rete behind the pad pasting, prevents the rete warpage. The film pasting device can be used for pasting a process protection film in the process of manufacturing a display panel, for example, can be used for pasting an upper process protection film and/or a lower process protection film of a G6 Half flexible display panel after a TFE (thin film encapsulation) process, and can also be used for pasting other films in other processes, which is not limited herein.
In one embodiment, the film sticking device at least comprises a film bearing platform, a substrate bearing platform, a film tearing mechanism, a sticking mechanism and a substrate conveying mechanism. When the film sticking equipment is used for carrying out a sticking process, the method mainly comprises the following steps:
and (6) loading the film layer. Specifically, the film to be laminated prepared in the previous process is conveyed to a film bearing table by a conveying manipulator, and enters the next process after being adsorbed and fixed by the film bearing table. The film bearing table comprises a first bearing table and a second bearing table, the first bearing table is used for bearing a main body part of the film to be attached, and the second bearing table is used for bearing a side edge part of the film to be attached. The second bearing table is positioned at one end of the first bearing table and can move relative to the first bearing table so as to give way to the laminating mechanism in the subsequent working procedures.
And (6) tearing the film. The film to be laminated is generally a three-layer structure, and the surface protective film (e.g., release film) needs to be torn off before the film layer is laminated. Specifically, dyestripping mechanism is provided with the adhesion layer including tearing membrane roller and dyestripping clamp etc. on tearing the membrane roller to the adhesion is mentioned and is waited to tear the membrane body. The film to be laminated is transferred to the film tearing mechanism through the film bearing platform, the film tearing roller is pressed downwards, the film tearing film moves at the edge of the film to be torn, if the film tearing roller can move in a Y shape, the film tearing body is lifted by adhesion, then the film tearing body is fixed and limited by the film tearing clamp, and the film tearing roller continuously moves along a straight line until the film to be torn is torn away from the film to be laminated.
And (6) loading the substrate. And conveying the substrate to be coated prepared in the previous process to a substrate bearing table by using a substrate conveying mechanism, adsorbing and fixing the substrate to be coated by the substrate bearing table, and then entering the next process.
And (6) attaching. Specifically, a film to be laminated runs to the lower portion of the substrate bearing table through the film bearing table, after position alignment correction is carried out, one end of the film to be laminated is pressed and attached to the surface of the substrate through the laminating mechanism, then the laminating roller and the film pressing roller of the laminating mechanism slide linearly, and the film to be laminated is gradually rolled and attached to the substrate until lamination is completed.
Wherein, in order to realize that the laminating mechanism starts to act from one end of the film layer, one side edge part of the film to be laminated is required to exceed the film bearing table so as to be used for the laminating mechanism to carry out laminating operation. Therefore, before the laminating procedure, the second bearing table of the film bearing table is moved to give way to the laminating mechanism, and the edge area of the film to be laminated is left. Generally, the second carrier stage can be lowered relative to the first carrier stage, and then moved toward the first carrier stage to retract the second carrier stage below the first carrier stage.
In the conventional method, the second carrier is generally a vacuum nozzle structure, and a film to be attached is adsorbed by using vacuum negative pressure. Because the film layer to be attached is thin and soft, the suction nozzle type adsorption structure easily leaves suction marks on the film layer, so that the smoothness of the surface of the film layer is damaged, the film layer is folded and deformed, and the film layer is warped due to uneven stress during attachment. If the warping amount is large, the subsequent process is affected, which results in product scrap and yield loss. Based on this, this application provides a pad pasting equipment, through the structure of improving second plummer in the film plummer, can improve the roughness of rete behind the pad pasting, prevents the rete warpage.
Referring to fig. 1, fig. 2 and fig. 3, fig. 1 is a schematic structural diagram of a film carrier of a film laminating apparatus in an embodiment of the present disclosure, fig. 2 is a schematic structural diagram of an effect of placing a film to be laminated on the film carrier in the embodiment of the present disclosure, and fig. 3 is a schematic structural diagram of another effect of placing the film to be laminated on the film carrier in the embodiment of the present disclosure. In this embodiment, the film laminating apparatus comprises at least a film carrier stage comprising a first carrier stage 101 and a second carrier stage 102.
The first carrying platform 101 is used for carrying a main body portion of the film 100 to be attached, and the second carrying platform 102 is located at one end of the first carrying platform 101 and is used for carrying a side edge portion of the film 100 to be attached, as shown in fig. 2. And the second carrier 102 can move relative to the first carrier 101 to free the edge area of the film 100 to be bonded, so as to give way to the bonding mechanism (not shown), as shown in fig. 3.
In this embodiment, the first stage 101 is a flat plate structure having a uniform plane, such as an aluminum alloy plate structure, and the flat plate structure is uniformly provided with vacuum suction holes 1011, and the vacuum suction holes 1011 are connected to a vacuum-pumping device (not shown) so as to suck the film 100 to be attached by vacuum negative pressure. The uniform plane refers to that all areas of the whole plane of the flat plate structure are on the same horizontal line, so that a flat plane can be provided, when the flat film layer is placed on the flat plate structure, all areas on the surface of the film layer are uniformly stressed, and creases or folds cannot occur due to uneven stress.
