CN211716326U - Lamp strip unit, lamp strip circuit board and lamp strip thereof - Google Patents
Lamp strip unit, lamp strip circuit board and lamp strip thereof Download PDFInfo
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- CN211716326U CN211716326U CN201922500278.6U CN201922500278U CN211716326U CN 211716326 U CN211716326 U CN 211716326U CN 201922500278 U CN201922500278 U CN 201922500278U CN 211716326 U CN211716326 U CN 211716326U
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Abstract
The application relates to a lamp area unit, lamp area circuit board and lamp area thereof, including insulating substrate, two at least series connection's main line unit and bypass circuit. The main line unit includes a main line and a light emitting diode connected in series. The main circuit is arranged on the insulating substrate through an etching process, and the anode and the cathode of the light emitting diode are welded and connected with the main circuit; the bypass circuit is arranged on the insulating substrate through an etching process and is connected with the main circuit unit in parallel, and the equivalent resistance value of the bypass circuit is larger than that of the main circuit unit. The application provides lamp area unit, lamp area circuit board and lamp area thereof can solve and have the problem that the flow is complicated, the cost of manufacture is high among the preparation LED lamp area in-process in the traditional scheme.
Description
Technical Field
The application relates to the field of LED circuit boards, in particular to a lamp strip unit, a lamp strip circuit board and a lamp strip thereof.
Background
The LED lamp strip is widely popular among the public as an auxiliary lighting source. At present, in LED lamp belts on the market, pure copper foils compounded on an insulating substrate are used for etching or processing a conducting circuit to be used as a circuit board of the LED lamp belt, and the LED surface mounting and the LED series-parallel circuit are realized by etching or processing the conducting circuit. However, because of the fluctuation of the power grid voltage and the matching requirement of the voltage output of the lamp strip, a plurality of chip current-limiting resistors must be connected in series and parallel on the circuit board of the LED lamp strip.
In order to prevent the situation that all LEDs on a lamp strip are not lighted due to the necrosis of one LED, two adjacent LED light-emitting circuits are often made into a parallel circuit, so that current can still flow through the adjacent LEDs under the situation that one LED is necrotic, and the situation that all LEDs on the lamp strip unit to which the necrotic LEDs belong are not lighted is avoided. However, such a light strip has a complicated manufacturing process and high manufacturing cost.
Therefore, the problems of complex flow and high manufacturing cost exist in the process of manufacturing the LED lamp strip in the traditional scheme.
SUMMERY OF THE UTILITY MODEL
Based on this, it is necessary to provide a lamp area unit, a lamp area circuit board and a lamp area thereof to solve the problems of complicated flow and high manufacturing cost in the process of manufacturing the LED lamp area in the conventional scheme.
A light strip unit, comprising:
an insulating substrate;
the main circuit unit comprises a main circuit and a light emitting diode which are connected in series, the main circuit is arranged on the insulating substrate through an etching process, and the positive electrode and the negative electrode of the light emitting diode are welded with the main circuit;
and the bypass line is arranged on the insulating substrate through an etching process and is connected with the main line unit in parallel, and the equivalent resistance value of the bypass line is greater than that of the main line unit.
The present embodiment provides a lamp strip unit, including insulating substrate, at least two main line units and the bypass circuit of series connection. The main circuit unit comprises a main circuit and a light emitting diode which are connected in series, and the main circuit is arranged on the insulating substrate through an etching process. The bypass circuit is etched on the insulating substrate and connected with the main circuit unit in parallel, and the equivalent resistance value of the bypass circuit is larger than that of the main circuit unit. When the light emitting diode works normally, current sequentially passes through the main circuit and the light emitting diode. When the light emitting diode is damaged, the current can reach another main line unit which is connected with the main line unit to which the damaged light emitting diode belongs in series through the bypass line, and the light emitting diode on the other main line unit can work normally. Compared with the traditional lamp strip with two adjacent LED luminous circuits made into a parallel circuit, the lamp strip unit provided by the application is simple in structure and obvious in effect, and therefore the problems of complex flow and high manufacturing cost in the process of manufacturing the LED lamp strip in the traditional scheme can be solved.
In one embodiment, the material of the bypass line has a resistivity greater than that of copper.
In one embodiment, the material of the bypass line and the material of the main line are the same metal material.
In one embodiment, the bypass line and the main line are made of alloy foil.
A light strip circuit board, comprising:
the light strip unit as described above;
a conductive line positive electrode;
and the main circuit is electrically connected with the conductive wire anode and the conductive wire cathode respectively.
A light strip, comprising:
at least two lamp area unit as above, at least two the lamp area unit is connected in series.
In one embodiment, one of the main line units and the other of the main line units are welded.
In one embodiment, the bypass line of one of the light strip units is connected with the main line unit of the other light strip unit by welding.
In one embodiment, the method further comprises:
and the insulating skin is wrapped and attached to the lamp strip unit.
In one embodiment, the insulating skin is plastic.
Drawings
Fig. 1 is a schematic structural diagram of a light strip unit provided in an embodiment of the present application.
Fig. 2 is a schematic structural view of a lamp strip wiring board provided in an embodiment of the present application.
Fig. 3 is a schematic structural diagram of a light strip provided in an embodiment of the present application.
Description of the reference numerals
Insulating sheath 400
Lamp belt circuit board 20
Detailed Description
The LED lamp strip is widely popular among the public as an auxiliary lighting source. At present, in LED lamp belts on the market, pure copper foils compounded on an insulating substrate are used for etching or processing a conducting circuit to be used as a circuit board of the LED lamp belt, and the LED surface mounting and the LED series-parallel circuit are realized by etching or processing the conducting circuit. However, because of the fluctuation of the power grid voltage and the matching requirement of the voltage output of the lamp strip, a plurality of chip current-limiting resistors must be connected in series and parallel on the circuit board of the LED lamp strip. In order to prevent the situation that all LEDs on a lamp strip are not lighted due to the necrosis of one LED, two adjacent LED light-emitting circuits are often made into a parallel circuit, so that current can still flow through the adjacent LEDs under the situation that one LED is necrotic, and the situation that all LEDs on the lamp strip to which the necrotic LEDs belong are not lighted is avoided. However, such a light strip has a complicated manufacturing process. The problem of complicated flow exists in the low band in-process of preparation LED among the traditional scheme. Based on this, this application provides a lamp area unit, lamp area circuit board and lamp area thereof.
In order to make the aforementioned objects, features and advantages of the present application more comprehensible, embodiments accompanying the present application are described in detail below with reference to the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. This application is capable of embodiments in many different forms than those described herein and those skilled in the art will be able to make similar modifications without departing from the spirit of the application and it is therefore not intended to be limited to the embodiments disclosed below.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Referring to fig. 1, the present application provides a light strip unit 10, which includes an insulating substrate 100, at least two main line units 200 connected in series, and a bypass line 300.
In an embodiment, the thickness, length, and shape of the insulating substrate 100 may be selected according to actual needs, and the application is not limited thereto.
The main line unit 200 includes a main line 210 and a light emitting diode 220 connected in series. The main line 210 is etched on the insulating substrate 100 by an etching process, and both the length and the thickness of the main line 210 may be selected according to actual needs, which is not limited in the present application. The light emitting diode 220 is disposed on the surface of the insulating substrate 100, but the specific location can be selected according to actual needs as long as the electrical connection relationship between the light emitting diode 220 and the main line 210 can be realized. And the positive and negative poles of the light emitting diode 220 are all welded to the main circuit 210, it can be understood that the current from the power supply sequentially passes through the positive pole of the lamp strip, the main circuit 210, the light emitting diode 220, the main circuit 210 and then returns to the negative pole of the lamp strip.
The bypass line 300 is disposed on the insulating substrate 100 by an etching process, and is connected in parallel with the main line unit 200, and an equivalent resistance value of the bypass line 300 is greater than an equivalent resistance value of the main line unit 200. In one embodiment, one end of the bypass line 300 is soldered to the first end of the main line 210 in the main line unit 200, and the other end of the bypass line 300 is soldered to the second end of the light emitting diode 220 in the main line unit 200. It should be noted that the second end of the main line 210 is connected in series with the first end of the light emitting diode 220.
