CN211603247U

CN211603247U - Three-axis acceleration sensor

Info

Publication number: CN211603247U
Application number: CN202020431309.7U
Authority: CN
Inventors: 聂泳忠; 许辉煌
Original assignee: Xirenma Combined Measurement And Control Quanzhou Technology Co ltd
Current assignee: Xirenma Combined Measurement And Control Quanzhou Technology Co ltd
Priority date: 2020-03-30
Filing date: 2020-03-30
Publication date: 2020-09-29
Anticipated expiration: 2030-03-30

Abstract

The utility model relates to a triaxial acceleration sensor, this sensor includes: a housing; the 3 sensor components are vertically arranged in the shell in pairs; the conditioning circuit board is arranged in the shell, and the input end of the conditioning circuit board is respectively connected with the 3 sensor components and the shell; the connector is arranged outside the shell and is connected with the output end of the conditioning circuit board; each sensor assembly comprises a piezoelectric ceramic, a mass block and a heat-shrinkable ring; the mass block is sleeved on the piezoelectric ceramic, and the heat-shrinkable ring is sleeved on the mass block; the mass comprises a first semi-ring mass and a second semi-ring mass corresponding to the first semi-ring mass. The utility model discloses can monitor three orthogonal axial acceleration simultaneously, and adopt the pyrocondensation ring fixed, the size is little, and the quality is light.

Description

Three-axis acceleration sensor

Technical Field

The utility model relates to an acceleration sensor, in particular to triaxial acceleration sensor.

Background

An acceleration sensor is a sensor capable of measuring acceleration. It is generally composed of mass, damper, elastic element, sensing element and adaptive circuit. In the acceleration process, the sensor obtains an acceleration value by measuring the inertial force borne by the mass block and utilizing Newton's second law. Common acceleration sensors include capacitive, inductive, strain, piezoresistive, piezoelectric, etc. depending on the sensor sensing element.

The piezoelectric acceleration sensor is also called piezoelectric accelerometer, and belongs to the field of inertial sensor. The principle of the piezoelectric acceleration sensor is that the force applied by the mass block on the piezoelectric element changes when the accelerometer is vibrated by utilizing the piezoelectric effect of the piezoelectric ceramic or the quartz crystal. When the measured vibration frequency is much lower than the natural frequency of the accelerometer, then the force change is directly proportional to the measured acceleration.

At present, piezoelectric acceleration sensors are widely applied in industry (electric power, rail transit, engineering machinery and the like), and are mainly used for monitoring the health state of important equipment, so that the sensors are required to have high vibration detection. Most of the existing triaxial acceleration sensors are large in size, narrow in sweep frequency range and inconvenient to apply to occasions requiring small mass and size of the sensors.

Disclosure of Invention

The to-be-solved technical problem of the utility model is to the aforesaid not enough, provide a triaxial piezoelectric type acceleration sensor small, that frequency sweep range is wide.

The utility model discloses a realize through following technical scheme:

a three-axis acceleration sensor, the sensor comprising:

a housing;

the 3 sensor components are vertically arranged in the shell in pairs;

the conditioning circuit board is arranged in the shell, and the input end of the conditioning circuit board is respectively connected with the 3 sensor components and the shell; and

the connector is arranged outside the shell and is connected with the output end of the conditioning circuit board;

each sensor assembly comprises a piezoelectric ceramic, a mass block and a heat-shrinkable ring; the mass block is sleeved on the piezoelectric ceramic, and the heat-shrinkable ring is sleeved on the mass block; the mass comprises a first semi-ring mass and a second semi-ring mass corresponding to the first semi-ring mass.

Furthermore, a bracket with 3 support columns which are vertical to each other in pairs is arranged in the shell of the three-axis acceleration sensor; and 3, respectively sleeving the piezoelectric ceramics of the sensor components on the supporting columns.

