CN211855587U - Non-contact infrared temperature monitoring device for electrical equipment - Google Patents
Non-contact infrared temperature monitoring device for electrical equipment Download PDFInfo
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- CN211855587U CN211855587U CN202020815572.6U CN202020815572U CN211855587U CN 211855587 U CN211855587 U CN 211855587U CN 202020815572 U CN202020815572 U CN 202020815572U CN 211855587 U CN211855587 U CN 211855587U
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- infrared temperature
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- 238000012806 monitoring device Methods 0.000 title claims abstract description 18
- 238000004891 communication Methods 0.000 claims abstract description 66
- 238000012545 processing Methods 0.000 claims abstract description 39
- 238000012544 monitoring process Methods 0.000 claims abstract description 33
- 239000003990 capacitor Substances 0.000 claims description 12
- 239000013078 crystal Substances 0.000 claims description 6
- 230000001052 transient effect Effects 0.000 claims description 6
- 238000009529 body temperature measurement Methods 0.000 claims description 5
- 238000010586 diagram Methods 0.000 description 9
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000006855 networking Effects 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003331 infrared imaging Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000013307 optical fiber Substances 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
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Abstract
The utility model discloses a non-contact infrared temperature monitoring device for electrical equipment, which comprises a shell, a fixed bracket and a monitoring circuit; the shell 2 is connected with the fixed bracket through a connecting shaft; the monitoring circuit is arranged inside the shell; the monitoring circuit comprises a power supply unit, an array type infrared temperature sensing unit, a core processing control module, a 485 communication unit and a radio frequency wireless communication unit. The utility model discloses an infrared temperature monitoring devices of non-contact for electrical equipment realizes carrying out temperature monitoring to key positions such as cable joint, female row promptly to electrical equipment temperature on-line monitoring systems such as high tension switchgear, transformer, also can monitor other electric positions.
Description
Technical Field
The utility model relates to an electrical equipment operation safety monitoring technology, concretely relates to infrared temperature monitoring devices of non-contact for electrical equipment.
Background
At present, the safe operation of electrical equipment is an important foundation for ensuring the safe life and production of people. Each type of electrical equipment may operate in an overheated state due to problems such as overload, aging of the electrical equipment, defects in the manufacturing process, and the like. Equipment damage can be caused by equipment overheating, power supply interruption can be caused if the equipment is overheated, and large-area power failure accidents, fire disasters and other vicious events can be caused if the equipment is overheated, and the power supply interruption is caused if the equipment is overheated, the power supply interruption can be caused if the equipment is overheated, and.
At present, a large number of temperature monitoring devices for electrical equipment exist, including two major categories, off-line and on-line. Offline detection: by adopting an infrared point temperature instrument or infrared imaging, the equipment in some boxes can not be detected, the problems can not be found in time, and the equipment state change trend can not be well reflected. Online monitoring: the optical fiber/grating temperature measurement mode is limited by the cost and the performance of the demodulator, and is not suitable for distributed and large-range temperature monitoring. The wireless temperature sensor mode is characterized in that a digital temperature sensor is in direct contact with high-voltage equipment for temperature measurement, and information is transmitted to a data acquisition module in a wireless radio frequency mode; the temperature sensor is difficult to supply power, and has certain limitations due to low power consumption and battery power supply. The digital temperature sensor is directly contacted with high-voltage equipment with an insulating layer for measuring temperature and is connected to the data acquisition module in a wired mode. The wiring is more, and secondary equipment has physical contact with primary equipment.
These monitoring methods can only detect the temperature of one contact point, and have great limitations and disadvantages.
Disclosure of Invention
The utility model provides a non-contact infrared temperature monitoring device for electrical equipment, aiming at the problems, comprising a shell, a fixed bracket and a monitoring circuit;
the shell 2 is connected with the fixed bracket through a connecting shaft;
the monitoring circuit is arranged inside the shell;
the monitoring circuit comprises a power supply unit, an array type infrared temperature sensing unit, a core processing control module, a 485 communication unit and a radio frequency wireless communication unit;
the array infrared temperature sensing unit is electrically connected with the core processing control module through I2C, data exchange is carried out through a data bus to obtain temperature data collected by the array type infrared temperature sensing units;
the core processing control module is respectively and electrically connected with the power supply unit, the array type infrared temperature sensing unit, the 485 communication unit and the radio frequency wireless communication unit, and is used for processing the acquired data, monitoring the temperature of the corresponding position of the core processing control module and exchanging data with external equipment;
the power supply unit is electrically connected with the array infrared temperature sensing unit, the core processing control module, the radio frequency wireless communication unit and the 485 communication unit respectively;
the 485 communication unit is electrically connected with the core processing control module;
the radio frequency wireless communication unit is electrically connected with the core processing control module.
Further, the bracket includes:
the fixing boss is used for placing the magnet and fixing the magnet, and installing a screw;
the strip-shaped fixing hole is used for fixing a binding belt and fixing a screw, so that the position of the shell can be conveniently adjusted;
the upright post is used for supporting the shell and realizing the rotation of the shell at any angle;
and the connecting shaft is used for connecting the shell and the fixed support, and the shell and the fixed support are fixed after the shell is adjusted to a proper position.
Still further, the housing includes:
the array infrared temperature sensing unit fixing hole is used for fixing the array infrared temperature sensing unit;
the shell external interface is used for connecting the shell external equipment.
Furthermore, the array type infrared temperature sensing unit adopts an MMLX9640 infrared temperature measurement dot matrix sensor and is electrically connected with the core processing control module through an IIC bus.
Further, the 485 communication unit comprises resistors RR1, RR2, RR3, RR4, RR5, transient diodes D2, D3, a capacitor CR1 and a communication chip U4; the communication chip U4 is respectively connected with resistors RR1, RR2, RR3, RR4 and RR5, transient diodes D2 and D3 and a capacitor CR 1.
Furthermore, the radio frequency wireless communication unit comprises resistors RW1, RW2, RW3 and RW4, and a radio frequency wireless communication 433M module; the radio frequency wireless communication 433M module is respectively connected with resistors RW1, RW2, RW3 and RW 4.
Further, the core processing control module comprises resistors RB1, RB2, RB3 and R7, capacitors C3, C4, C5, C10, C11, C12 and C13, a crystal oscillator Y1 and a CPU chip U2; the CPU chip U2 is respectively connected with resistors RB1, RB2, RB3 and R7, capacitors C3, C4, C5, C10, C11, C12 and C13 and a crystal oscillator Y1.
Furthermore, the array type infrared temperature sensing unit comprises resistors RT1, RT2, RT3, RT4 and an infrared chip U5; the infrared chip U5 is respectively connected with resistors RT1, RT2, RT3 and RT 4.
The utility model has the advantages that:
the utility model discloses an infrared temperature monitoring devices of non-contact for electrical equipment realizes carrying out temperature monitoring to key positions such as cable joint, female row promptly to electrical equipment temperature on-line monitoring systems such as high tension switchgear, transformer, also can monitor other electric positions.
The utility model has two communication modes of wireless and wired, which can meet the requirements of different networking modes; the device can form the temperature field in monitoring area, can carry out accurate monitoring to the temperature of monitoring facilities, realizes the warning of polymorphic type and early warning function. The device can satisfy multiple fixed mode needs, and the monitoring direction can be adjusted wantonly.
In addition to the above-described objects, features and advantages, the present invention has other objects, features and advantages. The present invention will be described in further detail with reference to the drawings.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this application, are included to provide a further understanding of the invention, and are incorporated in and constitute a part of this specification.
