CN211786962U - Heat dissipation mechanism for display - Google Patents
Heat dissipation mechanism for display Download PDFInfo
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- CN211786962U CN211786962U CN202020232764.4U CN202020232764U CN211786962U CN 211786962 U CN211786962 U CN 211786962U CN 202020232764 U CN202020232764 U CN 202020232764U CN 211786962 U CN211786962 U CN 211786962U
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- heat dissipation
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- display
- heat
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Abstract
The utility model discloses a display heat dissipation mechanism, display heat dissipation mechanism includes organism module, water-cooling module, fixed module and heat dissipation module, organism module inner chamber fixed mounting has the water-cooling module, organism module one side integrated into one piece has fixed module, the fixed module inner chamber can be dismantled and be connected with the heat dissipation module. The utility model discloses through multiple radiating mode in the use, dispel the heat to the display simultaneously to effectively promote the display and at the radiating effect of during operation, promote the life of display, can carry out nimble and swift installation to heat dissipation mechanism according to the user demand simultaneously, use convenience very.
Description
Technical Field
The utility model relates to a heat dissipation equipment technical field specifically is a display heat dissipation mechanism.
Background
The display is an I/O device belonging to a computer, namely an input/output device. It can be classified into CRT, LCD, etc. It is a display tool that displays certain electronic documents on a screen through a specific transmission device and reflects them to human eyes, and the display is also commonly called a monitor. The display is an I/O device belonging to a computer, namely an input/output device. It can be classified into CRT, LCD, PDP, OLED, etc. The electronic document display tool is a display tool which displays a certain electronic document on a screen through a specific transmission device and reflects the electronic document to human eyes.
However, the existing heat dissipation mechanism for the display has the following disadvantages in the using process:
1. the heat dissipation effect is not good in the use of current display heat dissipation mechanism, uses for a long time, causes the display to damage easily, can't carry out nimble and swift installation to heat dissipation mechanism according to the user demand simultaneously, uses very inconvenient.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a display heat dissipation mechanism to solve among the above-mentioned background art current display heat dissipation mechanism in the use radiating effect not good, long-time the use causes the display to damage easily, can't carry out nimble and swift installation to heat dissipation mechanism according to the user demand simultaneously, uses inconvenient problem very.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a display heat dissipation mechanism, display heat dissipation mechanism includes organism module, water-cooling module, fixed module and heat dissipation module, organism module inner chamber fixed mounting has the water-cooling module, organism module one side integrated into one piece has fixed module, fixed module inner chamber can dismantle and be connected with the heat dissipation module.
Preferably, the machine body module comprises a display shell, a base and a heat dissipation opening, the base is integrally formed at the bottom of the display shell, the heat dissipation opening is fixedly formed at the bottom of an inner cavity of the display shell, the display shell can be supported through the base, and meanwhile, heat in the inner cavity of the display shell can be dissipated through the heat dissipation opening.
Preferably, the water-cooling module comprises storage water tank, circulating pump and circulating pipe, the storage water tank is located display shell inner chamber bottom one end, the pipeline fixedly connected with circulating pump is passed through at the storage water tank top, the circulating pump goes out water end fixedly connected with circulating pipe, the circulating pipe other end links to each other with the storage water tank is fixed, and the circulating pipe is the copper material, extracts the coolant liquid of storage water tank inner chamber through the circulating pump to in pouring into the circulating pipe, the coolant liquid can absorb the heat that the display distributed out when the circulating pipe inner chamber circulates, and the circulating pipe adopts the copper material to make, thereby can effectively promote the absorption effect to the heat, thereby with further promotion to the radiating effect of display.
Preferably, fixed module comprises fixed slot, heat-conducting plate and exhaust hole, fixed slot integrated into one piece is at demonstration shell opposite side surface middle part, fixed slot inner chamber is fixed to be inlayed and is had the heat-conducting plate, the exhaust hole has all been fixed to have seted up in the heat-conducting plate both sides, can carry out quick installation and dismantlement to the heat dissipation module through the fixed slot to make things convenient for the operator that can be more to install and dismantle the heat dissipation module according to the user demand, use more nimble and convenient.