In this embodiment, the second stage 102 is also designed to have a flat plate structure with a uniform plane, and a plurality of through holes are formed in the flat plate structure, and the through holes are used for connecting a vacuum apparatus to suck the film 100 to be attached by using a vacuum force. Through designing the second plummer into the dull and stereotyped structure that has the homogeneous plane, can make the vacuum adsorption power that treats laminating film receives more even, prevent to lead to the rete fold because of the atress is inhomogeneous, be favorable to improving the rete roughness, prevent the pad pasting back rete warpage. Simultaneously, the second plummer of dull and stereotyped structural formula can also provide better supporting role for dyestripping mechanism, and dyestripping power is uneven when preventing to tear the membrane causes the damage to the rete.
In an embodiment, the through holes on the second carrier 102 may have a uniform diameter, and a plurality of through holes having the same diameter are arranged in an array on the carrier plate, so as to provide a more uniform adsorption force to the film 100 to be attached. In another embodiment, the through holes on the second carrier 102 may also be of different apertures, and a plurality of through holes of different apertures are distributed in different areas on the carrier plate, so as to achieve different functional effects.
Referring to fig. 1, in the embodiment, a plurality of through holes with different apertures are disposed on the second carrier 102. Specifically, the second carrier 102 includes a corner region 1021, a film tearing mechanism supporting region 1022 and a central absorption region 1023, wherein a plurality of first through holes 201 are arranged in the corner region 1021, a plurality of second through holes 202 are arranged in the film tearing mechanism supporting region 1022, and a plurality of third through holes 203 are arranged in the central absorption region 1023; the aperture of the second through hole 202 is larger than that of the third through hole 203, and the aperture of the third through hole 203 is larger than that of the first through hole 201.
The corner area 1021 is two bevel areas respectively adjacent to the corner at the end of the second carrier platform 102, the bevel edge of the bevel area faces the first carrier platform 101, and the first through holes 201 are arranged in the bevel area in an array manner. As shown in fig. 1, the second supporting platform 102 may be a rectangular plate, the corner region 1021 is located at an end of a short side of the rectangular plate, and may be a right trapezoid-shaped bevel region, and the first through holes 201 are arranged in an array in the right trapezoid-shaped bevel region.
When the film 100 to be attached is placed on the film bearing table, the film corners are affected by the alignment error, and film deviation may exist, so that the film 100 to be attached does not completely cover the vacuum holes on the film bearing table, and the film bearing table is prevented from leaking vacuum and is not firmly adsorbed. Among the technical scheme that this application provided, set up the aperture of the first through-hole 201 of corner district 1021 a little, even take place the rete skew like this, the vacuum hole that spills also can be little, reduces the influence to vacuum adsorption power.
In one embodiment, the diameter of the first through hole 201 may be 1.2 to 1.6mm, such as 1.3mm, 1.5mm, etc. The setting in this aperture can enough guarantee the basic adsorption affinity of plummer, can also reduce the absorption deviation that the rete offset brought.
In one embodiment, there are two film tearing mechanism supporting regions 1022, each film tearing mechanism supporting region 1022 is adjacent to the corner region 1021 and the central absorption region 1023 respectively, the film tearing mechanism supporting regions 1022 match the shapes of the corner region 1021 and the central absorption region 1023, and the plurality of second through holes 202 are arranged in an array in the film tearing mechanism supporting regions 1022. As shown in fig. 1, the film tearing mechanism supporting region 1022 may be a right trapezoid region adjacent to the edge region 1021, and the second through holes 202 are arranged in an array in the right trapezoid region.
When the film tearing mechanism is used for tearing the film to be laminated, the film tearing roller generally starts to act at the corner of the film to be laminated, the part of the film to be torn is lifted, and then the film to be torn is clamped and fixed for subsequent film tearing. When tearing the membrane, lead to treating that laminating film is whole to be mentioned for avoiding tearing the membrane power too big, cause rete fold or fracture. In the technical scheme that this application provided, the aperture setting with the second through-hole 202 of dyestripping mechanism support area 1022 is some big, can provide great adsorption affinity, prevents that the rete is whole to be lifted.
In one embodiment, the diameter of the second through hole 202 may be 2.9 to 3.2mm, such as 3.0mm, 3.1mm, etc. The setting in this aperture can enough provide great adsorption affinity, and is difficult for making the rete adsorbed in the pore-entering, leads to the rete to produce and inhales the trace, perhaps adsorption affinity is too big, damages the rete.
In one embodiment, the central suction area 1023 is a middle area of the second carrier platform adjacent to the two support areas 1022 of the film tearing mechanism, respectively, and the third through holes are arranged in an array in the middle area to provide uniform suction to the film 100 to be attached.
In one embodiment, the diameter of the third through hole 203 may be 1.8 to 2.3mm, such as 2.0mm, 2.2mm, etc. The setting in this aperture can enough guarantee the basic adsorption affinity to the rete, realizes the fixed to the rete, and is difficult for making the rete adsorbed in the pore, leads to the rete to produce and inhales the trace, perhaps the adsorption affinity is too big, damages the film.
In one embodiment, the second supporting member 102 is a flat plate made of silicone. Through the flat board of chooseing for use the silica gel material, plate body hardness is moderate (Shore60A), can not cause the indentation to the rete when pressing the rete, and adsorption effect is comparatively ideal simultaneously.
Referring to fig. 4, fig. 4 is a schematic structural diagram of a substrate conveying mechanism of a film laminating apparatus according to an embodiment of the present disclosure. In this embodiment, the substrate conveying mechanism 30 is a flat plate structure having a uniform plane, and the flat plate structure is provided with a plurality of fourth through holes 204, and the fourth through holes 204 are used for connecting a vacuum device to absorb the substrate to be film-pasted by using a vacuum acting force.
In the prior art, the substrate carrying mechanism is generally a vacuum suction nozzle type structure, and when the substrate to be laminated is a flexible substrate, since the flexible substrate is soft, the suction nozzle type adsorption structure is easy to leave suction marks on the substrate, so that the flatness of the substrate surface is damaged, the substrate is wrinkled and deformed, and further, the substrate is warped due to uneven stress when the film layer is laminated. If the warping amount is large, the subsequent process is affected, which results in product scrap and yield loss.