FIG. 1 is a schematic diagram of connection of parts of a module according to an embodiment of the present invention;
fig. 2 is a schematic structural view of a housing and a fixing bracket according to an embodiment of the present invention;
fig. 3 is a schematic diagram of a 485 communication unit according to an embodiment of the present invention;
fig. 4 is a schematic diagram of a radio frequency wireless communication unit according to an embodiment of the present invention;
FIG. 5 is a schematic diagram of a core processing control module according to an embodiment of the present invention;
fig. 6 is a schematic diagram of the array infrared temperature sensing unit according to the embodiment of the present invention.
Reference numerals:
2 is a shell, 3 is a fixed bracket;
the system comprises a power supply unit 11, an array infrared temperature sensing unit 12, a core processing control module 13, a radio frequency wireless communication unit 14 and a 485 communication unit 15, wherein the power supply unit is connected with the core processing control module through a wireless communication network;
21 is an array infrared temperature sensing unit fixing hole, and 22 is a shell external interface;
31 is a fixing boss, 32 is a strip-shaped fixing hole, 33 is an upright post and 34 is a connecting shaft.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the invention.
Referring to fig. 1 to 6, as shown in fig. 1 to 6, a non-contact infrared temperature monitoring device for electrical equipment includes a housing 2, a fixing bracket 3, and a monitoring circuit;
the shell 2 is connected with the fixed bracket 3 through a connecting shaft;
the monitoring circuit is arranged inside the shell 2;
the monitoring circuit comprises a power supply unit 11, an array type infrared temperature sensing unit 12, a core processing control module 13, a 485 communication unit 15 and a radio frequency wireless communication unit 14. After the power supply unit 11 is powered on, the core processing control module 13 firstly performs self-checking on each unit, and if an abnormal condition is detected, an alarm signal is sent out. After all parts are normal, the core processing control module 13 collects the temperature data of the array type infrared temperature sensing unit 12, and stores the temperature data in the internal storage space after scale conversion. When receiving a data request instruction sent by an external device through the 485 communication unit 15 or the radio frequency wireless communication unit 14, the core processing control module 13 controls the 485 communication unit 15 or the radio frequency wireless communication unit 14 to return data according to a corresponding request.
The array infrared temperature sensing unit 12 is used for being electrically connected with the core processing control module 13 through I2C, data exchange is carried out through a data bus to obtain temperature data collected by the array type infrared temperature sensing units;
the core processing control module 13 is respectively and electrically connected with the power supply unit 11, the array type infrared temperature sensing unit 12, the 485 communication unit 15 and the radio frequency wireless communication unit 14, and is used for processing the acquired data, monitoring the temperature of the corresponding position of the acquired data and exchanging data with external equipment;
the power supply unit 11 is electrically connected with the array type infrared temperature sensing unit 12, the core processing control module 13, the radio frequency wireless communication unit 14 and the 485 communication unit 15 respectively;
the 485 communication unit 15 is electrically connected with the core processing control module 13;
the radio frequency wireless communication unit 14 is electrically connected to the core processing control module 13.
The utility model discloses an infrared temperature monitoring devices of non-contact for electrical equipment realizes carrying out temperature monitoring to key positions such as cable joint, female row promptly to electrical equipment temperature on-line monitoring systems such as high tension switchgear, transformer, also can monitor other electric positions.
The utility model has two communication modes of wireless and wired, which can meet the requirements of different networking modes; the device can form the temperature field in monitoring area, can carry out accurate monitoring to the temperature of monitoring facilities, realizes the warning of polymorphic type and early warning function. The device can satisfy multiple fixed mode needs, and the monitoring direction can be adjusted wantonly.
The bracket 3 includes:
a fixing boss 31 for mounting a magnet and a fixing magnet, and mounting a screw;
the strip-shaped fixing hole 32 is used for fixing a binding belt and fixing a screw, so that the position of the shell 2 can be conveniently adjusted;
the upright column 33 is used for supporting the shell 2 and realizing the rotation of the shell 2 at any angle;
and the connecting shaft 34 is used for connecting the shell 2 and the fixed bracket 3, and after the shell 2 is adjusted to a proper position, the shell 2 and the fixed bracket 3 are fixed.
The housing 2 includes:
the array infrared temperature sensing unit fixing hole 21 is used for fixing the array infrared temperature sensing unit;
and a housing external interface 22 for connecting with a device external to the housing.
The array type infrared temperature sensing unit 12 adopts an MMLX9640 infrared temperature measurement lattice sensor and is electrically connected with the core processing control module 13 through an IIC bus.
Fig. 3 is a diagram of the 485 communication unit of the present invention, the 485 communication unit 15 includes resistors RR1, RR2, RR3, RR4, RR5, transient diodes D2, D3, capacitor CR1 and communication chip U4; the communication chip U4 is respectively connected with resistors RR1, RR2, RR3, RR4 and RR5, transient diodes D2 and D3 and a capacitor CR 1.
Fig. 4 is a diagram of the rf wireless communication unit of the present invention, the rf wireless communication unit 14 includes resistors RW1, RW2, RW3, RW4, and an rf wireless communication 433M module; the radio frequency wireless communication 433M module is respectively connected with resistors RW1, RW2, RW3 and RW 4.
Fig. 5 is a diagram of a core processing control module of the present invention, wherein the core processing control module 13 includes resistors RB1, RB2, RB3, R7, capacitors C3, C4, C5, C10, C11, C12, C13, crystal oscillator Y1 and a CPU chip U2; the CPU chip U2 is respectively connected with resistors RB1, RB2, RB3 and R7, capacitors C3, C4, C5, C10, C11, C12 and C13 and a crystal oscillator Y1.
Fig. 6 is a diagram of the array infrared temperature sensing unit 12 of the present invention, which includes resistors RT1, RT2, RT3, RT4 and an infrared chip U5; the infrared chip U5 is respectively connected with resistors RT1, RT2, RT3 and RT 4.
Preferably, the power supply unit 11 adopts a modular interface, can be compatible with various direct current supplies such as 5V, 12V and 24V, and has an anti-reverse connection function; and the device can be compatible with alternating current 220V power supply.
Preferably, the utility model discloses have 485 communication units, the multiple communication mode of radio frequency wireless communication unit; the 485 communication unit and the radio frequency wireless communication unit are connected with the core processing control module. Meanwhile, the communication unit is connected to the terminal on the shell, so that the communication unit is convenient to connect with other equipment during combined application.
Preferably, the infrared temperature sensor comprises an array type infrared temperature sensing unit, a core processing control module, an isolation power supply loop, a 485 communication unit and a radio frequency wireless communication unit which are connected with each other to form a whole and are arranged in the shell. The housing is connected to the fixed bracket by a connecting shaft. The position relation between the shell and the fixing can be changed by adjusting the connecting shaft. The mounting bracket has a plurality of fixing modes such as screws, magnets and the like.
The above description is only for the preferred embodiment of the present invention, and is not intended to limit the present invention, and any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention should be included within the protection scope of the present invention.
Claims (8)
1. A non-contact infrared temperature monitoring device for electrical equipment is characterized by comprising a shell
(2) The device comprises a fixed bracket (3) and a monitoring circuit;
the shell (2) is connected with the fixed support (3) through a connecting shaft;
the monitoring circuit is arranged inside the shell (2);
the monitoring circuit comprises a power supply unit (11), an array type infrared temperature sensing unit (12), a core processing control module (13), a 485 communication unit (15) and a radio frequency wireless communication unit (14);
the array infrared temperature sensing unit (12) is electrically connected with the core processing control module (13) through I2C, data exchange is carried out through a data bus to obtain temperature data collected by the array type infrared temperature sensing units;
the core processing control module (13) is respectively and electrically connected with the power supply unit (11), the array type infrared temperature sensing unit (12), the 485 communication unit (15) and the radio frequency wireless communication unit (14) and is used for processing acquired data, monitoring the temperature of the corresponding position of the core processing control module and exchanging data with external equipment;
the power supply unit (11) is electrically connected with the array type infrared temperature sensing unit (12), the core processing control module (13), the radio frequency wireless communication unit (14) and the 485 communication unit (15) respectively;
the 485 communication unit (15) is electrically connected with the core processing control module (13);
the radio frequency wireless communication unit (14) is electrically connected with the core processing control module (13).
