CN211785947U - Circuit board insulation resistance failure detection system - Google Patents
Circuit board insulation resistance failure detection system Download PDFInfo
- Publication number
- CN211785947U CN211785947U CN202020117682.5U CN202020117682U CN211785947U CN 211785947 U CN211785947 U CN 211785947U CN 202020117682 U CN202020117682 U CN 202020117682U CN 211785947 U CN211785947 U CN 211785947U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- insulation resistance
- power supply
- resistance failure
- infrared thermal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
Abstract
The utility model discloses a circuit board insulation resistance failure inspection system, which comprises a test power supply, a power supply and a power supply, wherein the test power supply is used for connecting a circuit board to be inspected and providing test current for the circuit board to be inspected; the infrared thermal imager sets up wait to examine the top of circuit board, be used for the scanning wait to examine the circuit board. When the inspection, test power provides test current for waiting to inspect the circuit board to make and wait to inspect and add test current between the network that two insulation resistance became invalid of circuit board, compare with other positions of waiting to inspect the circuit board, the position that insulation resistance became invalid generates heat because test current passes through, and the temperature risees, and the infrared thermal imager is treated the inspection circuit board and is scanned, can lock this position fast, and can not destroy and wait to inspect the circuit board.
Description
Technical Field
The utility model relates to a circuit board technical field, in particular to circuit board insulation resistance inefficacy test system.
Background
Reliability tests are required in the production process of the circuit board. When a voltage is applied to a circuit board in a high-temperature and high-humidity environment, the insulation resistance sometimes decreases, that is, electromigration occurs, and the position of the insulation resistance failure needs to be determined. The traditional method adopts a destructive network isolation method, which can damage the circuit board and is easily influenced by the temperature, the humidity and human factors of the environment, and some uncertain factors are brought to the further analysis of the circuit board.
SUMMERY OF THE UTILITY MODEL
The utility model discloses aim at solving one of the technical problem that exists among the prior art at least. Therefore, the utility model provides a circuit board insulation resistance test system that became invalid can confirm the position that insulation resistance became invalid under the condition of not destroying the circuit board.
The circuit board insulation resistance failure detection system comprises a test power supply, a detection circuit board and a detection circuit board, wherein the test power supply is used for connecting the circuit board to be detected and providing test current for the circuit board to be detected; the infrared thermal imager sets up wait to examine the top of circuit board, be used for the scanning wait to examine the circuit board.
According to the utility model discloses circuit board insulation resistance test system that became invalid has following beneficial effect at least: when the inspection, test power provides test current for waiting to inspect the circuit board to make and wait to inspect and add test current between the network that two insulation resistance became invalid of circuit board, compare with other positions of waiting to inspect the circuit board, the position that insulation resistance became invalid generates heat because test current passes through, and the temperature risees, and the infrared thermal imager is treated the inspection circuit board and is scanned, can lock this position fast, and can not destroy and wait to inspect the circuit board.
According to some embodiments of the invention, the test power supply is a dc pulsed power supply.
According to some embodiments of the invention, the current resolution of the test power supply is greater than or equal to 50 fA.
According to some embodiments of the invention, the resolution of the infrared thermal imager is >5 μm.
According to the utility model discloses a some embodiments, circuit board insulation resistance failure test system still includes the support, infrared thermal imager installs on the support.
According to some embodiments of the utility model, the support is liftable support.
According to some embodiments of the invention, the bottom of the support is provided with a positioning element.
Additional aspects and advantages of the invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the invention.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
fig. 1 is one of schematic structural diagrams of a circuit board insulation resistance failure inspection system according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of a daisy chain of circuit boards to be tested of the circuit board insulation resistance failure testing system shown in FIG. 1;
FIG. 3 is a schematic diagram of the current output of the test power supply of the insulation resistance failure inspection system of the circuit board shown in FIG. 1;
fig. 4 is one of the schematic structural diagrams of the insulation resistance failure inspection system of the circuit board according to the embodiment of the present invention.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present invention, and should not be construed as limiting the present invention.
In the description of the present invention, it should be understood that the orientation or positional relationship indicated with respect to the orientation description, such as up, down, front, rear, left, right, etc., is based on the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplification of description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
In the description of the present invention, unless there is an explicit limitation, the words such as setting, installation, connection, etc. should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above words in combination with the specific contents of the technical solution.