Further, in the triaxial acceleration sensor, the piezoelectric ceramics include a first half-ring piezoelectric ceramic and a second half-ring piezoelectric ceramic corresponding to the first half-ring piezoelectric ceramic.

Furthermore, triaxial acceleration sensor, 3 the pillar corresponds set up first installing port on the shell respectively, wherein, 2 first installing port is sealed with the upper cover, 1 first installing port is sealed with the connector interface.

Furthermore, the triaxial acceleration sensor, the connector interface has the second installing port, connect in the second installing port the conditioning circuit board, the second installing port outer joint the connector.

Furthermore, the connector is welded to the connector interface, and the connector interface is inserted into the connector interface through the second mounting opening.

Further, in the triaxial acceleration sensor, the connector is a four-core connector.

Further, the upper cover of the three-axis acceleration sensor is welded to the edge of the first mounting hole of the housing.

Further, the connector interface is welded to the edge of the first mounting opening of the housing.

Further, the connector is welded to the edge of the second mounting opening of the connector interface.

The utility model has the advantages and effects that:

1. the utility model provides a triaxial acceleration sensor sets up two liang of mutually perpendicular's 3 sensor assembly, can monitor three orthogonal axial acceleration simultaneously.

2. The utility model provides a three-axis acceleration sensor's piezoceramics, quality piece all adopt the integrated configuration of two semi-rings for the whole of piezoceramics and quality piece has bigger deformation volume, and the assembly of piezoceramics and quality piece of being convenient for is convenient for process and can reduce the influence to sensor subassembly overall performance when making piezoceramics and quality piece produce deformation.

3. The utility model provides a triaxial acceleration sensor adopts fixed piezoceramics of pyrocondensation ring and quality piece, and the size is little, and the quality is light. And the triaxial acceleration sensor can resist high temperature, keeps lower sensitivity temperature drift, and can normally operate in a high-temperature environment.

Drawings

Fig. 1 is a schematic view illustrating a structure of a three-axis acceleration sensor according to the present invention;

fig. 2 shows a cross-sectional view of a three-axis acceleration sensor provided by the present invention;

fig. 3 shows a schematic split view of a sensor assembly of a three-axis acceleration sensor provided by the present invention.

Description of reference numerals: 1-housing, 11-support, 111-support, 112-connection, 12-first mounting port, 2-sensor assembly, 21-piezoelectric ceramic, 211-first half-ring piezoelectric ceramic, 212-second half-ring piezoelectric ceramic, 22-mass, 221-first half-ring mass, 222-second half-ring mass, 23-heat shrink ring, 3-upper cover, 4-conditioning circuit board, 5-connector interface, 51-second mounting port, 6-connector.

Detailed Description

In order to make the purpose, technical solution and advantages of the present invention clearer, the following drawings in the embodiments of the present invention are combined to perform more detailed description on the technical solution in the embodiments of the present invention. The described embodiments are some, but not all embodiments of the invention. The embodiments described below with reference to the drawings are exemplary and intended to be used for explaining the present invention, and should not be construed as limiting the present invention. Based on the embodiments in the present invention, all other embodiments obtained by those skilled in the art without creative efforts belong to the protection scope of the present invention. The embodiments of the present invention will be described in detail below with reference to the accompanying drawings:

in the description of the present invention, it is to be understood that, unless otherwise specified, "a plurality" means two or more; the terms "central," "longitudinal," "lateral," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in the orientation or positional relationship indicated in the drawings for ease of description and simplicity of description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting of the scope of the present invention. Furthermore, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; may be directly connected or indirectly connected through an intermediate. The specific meaning of the above terms in the present invention can be understood as the case may be, by those of ordinary skill in the art.

The utility model discloses triaxial acceleration sensor is used for detecting the health condition of the equipment that awaits measuring, and can gather the acceleration condition of the equipment that awaits measuring under the three-dimensional coordinate system in space. The triaxial acceleration sensor can acquire vibration data of the equipment to be tested, further converts the vibration data into electric signals, and then sends the electric signals to other equipment for subsequent analysis and processing, so that the acceleration of the equipment to be tested in three orthogonal axial directions is monitored.

