CN211656729U - Heat dissipation assembly and electronic equipment carrying same - Google Patents

Abstract

The application provides a heat radiation assembly and electronic equipment carrying the same. The heat dissipation assembly comprises: the gas-liquid conversion device comprises a first cover plate, a second cover plate and a gas-liquid conversion module; the gas-liquid conversion module is provided with a first layer and a second layer which are arranged in a stacked mode, the first layer is arranged opposite to the first cover plate, and the second layer is arranged opposite to the second cover plate; the first layer is provided with fins and/or the first cover plate is provided with bulges so as to form a steam cavity; a plurality of runners for storing working media are arranged between the second layer and the second cover plate; a plurality of through holes are formed between the first layer and the second layer and are communicated with the steam cavity and the flow channel so as to discharge steam evaporated in the flow channel into the steam cavity or return working media condensed in the steam cavity into the flow channel. The heat source heat sink utilizes the phase change and the flow of the working medium to uniformly transfer the heat of the heat source received by the second cover plate, thereby realizing the high-efficiency heat transfer process.

Description

Heat dissipation assembly and electronic equipment carrying same

Technical Field

The utility model relates to a heat dissipation technical field specifically relates to an electronic equipment that is used for microelectronic element's radiator unit and carries on it.

Background

With the rapid development and application popularization of electronic information technology, the development of electronic components presents the trend of high speed, high frequency and high integration level, so that the power density of a chip is continuously improved to a new height at a high calculation rate, and the temperature is rapidly increased in a short time. The stability and the use precision of electronic components are reduced due to the overhigh temperature, the aging of products is accelerated, and the cycle service life is shortened. Therefore, the heat dissipation technology of electronic products is gradually becoming the bottleneck of the update of electronic products, and the research and development of safe and efficient heat dissipation technology is becoming the central focus of the electronic product field at present. The vapor cavity heat pipe utilizes liquid phase change, has good temperature uniformity and heat dissipation capability, and becomes the mainstream technology of passive heat dissipation at present, however, the efficiency of the vapor cavity heat pipe is not high, and how to improve the phase change efficiency of the phase change medium and improve the heat dissipation efficiency in increasingly thinner electronic products shows more urgent.

Therefore, a heat dissipation assembly for a miniaturized, light and thin vapor chamber heat pipe is needed in the industry.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a: the utility model provides a new radiator unit, the steam chamber structural design who has the gas-liquid conversion module in it for the gas/liquid separation of working medium in the radiator unit, it has cooling working medium (liquid) to be used for cooling the whole face of side, this working medium flows in the runner, the steam of being heated the evaporation passes through the perforation water conservancy diversion in the runner to the steam intracavity, flow, the condensation liquefaction to keeping away from steam overflow direction in the steam chamber, the working medium of liquefaction flows back to in the runner. Therefore, the heat dissipation assembly has extremely high heat conduction performance and good temperature equalization performance.

In order to achieve the purpose, the technical scheme adopted by the application is as follows,

a heat dissipating assembly, comprising: the gas-liquid conversion device comprises a first cover plate, a second cover plate and a gas-liquid conversion module; the gas-liquid conversion module is provided with a first layer and a second layer which are arranged in a stacked mode, the first layer is arranged opposite to the first cover plate, and the second layer is arranged opposite to the second cover plate; the first layer is provided with fins and/or the first cover plate is provided with bulges so as to form a steam cavity; a plurality of runners for storing working media are arranged between the second layer and the second cover plate; a plurality of through holes are formed between the first layer and the second layer and are communicated with the steam cavity and the flow channel so as to discharge steam evaporated in the flow channel into the steam cavity or return working media condensed in the steam cavity into the flow channel. This radiator unit, working medium (liquid) are in the runner, when the second apron input heat, working medium liquid is the vaporization of being heated, the steam that produces flows to the steam intracavity through the perforation under the pressure differential effect, overflow the direction to keeping away from steam in the steam intracavity and flow, through the condensation liquefaction, liquefied working medium liquid flows back to in the runner, utilize the phase transition and the process of flowing of working medium, the heat of the heat source that receives with the second apron transmits uniformly, thereby realize high-efficient heat transfer process, the effect of good samming. Through the plurality of arranged through holes, the heat dissipation component has the ventilation function (for the evaporated steam to flow out) and also has the backflow function (the working medium liquid liquefied by the evaporated steam flows back into the flow channel through the plurality of arranged through holes and is arranged in a regular array or in a random arrangement.

