CN211667599U - Light emitting assembly and bulb - Google Patents

Abstract

The utility model discloses a light-emitting component and bulb, its light-emitting component utilize the Printed Circuit Board (PCB) support of LED high-voltage chip and/or LED filament strip collocation self-designed, can constitute a class filament strip. The light-emitting component is directly assembled with the glass bulb shell, the linear power supply and the light-emitting diode lamp holder to form a complete bulb structure, and the whole assembly process is relatively simple and convenient.

Description

Light emitting assembly and bulb

Technical Field

The present invention relates to a light emitting device and a bulb, and more particularly to a light emitting device and a bulb capable of emitting light of various colors.

Background

Because the LED chips have the advantages of low power consumption, long service life and the like, the LED lamp filament composed of a plurality of LED chips can replace tungsten filaments in incandescent bulbs. Bulbs that use light emitting diode filament strips are often referred to as filament bulbs. In the led light strip, a plurality of led chips are placed on a substrate and connected by metal wires. The LED filament is connected with the metal support and then arranged on the glass core column together with the metal support. The common filament bulb needs to be manually assembled through complicated assembling procedures, and only can emit colored light with a single color.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a light-emitting component and bulb structure thereof to solve above-mentioned problem.

The utility model discloses a reach the technical scheme that above-mentioned purpose adopted and be: a light emitting assembly comprising a substrate comprising a first surface; a first LED group including a plurality of first LEDs emitting a first color light in series, the first LEDs being grouped in a first region on the first surface; a second LED group including a plurality of second LEDs emitting a second color light in series, the second LEDs being grouped in a second region on the first surface; the first electrode pad and the second electrode pad are arranged on the first surface of the first area and are electrically connected with the first light-emitting diode group; the third electrode pad and the fourth electrode pad are arranged on the first surface of the second area and are electrically connected with the second light-emitting diode group; and an external electrode pad disposed in a third region of the first surface, electrically connected to one of the first, second, third, and fourth electrode pads, and directly electrically connected to an external component; the first region, the second region and the third region are sequentially arranged along the long side direction of the substrate, and the areas of the external electrode pads are different from those of the first electrode pads.

In the light emitting assembly, the light reflectivity of the first surface is less than 50%.

The utility model also provides a bulb, which comprises a base; a plurality of light emitting assemblies as described above coupled to the base; a first common electrical connector coupled to the plurality of light emitting devices and electrically connected to the first electrode pad of each of the light emitting devices; a second common electrical connector coupled to the plurality of light emitting devices and electrically connected to the third electrode pad of each of the light emitting devices; and the light-transmitting shell surrounds and encapsulates the plurality of light-emitting components and is connected with the base.

The bulb further comprises a third common electrical connector directly electrically connected to the external electrode pad of each light emitting element.

In an embodiment, the first common electrical connection member has a second surface facing the first led group, and the light reflectivity of the second surface is less than 50%.

The utility model has the advantages of, a novel colorful bulb structure is provided, it has one kind and can be used for replacing the light-emitting component of traditional glass stem, and this light-emitting component includes Printed Circuit Board (PCB) supporting structure. The PCB support structure can be connected with a plurality of LED high-voltage chips and/or LED lamp strips with different colors, such as red, blue and green LED high-voltage chips and/or LED lamp strips, or red, blue, green and white LED high-voltage chips and/or LED lamp strips. The colorful bulb structure also comprises a glass bulb shell, a linear power supply and other structures, and the whole assembly process is relatively simple and convenient. The high-voltage chips and/or filament strips of the LEDs of all colors in the multi-color bulb structure can be independently controlled, so that light rays with more colors than red, blue, green and white can be emitted, and different light-emitting effects can be generated by changing the light-emitting sequence of the high-voltage chips and/or filament strips of the LEDs of all colors.

Furthermore, the utility model provides an utilize this kind of light emitting component to carry out colorful bulb structure of equipment, its structure has except contained the aforesaid light emitting component who comprises emitting diode high-voltage chip and/or emitting diode filament collocation Printed Circuit Board (PCB) support, because light emitting component is collocation simultaneously and adopts multiple different photochromic emitting diode high-voltage chip and/or emitting diode filament to constitute light emitting component and dispose on Printed Circuit Board (PCB) support that has independent circuit design, still can realize having the atmosphere lamp effect of different photochromic simultaneously in a bulb structure.