Fig. 1 and 2 show the schematic structural diagram of the three-axis acceleration sensor provided by the present invention. The sensor comprises a housing 1, 3 sensor assemblies 2, a conditioning circuit board 4 and a connector 6. The housing 1 is used to provide a mounting base for 3 sensor assemblies 2. The housing 1 can enclose 3 sensor assemblies 2 inside it, thus providing protection for the 3 sensor assemblies 2. Every two of the 3 sensor assemblies 2 are arranged in the shell 1 in a mutually perpendicular mode and are used for detecting acceleration in the directions of an X axis, a Y axis and a Z axis respectively. The X axis, the Y axis and the Z axis are mutually vertical in pairs. The conditioning circuit board 4 is disposed in the housing 1, and has 4 input terminals connected to the 3 sensor assemblies 2 and the housing 1, respectively. The connector 6 is disposed outside the housing 1, and is connected to an output terminal of the conditioning circuit board 4. The 3 sensor units 2 are electrically connected to an external device via the conditioning circuit board 4 via the connector 6, so that their own output signals can be transmitted to the external device.

Specifically, as shown in fig. 2, each of the sensor assemblies 2 includes a piezoelectric ceramic 21, a mass 22, and a heat shrink ring 23. Piezoelectric ceramic 21 can withstand high temperatures and can maintain a low sensitivity temperature drift. The mass 22 has a through hole and is sleeved on the piezoelectric ceramic 21. The thermal shrinkage ring 23 has a through hole and is sleeved on the mass block 22. Because the piezoelectric ceramic 21 and the mass block 22 are in direct contact and interference fit, an intermediate connecting layer is not required to be arranged, so that the overall rigidity of the sensor component 2 is improved, the frequency response characteristic of the sensor component 2 is improved, the problem of stress fluctuation when the sensor component is used in a high-temperature environment is greatly reduced, and the high-temperature characteristic is good. Therefore, the triaxial acceleration sensor with the sensor assembly 2 has good frequency response characteristics and resonance performance, and can ensure the accuracy of detection results.

In one embodiment, the mass 22 is a ring-shaped structure, which includes a first semi-ring mass 221 and a second semi-ring mass 222 corresponding to the first semi-ring mass 221, wherein the first semi-ring mass 221 and the second semi-ring mass 222 form a ring-shaped mass and are sleeved on the piezoelectric ceramic 21. This configuration of the mass provides a greater amount of deformation of the mass 22 as a whole, facilitates assembly of the mass 22, facilitates tooling, and reduces the impact on the overall performance of the sensor assembly 2 when the mass 22 is deformed. The heat shrinkable ring 23 is an annular structure, and is sleeved on the first half-ring mass block 221 and the second half-ring mass block 222 to form the annular mass block 22, which is an annular part capable of shrinking and keeping a shape after heat shrinkage after being heated to a certain temperature. In the initial installation state or after heating, the first half-ring mass 221 and the second half-ring mass 222 may or may not be in contact with each other.

In another embodiment, a bracket 11 is arranged in the housing 1, the bracket 11 is connected to the inside of the housing 1, and the bracket 11 comprises 3 support columns 111 which are mutually perpendicular in pairs. The 3 pillars 111 may be separately disposed inside the housing 1, or may be linked to be integrally disposed inside the housing 1. The piezoelectric ceramic 21 is an annular structure body, and is sleeved on the pillar 111, the mass block 22 is sleeved on the piezoelectric ceramic 21, and the thermal shrinkage ring 23 is sleeved on the mass block 22, so that the 3 sensor components 2 are arranged in a mutually perpendicular manner in pairs.