Preferably, the plurality of projections have a continuous elongated square shape or a discontinuous segmented square shape, and have a width of 10 μm to 3 mm.

Preferably, the plurality of protrusions are randomly distributed or distributed in an array, and are spherical or cylindrical, or the cross section of each protrusion is square, and at least comprises one or more of a pointed shape, a round-bag shape and a semicircular shape.

Preferably, the plurality of protrusions are randomly distributed or distributed in an array, and are spherical or cylindrical.

Preferably, the top of the protrusion is in the same plane with the end surface of the side wall of the first cover plate.

Preferably, at least one fin array arranged in a row or column is arranged on the side of the gas-liquid conversion module, which is in contact with the protrusion, and the end of the fin array is connected with the top of the protrusion.

Preferably, the ends of the array of fins are planar and have the same width as the tops of the projections.

Preferably, the end of the fin array is in the same plane as the end of the side wall of the second cover plate.

Preferably, the adjacent 2 fins in the fin array are parallel to each other or are trumpet-shaped, and the through holes are arranged in the trumpet-shaped fins.

Preferably, the heights of the two adjacent flow channels are the same or different.

Preferably, the perforation is circular, oval, triangular, polygonal, or comprises a bend.

Preferably, the fins are arranged intermittently, continuously or intermittently.

The embodiment of the application provides a heat radiation component, it has: the steam-liquid conversion device comprises a first cover plate, a second cover plate and a gas-liquid conversion module, wherein the first cover plate is provided with a first cavity, the bottom of the first cover plate is provided with a plurality of bulges arranged at intervals, the gas-liquid conversion module is provided with a base plate, one side of the base plate is connected with the bulges to form a steam cavity, one side opposite to the contact side of the bulges is provided with a plurality of fins arranged at intervals, the end parts of the fins are in contact with the bottom of the second cavity of the second cover plate, a flow channel for storing working media is formed between every two adjacent fins and the bottom of the second cavity in contact, the base plate is provided with a plurality of through holes, and at least part of the through holes are communicated with the flow channel and the steam cavity and used for discharging steam evaporated in the flow channel into the steam cavity.

An embodiment of the present application provides an electronic device, which is characterized in that the heat dissipation assembly is mounted. Since the heat sink assembly can be designed to be thin, it can be used for thin and light electronic devices, such as smart phones.

Advantageous effects

Compared with the scheme in the prior art, the heat dissipation assembly provided by the embodiment of the application has the advantages that the structure is simple, the whole steam cavity structure has extremely high heat conduction performance, the good temperature equalization performance is realized, and efficient cooling is provided for small-area high-heat-flow-density electronic elements. Through the perforation with ventilation and backflow functions, a path for liquefying and backflow of the working medium is not required to be additionally configured, and the structure of the heat dissipation assembly is simplified.

Drawings

In order to more clearly illustrate the embodiments of the present specification or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments described in the specification, and for those skilled in the art, other drawings can be obtained according to the drawings without inventive exercise:

fig. 1 is a schematic structural diagram of a heat dissipation assembly according to an embodiment of the present disclosure;

fig. 2 is an exploded view of a heat dissipation assembly according to an embodiment of the present disclosure;

FIG. 3 is a schematic structural view of the gas-liquid conversion module of FIG. 2 mounted on a second cover plate;

FIG. 4a is a schematic front view of the gas-to-liquid conversion module of FIG. 2;

FIG. 4b is a schematic cross-sectional view A-A of FIG. 4;

FIG. 4c is a schematic view of a view angle of the gas-liquid conversion module;

FIG. 4d is a schematic view of a partial enlarged structure of I in FIG. 4 c;

FIG. 4e is a partial enlarged view of X in FIG. 4 a;

fig. 4f is a schematic structural diagram of a gas-liquid conversion module according to an embodiment of the present application;

fig. 4g is a partial enlarged view of D in fig. 4 f.