Drawings

The present invention will be further explained with reference to the drawings and examples.

Fig. 1 is a schematic view of a light emitting device according to an embodiment of the present invention;

fig. 2 is a circuit diagram of a substrate according to an embodiment of the present invention;

fig. 3 is a schematic perspective view of a filament of an led lamp according to an embodiment of the present invention;

fig. 4 is a schematic view of a main body of a filament strip light source according to an embodiment of the present invention;

fig. 5A is a circuit layout diagram of three substrates according to an embodiment of the present invention;

fig. 5B is an equivalent circuit diagram of three first light emitting diode groups according to an embodiment of the present invention;

fig. 5C is an equivalent circuit diagram of three second led groups according to an embodiment of the present invention;

fig. 5D is an equivalent circuit diagram of three third led groups according to an embodiment of the present invention;

FIG. 6 is a top view of a common electrical connector according to an embodiment of the present invention;

fig. 7A is a schematic view of a bulb structure according to an embodiment of the present invention;

fig. 7B is an exploded view of the bulb structure with the transparent shell removed and the base shell according to an embodiment of the present invention;

fig. 8 is a top view of a high voltage led chip according to an embodiment of the present invention.

Detailed Description

[ example 1 ]

Fig. 1 shows a schematic view of a light emitting device 100 according to the present invention, in which the light emitting device 100 includes a substrate 10, the substrate 10 is, for example, a Printed Circuit Board (PCB) having a circuit configuration on a surface thereof, and different electrical conduction effects can be achieved through different circuit configurations. The surface circuit design of the substrate 10 will be described later in fig. 2, and will not be described in detail here.

As shown in fig. 1, the substrate 10 includes a first surface 11 and a second surface (not shown) opposite to the first surface 11. The first surface 11 has a first region a1, and the first region a1 has first electrode pads 111 and second electrode pads 112 disposed thereon. The light emitting device 100 further includes a first light emitting diode group 110, in the embodiment, the first light emitting diode group 110 is, for example, a blue light emitting diode lamp filament 110, and is formed by grouping and connecting a plurality of first light emitting diodes 21 (as shown in fig. 3) emitting blue light in series. The first led lamp filament 110 is located between the first electrode pad 111 and the second electrode pad 112, and the two electrodes E1 and E2 of the first led group 110 are electrically connected to the first electrode pad 111 and the second electrode pad 112 by soldering, respectively, so that the first led group 110 is disposed on the first region a1 of the first surface 11; the first surface 11 also has a second region a2, and the third electrode pad 113 and the fourth electrode pad 114 are disposed on the second region a 2. The light emitting device 100 further includes a second light emitting diode group 120, in the embodiment, the second light emitting diode group 120 is, for example, a red light emitting diode lamp strip, and is formed by connecting a plurality of second light emitting diodes 31 (as shown in fig. 3) emitting red light in series. The second led group 120 is located between the third electrode pad 113 and the fourth electrode pad 114, and the two electrodes E3 and E4 of the second led group 120 are electrically connected to the third electrode pad 113 and the fourth electrode pad 114 respectively by soldering, so that the second led group 120 is disposed on the second region a2 of the first surface 11; the first surface 11 further has a third region A3, and the fifth electrode pad 115 and the sixth electrode pad 116 are disposed on the third region A3. The light emitting device 100 further includes a third led group 130, in this embodiment, the third led group 130 is, for example, a green led lamp strip, and is formed by connecting a plurality of third leds 41 (as shown in fig. 3) emitting green light in series. The third led group 130 is located between the fifth electrode pad 115 and the sixth electrode pad 116, and the two electrodes E5 and E6 of the third led group 130 are electrically connected to the fifth electrode pad 115 and the sixth electrode pad 116 by soldering, respectively, so that the third led group 130 is disposed on the third region A3 of the first surface 11. The detailed structure of the filament of the led will be described in the following fig. 3, and will not be described in detail. The first surface 11 further has a fourth region a4, and the light emitting device 100 further includes an external electrode pad 117, wherein the external electrode pad 117 is electrically connected to one of the first electrode pad 111, the second electrode pad 112, the third electrode pad 113, the fourth electrode pad 114, the fifth electrode pad 115, and the sixth electrode pad 116 through a circuit configuration on a surface of a Printed Circuit Board (PCB) or inside the PCB, and is then electrically connected to an external device. As can be seen from fig. 1, the first region a1, the second region a2, the third region A3, and the fourth region a4 are sequentially arranged along the longitudinal direction of the substrate 10. In order to facilitate direct electrical connection with other external devices, as can be seen from fig. 1, the external electrode pad 117 has a large area, is different from the areas of the first to sixth electrode pads 111 to 116, and is disposed adjacent to the short side of the substrate 10.