Preferably, the heat dissipation module comprises a heat dissipation plate, a mounting plate, a semiconductor refrigeration piece and a heat dissipation fan, the heat dissipation plate is fixedly mounted on one side of the water cooling module, the heat dissipation plate is attached to one side of the heat conduction plate, the mounting plate is matched with the fixing groove, the semiconductor refrigeration piece is fixedly embedded on the surface of the mounting plate, the heat dissipation fan is fixedly mounted on one side of the semiconductor refrigeration piece through a support, the heat dissipation plate can absorb heat of the inner cavity of the display, the semiconductor refrigeration piece is fixedly embedded on the mounting plate, the semiconductor refrigeration piece utilizes the Peltier effect of semiconductor materials, when direct current passes through a galvanic couple formed by serially connecting two different semiconductor materials, heat can be respectively absorbed and released at two ends of the galvanic couple, so that cold air can be released, the semiconductor refrigeration piece and the heat conduction plate are attached to each other, so that the, thereby, the heat dissipation effect of the display can be achieved.
Preferably, the mounting panel both sides are all fixed and have been seted up the aspirating hole, and aspirating hole and exhaust hole mutually support, the fixed parcel of mounting panel lateral wall has the sealing washer, to heat dissipation module installation back, can seal fixed slot and mounting panel junction through the sealing washer, and aspirating hole and exhaust hole link to each other simultaneously, can take out the heat of display inner chamber fast through the heat dissipation fan to further promotion is to the radiating effect who shows.
The utility model provides a display heat dissipation mechanism possesses following beneficial effect:
(1) the utility model discloses a circulating pump extracts the coolant liquid of storage water tank inner chamber to in pouring into the circulating pipe, the coolant liquid can absorb the heat that the display distributed when the circulating pipe inner chamber circulates, and the circulating pipe adopts the copper material to make, thereby can effectively promote thermal absorption effect, thereby with the further radiating effect of promotion to the display.
(2) The utility model discloses a fixed slot can carry out quick installation and dismantlement to the heat dissipation module, thereby can be more make things convenient for the operator to install and dismantle the heat dissipation module according to the user demand, use more nimble and convenient, the fin can absorb the heat of display inner chamber, fixed the inlaying has the semiconductor refrigeration piece on the mounting panel, the semiconductor refrigeration piece utilizes semiconductor material's Peltier effect, when the galvanic couple that the direct current is established ties into through two kinds of different semiconductor material, can absorb the heat respectively and emit the heat at the both ends of galvanic couple, thereby air conditioning can be released, the semiconductor refrigeration piece is in the same place with the heat-conducting plate is pasted each other, thereby the heat of accessible heat-conducting plate on to the fin is neutralized, thereby can play the radiating effect to the display.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic structural view of the water cooling module of the present invention;
fig. 3 is a schematic sectional structure of the present invention;
fig. 4 is a schematic structural diagram of the heat dissipation module of the present invention.
In the figure: 1. a body module; 101. a display housing; 102. a base; 103. a heat dissipation port; 2. a water-cooled module; 201. a water storage tank; 202. a circulation pump; 203. a circulation pipe; 3. a fixed module; 301. fixing grooves; 302. a heat conducting plate; 303. an exhaust hole; 4. a heat dissipation module; 401. a heat sink; 402. mounting a plate; 403. A semiconductor refrigeration sheet; 404. a heat dissipation fan; 405. an air exhaust hole; 406. and (5) sealing rings.
Detailed Description
The technical solution in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention.
As shown in fig. 1-4, the utility model provides a technical solution: the utility model provides a display heat dissipation mechanism, display heat dissipation mechanism includes organism module 1, water-cooling module 2, fixed module 3 and heat dissipation module 4, 1 inner chamber fixed mounting of organism module has water- cooling module 2, 1 one side integrated into one piece of organism module has fixed module 3, 3 inner chambers of fixed module can dismantle and be connected with heat dissipation module 4.