FIG. 5a is a perspective view of the first cover plate of FIG. 2;

FIG. 5b is a schematic view of a first cover plate of FIG. 5 a;

FIG. 5c is a schematic cross-sectional view B-B of FIG. 5B;

FIG. 5d is a perspective view of a first cover plate according to an embodiment of the present application;

fig. 6 is a schematic front view of a gas-liquid conversion module according to an embodiment of the present application;

FIG. 7a is a perspective view of the second cover plate of FIG. 2;

fig. 7b is a schematic structural view of a view angle after the second cover plate of fig. 7a is mounted with the gas-liquid conversion module;

FIG. 7C is a schematic cross-sectional view of C-C in FIG. 7 b;

fig. 8a is a schematic structural view of a heat dissipation assembly according to an embodiment of the present application;

FIG. 8b is a schematic cross-sectional view C-C of FIG. 8 a;

FIG. 8c is a schematic cross-sectional view of a heat dissipation assembly according to an embodiment of the present application;

FIG. 8d is a schematic cross-sectional view of a heat sink assembly according to an embodiment of the present application;

fig. 9 is a schematic structural diagram of a gas-liquid conversion module according to an embodiment of the present application.

Detailed Description

In order to make those skilled in the art better understand the technical solution proposed by the present invention, the technical solution in the embodiments of the present specification will be clearly and completely described below with reference to the drawings in the embodiments of the present specification, and it is obvious that the described embodiments are only a part of the embodiments in the present specification, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from one or more embodiments of the present disclosure without any inventive step, shall fall within the scope of protection of the present disclosure.

The present application provides a heat dissipation assembly for providing efficient cooling for small area high heat flux electronic components having: the gas-liquid conversion device comprises a first cover plate, a second cover plate and a gas-liquid conversion module; the gas-liquid conversion module is provided with a first layer and a second layer which are arranged in a stacked mode, the first layer is arranged opposite to the first cover plate, and the second layer is arranged opposite to the second cover plate; the first layer is provided with fins and/or the first cover plate is provided with bulges so as to form a steam cavity; a plurality of runners for storing working media are arranged between the second layer and the second cover plate; a plurality of through holes are arranged between the first layer and the second layer and are communicated with the steam cavity and the flow channel so as to discharge steam evaporated in the flow channel into the steam cavity or return working medium condensed in the steam cavity into the flow channel. Or at least one fin array arranged in a row or column shape is arranged on the contact side of the gas-liquid conversion module and the protrusion, and the end part of the fin array is contacted with the top (end part) of the protrusion to form a steam cavity. This gas-liquid conversion module's steam chamber structural design for the gas/liquid separation of working medium in the radiator unit for there is liquid cooling side whole face, and this liquid is in the runner, and when second apron input heat, working medium liquid is heated the vaporization, and the steam of production flows to the steam intracavity through the perforation under the pressure differential effect, and steam overflow direction flow, condensation liquefaction are overflowed to keeping away from to the steam in the steam chamber, and the working medium of liquefaction flows back to in the runner. Therefore, the heat of the heat source received by the second cover plate is uniformly transferred by utilizing the phase change and flowing processes of the working medium, so that the efficient heat transfer process is realized, and the heat dissipation assembly has good temperature equalization performance. Preferably, the top of the protrusion is configured to be planar. The end of the fin array is planar and connected with the top of the protrusion. Further, the top width of the protrusion is substantially the same as the width of the fin array.

The heat dissipation assembly proposed in the present application is described in detail below with reference to the accompanying drawings.