Fig. 2 is a circuit diagram of the substrate 10 used in the light emitting device 100, and the first to sixth electrode pads 111 to 116 and the external electrode pad 117 can be seen from the diagram. In addition, the substrate 10 is formed with notches C1-C6 at positions corresponding to the led groups, and grooves D1-D4 at positions corresponding to the electrode pads at the long sides, wherein the grooves D1-D4 can be engaged with other components to form a light source main body inside the bulb, and the detailed structure is as follows.

As can be seen from the circuit design of fig. 2, the external electrode pad 117 is electrically connected to the third electrode pad 113, since the external electrode pad 117 is subsequently electrically connected to an external device, a voltage of one pole of the second led group 120 can be supplied through the external electrode pad 117, and the first led group 110 and the third led group 130 are not electrically connected to the outside. In another light emitting device, it is conceivable that the external electrode pad 117 is selectively electrically connected to one of the first electrode pad 111, the second electrode pad 112, the third electrode pad 113, the fourth electrode pad 114, the fifth electrode pad 115, and the sixth electrode pad 11, so that the voltage of one electrode of the first light emitting diode group 110, the second light emitting diode group 120, and the third light emitting diode group 130 is supplied through the external electrode pad 117.

It should be noted that, according to design requirements, the number of the led groups that can be soldered on each of the light emitting assemblies 100, 100' is not limited to three, and only two led groups or other groups may be soldered selectively.

With reference to fig. 1 and fig. 2, after soldering, the first led group 110 is disposed at the notch C1 of the first region a1, the second led group 120 is disposed at the notch C2 of the second region a2, and the third led group 130 is disposed at the notch C3 of the third region A3. Since the corresponding notches are disposed at the positions where the light emitting diode groups are disposed on the substrate 10, the light emitting diode groups 110, 120, and 130 of the light emitting device 100 emitting three colors of light can all emit light toward two sides of the first surface 11 of the substrate 10. In addition, since the light emitting device 100 has the light emitting diode groups 110, 120, and 130 emitting three color lights simultaneously, in order to prevent the color lights from mixing with each other when emitting light simultaneously, in a preferred embodiment, the first surface 11 of the substrate 10 may be coated with black or dark light absorbing paint, so that the light reflectivity of the first surface 11 is less than 50%, and light mixing is reduced.

Fig. 3 is a schematic perspective view of an embodiment of a possible structure of the led lamp strip 110(120, 130). As can be seen from the figure, the plurality of light emitting diodes 21(31, 41) are disposed on the upper surface 102 of the transparent substrate 150, and the transparent substrate 150 is, for example, a ceramic substrate, glass, sapphire, or the like, and has an upper surface 102 and a lower surface 104. The light emitting diodes 21(31, 41) are electrically connected by wire bonding via a metal wire 119, and the connection method may be series connection, parallel connection or series-parallel connection, and then the light emitting diodes 21 '(31', 41 ') and 21' (31 ', 41') at both ends of the whole string of light emitting diodes are electrically connected with the first electrode E1(E3, E5) and the second electrode E2(E4, E6), respectively, by wire bonding. The light emitting diodes 21(31, 41), the metal wires 119, and portions of the peripheries of the first electrode E1(E3, E5) and the second electrode E2(E4, E6) are covered by a transparent colloid 122 such as epoxy resin or silicone …, and portions of the first electrode E1(E3, E5) and the second electrode E2(E4, E6) are exposed. Then, the first electrode E1(E3, E5) and the second electrode E2(E4, E6) are electrically connected to the first electrode pad 111(113, 115) and the second electrode pad 112(114,116) on the upper surface of the substrate 10 by metal soldering. If the leds 21(31, 41) emit a single color light, such as blue light, the transparent resin 122 needs to be mixed with a wavelength conversion material, such as phosphor, in addition to the blue filament to generate a desired color light, such as red, green and white. If the plurality of light emitting diodes 21(31, 41) can emit different color lights, for example, red, blue, green, the transparent gel 122 does not need to be mixed with the wavelength conversion material. The white light filament may be composed of a blue light emitting diode and a wavelength conversion material, or may be composed of a red, blue, green light emitting diode.