Referring to fig. 1, the present embodiment discloses a circuit board insulation resistance failure inspection system, which includes a testing power supply 100 and an infrared thermal imager 200, wherein the testing power supply 100 is used for connecting a circuit board 300 to be inspected and providing a testing current for the circuit board 300 to be inspected, the infrared thermal imager 200 is disposed above the circuit board 300 to be inspected, and the infrared thermal imager 200 is used for scanning the circuit board 300 to be inspected. It should be noted that the infrared thermal imaging camera 200 is a device that converts an image of the temperature distribution of a subject into a visible image by detecting infrared radiation from the subject and performing signal processing, photoelectric conversion, and the like using an infrared thermal imaging technique. According to the operating mode differentiation, infrared thermal imager 200 can be divided into handheld, online and wear-type, the utility model discloses infrared thermal imager 200 is handheld, handheld infrared thermal imager easy operation, small, portable and deposit.
Referring to fig. 2, fig. 2 is a schematic diagram of a daisy chain (daisy chain) of a circuit board 300 to be tested, where circles in fig. 2 represent nodes of the daisy chain, the nodes may be copper plated through holes, blind holes or pads, a "+" in the circles represents a positive electrode, and a "-" in the circles represents a negative electrode. When the board fails, the daisy chain is shorted between two adjacent nets, such as insulation failure location 310 shown in the figure. During inspection, the test power supply 100 provides test current for the circuit board 300 to be inspected so as to add the test current between the two insulation resistance failure networks of the circuit board 300 to be inspected, compared with other positions of the circuit board 300 to be inspected, the insulation resistance failure position 310 generates heat because the test current passes through, the temperature rises, the infrared thermal imager 200 scans the circuit board 300 to be inspected, the position can be locked quickly, and the circuit board 300 to be inspected can not be damaged.
In some embodiments, the test power supply 100 employs a dc pulse power supply, and the insulation resistance failure location 310 is resistive, and when a pulse current passes through the insulation resistance failure location 310, the location is more likely to generate heat, which is beneficial to improving the inspection efficiency.
Referring to fig. 3, fig. 3 is a schematic diagram of the current output of the test power supply 100, wherein the ordinate is the current value, and the settable interval of the current value is [10nA, 1A ]]The abscissa is time, where T is time for which current is applied, and the settable interval of T is [1s (sec), 10000s]T is the time without loading current, and the settable range of t is [1s, 10000s ]]. The settable period of the current is [ T, nT + T]. The current resolution of the test power supply 100 is greater than or equal to 50fA (1 fA-1 e)-15A) The testing current can be accurately adjusted according to the testing requirements of different circuit boards, and the circuit board is prevented from being damaged due to overlarge testing current.
In some embodiments, the resolution of the infrared thermal imager 200 is >5 μm, and after the initial positioning of the insulation resistance failure location 310, the location can be identified by zooming in to facilitate more accurate determination of the insulation resistance failure location 310.
Referring to fig. 4, in some embodiments, the insulation resistance failure inspection system further includes a bracket 400, and the infrared thermal imaging camera 200 is mounted on the bracket 400. When the inspection time is long, the labor intensity of operators can be reduced by fixing the infrared thermal imager 200 through the support 400, the infrared thermal imager 200 can be stably placed, and the problems of double images and blurring of the obtained images are avoided.
In order to facilitate adjustment of the distance between the thermal infrared imager 200 and the circuit board 300 to be inspected, the support 400 is a liftable support, and the distance between the thermal infrared imager 200 and the circuit board 300 to be inspected can be quickly, simply and conveniently adjusted by the liftable support.
Referring to fig. 4, in some embodiments, the bottom of the bracket 400 is provided with a positioning element 500, and the positioning element 500 may be a linear frame, a positioning point or a positioning post. During inspection, the positioning member 500 may identify the imaging range of the thermal infrared imager 200.
The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made without departing from the spirit of the present invention within the knowledge of those skilled in the art.
Claims (7)
1. A circuit board insulation resistance failure inspection system, comprising:
the testing power supply (100) is used for connecting the circuit board (300) to be tested and providing testing current for the circuit board (300) to be tested;
the infrared thermal imaging system (200) is arranged above the circuit board (300) to be detected and used for scanning the circuit board (300) to be detected.