Fig. 1 to fig. 3 and fig. 5a to fig. 5c are schematic structural diagrams of a heat dissipation assembly according to an embodiment of the present application; the heat dissipation assembly 100 includes: the first cover plate 101 is provided with a first cavity inside, the bottom of the first cavity is provided with a plurality of protrusions 101c, grooves 101d are formed between every two adjacent protrusions, and the second cover plate 102 is provided with a second cavity inside; after the first cover plate and the second cover plate are combined, a gas-liquid conversion module 103 is configured in the cavity formed by combining the first cavity and the second cavity. The steam cavity of the gas-liquid conversion module 103 is designed to separate gas and liquid of a working medium (not shown) in the heat dissipation assembly 100, the whole surface of the cooling side of the heat dissipation assembly is provided with liquid, the liquid flows in the flow channel, the steam of the working medium heated and evaporated flows into the steam cavity through the plurality of through holes, the steam flows in the direction far away from the overflow direction of the steam in the steam cavity and is condensed and liquefied, and the liquefied working medium flows back to the flow channel. Therefore, the heat dissipation assembly has extremely high heat conduction performance and good temperature equalization performance. Preferably, a side wall 101b is disposed on one side of the first cover plate 101, and an injection port 101a is disposed on the side wall 101b on one side, and the injection port 101a is used for injecting a cooling working medium into the heat dissipation assembly, and after injecting a predetermined amount of the working medium, the injection port is vacuumized and sealed. The first cover plate 101 is hermetically connected to the second cover plate 102 through an end portion of the sidewall 101 b. Preferably, the phase change working medium at least comprises one or a combination of water, deionized water, alcohol, methanol, acetone, ethylene glycol and the like. The material of the first cover plate/the second cover plate can be copper or aluminum, etc. The heat dissipation assembly solves the problem of high heat flux density heat dissipation in a small space, and greatly improves the heat dissipation efficiency and the temperature uniformity of the heat dissipation assembly. Because its whole thickness is little, can be used to portable intelligent treater heat dissipation. The plurality of protrusions are in the form of continuous elongated cubes, and the discontinuous segmented arrangement of the protrusions is described next in connection with fig. 5 d. The first cover plate 201 has a first cavity therein, the bottom of the first cavity is configured with a plurality of protrusions 201c configured in sections, grooves 201d are formed between adjacent protrusions, and the length of each section or each section may be the same or different. The width of the projections is 10 μm to 3mm, and the width of the space between the projections of adjacent projections is 100 μm to 10 mm. In one embodiment, the cross-section of the convex portion of the protrusion is square, and at least one side of the convex portion includes a pointed shape (refer to 301C of fig. 8C); or the cross section is round bag type (refer to 401C of fig. 8 d) or the cross section is round (semicircular), in this case, the protrusions are arranged in random or array, the size can be the same or different, and the width of the protrusions is the diameter or the largest diameter. The bulge is combined with a first layer arranged on the gas-liquid conversion module to form a steam cavity; the second layer and the combination of the gas-liquid conversion module are used for receiving heat and dissipating heat.

Next, referring to fig. 4a to 4e, a gas-liquid conversion module according to an embodiment of the present invention is described, in which at least one fin array 105 arranged in a row or a column is disposed on one side of the gas-liquid conversion module 103, a plurality of fins 104 disposed at intervals are disposed on the side opposite to the fin array, an end portion 104a of the fin contacts with a bottom portion of the second cavity (not shown), a flow path 104b for a cooling liquid to flow is formed between the two fins (in the present embodiment, the adjacent flow paths 104b communicate with each other), and a plurality of perforations 104c are further disposed in the gas-liquid conversion module, and the perforations 104c are used for allowing the steam to flow out from the perforations 104c (the liquid in the flow path is heated and gasified to be converted into steam, and flows from the side of the fin 104 to the side of the fin array 105 through the perforations 104 c) and flows in the steam cavity (not. Preferably, the width of the fin array 105 arranged in rows or columns is w1, the height of the flow path 104b is h, and in one embodiment, the heights h of the flow paths are uniform or non-uniform. In the present embodiment, the heights h of the flow paths are not uniform, and the height of the flow path 104b on the side where the fin array 105 is arranged is higher than the height of the flow path 104b on the side where no fin array 105 is arranged. A through hole 104c is disposed between two adjacent fins in the fin array 105. In one embodiment, the through holes 104c are only disposed in the fin array 105 (see fig. 6, i.e., no through holes are disposed where no fin array is present). The shape of the through hole can be circular, oval, triangular or polygonal, the shape with a bending part is T-shaped, and the like, and the through hole has a ventilation function (for steam to flow out) and a backflow function (the liquefied working medium flows back into the flow channel through the through hole, and the liquefied liquid backflow path does not need to be configured to simplify the internal structure). Preferably, in an embodiment, the flow guiding groove is disposed at the periphery of the through hole for guiding the condensed and liquefied working medium to the through hole and flowing back to the flow channel. Fig. 4e is a partial enlarged view of X in fig. 4 a.

