CN211856799U

CN211856799U - Tester for IC carrier plate after ball mounting

Info

Publication number: CN211856799U
Application number: CN201922363033.3U
Authority: CN
Inventors: 赵志刚; 文东升
Original assignee: Suzhou Kelinyuan Electronic Co ltd
Current assignee: Suzhou Kelinyuan Electronic Co ltd
Priority date: 2019-12-25
Filing date: 2019-12-25
Publication date: 2020-11-03
Anticipated expiration: 2029-12-25

Abstract

The utility model discloses a testing instrument after ball mounting of an integrated circuit IC support plate, which comprises a jig structure plate and a probe structure, wherein the probe structure comprises a probe connecting wire and a square probe, the probe connecting wire is connected with the end part of the square probe, the square probe comprises a square needle main body and a convex edge arranged on the end surface of the square needle main body, the cross section of the square needle main body is rectangular, and the vertical projection area of the square needle main body is larger than that of the convex edge; the jig structure plate comprises an upper structure plate and a lower structure plate, a plurality of spherical test contact positions are arranged on the circuit board to be tested, the jig structure plate and the probe structure are close to the circuit board to be tested, and the convex edges are in contact with the spherical test contact positions for testing. The square needle main body is used for testing, the distance between the adjacent square needle main bodies is reduced, the contact area of the probe is further reduced, the minimum distance between the needle heads can be ensured due to the guidance of the square needle, and the requirement for testing the solder balls of smaller PCBs is met.

Description

Tester for IC carrier plate after ball mounting

Technical Field

The utility model relates to a test field especially relates to a test instrument after integrated circuit IC support plate ball planting.

Background

At present, a PCB, which is called a printed circuit board in chinese, is an important electronic component, a support for an electronic component, and a carrier for electrical connection of the electronic component. It is called a "printed" circuit board because it is made using electronic printing. Almost every kind of electronic equipment, as small as electronic watches, calculators, as large as computers, communication electronics, military weaponry systems, has electronic components such as integrated circuits, and printed boards are used to electrically interconnect the various components. The printed circuit board consists of an insulating bottom plate, a connecting lead and a welding disc for assembling and welding electronic elements, and has double functions of a conductive circuit and the insulating bottom plate. The circuit can replace complex wiring to realize electrical connection among elements in the circuit, thereby simplifying the assembly and welding work of electronic products, reducing the wiring workload in the traditional mode and greatly lightening the labor intensity of workers; and the volume of the whole machine is reduced, the product cost is reduced, and the quality and the reliability of the electronic equipment are improved. The printed circuit board has good product consistency, can adopt standardized design, and is beneficial to realizing mechanization and automation in the production process. Meanwhile, the whole printed circuit board subjected to assembly and debugging can be used as an independent spare part, so that the exchange and maintenance of the whole product are facilitated. At present, printed wiring boards have been used very widely in the manufacture of electronic products.

However, the existing solder ball test has the following defects:

referring to fig. 3, a side view of the prior art is shown, in which two pogo pins are disposed on a jig board, and 2 pogo pins are designed on a solder ball of a PCB for testing in contact with a product, but since the pogo pins are composed of the pins themselves and a spring sleeve on the outer layer, the designed structure occupies a large space and cannot meet the requirement of testing a smaller solder ball of the PCB.

SUMMERY OF THE UTILITY MODEL

In order to overcome the defects of the prior art, one of the purposes of the utility model is to provide a test instrument after ball mounting of an integrated circuit IC carrier plate, which can solve the problem of the solder ball test of a small-sized PCB.

The utility model discloses an one of the purpose adopts following technical scheme to realize:

a testing instrument for integrated circuit IC carrier plates after ball mounting comprises a jig structure plate and a probe structure, wherein the probe structure comprises a probe connecting line and a square probe, the probe connecting line is connected with the end part of the square probe, the square probe comprises a square needle main body and a raised edge arranged on the end surface of the square needle main body, the cross section of the square needle main body is rectangular, and the vertical projection area of the square needle main body is larger than that of the raised edge; the jig structure plate comprises an upper structure plate and a lower structure plate, and the upper structure plate and the lower structure plate are fixed through screws; the guideline body is secured to the upper structural plate and the lower structural plate; the test device comprises a jig structure plate, a probe structure, a spherical test contact position and a plurality of convex edges, wherein the jig structure plate and the probe structure are arranged on a circuit board to be tested, and the convex edges are contacted with the spherical test contact position to test.