Specifically, the housing 1 includes a connecting portion 112 and 3 support posts 111 that are perpendicular to each other in pairs. The connecting portion 112 is fixed inside the housing 1, and the 3 pillars 111 are cylindrical structures and are all connected to the connecting portion 112. The housing 1, the connecting portion 112 and the support 111 may be, but are not limited to, integrally formed. The piezoelectric ceramics 21 of the 3 sensor components 2 are respectively sleeved on a support 111. Piezoelectric ceramics 21 includes a first half-ring piezoelectric ceramic 211 and a second half-ring piezoelectric ceramic 212 corresponding to first half-ring piezoelectric ceramic 211, and first half-ring piezoelectric ceramic 211 and second half-ring piezoelectric ceramic 212 form a ring-shaped piezoelectric ceramic. The piezoelectric ceramic 21 has larger deformation, so that the piezoelectric ceramic 21 is convenient to assemble, the processing is convenient, and the influence on the overall performance of the sensor component 2 is reduced when the piezoelectric ceramic 21 deforms. The inner ring of the piezoelectric ceramic 21 is matched with the outer ring of the strut 111, the inner ring of the mass block 22 is matched with the outer ring of the piezoelectric ceramic 21, and the outer ring of the mass block 22 is matched with the inner ring of the heat shrinkage ring 23. The heat shrinkable ring 23 has heat shrinkability, and when the support 111, the piezoelectric ceramic 21, the mass 22, and the heat shrinkable ring 23 are assembled together, the mass 22 and the piezoelectric ceramic 21 are held tightly on the support 111 by heating while the heat shrinkable ring 23 is shrunk. In the initial mounting state or after heating, the first half-ring piezoelectric ceramic 211 and the second half-ring piezoelectric ceramic 212 may be in contact with each other, or may not be in contact with each other; the first semi-ring mass 221 and the second semi-ring mass 222 may or may not be in contact.

Further, as shown in fig. 3, the piezoelectric ceramic 21 includes an inner ring surface and an outer ring surface which are opposite to each other, i.e. the first half-ring piezoelectric ceramic 211 includes an inner ring surface and an outer ring surface which are opposite to each other, and the second half-ring piezoelectric ceramic 212 includes an inner ring surface and an outer ring surface which are opposite to each other. The first half-ring piezoelectric ceramic 211 and the second half-ring piezoelectric ceramic 212 are fastened to the pillar 111, so that the first half-ring inner annular surface and the second half-ring inner annular surface of the piezoelectric ceramic 21 are sleeved on the pillar 111, and the piezoelectric ceramic 21 is located above the connecting portion 112 and suspended. The diameter of the inner ring surface of the piezoelectric ceramic 21 is smaller than the diameter of the pillar 111, i.e., the combined diameter of the first half-ring inner ring surface of the first half-ring piezoelectric ceramic 211 and the second half-ring inner ring surface of the second half-ring piezoelectric ceramic 212 is smaller than the diameter of the pillar 111. The piezoelectric ceramic 21 is in direct contact and interference fit with the post 111. In the initial mounting state or after heating, both end surfaces of the first half-ring piezoelectric ceramic 211 and both end surfaces of the second half-ring piezoelectric ceramic 212 may be in contact with each other or may not be in contact with each other. The masses 22 include opposing inner and outer annular surfaces, i.e., the first half-ring mass 221 includes opposing first half-ring inner and outer annular surfaces, and the second half-ring mass 222 includes opposing second half-ring inner and outer annular surfaces. The first half-ring mass block 221 and the second half-ring mass block 222 are fastened to the piezoelectric ceramic 21, so that the first half-ring inner annular surface and the second half-ring inner annular surface of the mass block 22 are sleeved on the first half-ring outer annular surface and the second half-ring outer annular surface of the piezoelectric ceramic 21, and the mass block 22 is located above the connecting portion 112 and suspended. The diameter of the inner annular surface of the mass 22 is smaller than the diameter of the outer annular surface of the piezoelectric ceramic 21, i.e., the combined diameter of the first semi-annular inner annular surface of the first semi-annular mass 221 and the second semi-annular inner annular surface of the second semi-annular mass 222 is smaller than the diameter of the outer annular surface of the piezoelectric ceramic 21. The piezoelectric ceramic 21 and the mass 22 are in direct contact and have an interference fit. In the initial mounting state or after heating, the two end surfaces of the first semi-ring mass 221 and the two end surfaces of the second semi-ring mass 222 may or may not be in contact. The heat-shrinkable ring 23 includes an inner annular surface and an outer annular surface opposite to each other, the inner annular surface of the heat-shrinkable ring 23 is sleeved on the first semi-annular outer annular surface and the second semi-annular outer annular surface of the mass block 22, and the heat-shrinkable ring 23 is located above the connecting portion 112 and suspended. Preferably, but not exclusively, the width of the piezoelectric ceramic 21 corresponds to the width of the mass 22, and the width of the heat shrink ring 23 is smaller than the piezoelectric ceramic 21 and the mass 22. The thermal shrinkage ring 23 has thermal shrinkage, and through setting up the thermal shrinkage ring 23, can apply certain pretightning force for piezoceramics 21 and quality piece 22, the assembly of the pillar 111 of being convenient for, piezoceramics 21 and quality piece 22 combines to can improve the joint strength between pillar 111, piezoceramics 21 and the quality piece 22, promote sensor assembly 2's bulk rigidity, guarantee triaxial acceleration sensor's frequency response characteristic then. After the support 11, the piezoelectric ceramic 21, the mass 22 and the heat shrink ring 23 are assembled together, the mass 22 and the piezoelectric ceramic 21 are tightly held on the support 111 by heating when the heat shrink ring 23 is shrunk, so that the piezoelectric ceramic 21 and the mass 22 and the piezoelectric ceramic 21 and the support 111 form an interference fit.