Next, referring to fig. 4, fig. 4 is a schematic diagram of the filament strip light source main body 1000. As shown in the figure, the light source body 1000 is formed by three light emitting elements 100, 100', 100 ″ and four disc-shaped common electrical connectors 1501 to 1504 which are engaged with each other. In this embodiment, each of the light emitting devices 100, 100', 100 ″ is only soldered with two sets of light emitting diode groups, and the electrical connectors 1501 to 1504 are made of conductive material, such as metal disc or circuit board in this embodiment.

In the present embodiment, the common electrical connectors 1501 to 1504 are connected to each of the light emitting assemblies 100, 100', 100 ″ of FIG. 2 through the grooves D1 to D4. The common electrical connectors 1501 to 1504 not only have the effect of supporting the light emitting devices 100, 100 ', 100 ", but also extend along the short side direction of the substrate at the positions of the grooves D1 to D4 corresponding to the positions of the first to sixth electrode pads 111 to 116 of each of the light emitting devices 100, 100', 100", respectively, so that the light emitting devices 100, 100 ', 100 "can be electrically connected by contacting the common electrical connectors 1501 to 1504 fastened along the short side direction of the substrate with the first to sixth electrode pads 111 to 116 of the different light emitting devices 100, 100', 100", thereby achieving the effect of electrically connecting the entire light source body 1000 in series and in series, and selectively enabling the different colors of light to be independently or commonly controlled.

Fig. 5A is a circuit diagram of three substrates 10, 10', 10 ″ in one embodiment of the lamp filament light source main body 1000. Fig. 5B is an equivalent circuit diagram of the three first led groups 110, 110', 110 ″ in the circuit layout diagram of fig. 5A. In this embodiment, to connect the three first led groups 110, 110 ', 110 "in series, first, the first electrode pad 111" on the first surface of the substrate 10 "is connected to the external electrode pad 117" through the wire 118 "designed on the surface or inside the substrate 10", and the second electrode pad 112 "is electrically connected to the second electrode pad 112 of the substrate 10 through the second common electrical connector 1502 clamped in the grooves D2, D2', and D2"; then, the first electrode pads 111 of the substrate 10 are electrically connected to the first electrode pads 111 ' of the substrate 10 ' through the common electrical connector 1501 clamped in the grooves D1, D1 ' and D1 ″. Finally, the second electrode pad 112 'on the substrate 10' is used to generate an external electrical connection structure of the other electrode by means of wire bonding or via hole connection, and is used for electrical connection with an external power source. The external connection structure for electrically connecting with an external power source may be, for example, a structure in which a metal via hole is formed through the substrate 10 'at a position corresponding to the second electrode pad 112', and a second external electrode pad (not shown) is formed on the lower surface of the substrate 10 'at a position corresponding to the second electrode pad 112'. In the above design, after the three first led groups 110, 110 ', 110 "are respectively soldered on the three substrates 10, 10', 10", the equivalent circuit diagram shown in fig. 5B can be generated.

Fig. 5C is an equivalent circuit diagram of the three second led groups 120, 120', 120 ″ in the circuit layout diagram of fig. 5A. In this embodiment, to connect the three second led groups 120, 120 ', 120 ″ in series, first, the third electrode pad 113 on the first surface of the substrate 10 is connected to the external electrode pad 117 through the wire 118 designed on the surface or inside the substrate 10, and the fourth electrode pad 114 is electrically connected to the fourth electrode pad 114' of the substrate 10 'through the common electrical connector 1503 clamped in the grooves D3, D3', and D3 "; then, the third electrode pad 113 ' of the substrate 10 ' is electrically connected to the third electrode pad 113 "of the substrate 10" through the common electrical connector 1502 clamped in the grooves D2, D2 ' and D2 ", and finally, the fourth electrode pad 114" of the substrate 10 "is electrically connected to an external power source through a wire or via. The external connection and electrical connection to the external power source may be formed by, for example, forming a metal via hole through the substrate 10 "at a position corresponding to the fourth electrode pad 114", and forming a third external electrode pad (not shown) at a position corresponding to the fourth electrode pad 114 "on the lower surface of the substrate 10". In the above design, after the three second led groups 120, 120 ', 120 ″ are respectively soldered on the three substrates 10, 10', 10 ″, the equivalent circuit diagram shown in fig. 5C can be generated.