2. The insulation resistance failure inspection system of a circuit board according to claim 1, wherein the test power supply (100) employs a direct current pulse power supply.
3. The insulation resistance failure inspection system of the circuit board according to claim 2, wherein the current resolution of the test power supply (100) is greater than or equal to 50 fA.
4. The insulation resistance failure inspection system of circuit board according to claim 1, characterized in that the resolution of the infrared thermal imager (200) is >5 μm.
5. The insulation resistance failure inspection system of circuit board according to claim 1, further comprising a bracket (400), wherein the infrared thermal imaging camera (200) is mounted on the bracket (400).
6. The insulation resistance failure inspection system of a circuit board according to claim 5, wherein the bracket (400) is a liftable bracket.
7. The insulation resistance failure inspection system for the circuit board as recited in claim 5 or 6, characterized in that a positioning piece (500) is arranged at the bottom of the bracket (400).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020117682.5U CN211785947U (en) | 2020-01-17 | 2020-01-17 | Circuit board insulation resistance failure detection system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020117682.5U CN211785947U (en) | 2020-01-17 | 2020-01-17 | Circuit board insulation resistance failure detection system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211785947U true CN211785947U (en) | 2020-10-27 |
Family
ID=72894488
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020117682.5U Active CN211785947U (en) | 2020-01-17 | 2020-01-17 | Circuit board insulation resistance failure detection system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211785947U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113447848A (en) * | 2021-06-24 | 2021-09-28 | 深圳市美信咨询有限公司 | Method for positioning electric leakage between PCB holes |
| CN115389820A (en) * | 2022-10-27 | 2022-11-25 | 广东微容电子科技有限公司 | MLCC insulation resistance detection device and use method |
-
2020
- 2020-01-17 CN CN202020117682.5U patent/CN211785947U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113447848A (en) * | 2021-06-24 | 2021-09-28 | 深圳市美信咨询有限公司 | Method for positioning electric leakage between PCB holes |
| CN115389820A (en) * | 2022-10-27 | 2022-11-25 | 广东微容电子科技有限公司 | MLCC insulation resistance detection device and use method |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN211785947U (en) | Circuit board insulation resistance failure detection system | |
| CN105158678A (en) | Printed circuit board short-circuit fault rapid detection device | |
| JP2018159705A (en) | Automatic optical inspection system and method for operation | |
| JPH05312636A (en) | Infrared inspection system and method | |
| CN107238796A (en) | A kind of maintainability test equipment for wiring board | |
| CN104730078A (en) | Thermal infrared imager-based AOI circuit board detection method | |
| CN112881786B (en) | Electric leakage detection method, device and system | |
| CN105659352B (en) | For the target and/or filament of X-ray tube, X-ray tube, for identifying the method for target and/or filament and the method for the characteristic value for setting target and/or filament | |
| CN201715996U (en) | Interlayer offset measuring device | |
| CN116124006A (en) | Automatic spot inspection method of battery pole piece visual inspection system | |
| JP2002526940A (en) | Method for detecting the position of a component mounted on a substrate in an automatic mounting machine | |
| CN108181323A (en) | Integrated circuit plate fault detection method and system based on electromagnetic signature | |
| CN103018163A (en) | Fault detection method and fault detection device | |
| KR101018717B1 (en) | Method and standard block for the performance evaluation of an infrared thermography system inspecting PCBA | |
| US11573251B2 (en) | Semiconductor sample inspection device and inspection method | |
| KR100783352B1 (en) | System and method for inspect printed circuit board assembly using infrared thermography | |
| JPS63134943A (en) | Testing device for semiconductor element | |
| KR20110026047A (en) | Pcb assembly inspection devices using infrared thermal imaging camera | |
| KR100513877B1 (en) | Device and method for detecting the defect of IC | |
| CN210863483U (en) | Detection device for evaluating uniform corrosion of metal material | |
| TW202122810A (en) | Light emitting element detecting method and equipment | |
| TWI239063B (en) | Method for detecting defectives in an integrated circuit | |
| CN217212848U (en) | Telescopic probe device for IV and EL tests | |
| RU2413273C1 (en) | Automated device of nondestructive check of operability and diagnostics of radio electronic equipment faults | |
| KR20190119372A (en) | Method of testing a cmos image sensor and apparatus for performing the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |