CN211828752U

CN211828752U - SMPC diode lead frame

Info

Publication number: CN211828752U
Application number: CN202020322895.1U
Authority: CN
Inventors: 徐红波
Original assignee: Ningbo Gangbo Electronics Co ltd
Current assignee: Ningbo Gangbo Electronics Co ltd
Priority date: 2020-03-16
Filing date: 2020-03-16
Publication date: 2020-10-30
Anticipated expiration: 2030-03-16

Abstract

The utility model discloses a SMPC diode lead frame, including lead frame body, standing groove, connection dog and second connecting hole, the lead frame body left and right sides face all is provided with the connecting plate, and has seted up the connecting hole on the connecting plate, the standing groove is seted up at lead frame body leading flank, and lead frame body leading flank has seted up first connecting hole, and first connecting hole setting is at the standing groove downside simultaneously, first soldering tin hole has all been seted up to the inside left and right sides of first connecting hole, and first connecting hole downside through connection has first outside wire hole, and first outside wire hole is seted up at lead frame body leading flank simultaneously. SMPC diode lead frame is provided with first soldering tin hole and second soldering tin hole, when using the lead frame to carry out pin connection to the SMPC diode, when welding SMPC diode and external line, through the effect in first soldering tin hole and second soldering tin hole for SMPC diode is better with external line welded connection effect, connects more firmly.

Description

SMPC diode lead frame

Technical Field

The utility model relates to a lead frame especially relates to SMPC diode lead frame.

Background

The lead frame is used as a chip carrier of an integrated circuit, is a key structure body for realizing the electrical connection between the leading-out end of an internal circuit of a chip and a lead by means of a bonding material to form an electrical circuit, plays a role of a bridge connected with an external lead and has better mechanical strength, stress relaxation resistance and low creep property.

Present lead frame for SMPC diode is when using, and the inside soldering tin hole that lacks of connecting hole makes the pin connection effect on external line and the lead frame not good like this, and after pin connection on present external line and the lead frame had in addition is connected, lacks spacing measure, the condition that takes place to drop like this easily.

SUMMERY OF THE UTILITY MODEL

The utility model provides a not enough to among the prior art, provide SMPC diode lead frame, the pin connection effect on exterior line and the lead frame is not good, takes place to drop easily.

In order to solve the technical problem, the utility model is solved by the following technical scheme: the SMPC diode lead frame comprises a lead frame body, a placing groove, a connecting stop block and a second connecting hole, wherein the left side surface and the right side surface of the lead frame body are respectively provided with a connecting plate, the connecting holes are formed in the connecting plates, the placing groove is formed in the front side surface of the lead frame body, the front side surface of the lead frame body is provided with a first connecting hole, the first connecting hole is formed in the lower side surface of the placing groove, the left side and the right side of the inner part of the first connecting hole are respectively provided with a first soldering tin hole, the lower side surface of the first connecting hole is connected with a first outer wire hole in a penetrating way, the first outer wire hole is formed in the front side surface of the lead frame body, the connecting stop block is arranged in the front side of the lead frame body and is arranged in front of the first connecting, and the second connecting hole sets up side on the standing groove, and second soldering tin hole has all been seted up to the inside left and right sides of second connecting hole simultaneously, side through connection has the second outer wire hole on the second connecting hole, and the second outer wire hole is seted up at lead frame body leading flank, and second connecting hole front side is provided with the connection dog simultaneously.

Preferably, the connecting plate and the connecting hole are both about a central axis of the lead frame body.

Preferably, the upper side surface and the lower side surface of the placing groove are respectively communicated with the second connecting hole and the first connecting hole.

Preferably, the distance between the inner side surfaces of the first outer line holes is connected with the distance between the inner side surfaces of the first connecting holes.

Preferably, the connecting stop block and the connecting screw are symmetrically arranged about the central axis of the lead frame body, and the length of the connecting stop block is equal to that of the lead frame body.