Fig. 5D is an equivalent circuit diagram of the three third led groups 130, 130', 130 ″ in the circuit layout diagram of fig. 5B. In this embodiment, to connect the three third led groups 130, 130 ', 130 ″ in series, first, the fifth electrode pad 115' on the first surface of the substrate 10 'is connected to the external electrode pad 117' through the wire 118 'designed on the surface of the substrate 10' or inside the substrate, and the sixth electrode pad 116 'is electrically connected to the sixth electrode pad 116 "of the substrate 10" through the common electrical connector 1504 clamped in the grooves D4, D4', and D4 "; then, the fifth electrode pad 115 of the substrate 10 "is electrically connected to the fifth electrode pad 115 of the substrate 10 through the common electrical connector 1503 connected to the grooves D3, D3', and D3". Finally, the sixth electrode pad 116 on the substrate 10 is electrically connected to an external power source by means of wire bonding or via hole bonding. The external connection structure for electrically connecting with the external power source may be, for example, a metal via hole penetrating the substrate 10 at a position corresponding to the sixth electrode pad 116, and a fourth external electrode pad (not shown) at a position corresponding to the sixth electrode pad 116 on the lower surface of the substrate 10. In the above design, after the three third led groups 130, 130 ', 130 "are respectively soldered on the three substrates 10, 10', 10", the equivalent circuit diagram shown in fig. 5D can be generated.

By such a design, in one light source main body 1000, the light emission of the first led group 110, the second led group 120, and the third led group 130 in a single light emitting device 100 can be controlled independently, and the light darkness of the corresponding same led group in each light bar light source main body 1000 can be controlled synchronously, so that the light emission of the same color light has consistency.

In one embodiment, each of the light emitting devices 100, 100', 100 ″ is soldered with three sets of three color LEDs. When the external electrode pads 117, 117', and 117 ″ are grounded at the same time and sufficiently positive voltages are applied to the second, third, and fourth external electrode pads, respectively, the filament strip light source body 1000 can emit blue, red, and green lights at the same time, and also emit blue (110), red (120), and green (130) lights at the same time when viewed from a single light emitting device 100. And the light and darkness of different colors can be independently controlled by different positive voltage electrodes without synchronization.

FIG. 6 is a top view of an embodiment of common electrical connectors 1501-1504. In the present embodiment, the common electrical connection member 1501 is taken as an example. The common electrical connector 1501 is disk-shaped, but the shape is not limited to circular, and may be polygonal or other shapes adjusted according to design requirements. The common electrical connection member 1501 is required to be a conductive material, and can be electrically connected to the electrode pad through contact when being subsequently engaged with the light emitting device. From the top view, the common electrical connector 1501 has first through sixth notches O1-O6, the notches O1-O6 can be engaged with the grooves D1-D4 of the light emitting device 100, and the number and shape of the notches O1-O6 can be adjusted according to the design requirement.

With reference to fig. 4, since the light source body 1000 is designed to emit light beams of different colors, such that the light beams do not mix with each other when they emit light, in a preferred embodiment, the upper surface 1511 and/or the lower surface (not shown) of the electrical connectors 1501 to 1504 may be coated with black or dark light-absorbing paint, so that the light reflectivity of the upper surface and/or the lower surface is less than 50% when the upper surface and/or the lower surface face the led group after being engaged, thereby reducing the mixing.

Fig. 7A is a schematic view of a bulb structure 2000 configured with the filament strip light source body 1000, and fig. 7B is an exploded view of a bulb internal structure 2000' with the light-transmissive housing 2200 and the outer housing of the base 2100 removed in another embodiment. The bulb structure 2000 (2000') includes a base 2100, a filament strip light source body 1000, and a light-transmissive housing 2200. As mentioned above, the filament strip light source body 1000 includes three light emitting devices 100, 100 ', 100 ″ and four common electrical connectors 1501 to 1504 respectively vertically engaging with the surfaces of the three light emitting devices 100, 100', 100 ″. In addition, the base 2100 further includes a circuit board 2110 configured therein, wherein the three light emitting elements 100, 100 ', 100 ″ of the filament strip light source main body 1000 are coupled to the base 2100 and electrically connected to the conductive elements on the circuit board 2110 by soldering through the external electrode pads 117, 117' (117 "); the light-transmitting case 2200 is disposed on the base 2100, the light-transmitting case 2200 and the base 2100 define a receiving space R, and the filament strip light source body 1000 is disposed in the receiving space R. An edison joint is disposed below the base 2100 and can be used to electrically connect the filament strip light source body 1000 to an external power source.