As a variation of the embodiment of fig. 4a, please refer to fig. 4f and fig. 4g, wherein fig. 4g is a partial enlarged view of D in fig. 4 f. In the schematic view of the gas-liquid conversion module 403, the gas-liquid conversion module 403 is not provided with a fin array, a plurality of fins 404 are arranged at one side of the gas-liquid conversion module, the end 404a of each fin is in contact with the bottom of the second cavity (not shown), a flow path 404b for flowing cooling liquid is formed between the two fins (in the present embodiment, the adjacent flow paths 404b are communicated with each other), and the gas-liquid conversion module is further provided with a plurality of through holes 404c for flowing out steam from the through holes 404c (the liquid in the flow path is heated and gasified into steam, and flows out from the fin 404 side through the through holes 104c and is guided into a steam cavity (not shown), and the gas-liquid conversion module is combined with the first cover plate, so that the protrusion protruding from the first cover plate and the contact surface of the protrusion form the steam cavity) and flows away from the.

Next, referring to fig. 7a, 7b and 7c, a structure of a second cover plate according to an embodiment of the present invention is described, in which the second cover plate 102, a sidewall 102b thereof, and a cavity 102a (second cavity) therein are disposed, and the cavity 102a is used for accommodating the gas-liquid conversion module 103. Preferably, the ends of the fin array 105 of the liquid crystal module 103 and the ends of the sidewalls 102b are in the same plane; the end surface of the side wall 101b of the first cover plate is connected (hermetically connected) to the end of the side wall 102b of the second cover plate 102

After the second cover plate is combined, the view angle is shown in fig. 8a, fig. 8b is a schematic cross-sectional view of C-C in fig. 8a, the end surface of the protruding strip 101C of the first cover plate is connected with the end surface 105a of the fin array 105, the recess between the adjacent fin arrays 105 and the groove 101d (refer to fig. 5b) of the first cover plate form a steam cavity a, so that gas/liquid of a working medium (not shown) in the heat dissipation assembly 100 is separated, steam evaporated when the working medium is heated flows into the steam cavity a through the through hole, and the working medium condensed and liquefied far from a heat source in the steam cavity a flows back into the flow channel through the through hole.

In one embodiment, as a variation of the heat dissipation assembly, if the protruding strip of the first cover plate has at least one pointed shape, the cross-section (position is shown in fig. 8a as C-C) is schematically shown in fig. 8C. If the tip end side of the protruding strip 301c of the first cover plate 301 is connected to the end of the fin array, a vapor chamber a (formed by combining the grooves of the adjacent 2 protrusions and the recesses of the adjacent fin array) and a vapor chamber b (formed by combining the protrusions and the adjacent fins with the side walls of the adjacent first cover plate/second cover plate) are formed.

In an embodiment, as a modification of the heat sink assembly, if the cross section of the protruding strip of the first cover plate is configured to be a round-bag shape, the gas-liquid conversion module is not configured with a fin array, and the cross section (position is referred to as C-C in fig. 8 a) is as shown in fig. 8d, the protruding strip 401C of the first cover plate 401 and the contact surface of the gas-liquid conversion module form a steam cavity a (formed between the grooves of the adjacent 2 protrusions) and a steam cavity b (formed by combining the protrusions and the side wall of the adjacent first cover plate/second cover plate). In another embodiment, as a modification of the heat dissipation assembly, if the protruding strips of the first cover plate are in a round bag shape or a cylindrical shape, the gas-liquid conversion module is configured with a fin array.

Next, referring to fig. 9, a gas-liquid conversion module according to an embodiment of the present invention is described, in which the gas-liquid conversion module 203 includes a substrate 204, a through hole 204d is disposed on the substrate 204, a fin array 205 arranged in a row is disposed on one side of the substrate 204, and the fin array 205 includes a plurality of fins 205a parallel to each other. The space 205b formed by the adjacent fins 205a forms a vapor chamber after the fin array is connected with the end surface of the protruding strip of the first cover plate, and the space 205b formed by the adjacent fins 205a forms a vapor chamber. A plurality of fins 204a are disposed at intervals on the opposite side of the fin array, the end of the fin 204a is in contact with the bottom of the second cavity (not shown), a flow path 204b and a flow path 204c for flowing cooling liquid are formed between the two fins, the gas-liquid conversion module is further provided with a plurality of through holes 204d for flowing out the vapor evaporated in the flow path 204b from the through holes 204d (the liquid in the flow path is vaporized into vapor by heating and flows from the fin 204a side to the fin array 205 side through the through holes 204 d. preferably, the through holes 204d are disposed between the adjacent fins of the fin array 205 and/or outside the fin array 205. the shape may be circular, oval, triangular, polygonal, or a shape having a bent portion such as T-shape, and the like, and has a ventilation function (for flowing out vapor) and a backflow function (a design through which the liquefied working medium flows back into the flow path), the internal structure is simplified without disposing a liquid reflux path after liquefaction). Preferably, in an embodiment, the flow guiding groove is disposed at the periphery of the through hole for guiding the condensed and liquefied working medium to the through hole and flowing back to the flow channel.

The application provides a radiator unit, steam chamber structural optimization design through the gas-liquid conversion module, make the gas/liquid separation of working medium in the radiator unit, it is used for the whole face of contact surface that the gas-liquid conversion module of cooling side corresponds to have liquid, this liquid is in the runner, when the second apron input heat, working medium liquid is the vaporization of being heated, the steam of production flows to the steam intracavity through the perforation under the pressure differential effect, overflow the direction to keeping away from steam in the steam intracavity and flow, the condensation liquefaction, liquefied working medium flows back to in the runner. The heat source heat sink utilizes the phase change and flowing processes of working media to uniformly transfer the heat of the heat source received by the second cover plate, so that the efficient heat transfer process is realized, and the heat sink assembly has good temperature equalization performance.

In the design of radiating component, first apron, the second apron, the gas-liquid conversion module, first apron has first cavity, its bottom disposes the arch that the plural number interval set up, the gas-liquid conversion module, have the base plate, its one side is connected with the arch, in order to constitute the steam chamber, the one side relative with protruding contact side disposes the plural fin of outstanding interval configuration, the tip of plural fin contacts with the bottom of the second cavity of second apron, constitute the runner that stores working medium between the bottom of adjacent two fins and the second cavity of contact, dispose the plural perforation on the base plate, at least part perforation intercommunication runner and steam chamber, be used for discharging the steam of evaporating in the runner to the steam intracavity or with the working medium backward flow of steam intracavity condensation to the runner in.

In the design of the first cover plate, a first cavity is arranged in the first cover plate, and a plurality of bulges which are arranged at intervals are arranged at the bottom of the cavity. Preferably, the top (also called end) of the protrusion 101c is in the same plane as the end of the sidewall 101 b. Preferably, the top of the protrusion may be configured to be planar.