The machine body module 1 comprises a display shell 101, a base 102 and a heat dissipation port 103, wherein the base 102 is integrally formed at the bottom of the display shell 101, the heat dissipation port 103 is fixedly formed at the bottom of an inner cavity of the display shell 101, the display shell 101 can be supported through the base 102, and heat in the inner cavity of the display shell 101 can be dissipated through the heat dissipation port 103.
The water-cooling module 2 comprises storage water tank 201, circulating pump 202 and circulating pipe 203, storage water tank 201 is located display shell 101 inner chamber bottom one end, pipeline fixedly connected with circulating pump 202 is passed through at storage water tank 201 top, circulating pump 202 water outlet end fixedly connected with circulating pipe 203, the circulating pipe 203 other end links to each other with storage water tank 201 is fixed, and circulating pipe 203 is the copper material, extracts the coolant liquid of storage water tank 201 inner chamber through circulating pump 202 to pour into in the circulating pipe 203, the coolant liquid when circulating pipe 203 inner chamber circulation, can absorb the heat that the display gave out, and circulating pipe 203 adopts the copper material to make, thereby can effectively promote thermal absorption effect, thereby with further promotion to the radiating effect of display.
Fixed module 3 comprises fixed slot 301, heat-conducting plate 302 and exhaust hole 303, fixed slot 301 integrated into one piece is at display shell 101 opposite side surface middle part, fixed the inlaying of fixed slot 301 inner chamber has heat-conducting plate 302, exhaust hole 303 has all been fixed to have seted up in heat-conducting plate 302 both sides, can carry out quick installation and dismantlement to heat dissipation module 4 through fixed slot 301 to the convenient operator that can be more installs and dismantles heat dissipation module 4 according to the user demand, uses more nimble and convenient.
The heat dissipation module 4 comprises a heat dissipation plate 401, a mounting plate 402, a semiconductor refrigeration plate 403 and a heat dissipation fan 404, the heat dissipation plate 401 is fixedly mounted on one side of the water cooling module 2, the heat dissipation plate 401 is attached to one side of the heat conduction plate 302, the mounting plate 402 is matched with the fixing groove 301, the semiconductor refrigeration plate 403 is fixedly embedded on the surface of the mounting plate 402, the heat dissipation fan 404 is fixedly mounted on one side of the semiconductor refrigeration plate 403 through a support, the heat dissipation plate 401 can absorb heat in the inner cavity of the display, the semiconductor refrigeration plate 403 is fixedly embedded on the mounting plate 402, the semiconductor refrigeration plate 403 utilizes the Peltier effect of semiconductor materials, when direct current passes through a galvanic couple formed by connecting two different semiconductor materials in series, heat can be absorbed and released at two ends of the galvanic couple respectively, so as to release cold air, and the semiconductor refrigeration plate 403 is attached, therefore, the heat on the heat sink 401 can be neutralized by the heat conducting plate 302, and the heat dissipation effect on the display can be achieved.
It should be noted that, when the display heat dissipation mechanism works, the display shell 101 can be supported by the base 102, and the heat in the inner cavity of the display shell 101 can be dissipated by the heat dissipating port 103, the coolant in the inner cavity of the water storage tank 201 is extracted by the circulating pump 202 and injected into the circulating pipe 203, when the coolant circulates in the inner cavity of the circulating pipe 203, the heat dissipated by the display can be absorbed, and the circulating pipe 203 is made of copper material, so that the heat absorption effect can be effectively improved, the heat dissipation effect on the display can be further improved, the heat dissipation module 4 can be rapidly installed and disassembled by the fixing groove 301, so that the operator can install and disassemble the heat dissipation module 4 according to the use requirement, the use is more flexible and convenient, and the heat dissipating fins 401 can absorb the heat in the inner cavity of the display, the semiconductor refrigerating sheet 403 is fixedly embedded in the mounting plate 402, the semiconductor refrigerating sheet 403 utilizes the Peltier effect of semiconductor materials, when direct current passes through a couple formed by connecting two different semiconductor materials in series, heat can be absorbed and released at two ends of the couple respectively, so that cold air can be released, the semiconductor refrigerating sheet 403 and the heat conducting plate 302 are attached together, so that the heat on the heat radiating sheet 401 can be neutralized through the heat conducting plate 302, and the heat radiating effect of the display can be achieved.