Further, the upper structural plate is parallel to the lower structural plate, and the probe connection lines are perpendicular to the lower structural plate.

Further, the lower end face of the convex edge is provided with an arc-shaped end face, and the arc-shaped end face is opposite to the spherical test contact position.

Further, the side end face of the protruding rib is flush with the side end face of the guide main body.

Furthermore, the number of the probe structures is even, and every two probe structures are correspondingly arranged on the jig structure plate.

Further, in two corresponding probe structures, the convex ribs are distributed on the inner sides of the two probe structures.

Further, the guideline body is perpendicular to the raised ridge.

Further, the vertical projection area of the guideline main body is 2-3 times of the vertical projection area of the convex edge.

Compared with the prior art, the beneficial effects of the utility model reside in that:

the cross section of the square needle main body is rectangular, and the vertical projection area of the square needle main body is larger than that of the convex edge; the jig structure plate comprises an upper structure plate and a lower structure plate, and the upper structure plate and the lower structure plate are fixed through screws; the guideline body is secured to the upper structural plate and the lower structural plate; the test device comprises a jig structure plate, a probe structure, a spherical test contact position and a plurality of convex edges, wherein the jig structure plate and the probe structure are arranged on a circuit board to be tested, and the convex edges are contacted with the spherical test contact position to test. The square needle main body is used for testing, the distance between every two adjacent square needle main bodies is reduced, the contact area of the probe is further reduced, the minimum distance between the needle heads can be ensured due to the guidance of the square needle, and the requirement for testing the solder balls of smaller PCBs is met.

The foregoing description is only an overview of the technical solutions of the present invention, and in order to make the technical means of the present invention more clearly understood, the present invention may be implemented according to the content of the description, and in order to make the above and other objects, features, and advantages of the present invention more obvious and understandable, the following preferred embodiments are described in detail with reference to the accompanying drawings.

Drawings

FIG. 1 is a block diagram of the present application;

fig. 2 is another structural diagram of the present application.

FIG. 3 is a diagram illustrating a structure of a solder ball test in the prior art.

In the figure: 100. testing instrument after ball mounting of IC carrier plate; 10. a jig structure plate; 11. an upper structural panel; 12. a lower structural panel; 20. a probe structure; 21. a probe connecting wire; 22. a square probe; 221. a guideline body; 222. a raised edge; 2221. an arc-shaped end face; 30. a circuit board to be tested; 31. spherical test contact positions; 200. a jig plate; 300. a pogo pin.

Detailed Description

The present invention will be further described with reference to the accompanying drawings and the detailed description, and it should be noted that the embodiments or technical features described below can be arbitrarily combined to form a new embodiment without conflict.

It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When a component is referred to as being "connected" to another component, it can be directly connected to the other component or intervening components may also be present. When a component is referred to as being "disposed on" another component, it can be directly on the other component or intervening components may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

Referring to fig. 1-3, the integrated circuit IC carrier ball mounting post-test apparatus 100 includes a fixture structure board 10 and a probe structure 20, the probe structure 20 includes a probe connection line 21 and a square probe 22, the probe connection line 21 is connected to an end of the square probe 22, the square probe 22 includes a square needle main body 221 and a raised ridge 222 disposed on an end surface of the square needle main body 221, a cross section of the square needle main body 221 is rectangular, and a vertical projection area of the square needle main body 221 is larger than a vertical projection area of the raised ridge 222; the jig structure plate 10 comprises an upper structure plate 11 and a lower structure plate 12, wherein the upper structure plate 11 and the lower structure plate 12 are fixed through screws; the guideline body 221 is fixed to the upper structural plate 11 and the lower structural plate 12; the circuit board to be tested 30 is provided with a plurality of spherical test contact positions 31, and during testing, the jig structure plate 10 and the probe structure 20 approach the circuit board to be tested 30, and the convex ribs 222 contact the spherical test contact positions 31 for testing. The square needle main body 221 is used for testing, the distance between every two adjacent square needle main bodies 221 is reduced, the contact area of the probes is further reduced, the minimum distance between needle heads can be ensured due to the guiding performance of the square needle, and the requirement for testing the solder balls of smaller PCBs is met.

In a specific application process, the jig plate 200 is used to fix the pogo pin 300, and the pogo pin 300 includes a pin and an external spring bushing, which increases the whole pogo pin 300, and the width of the square pin body 221 can be made as large as the pin itself in the pogo pin 300 in this application, further reducing the contact area of the probe.

Preferably, the upper structural plate 11 is parallel to the lower structural plate 12, and the probe connecting lines 21 are perpendicular to the lower structural plate 12. The lower end surface of the protruding ridge 222 is provided with an arc-shaped end surface 2221, and the arc-shaped end surface 2221 is opposite to the spherical test contact position 31. The stability of test is improved, to vertical test, avoids the off normal.

Preferably, referring to fig. 2 in detail, a side end surface of the protruding rib 222 is flush with a side end surface of the guideline body 221. The purpose of this arrangement is to further reduce the contact area of the probes, the number of the probe structures 20 is even, and the probe structures 20 are correspondingly arranged on the jig structure plate 10 in pairs. In two corresponding probe structures 20, the protruding ribs 222 are distributed on the inner sides of the two probe structures 20. By this arrangement, the test apparatus can be applied to a test with a smaller contact area.

Preferably, the guideline body 221 is perpendicular to the raised edge 222. The vertical projection area of the guideline body 221 is 2-3 times the vertical projection area of the protruding rib 222. Novel structure, design benefit, the suitability is strong, the facilitate promotion.

The above embodiments are only preferred embodiments of the present invention, and the protection scope of the present invention cannot be limited thereby, and any insubstantial changes and substitutions made by those skilled in the art based on the present invention are all within the protection scope of the present invention.

Claims

1. The utility model provides an integrated circuit IC support plate test instrument after balling, includes tool structural slab and probe structure, its characterized in that:

the probe structure comprises a probe connecting line and a square probe, the probe connecting line is connected with the end part of the square probe, the square probe comprises a square needle main body and a raised edge arranged on the end surface of the square needle main body, the cross section of the square needle main body is rectangular, and the vertical projection area of the square needle main body is larger than that of the raised edge;

the jig structure plate comprises an upper structure plate and a lower structure plate, and the upper structure plate and the lower structure plate are fixed through screws; the guideline body is secured to the upper structural plate and the lower structural plate;

the test device comprises a jig structure plate, a probe structure, a spherical test contact position and a plurality of convex edges, wherein the jig structure plate and the probe structure are arranged on a circuit board to be tested, and the convex edges are contacted with the spherical test contact position to test.

2. The integrated circuit IC carrier ball mounting post-test instrument according to claim 1, wherein: the upper structural plate is parallel to the lower structural plate, and the probe connecting lines are perpendicular to the lower structural plate.

3. The integrated circuit IC carrier ball mounting post-test instrument according to claim 1, wherein: the lower end face of the convex ridge is provided with an arc-shaped end face, and the arc-shaped end face is right opposite to the spherical test contact position.

4. The integrated circuit IC carrier ball mounting post-test instrument according to claim 1, wherein: the side end face of the convex edge is flush with the side end face of the square needle main body.

5. The IC carrier ball mounting post-test instrument according to claim 4, wherein: the number of the probe structures is even, and every two probe structures are correspondingly arranged on the jig structure plate.

6. The integrated circuit IC carrier ball mounting post-test instrument according to claim 5, wherein: in two corresponding probe structures, the convex ribs are distributed on the inner sides of the two probe structures.

7. The integrated circuit IC carrier ball mounting post-test instrument according to claim 1, wherein: the square needle main body is perpendicular to the convex edges.

8. The integrated circuit IC carrier ball mounting post-test instrument according to claim 1, wherein: the vertical projection area of the square needle main body is 2-3 times of the vertical projection area of the convex edge.