In the design of the first cover plate, a first cavity is arranged therein, a plurality of protrusions arranged at intervals are arranged in the cavity (e.g. at the bottom), the plurality of protrusions are in a continuous strip cube shape or an intermittent strip cube shape, and the length of each section or each section can be uniform or different. The width of the projections is 10 mu m-3 mm, and the width w2 may be uniform or nonuniform. The width of the space between the adjacent projections is 100 μm to 10 mm. Preferably, the cross-section of the protrusion is square or at least one side of the protrusion comprises a pointed shape or a round bag shape (the protrusion is continuously arranged in a whole strip or is arranged in discontinuous sections, and the length of each section or each section can be the same or different). Or the cross section is circular (semicircular), and the convex spheres or hemispheres are randomly arranged or arranged in an array, and the sizes of the convex spheres or hemispheres can be the same or different. Preferably, the protrusions are cylindrical, either randomly or in an array.

In the design of the gas-liquid conversion module, one side of the gas-liquid conversion module is provided with at least one fin array which is arranged in a row or column shape, one side opposite to the fin array is provided with a plurality of fins which are arranged at intervals and protrude, the plurality of fins form an evaporation module, the end parts of the fins are connected with the bottom of the second cavity, the bottom of the second cavity which is adjacent to the two fins and is in contact with the two fins forms a flow path for storing working media, and the adjacent flow paths are communicated, so that the whole surface of the evaporation module can be used for cooling. The gas-liquid conversion module is also provided with a plurality of through holes, and has the functions of ventilation (for the outflow of evaporated steam) and backflow (the liquefied working medium liquid of the evaporated steam flows back into the flow channel through the through holes and is arranged in a regular array or random arrangement).

In the design of the fin array, the ends of the fin array are connected to the tops (ends) of the projections. The top width of the protrusion is the same or approximately the same as the width of the fin array. The depressions between the adjacent fin arrays and the grooves of the first cover plate form steam cavities, steam evaporated when the working medium is heated flows into the steam cavities a through the through holes, and the working medium condensed and liquefied at the side far away from the heat source flows back into the flow channel through the through holes. A through hole is arranged between two adjacent fins. The shape of the through hole can be circular, oval, triangular, polygonal, the shape with a bending part such as T-shaped, and the like, preferably, the periphery of the through hole is provided with a diversion trench for guiding the condensed and liquefied working medium to the through hole to flow back to the flow channel. Preferably, the through hole is disposed at the recess and/or between two adjacent fins.

In the design of the fins, the single fins are configured into a continuous or intermittent design, preferably, at least one side of one side is in an intermittent design at intervals, so that two adjacent flow passages can be communicated, and the side of each fin is provided with a cooling working medium on the whole surface, so that the heat dissipation efficiency is good.

In the design of the gas-liquid conversion module, the gas-liquid conversion module is provided with a base plate, a plurality of perforations with the functions of ventilation (for the outflow of evaporated steam) and backflow (for the backflow of the working medium liquid after the liquefaction of the evaporated steam into a flow channel) are arranged on the base plate, and at least part of the perforations are communicated with the flow channel and a steam cavity for ventilation or backflow. The perforations are randomly distributed or arranged in an array. One side of the substrate is used for contacting with the protrusion to form a steam cavity, preferably, at least one fin array arranged in a row or column shape is arranged on the side of the substrate contacting with the protrusion, and the end part of the fin array is connected with the top part (also called end part) of the protrusion to form the steam cavity; and a plurality of protruding fins arranged at intervals are arranged on one side opposite to the fin array, the plurality of fins form an evaporation module, the end parts of the fins are connected with the bottom of the second cavity, a flow channel (also called a flow channel) for storing working media is formed between two fins (between two adjacent fins and the bottom of the second cavity contacted with the fins), and the adjacent flow channels are communicated, so that the whole surface of the evaporation module can be used for cooling. The heat dissipation assembly is designed without a liquefied liquid return path, so that the internal structure is simplified. Preferably, the continuous fins or the intermittent fins are arranged in the array of fins arranged in rows or columns and are parallel to each other. Preferably, the fin array, the substrate and the plurality of fins are integrally formed.