It is understood that, only if the equivalent resistance value of the bypass line 300 is greater than that of the main line unit 200, the main current passes through the main line 220, and the light emitting diode 220 emits light. Therefore, under normal operation of the led 220, most of the current passes through the main line, and only a small part of the current passes through the bypass line 300. However, in case of necrosis of the led 220, the main line unit 200 is in an open circuit state, and the current mainly passes through the bypass line 300 to the next led 220 in series with the main line unit in which the necrotic led is located. At this time, the next led can still work normally.
The present embodiment provides a lamp strip unit 10, which includes an insulating substrate 100, at least two main line units 200 connected in series, and a bypass line 300. The main circuit unit 200 includes a main circuit 210 and a light emitting diode 220 connected in series, the main circuit 210 is etched on the insulating substrate 100, and the light emitting diode 220 is disposed on the surface of the insulating substrate 100. The bypass line 300 is etched on the insulating substrate 100 and connected in parallel with the main line unit 200, and an equivalent resistance value of the bypass line 300 is greater than an equivalent resistance value of the main line 220. When the light emitting diode 220 normally works, current sequentially passes through the main line 210 and the light emitting diode 220. When the led 220 is damaged, the current can pass through the bypass line 300 to reach the next led connected in series with the main line unit to which the damaged led belongs, and at this time, the leds on the other main line unit can work normally. Compared with the traditional lamp strip with two adjacent LED luminous circuits made into a parallel circuit, the lamp strip unit provided by the application is simple in structure and obvious in effect, and therefore the problems of complex flow and high manufacturing cost in the process of manufacturing the LED lamp strip in the traditional scheme can be solved.
In one embodiment of the present application, the resistivity of the material of the bypass line 300 is greater than the resistivity of copper. It is understood that the equivalent resistance of the bypass line 300 is not solely dependent on the resistivity of the material of the bypass line 300, and the sectional area of the material per unit length of the bypass line 300 and the length of the bypass line 300 are all factors influencing the equivalent resistance of the bypass line 300. It should be noted that the resistivity of the material of the bypass line 300 needs to be greater than the resistivity of the copper foil used in the conventional solution, so that the amount of material of the bypass line 300 can be reduced. It is understood that the material of the bypass line 300 may be a metal, an alloy or a non-metal, but the material of the bypass line 300 must be a conductive material.
In one embodiment of the present application, the material of the bypass line 300 and the material of the main line 210 are the same metal material. The metal material may be a pure metal or an alloy. It will be appreciated that the resistivity of the metal material needs to be greater than that of copper. For example, the material of the bypass line 300 may be iron, iron-aluminum alloy, or alloy foil.
In one embodiment of the present application, the materials of the bypass line 300 and the main line 210 are both alloy foils. The thickness and the length of the alloy foil can be selected according to actual needs, and the alloy foil is not limited in the application. In one embodiment, the resistivity of the specific metallic material in the alloy foil needs to be greater than the resistivity of copper.
Referring to fig. 2 together, the present application further provides a light strip wiring board 20, which includes the light strip unit 10, the conductive wire anode 21, and the conductive wire cathode 22. The main line 210 is electrically connected to the conductive positive electrode 21 and the conductive negative electrode 22, respectively. It is understood that the main line 210 is an alloy foil disposed on the insulating substrate through an etching process. The current from the positive electrode 21 of the conductive wire sequentially passes through the main circuit 210, and the main circuit 210 is electrically connected to the negative electrode 22 of the conductive wire by sequentially connecting the positive and negative electrodes of the light emitting diode 220. That is, the current from the conductive wire anode 21 sequentially passes through a section of the main circuit 210, then passes through the light emitting diode 220 connected to the main circuit 210, and then reaches the conductive wire cathode 22.