Preferably, the distance between the inner side surfaces of the second outer line holes is equal to the distance between the inner side surfaces of the two connecting holes.

The utility model provides an SMPC diode lead frame, which is provided with a first soldering tin hole and a second soldering tin hole, when the lead frame is used for lead wire connection of an SMPC diode, and when the SMPC diode and an external wire are welded, the SMPC diode and the external wire are welded better in welding connection effect and more stable in connection through the action of the first soldering tin hole and the second soldering tin hole; be provided with and connect dog and connecting screw, after SMPC diode and outer pin-out connection accomplished, let to connect the dog and fix on the lead frame through using connecting screw, play to shelter from limiting displacement to SMPC diode and outer pin-out connection department through connecting the dog simultaneously, cause it to be difficult to take place to drop.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following will discuss the drawings required to be used in the description of the embodiments or the prior art, it is obvious that the technical solutions described in conjunction with the drawings are only some embodiments of the present invention, and for those skilled in the art, other embodiments and drawings thereof can be obtained according to the embodiments shown in the drawings without creative efforts.

Fig. 1 is a front view of the present invention.

Fig. 2 is a side view and front view schematic diagram of the connection block of the present invention.

Fig. 3 is an enlarged schematic view of a portion a of fig. 1 according to the present invention.

Fig. 4 is an enlarged schematic view of the structure at B in fig. 1 according to the present invention.

In the figure: the lead frame comprises a lead frame body 1, a connecting plate 2, connecting holes 3, a placing groove 4, a first connecting hole 5, a first soldering tin hole 6, a first outer wire hole 7, a connecting stop block 8, a connecting screw 9, a second connecting hole 10, a second soldering tin hole 11 and a second outer wire hole 12.

Detailed Description

The technical solutions of the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings, and it is to be understood that the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments described in the present disclosure, all other embodiments obtained by a person skilled in the art without creative efforts are within the scope of the present disclosure.

The embodiment of the utility model provides a SMPC diode lead frame can make the lead wire gas tightness better.

As shown in FIGS. 1 to 4, the lead frame comprises a lead frame body 1, a placement groove 4, a connection block 8 and a second connection hole 10, wherein the left and right sides of the lead frame body 1 are both provided with connection plates 2, the connection holes 3 are formed on the connection plates 2, the placement groove 4 is opened on the front side of the lead frame body 1, the front side of the lead frame body 1 is provided with a first connection hole 5, the first connection hole 5 is arranged on the lower side of the placement groove 4, the left and right sides of the inside of the first connection hole 5 are both provided with a first soldering hole 6, the lower side of the first connection hole 5 is connected with a first outer wire hole 7 in a penetrating manner, the first outer wire hole 7 is opened on the front side of the lead frame body 1, the connection block 8 is arranged on the front, the second connecting hole 10 is opened at the 1 front side of lead frame body, and the second connecting hole 10 sets up the side on standing groove 4, and second soldering tin hole 11 has all been seted up to the inside left and right sides of second connecting hole 10 simultaneously, and the side through connection has the second outer wire hole 12 on the second connecting hole 10, and the second outer wire hole 12 is opened at the 1 front side of lead frame body, and the 10 front sides of second connecting hole are provided with connection dog 8 simultaneously.

Further, the connecting plate 2 and the connecting hole 3 are both about the central axis of the lead frame body 1.

Further, the upper and lower side surfaces of the placement groove 4 are respectively communicated with the second connection hole 10 and the first connection hole 5.

Further, the distance between the inner sides of the first outer wire holes 7 is connected with the distance between the inner sides of the first connecting holes 5.

Further, the connecting stoppers 8 and the connecting screws 9 are symmetrically arranged about the central axis of the lead frame body 1, and the length of the connecting stoppers 8 is equal to the length of the lead frame body 1.

Further, the distance between the inner sides of the second outer wire holes 12 is equal to the distance between the inner sides of the two connecting holes 10.