In the design of the fin array, it is configured with continuous fins or intermittent fins parallel to each other, which are parallel or at an angle to the vapor chamber. For example, the angle between the fins and the steam cavity is 30 degrees, 45 degrees, 60 degrees, 90 degrees and the like, so that the space between the adjacent fins is communicated with the steam cavity, and after the angle is formed, the space formed between the adjacent fins is communicated with the steam cavity, and then the drainage effect is started, and the steam is guided to flow far away from the heat source side. Further improving the heat (soaking) effect.

In the design of the steam cavity, the steam cavity can comprise a first steam cavity, a second steam cavity and a third steam cavity; the groove between every two adjacent bulges and the recess between every two adjacent fin arrays are combined to form a first steam cavity; or the groove between the bulge and the side wall of the first cover plate adjacent to the bulge and the depression between the fin array and the side wall of the second cover plate are combined to form a second steam cavity; or the space between two adjacent fins and the top of the bulge are combined to form a third steam cavity. For the heat dissipation assembly, the outermost steam cavity (second steam cavity) can be designed to be communicated.

In the above embodiments, the heat dissipation assembly may dissipate heat of a processor of an electronic device. Preferably, the thickness is less than 3 mm.

The above embodiments are only for illustrating the technical concept and features of the present invention, and the purpose of the embodiments is to enable those skilled in the art to understand the contents of the present invention and to implement the present invention, which cannot limit the protection scope of the present invention. All equivalent changes and modifications made according to the spirit of the present invention should be covered by the protection scope of the present invention.

Claims (12)

1. A heat dissipating assembly, comprising:

the gas-liquid conversion device comprises a first cover plate, a second cover plate and a gas-liquid conversion module;

the gas-liquid conversion module is provided with a first layer and a second layer which are arranged in a stacked mode, the first layer is arranged opposite to the first cover plate, and the second layer is arranged opposite to the second cover plate;

the first layer is provided with fins and/or the first cover plate is provided with bulges so as to form a steam cavity;

a plurality of runners for storing working media are arranged between the second layer and the second cover plate;

a plurality of through holes are formed between the first layer and the second layer and are communicated with the steam cavity and the flow channel so as to discharge steam evaporated in the flow channel into the steam cavity or return working media condensed in the steam cavity into the flow channel.

2. The heat dissipation assembly of claim 1, wherein: the plurality of protrusions are continuous long square bodies or discontinuous square bodies arranged in sections, and the width of the protrusions is 10 mu m-3 mm.

3. The heat dissipation assembly of claim 1, wherein: the plurality of bulges are distributed randomly or in an array, are spherical or cylindrical, or have square cross sections and at least comprise one or more than one of a sharp corner shape, a round bag shape and a semicircular shape.

4. The heat dissipation assembly of claim 1, wherein:

the top of the protrusion and the end surface of the side wall of the first cover plate are positioned on the same plane.

5. The heat dissipation assembly of claim 1, wherein:

the side, which is in contact with the protrusion, of the gas-liquid conversion module is provided with at least one fin array which is arranged in a row or column shape, and the end part of the fin array is connected with the top of the protrusion.

6. The heat removal assembly of claim 5, wherein: the array of fins has a width that is the same as the width of the top of the protrusion.

7. The heat removal assembly of claim 6, wherein: the end part of the fin array and the end part of the side wall of the second cover plate are in the same plane.

8. The heat removal assembly of claim 5, wherein: the adjacent 2 fins in the fin array are parallel to each other or are trumpet-shaped, and the through holes are arranged in the trumpet-shaped fins.

9. The heat dissipation assembly of claim 1, wherein: the heights of two adjacent flow passages are the same or different.

10. The heat dissipation assembly of claim 1, wherein: the perforation is circular, oval, triangular or polygonal.

11. The heat dissipation assembly of claim 1, wherein: and fins are arranged on one side of the gas-liquid conversion module and are continuously or intermittently arranged at intervals.

12. An electronic device carrying the heat dissipating component as claimed in any one of claims 1 to 11.

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