Based on this, this application provides a base plate transport mechanism 30, this base plate transport mechanism 30 is for having the flat structure of homogeneous plane, through setting up base plate transport mechanism into flat structure, can make the vacuum adsorption power that treats the pad pasting base plate receives more even, prevents to lead to the fold because of the atress is inhomogeneous, is favorable to improving the roughness on base plate top layer, prevents the pad pasting back rete warpage.
In one embodiment, the apertures of the through holes in the substrate handling mechanism 30 are the same, and the through holes with uniform apertures are arranged in an array on the plate structure. The apertures of the through holes on the substrate carrying mechanism are designed to be uniform, so that the adsorption force applied to each area on the surface of the substrate can be more uniform, and the flatness of the surface of the substrate can be ensured.
As shown in fig. 4, a plurality of adsorption units are arrayed on the substrate transfer mechanism 30, each adsorption unit includes three fourth through holes 204, and the three fourth through holes 204 are arranged in a triangle. In other embodiments, the plurality of fourth through holes 204 may also be arranged in other manners, such as a rectangular array, which is not limited herein.
In one embodiment, the diameter of the fourth through hole 204 may be 2.4 to 3.0mm, for example, 2.5mm, 2.8mm, etc. The setting in this aperture can enough guarantee the basic adsorption affinity to the base plate, realizes the fixed to the base plate, and is difficult for making the base plate adsorbed in the inlet hole, leads to the base plate surface to produce and inhales the trace, perhaps the adsorption affinity is too big, damages the base plate.
Referring to fig. 4, the substrate handling mechanism 30 includes at least two sets of flat plate structures disposed opposite to each other, and the two sets of flat plate structures are disposed to form a rectangular space. With this arrangement, the substrate transfer mechanism 30 can be made to adsorb and fix the four sides of the substrate, and the uniformity of the force applied to the substrate surface can be further improved compared with the balanced adsorption transfer of the substrate. The size of the substrate transfer mechanism 30 may be set according to the size of the substrate to be transferred. If the flat plate structure is the flat plate structure with the triangular adsorption unit, when the 4 flat plate structures are arranged oppositely, the side where the vertex angle is located in the triangle is arranged oppositely, as shown in fig. 4, the top end of the triangle faces inwards.
In one embodiment, the substrate transfer mechanism 30 is a flat plate made of silicone. Through the flat board of chooseing for use the silica gel material, plate body hardness is moderate (Shore60A), can not cause the indentation to the base plate when pressing the base plate, and the adsorption effect is comparatively ideal simultaneously.
Referring to fig. 1 to 6, fig. 5 is a schematic view illustrating a process of transferring a substrate by a substrate transfer mechanism according to an embodiment of the present disclosure, and fig. 6 is a schematic view illustrating a process of bonding a film according to an embodiment of the present disclosure. When a film sticking device is used for carrying out a sticking process, the method mainly comprises the following steps:
the film 100 to be bonded obtained in the previous step is transferred onto a film stage by a transfer robot, so that the first stage 101 of the film stage adsorbs a main portion of the film 100 to be bonded and an edge portion of one side of the second stage 102. Transferring the film 100 to be laminated to a film tearing mechanism (not shown) through a film bearing table, and performing film tearing operation; after the film is torn off, the second carrier 102 is removed to wait for the film to be pasted.
After the substrate 40 is sucked by the substrate transfer mechanism 30, the substrate 40 is placed on the substrate stage 50, sucked and fixed, and a film application is waited.
The film 100 to be laminated is transferred to the lower part of the substrate bearing table 50 through the film bearing table, after position alignment correction, one end of the film 100 to be laminated is pressed and attached on the surface of the substrate 40 by a laminating mechanism (not shown), then the laminating roller and the film pressing roller of the laminating mechanism slide linearly, and the film 100 to be laminated is gradually rolled and attached on the substrate 40 until lamination is completed.
The pad pasting equipment that this embodiment provided sets up second plummer and the base plate transport mechanism through with the film plummer into the dull and stereotyped structure that has the uniform plane, can make the adsorption affinity of rete and base plate more even, is difficult for producing the fold, and then prevents the rete warpage, improves the product yield.
Referring to fig. 7, fig. 7 is a schematic diagram illustrating yield of the substrate film according to the embodiment of the present disclosure. In one embodiment, the film pasting device provided by the present application and the film pasting device in the prior art are used to film different samples of the same batch of products, and the yield is calculated.
Example 1
124806 substrates are filmed by using the film sticking equipment in the prior art, and then 371 warpage defective products are detected, wherein the abnormal rate is 0.30%.
Example 2
The film sticking equipment provided by the application is used for sticking films to 43385 substrates, then detection is carried out, 109 warping defective products are detected, and the abnormal rate is 0.25%.
Example 3
The film sticking equipment provided by the application is used for sticking films on 31003 substrates, and then detection is carried out to detect 49 warping defective products with the abnormal rate of 0.16 percent.
As shown in fig. 7, by improving the film pasting device, the abnormal rate of the product is reduced, the yield of the product is increased, and the productivity is further increased.
The above description is only for the purpose of illustrating embodiments of the present application and is not intended to limit the scope of the present application, and all modifications of equivalent structures and equivalent processes, which are made by the contents of the specification and the drawings of the present application or are directly or indirectly applied to other related technical fields, are also included in the scope of the present application.