It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive. The scope of the present application is defined by the appended claims, rather than the foregoing description, and all changes that come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.

The utility model provides an SMPC diode lead frame, when using, the SMPC diode is put into the placing groove 4 on the lead frame body 1, and the connecting pin on the SMPC diode is correspondingly put into the first connecting hole 5 and the second connecting hole 10, so that the SMPC diode can be fully put into the placing groove 4, at the same time, the outer lead wire is put into the first outer wire hole 7 and the second outer wire hole 12 according to the size, so that the outer lead wire can correspond to the SMPC diode connecting pin in the first connecting hole 5 and the second connecting hole 10, then the SMPC diode connecting pin is welded with the outer lead wire connection part, so that the soldering tin can enter the first soldering tin hole 6 and the second soldering tin hole 11, so that the connection effect of the SMPC diode connecting pin and the outer lead wire is better, after the welding is finished, the connecting block 8 is fixed on the lead frame body 1 by using the connecting block 9 screw, make two connection stop dogs 8 fix respectively in first connecting hole 5 and first outer wire hole 7 junction front side and second connecting hole 10 and second outer wire hole 12 junction front side, make like this and connect stop dog 8 and can play to shelter from limiting displacement to SMPC diode connection pin and outer lead wire, cause it to be difficult to take place to drop, when installation lead frame body 1, through using connecting hole 3 on the fixed screw through connection board 2 to be connected with adjacent lead frame body 1, or directly fix lead frame body 1 in the installation region.

Claims

SMPC diode lead frame, including lead frame body (1), standing groove (4), connection dog (8) and second connecting hole (10), its characterized in that: the lead frame comprises a lead frame body (1), wherein the left side surface and the right side surface of the lead frame body (1) are respectively provided with a connecting plate (2), the connecting plates (2) are provided with connecting holes (3), a placing groove (4) is arranged on the front side surface of the lead frame body (1), the front side surface of the lead frame body (1) is provided with a first connecting hole (5), the first connecting hole (5) is arranged on the lower side surface of the placing groove (4), the left side and the right side inside the first connecting hole (5) are respectively provided with a first soldering tin hole (6), the lower side surface of the first connecting hole (5) is connected with a first outer line hole (7) in a penetrating way, the first outer line hole (7) is arranged on the front side surface of the lead frame body (1), a connecting stop block (8) is arranged on the front side of the lead frame body (1), the connecting stop block (8) is arranged on the front side of, the lead frame is characterized in that the second connecting hole (10) is formed in the front side face of the lead frame body (1), the second connecting hole (10) is formed in the upper side face of the placing groove (4), meanwhile, second soldering tin holes (11) are formed in the left side and the right side of the inner portion of the second connecting hole (10), the second connecting hole (10) is connected with a second outer wire hole (12) in a penetrating mode, the second outer wire hole (12) is formed in the front side face of the lead frame body (1), and meanwhile the connecting stop block (8) is arranged on the front side of the second connecting hole (10).
2. The SMPC diode lead frame of claim 1, wherein: the connecting plate (2) and the connecting hole (3) are all about the central axis of the lead frame body (1).
3. The SMPC diode lead frame of claim 1, wherein: the upper side surface and the lower side surface of the placing groove (4) are respectively communicated with the second connecting hole (10) and the first connecting hole (5).
4. The SMPC diode lead frame of claim 1, wherein: the distance between the inner side surfaces of the first outer wire holes (7) is connected with the distance between the inner side surfaces of the first connecting holes (5).
5. The SMPC diode lead frame of claim 1, wherein: the connecting stop block (8) and the connecting screw (9) are symmetrically arranged about the central axis of the lead frame body (1), and the length of the connecting stop block (8) is equal to that of the lead frame body (1).
6. The SMPC diode lead frame of claim 1, wherein: the distance between the inner side surfaces of the second outer line holes (12) is equal to the distance between the inner side surfaces of the two connecting holes (10).