2. The non-contact infrared temperature monitoring device for electric apparatus of claim 1,
characterized in that the support (3) comprises:
the fixing boss (31) is used for placing the magnet and the fixing magnet and installing a screw;
the strip-shaped fixing hole (32) is used for fixing a binding belt and fixing a screw, so that the position of the shell (2) can be conveniently adjusted;
the upright column (33) is used for supporting the shell (2) and realizing the rotation of the shell (2) at any angle;
and the connecting shaft (34) is used for connecting the shell (2) and the fixing support (3), and after the shell (2) is adjusted to a proper position, the shell (2) and the fixing support (3) are fixed.
3. Non-contact infrared temperature monitoring device for electrical apparatuses according to claim 1, characterized in that
Characterized in that said housing (2) comprises:
the array infrared temperature sensing unit fixing hole (21) is used for fixing the array infrared temperature sensing unit;
and the shell external interface (22) is used for connecting the shell external equipment.
4. Non-contact infrared temperature monitoring device for electrical apparatuses according to claim 1, characterized in that
Characterized in that the array type infrared temperature sensing unit (12) adopts an MMLX9640 infrared temperature measurement lattice sensor and is electrically connected with the core processing control module (13) through an IIC bus.
5. Non-contact infrared temperature monitoring device for electrical apparatuses according to claim 1, characterized in that
Characterized in that the 485 communication unit (15) comprises resistors RR1, RR2, RR3, RR4, RR5, transient diodes D2, D3, a capacitor CR1 and a communication chip U4; the communication chip U4 is respectively connected with resistors RR1, RR2, RR3, RR4 and RR5, transient diodes D2 and D3 and a capacitor CR 1.
6. Non-contact infrared temperature monitoring device for electrical apparatuses according to claim 1, characterized in that
Characterized in that the radio frequency wireless communication unit (14) comprises resistors RW1, RW2, RW3 and RW4, and a radio frequency wireless communication 433M module; the radio frequency wireless communication 433M module is respectively connected with resistors RW1, RW2, RW3 and RW 4.
7. Non-contact infrared temperature monitoring device for electrical apparatuses according to claim 1, characterized in that
Characterized in that the core processing control module (13) comprises resistors RB1, RB2, RB3 and R7, capacitors C3, C4, C5, C10, C11, C12 and C13, a crystal oscillator Y1 and a CPU chip U2; the CPU chip U2 is respectively connected with resistors RB1, RB2, RB3 and R7, capacitors C3, C4, C5, C10, C11, C12 and C13 and a crystal oscillator Y1.
8. Non-contact infrared temperature monitoring device for electrical apparatuses according to claim 1, characterized in that
Characterized in that the array infrared temperature sensing unit (12) comprises resistors RT1, RT2, RT3, RT4 and an infrared chip U5; the infrared chip U5 is respectively connected with resistors RT1, RT2, RT3 and RT 4.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020815572.6U CN211855587U (en) | 2020-05-16 | 2020-05-16 | Non-contact infrared temperature monitoring device for electrical equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020815572.6U CN211855587U (en) | 2020-05-16 | 2020-05-16 | Non-contact infrared temperature monitoring device for electrical equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211855587U true CN211855587U (en) | 2020-11-03 |
Family
ID=73178702
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020815572.6U Expired - Fee Related CN211855587U (en) | 2020-05-16 | 2020-05-16 | Non-contact infrared temperature monitoring device for electrical equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211855587U (en) |
-
2020
- 2020-05-16 CN CN202020815572.6U patent/CN211855587U/en not_active Expired - Fee Related
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| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20201103 Termination date: 20210516 |
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| CF01 | Termination of patent right due to non-payment of annual fee |