Referring to fig. 3, the present application also provides a light strip 20, which includes at least two light strip units 10 as described above, wherein at least two light strip units 10 are connected in series. It is understood that the series connection means that the main line unit 200 in one of the light strip units 20 is connected in series with the main line unit 200 in another one of the light strip units 20. In addition, the bypass line 300 in one of the light strip units 10 is also connected in series with the bypass line 300 of the other light strip unit 10. It should be noted that, when a circuit breaking condition occurs in the main line unit 200 in one of the light strip units 10, current may flow from the bypass line 300 in the one of the light strip units 10 to the main line unit 200 in another one of the light strip units 10. It can be understood that at least two of the light strip units 10 are connected in series, but the mechanical connection manner may be welding or hinge, and the specific connection manner may be selected according to actual needs, which is not limited in this application. It should be noted that, one of the light strips 20 and the other of the light strips 20 may be connected in series or in parallel, and the application is not limited thereto.
In one embodiment of the present application, one of the main line units 200 is connected to another of the main line units 200 by soldering, and the bypass line 300 of one of the light strip units 10 is connected to the main line unit 200 of another of the light strip units 10 by soldering. It is understood that the welding connection may be replaced by other connection methods as long as the electrical connection between the at least two main line units 200 and the electrical connection between the at least two bypass lines 300 can be achieved. It should be noted that the main line unit 200 and the bypass line 300 in one of the light strip units 10 are connected by soldering.
In one embodiment of the present application, the light strip 20 further comprises an insulating cover 400, and the insulating cover 400 is adhered to the light strip unit 10. The insulating sheath 400 may be an inorganic insulating material, an organic insulating material, or a mixed insulating material, and the specific type of the insulating sheath 400 may be selected according to actual needs, which is not limited in this application. It should be noted that the insulating cover 400 is attached to the light strip unit 10, and may also be attached to the light strip 20. In one embodiment of the present application, the insulating sheath 400 is plastic.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present application, and the description thereof is more specific and detailed, but not construed as limiting the claims. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the concept of the present application, which falls within the scope of protection of the present application. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A light strip unit, comprising:
an insulating substrate (100);
the circuit comprises at least two main circuit units (200) connected in series, wherein each main circuit unit (200) comprises a main circuit (210) and a light emitting diode (220) which are connected in series, the main circuits (210) are arranged on the insulating substrate (100) through an etching process, and the positive and negative electrodes of the light emitting diodes (220) are connected with the main circuits (210) in a welding mode;
and the bypass line (300) is arranged on the insulating substrate (100) through an etching process and is connected with the main line unit (200) in parallel, and the equivalent resistance value of the bypass line (300) is greater than that of the main line unit (200).
2. A light strip unit as claimed in claim 1, characterized in that the resistivity of the material of the bypass line (300) is greater than the resistivity of copper.
3. A light strip unit as claimed in claim 2, characterized in that the material of the bypass line (300) and the material of the main line (210) are the same metallic material.
4. A light strip unit according to claim 1, characterized in that the material of the bypass line (300) and the main line (210) are both alloy foils.
5. A lamp area circuit board which characterized in that includes:
the light strip unit (10) according to any one of claims 1 to 4;
a conductive positive electrode (21);
a conductive line cathode (22), the main line (210) being electrically connected to the conductive line anode (21) and the conductive line cathode (22), respectively.
6. A light strip, comprising:
at least two light strip units (10) according to any of claims 1 to 4, at least two of said light strip units (10) being connected in series.
7. A light strip according to claim 6, characterized in that one of said main line units (200) is soldered to the other main line unit (200).
8. A light strip according to claim 7, characterized in that said bypass line (300) of one of said light strip units (10) is soldered to said main line unit (200) of another of said light strip units (10).
9. The light strip of claim 7, further comprising:
and the insulating skin (400) is attached to the lamp strip unit (10).
10. A light strip according to claim 9, wherein said insulating cover (400) is plastic.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922500278.6U CN211716326U (en) | 2019-12-31 | 2019-12-31 | Lamp strip unit, lamp strip circuit board and lamp strip thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922500278.6U CN211716326U (en) | 2019-12-31 | 2019-12-31 | Lamp strip unit, lamp strip circuit board and lamp strip thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211716326U true CN211716326U (en) | 2020-10-20 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922500278.6U Active CN211716326U (en) | 2019-12-31 | 2019-12-31 | Lamp strip unit, lamp strip circuit board and lamp strip thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211716326U (en) |
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2019
- 2019-12-31 CN CN201922500278.6U patent/CN211716326U/en active Active
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