It is understood that piezoelectric ceramic 21 is not limited to being composed of two first half-ring piezoelectric ceramic 211 and second half-ring piezoelectric ceramic 212 whose cross-sectional shapes are regular as a semicircle, i.e., first half-ring piezoelectric ceramic 211 and second half-ring piezoelectric ceramic 212 are the same shape. In alternative embodiments, piezoceramic material 21 may also be comprised of a slightly larger fan-shaped ring and a slightly smaller fan-shaped ring. Or the opposite end faces of the two sector rings constituting the piezoelectric ceramic 21 are not limited to extending in the axial direction of the piezoelectric ceramic 21, but may intersect the axis of the piezoelectric ceramic 21 as long as the piezoelectric ceramic in which the two sector rings can be formed into a ring shape is ensured. The mass 22 is constructed as above. Piezoelectric ceramic 21 in other embodiments, a piezoelectric single crystal, such as a quartz crystal, may also be used. The piezoelectric ceramic 21 and the mass 22 are not limited to circular ring structures, but in some alternative embodiments, polygonal ring structures may be adopted, and correspondingly, the pillars 111 may be polygonal column structures as long as the requirements of the sensor assembly 2 can be met. The structure of the heat shrink ring 23 is not limited to a circular ring structure, and a polygonal ring structure may be used correspondingly to the structure of the mass 22.