In another embodiment, the conventional led lamp strip forming the led group may be directly replaced by a high voltage led chip. The high-voltage light-emitting diode chip is formed by epitaxially forming a light-emitting diode epitaxial structure on a growth substrate, directly dividing the light-emitting diode epitaxial structure into a plurality of independent light-emitting diode components through a semiconductor manufacturing process, and then electrically connecting the light-emitting diode components through the semiconductor manufacturing process. Fig. 8 is a top view of a high voltage led chip 3000. Taking the first led group 110 for forming blue light as an example, in fig. 8, a plurality of independent blue light led structures 310 are directly formed on the upper surface of the long transparent sapphire substrate 300 by epitaxy, after being separated by the etching process, each independent blue light led structure 310 is electrically connected in series and in parallel by the metal wire structure 320 formed by the exposure and development process, and two ends of the whole series of structures are electrically extended to form the first electrode E1 'and the second electrode E2', so as to form the first led group 110 formed by one high voltage led chip 3000. Then, the two electrodes E1 'and E2' of the first led group 110 are directly soldered to the first electrode pad 111 and the second electrode pad 112 in a flip chip manner by soldering, so that the first led group 110 is disposed on the first region a1 of the first surface 11. In the present embodiment, since the sapphire substrate forming the high voltage diode chip 3000 is a transparent substrate and has high physical strength, the periphery of the entire first led group 110 does not necessarily need to be coated with a transparent adhesive. Similarly, the led group of the present invention can be replaced by high voltage led chips with different colors according to design requirements.

Based on the above, the utility model provides a light-emitting component and bulb structure whole equipment flow is simple and convenient relatively, because light-emitting component arranges simultaneously and adopts multiple different photochromic emitting diode high-voltage chip and/or emitting diode filament strip to constitute light-emitting component and dispose on Printed Circuit Board (PCB) support that has independent circuit design, still can realize having the atmosphere lamp effect of different photochromic simultaneously in a bulb structure.

The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not intended to limit the present invention, and all modifications, equivalents, improvements, etc. that are made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.

Claims (5)

1. A light emitting assembly, comprising:

a substrate comprising a first surface;

a first LED group including a plurality of first LEDs emitting a first color light in series, the first LEDs being grouped in a first region on the first surface;

a second LED group including a plurality of second LEDs emitting a second color light in series, the second LEDs being grouped in a second region on the first surface;

a first electrode pad and a second electrode pad disposed on the first surface of the first region and electrically connected to the first light emitting diode group;

a third electrode pad and a fourth electrode pad disposed on the first surface of the second region and electrically connected to the second led group; and

an external electrode pad disposed on the third region of the first surface, electrically connected to one of the first, second, third, and fourth electrode pads, and directly electrically connected to an external component;

wherein the first region, the second region, and the third region are sequentially arranged along a longitudinal direction of the substrate, and the external electrode pads have different areas from the first electrode pads.

2. The light emitting assembly of claim 1, wherein the first surface has a light reflectivity of less than 50%.

3. A light bulb, comprising:

a base;

a plurality of light emitting assemblies according to claim 1 coupled to the base;

a first common electrical connector coupled to the plurality of light emitting devices and electrically connected to the first electrode pad of each of the light emitting devices;

a second common electrical connector coupled to the plurality of light emitting devices and directly electrically connected to the third electrode pad of each of the light emitting devices; and

and the light-transmitting shell surrounds and encapsulates the plurality of light-emitting components and is connected with the base.

4. The lamp of claim 3, further comprising a third common electrical connection directly electrically connecting the external electrode pads of each of said light emitting elements.

5. The bulb as claimed in claim 3, wherein the first common electrical connection has a second surface facing the first group of LEDs, and the light reflectivity of the second surface is less than 50%.

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