CN211604129U - 传感器模组及电子设备 - Google Patents
传感器模组及电子设备 Download PDFInfo
- Publication number
- CN211604129U CN211604129U CN201921873820.6U CN201921873820U CN211604129U CN 211604129 U CN211604129 U CN 211604129U CN 201921873820 U CN201921873820 U CN 201921873820U CN 211604129 U CN211604129 U CN 211604129U
- Authority
- CN
- China
- Prior art keywords
- photoelectric conversion
- sensor module
- component
- substrate
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000006243 chemical reaction Methods 0.000 claims abstract description 139
- 239000000758 substrate Substances 0.000 claims abstract description 90
- 230000001681 protective effect Effects 0.000 claims abstract description 37
- 239000000463 material Substances 0.000 claims abstract description 33
- 239000003292 glue Substances 0.000 claims abstract description 29
- 230000003287 optical effect Effects 0.000 claims description 43
- 239000011248 coating agent Substances 0.000 claims description 28
- 238000000576 coating method Methods 0.000 claims description 28
- 239000000853 adhesive Substances 0.000 claims description 17
- 230000001070 adhesive effect Effects 0.000 claims description 17
- 238000003384 imaging method Methods 0.000 claims description 9
- 229920001296 polysiloxane Polymers 0.000 claims description 2
- 239000002184 metal Substances 0.000 abstract description 4
- 239000010410 layer Substances 0.000 description 29
- 238000000034 method Methods 0.000 description 25
- 239000012790 adhesive layer Substances 0.000 description 11
- 230000008569 process Effects 0.000 description 9
- 230000009286 beneficial effect Effects 0.000 description 5
- 238000009434 installation Methods 0.000 description 5
- 238000004806 packaging method and process Methods 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 230000003139 buffering effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000000499 gel Substances 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- 230000000712 assembly Effects 0.000 description 2
- 238000000429 assembly Methods 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 238000011900 installation process Methods 0.000 description 2
- 235000015110 jellies Nutrition 0.000 description 2
- 239000008274 jelly Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000012780 transparent material Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009776 industrial production Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000012788 optical film Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1318—Sensors therefor using electro-optical elements or layers, e.g. electroluminescent sensing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
Landscapes
- Engineering & Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Multimedia (AREA)
- Theoretical Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Solid State Image Pick-Up Elements (AREA)
Abstract
Description
Claims (16)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201910300583 | 2019-04-15 | ||
CN2019103005832 | 2019-04-15 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN211604129U true CN211604129U (zh) | 2020-09-29 |
Family
ID=72586895
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201911053111.8A Pending CN111832380A (zh) | 2019-03-05 | 2019-10-31 | 传感器模组、电子设备及装配方法 |
CN201921873820.6U Active CN211604129U (zh) | 2019-04-15 | 2019-10-31 | 传感器模组及电子设备 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201911053111.8A Pending CN111832380A (zh) | 2019-03-05 | 2019-10-31 | 传感器模组、电子设备及装配方法 |
Country Status (1)
Country | Link |
---|---|
CN (2) | CN111832380A (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN112711150B (zh) * | 2020-12-22 | 2022-11-22 | 业泓科技(成都)有限公司 | 显示装置 |
-
2019
- 2019-10-31 CN CN201911053111.8A patent/CN111832380A/zh active Pending
- 2019-10-31 CN CN201921873820.6U patent/CN211604129U/zh active Active
Also Published As
Publication number | Publication date |
---|---|
CN111832380A (zh) | 2020-10-27 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US7453509B2 (en) | Digital camera with a transparent core disposed between a lens and a light-sensitive sensor | |
US10032824B2 (en) | Image sensor structure and packaging method thereof | |
EP2393116B1 (en) | Wafer level image sensor packaging structure and manufacturing method for the same | |
US8605211B2 (en) | Low rise camera module | |
TWI302742B (en) | Solid-state image sensing device | |
US20040041261A1 (en) | Flip-chip image sensor packages and methods of fabrication | |
CN109075141A (zh) | 芯片封装结构、方法和终端设备 | |
US20050270405A1 (en) | Image pickup device and camera module | |
KR20110001659A (ko) | 카메라 모듈 | |
US20040256687A1 (en) | Optical module, method of manufacturing the same, and electronic instrument | |
TWI690779B (zh) | 感光晶片封裝模組及其形成方法 | |
CN211555889U (zh) | 图像感测模块 | |
CN109461748B (zh) | 一种光学元件的封装结构及封装方法 | |
CN211604129U (zh) | 传感器模组及电子设备 | |
CN209785021U (zh) | 传感器模组及电子设备 | |
CN111666783A (zh) | 基材结构、传感器模组、电子设备及安装方法 | |
JP5658466B2 (ja) | 固体撮像装置の製造方法 | |
CN209472762U (zh) | 基材结构、传感器模组及电子设备 | |
CN209086962U (zh) | 用于屏下光学指纹的识别组件及电子设备 | |
CN108881675A (zh) | 摄像模组 | |
CN108336038B (zh) | 封装结构、封装方法和摄像头模组 | |
CN103928481B (zh) | 一种图像传感器封装结构及封装方法 | |
CN114339000B (zh) | 一种摄像头模组及制备方法 | |
CN212519174U (zh) | 摄像头模组及电子设备 | |
CN205211751U (zh) | 邻近传感器以及电子设备 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20220713 Address after: 523808 room 718, building 9, No. 1 Xuefu Road, Songshanhu Park, Dongguan City, Guangdong Province Patentee after: Impression cognition (Dongguan) Technology Co.,Ltd. Address before: 100193 room 306b, area 2, building 9, Zhongguancun Software Park, Haidian District, Beijing Patentee before: VKANSEE (BEIJING) TECHNOLOGY Co.,Ltd. |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20231214 Address after: 714000 floors 4-6, building 3, additive manufacturing Innovation Center Industrial Park, west section of Chaoyang Street, high tech Industrial Development Zone, Weinan City, Shaanxi Province Patentee after: Weinan impression Cognitive Technology Co.,Ltd. Address before: 523808 room 718, building 9, No. 1 Xuefu Road, Songshanhu Park, Dongguan City, Guangdong Province Patentee before: Impression cognition (Dongguan) Technology Co.,Ltd. |
|
TR01 | Transfer of patent right |