The 15G0.5-8 type circulating pump 202, the TEC1-12706 type semiconductor refrigerating plate 403 and the 5V-DRGB type heat dissipation fan 404 are all products of the prior art, and detailed description is omitted.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. A display heat dissipation mechanism, its characterized in that: the display heat dissipation mechanism comprises a machine body module (1), a water cooling module (2), a fixed module (3) and a heat dissipation module (4), wherein the water cooling module (2) is fixedly installed in the inner cavity of the machine body module (1), the fixed module (3) is integrally formed on one side of the machine body module (1), and the heat dissipation module (4) is detachably connected to the inner cavity of the fixed module (3).
2. The heat dissipation mechanism of claim 1, wherein: the machine body module (1) is composed of a display shell (101), a base (102) and a heat dissipation port (103), the base (102) is integrally formed at the bottom of the display shell (101), and the heat dissipation port (103) is fixedly formed at the bottom of an inner cavity of the display shell (101).
3. The heat dissipation mechanism of claim 1, wherein: the water-cooling module (2) comprises storage water tank (201), circulating pump (202) and circulating pipe (203), storage water tank (201) are located display shell (101) inner chamber bottom one end, pipeline fixedly connected with circulating pump (202) are passed through at storage water tank (201) top, circulating pump (202) water-out end fixedly connected with circulating pipe (203), the circulating pipe (203) other end is fixed continuous with storage water tank (201), and circulating pipe (203) are the copper material.
4. The heat dissipation mechanism of claim 1, wherein: fixed module (3) comprise fixed slot (301), heat-conducting plate (302) and exhaust hole (303), fixed slot (301) integrated into one piece is at display shell (101) opposite side surface middle part, fixed slot (301) inner chamber is fixed to be inlayed and is had heat-conducting plate (302), exhaust hole (303) have all been fixed to heat-conducting plate (302) both sides.
5. The heat dissipation mechanism of claim 4, wherein: radiating module (4) comprises fin (401), mounting panel (402), semiconductor refrigeration piece (403) and heat dissipation fan (404), fin (401) fixed mounting is in water-cooling module (2) one side, and fin (401) laminate mutually with heat-conducting plate (302) one side, mounting panel (402) and fixed slot (301) mutually support, mounting panel (402) fixed surface inlays and has semiconductor refrigeration piece (403), semiconductor refrigeration piece (403) one side has heat dissipation fan (404) through support fixed mounting.
6. The heat dissipation mechanism of claim 5, wherein: mounting panel (402) both sides are all fixed and have been seted up aspirating hole (405), and aspirating hole (405) and exhaust hole (303) mutually support, the fixed parcel of mounting panel (402) lateral wall has sealing washer (406).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020232764.4U CN211786962U (en) | 2020-02-28 | 2020-02-28 | Heat dissipation mechanism for display |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020232764.4U CN211786962U (en) | 2020-02-28 | 2020-02-28 | Heat dissipation mechanism for display |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211786962U true CN211786962U (en) | 2020-10-27 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020232764.4U Expired - Fee Related CN211786962U (en) | 2020-02-28 | 2020-02-28 | Heat dissipation mechanism for display |
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| CN (1) | CN211786962U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113270004A (en) * | 2021-05-20 | 2021-08-17 | 江西环境工程职业学院 | A mathematics teaching aid for training of mathematics thinking |
-
2020
- 2020-02-28 CN CN202020232764.4U patent/CN211786962U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113270004A (en) * | 2021-05-20 | 2021-08-17 | 江西环境工程职业学院 | A mathematics teaching aid for training of mathematics thinking |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20201027 |
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| CF01 | Termination of patent right due to non-payment of annual fee |