Claims (10)

1. A film laminating apparatus, comprising:
the first bearing table is used for bearing the main body part of the film to be attached;
the second bearing table is positioned at one end of the first bearing table and used for bearing the edge part of one side of the film to be attached;
the substrate carrying mechanism is used for carrying the substrate to be coated with the film;
the second bearing table is of a flat plate structure, and is provided with a plurality of through holes which are used for being connected with vacuum equipment so as to adsorb the film to be attached by utilizing vacuum acting force; and/or
The substrate carrying mechanism is of a flat plate structure, a plurality of through holes are formed in the substrate carrying mechanism and are used for being connected with vacuum equipment so as to adsorb the substrate to be subjected to film pasting through vacuum acting force.
2. The film laminating apparatus according to claim 1,
the second bearing table comprises an edge area, a film tearing mechanism supporting area and a central adsorption area, wherein a plurality of first through holes are formed in the edge area, a plurality of second through holes are formed in the film tearing mechanism supporting area, and a plurality of third through holes are formed in the central adsorption area; the aperture of the second through hole is larger than that of the third through hole, and the aperture of the third through hole is larger than that of the first through hole.
3. The film laminating apparatus according to claim 2,
the corner areas are two bevel corner areas which are respectively adjacent to corners of the end part of the second bearing table, the bevel edges of the bevel corner areas face the first bearing table, and the first through holes are arranged in the bevel corner areas in an array mode; the film tearing mechanism supporting areas are two, each film tearing mechanism supporting area is respectively adjacent to the corner area and the central adsorption area, the shape of each film tearing mechanism supporting area is matched with the shape of each corner area and the shape of each central adsorption area, and a plurality of second through holes are arrayed in each film tearing mechanism supporting area; the central adsorption area is a middle area of the second bearing table adjacent to the two support areas of the film tearing mechanism, and the plurality of third through holes are arranged in the central adsorption area in an array mode.
4. The film laminating apparatus according to claim 2,
the diameter of the first through hole is 1.2-1.6 mm, the diameter of the second through hole is 2.9-3.2 mm, and the diameter of the third through hole is 1.8-2.3 mm.
5. The film laminating apparatus according to claim 1,
a plurality of adsorption units are arranged on the substrate carrying mechanism in an array mode, each adsorption unit comprises three fourth through holes, and the three fourth through holes are arranged in a triangular mode.
6. The film laminating apparatus according to claim 5,
the diameter of the fourth through hole is 2.4-3.0 mm.
7. The film laminating apparatus according to claim 5,
the carrying mechanism comprises at least two groups of oppositely arranged flat plate structures, and the two groups of oppositely arranged flat plate structures are combined to form a rectangular space in a surrounding mode.
8. The film laminating apparatus according to claim 1,
the second plummer and/or the transport mechanism is the dull and stereotyped structure of silica gel material.
9. The film laminating apparatus of claim 1, further comprising:
the film tearing mechanism is used for tearing the protective layer of the film to be attached;
the laminating mechanism is used for laminating the film to be laminated with the substrate to be laminated;
the second plummer can give tear film mechanism provides the support, and can be relative first plummer motion is in order to give laminating mechanism gives way.
10. The film laminating apparatus according to claim 1,
the substrate to be filmed is a flexible substrate.
CN202020233984.9U 2020-02-28 2020-02-28 Film pasting equipment Active CN211868630U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202020233984.9U CN211868630U (en) 2020-02-28 2020-02-28 Film pasting equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202020233984.9U CN211868630U (en) 2020-02-28 2020-02-28 Film pasting equipment