In one embodiment, the housing 1 corresponding to the 3 pillars 111 is provided with the first mounting openings 12, respectively, for 3 first mounting openings 12. Wherein 2 first mounting openings 12 are sealed by the upper cover 3, and the remaining 1 first mounting openings 12 are sealed by the connector interface 5. The connector port 5 is a cylindrical connector having a depth, and a second mounting opening 51 is provided (on one end surface of the cylindrical connector) in the connector port 5 and communicates with the inside of the housing 1. The second mounting opening 51 has inner and outer edges along the axis of the cylinder. The conditioning circuit board 4 is connected with the inner edge of the second mounting opening 51 by glue, and the outer periphery of the conditioning circuit board 4 is attached to the inner edge of the second mounting opening 51. The connector 6 is connected to the outside (outer edge) of the second mounting opening 51. Specifically, the connector 6 is a four-core connector, such as an M4.5 connector. The 3 mass blocks 22 are respectively welded with an enameled wire and are connected with an input end of the conditioning circuit board 4 one by one. The shell 1 is welded with an enameled wire and is connected with one input end of the conditioning circuit board 4. The connector 6 is soldered to the outer edge of the connector interface 51, and the pins of the connector are inserted into the connector interface 51 through the second mounting opening 51, and 4 pins are connected to 4 output terminals of the conditioning circuit board 4. The upper cover 3 is connected to the edge of the first mounting hole 12 of the housing 1 by welding, and the connector interface 51 is connected to the edge of the first mounting hole 12 of the housing 1 by welding. The connector 6 is connected to an edge of the second mounting opening 51 of the connector interface 51 by means of soldering.

In one embodiment, the housing 1 is preferably, but not limited to, a square, rectangular parallelepiped or other irregular shape. The first mounting opening 12 is preferably, but not limited to, circular.

The above embodiments are only used to illustrate the technical solutions of the present invention, and are not used to limit the scope of the present invention. However, all equivalent changes and modifications made within the scope of the present invention should be considered as falling within the scope of the present invention.

Claims

1. A three-axis acceleration sensor, characterized in that it comprises:

a housing (1);

the 3 sensor components (2) are vertically arranged in the shell (1) in pairs;

the conditioning circuit board (4) is arranged in the shell (1), and the input end of the conditioning circuit board is respectively connected with the 3 sensor components (2) and the shell (1); and

the connector (6) is arranged outside the shell (1) and is connected with the output end of the conditioning circuit board (4);

each sensor assembly (2) comprises a piezoelectric ceramic (21), a mass block (22) and a heat-shrinkable ring (23); the mass block (22) is sleeved on the piezoelectric ceramic (21), and the heat shrinkage ring (23) is sleeved on the mass block (22); the mass (22) comprises a first semi-ring mass (221) and a second semi-ring mass (222) corresponding to the first semi-ring mass (221).

2. The triaxial acceleration sensor of claim 1, characterized in that a carrier (11) with two mutually perpendicular 3 struts (111) is provided in the housing (1); the piezoelectric ceramics (21) of the 3 sensor components (2) are respectively sleeved on the supporting columns (111).

3. The triaxial acceleration sensor of claim 2, wherein the piezoelectric ceramic (21) comprises a first half-ring piezoelectric ceramic (211) and a second half-ring piezoelectric ceramic (212) corresponding to the first half-ring piezoelectric ceramic (211).

4. The triaxial acceleration sensor according to claim 2 or 3, wherein 3 pillars (111) are provided on the housing (1) with respective first mounting ports (12), wherein 2 first mounting ports (12) are sealed with an upper cover (3) and 1 first mounting port (12) is sealed with a connector interface (5).

5. The triaxial acceleration sensor of claim 4, wherein the connector interface (5) has a second mounting opening (51), the conditioning circuit board (4) being connected inside the second mounting opening (51), the second mounting opening (51) being connected outside the connector (6).

6. The triaxial acceleration sensor of claim 5, wherein the connector (6) is welded to the connector interface (5) and protrudes into the connector interface (5) through the second mounting opening (51).

7. The triaxial acceleration sensor of claim 1, 2, 3, 5 or 6, wherein the connector (6) is a four-core connector.

8. The triaxial acceleration sensor of claim 4, wherein the upper cover (3) is welded to the rim of the first mounting opening (12) of the housing (1).

9. The triaxial acceleration sensor of claim 4, wherein the connector interface (5) is welded to an edge of the first mounting opening (12) of the housing (1).

10. The triaxial acceleration sensor of claim 5, wherein the connector (6) is welded to an edge of the second mounting opening (51) of the connector interface (5).