Publications (1)

Publication Number Publication Date
CN211868630U true CN211868630U (en) 2020-11-06

Family

ID=73254428

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202020233984.9U Active CN211868630U (en) 2020-02-28 2020-02-28 Film pasting equipment

Country Status (1)

Country Link
CN (1) CN211868630U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113437121A (en) * 2021-06-11 2021-09-24 深圳市华星光电半导体显示技术有限公司 Assembling device and assembling method of display panel

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113437121A (en) * 2021-06-11 2021-09-24 深圳市华星光电半导体显示技术有限公司 Assembling device and assembling method of display panel

Similar Documents

Publication Publication Date Title
TWI373813B (en)
TW200832607A (en) Method for lamination substrate and apparatus using the method
JPWO2011158652A1 (en) Method for manufacturing translucent hard substrate laminate
TWI718688B (en) Attaching apparatus, intermediary mechansim thereof, and attaching method
JP5697769B2 (en) Polarizing film pasting device
WO2015102340A1 (en) Method and apparatus for applying film
CN211868630U (en) Film pasting equipment
CN108269754B (en) Film carrying table, film pasting equipment, film pasting method and film to be pasted for display panel
JP2004325539A (en) Method and device for sticking polarizing plate to substrate
JP2008139523A (en) Optical film-pasting method, optical film-pasting device, and manufacturing method of display panel
KR101085585B1 (en) Film bonding apparatus and bonding method of the film
JP4661808B2 (en) Component mounting apparatus and board conveying method
CN105529260A (en) Adhesive tape adhering method and adhesive tape adhering device
CN207097963U (en) One kind inhales film and hot-melting mechanism and dielectric film feeding, hot melt and transfer device
JP4555008B2 (en) Component mounting equipment
JP2015187648A (en) Bonding method and bonding device
CN212610290U (en) A backplate glass for automizing produce line
JP2006039238A (en) Sticking device for functional film such as polarizing plate and ar film
TW201637874A (en) Peeling apparatus and peeling method of laminate body and manufacturing method of electronic apparatus
JP6468462B2 (en) Laminate peeling apparatus, peeling method, and electronic device manufacturing method
JP2001174835A (en) Glass substrate assembly device for liquid crystal display device and method for manufacturing liquid crystal display device
CN105261578B (en) The stripping off device and stripping means of laminated body and the manufacturing method of electronic device
TWI690398B (en) Suction Laminating Machine
TWI605737B (en) Flatbed flexible printed circuit board lamination process
CN217214683U (en) Bearing device and laminating device for flexible substrate

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant