CN211587742U

CN211587742U - Wet cleaning equipment for wafer processing

Info

Publication number: CN211587742U
Application number: CN201922459023.XU
Authority: CN
Inventors: 郑东来; 缪小波
Original assignee: Jiangsu Jiazhao Electronic Co ltd
Current assignee: Jiangsu Jiazhao Electronic Co ltd
Priority date: 2019-12-30
Filing date: 2019-12-30
Publication date: 2020-09-29
Anticipated expiration: 2029-12-30

Abstract

The utility model discloses a wet cleaning equipment is used in wafer processing, which comprises a bracket, the washing tank, place the frame, the connecting rod, the slide, the threaded rod, a fixed plate, elevator motor, slide bar and wafer frame, the support top is fixed with the washing tank, washing tank inner wall is equipped with places the frame, it is fixed with the connecting rod to place frame bilateral symmetry, two connecting rod one ends of placing the frame both ends are fixed with the slide, the screw hole is seted up at the slide middle part, threaded hole inner wall threaded connection has the threaded rod, and the threaded rod bottom is rotated through bearing and washing tank bottom and is connected, washing tank inner wall top symmetry is fixed with the fixed plate, the threaded rod top is passed through the bearing and is rotated with the fixed plate and be connected, the fixed plate middle part is fixed with elevator motor, and elevator motor's output and threaded rod fixed connection, the slide, And the cleaning efficiency is higher, and the use of people is convenient.

Description

Wet cleaning equipment for wafer processing

Technical Field

The utility model relates to a wafer washs technical field, specifically is a wafer processing is with wet process cleaning equipment.

Background

The wafer refers to a silicon wafer used for manufacturing a silicon semiconductor integrated circuit, and is called a wafer because the shape is circular; various circuit device structures can be fabricated on a silicon wafer to form an IC product with specific electrical functions. The original material of the wafer is silicon, and the crust surface has inexhaustible silicon dioxide, because the silicon chip will pollute in the transportation, the surface cleanliness is not very high, and the corrosion and the etching to be carried out have great influence, so at first need carry out a series of cleaning operations to the silicon chip surface, the wafer is soaked in the cleaning solution to soak in most of the existing wafer wet cleaning, in order to get rid of the filth on the wafer surface, but the existing wafer cleaning device is not convenient for people to get and put the wafer when cleaning, and the cleaning effect is poor. Therefore, a wet cleaning device for wafer processing is provided.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a wafer processing is with wet process cleaning equipment to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: a wet cleaning device for wafer processing comprises a support, a cleaning tank, a placing frame, connecting rods, a sliding plate, a threaded rod, a fixing plate, a lifting motor, a sliding rod and a wafer frame, wherein the cleaning tank is fixed at the top of the support, the placing frame is arranged on the inner wall of the cleaning tank, the connecting rods are symmetrically fixed on two sides of the placing frame, the sliding plate is fixed at one end of each of the two connecting rods at two ends of the placing frame, a threaded hole is formed in the middle of the sliding plate, the threaded rod is connected to the inner wall of the threaded hole in a threaded manner, the bottom of the threaded rod is rotatably connected with the bottom of the cleaning tank through a bearing, the fixing plate is symmetrically fixed at the top of the inner wall of the cleaning tank, the top of the threaded rod is rotatably connected with the fixing, slide bar one end and purge tank bottom fixed connection, and the slide bar other end and fixed plate fixed connection, place the frame inner wall and placed the wafer frame.

Preferably, a stirring motor is fixed at the bottom of the cleaning tank, and an output end of the stirring motor penetrates through the cleaning tank and is fixed with a stirring paddle.

Preferably, the bottom of the inner wall of the cleaning tank is fixed with an annular electric heater.

Preferably, the lifting motor and the stirring motor are both speed reducing motors.

Preferably, a control panel is fixed on one side of the cleaning tank, and the lifting motor, the stirring motor and the annular electric heater are electrically connected with the control panel.

Preferably, a drain valve is fixed on one side of the cleaning tank.

Compared with the prior art, the beneficial effects of the utility model are that:

when the cleaning device is used, a proper amount of cleaning solution is injected into the cleaning tank, the cleaning solution is heated by the annular electric heater to improve the cleaning effect, then the wafer frame filled with wafers is placed in the placing frame, the lifting motor is controlled to be started by the control panel at the moment, the threaded rod is driven to rotate, the threaded rod drives the sliding plate to move downwards, the sliding plate drives the placing frame to move downwards by the connecting rod, the wafer frame is moved downwards into the cleaning tank until the cleaning solution overflows the wafers, the stirring motor is driven to rotate at the moment to drive the stirring paddle to rotate, the stirring paddle rolls and mixes the cleaning solution in the cleaning tank, the heating speed of the annular electric heater to the cleaning solution can be improved, the surface of the wafers is washed by the movement of the cleaning solution, the cleaning effect of the wafers is improved, and after the cleaning is finished, the sliding plate is driven to move upwards by the lifting motor, the wafer rack is lifted by the placing frame, so that people can take the wafer rack out.

Drawings

FIG. 1 is a schematic view of the overall cross-sectional structure of the present invention;

fig. 2 is a schematic view of a cross-sectional structure of the sliding rod of the present invention.

In the figure: 1. a support; 2. a cleaning tank; 3. placing the frame; 4. a connecting rod; 5. a slide plate; 6. a threaded rod; 7. a fixing plate; 8. a lifting motor; 9. a slide bar; 10. a wafer rack; 11. a stirring motor; 12. a stirring paddle; 13. an annular electric heater; 14. a control panel; 15. and a drain valve.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-2, the present invention provides a technical solution: a wet cleaning device for wafer processing comprises a support 1, a cleaning groove 2, a placing frame 3, connecting rods 4, sliding plates 5, threaded rods 6, a fixing plate 7, a lifting motor 8, sliding rods 9 and a wafer frame 10, wherein the cleaning groove 2 is fixed at the top of the support 1, the placing frame 3 is arranged on the inner wall of the cleaning groove 2, the connecting rods 4 are symmetrically fixed on two sides of the placing frame 3, the sliding plates 5 are fixed at one ends of the two connecting rods 4 at two ends of the placing frame 3, a threaded hole is formed in the middle of the sliding plate 5, the threaded rods 6 are connected with the inner wall of the threaded hole in a threaded manner, the bottom of each threaded rod 6 is rotatably connected with the bottom of the corresponding cleaning groove 2 through a bearing, the fixing plate 7 is symmetrically fixed at the top of the inner wall of the cleaning groove 2, the top of each threaded rod 6 is rotatably connected with the fixing plate 7, one end of a sliding rod 9 is fixedly connected with the bottom of the cleaning tank 2, the other end of the sliding rod 9 is fixedly connected with a fixing plate 7, a wafer frame 10 is placed on the inner wall of the placing frame 3, when the wafer frame is used, people inject a proper amount of cleaning solution into the cleaning tank 2 and heat the cleaning solution through an annular electric heater 13 to improve the cleaning effect, then the wafer frame 10 filled with wafers is placed in the placing frame 3, at the moment, a control panel 14 controls a lifting motor 8 to start, and then a threaded rod 6 is driven to rotate, so that the threaded rod 6 drives a sliding plate 5 to move downwards, and further the sliding plate 5 drives the placing frame 3 to move downwards through a connecting rod 4, and further the wafer frame 10 is moved downwards into the cleaning tank 2 until the cleaning solution overflows the wafers, at the moment, the stirring motor 11 rotates to drive a stirring paddle 12 to rotate, so that the stirring paddle 12 rolls and mixes the cleaning, not only can improve the rate of heating of annular electric heater 13 to the cleaning solution to the motion through the cleaning solution washes away the wafer surface, with the cleaning performance who improves the wafer, accomplishes the back at the washing, drives slide 5 upward movement through elevator motor 8, makes and places frame 3 and puts up 10 lifts with the wafer frame, makes people can take out wafer frame 10.

The bottom of cleaning tank 2 is fixed with agitator motor 11, and agitator motor 11's output passes cleaning tank 2 and is fixed with stirring rake 12, is convenient for stir the cleaning solution in cleaning tank 2, improves the rate of heating of cleaning solution and the cleaning performance to the wafer.

And an annular electric heater 13 is fixed at the bottom of the inner wall of the cleaning tank 2, so that the cleaning solution is heated conveniently, and the cleaning effect is improved.

The lifting motor 8 and the stirring motor 11 are both speed reducing motors, so that the output rotating speeds of the lifting motor 8 and the stirring motor 11 are conveniently reduced.

A control panel 14 is fixed on one side of the cleaning tank 2, and the lifting motor 8, the stirring motor 11 and the annular electric heater 13 are all electrically connected with the control panel 14, so that the operation of the electrical equipment is controlled conveniently.

A liquid discharge valve 15 is fixed on one side of the cleaning tank 2, so that the waste liquid in the cleaning tank 2 can be conveniently discharged.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a wafer processing is with wet cleaning equipment, includes support (1), washing tank (2), places frame (3), connecting rod (4), slide (5), threaded rod (6), fixed plate (7), elevator motor (8), slide bar (9) and wafer frame (10), its characterized in that: the cleaning device is characterized in that a cleaning groove (2) is fixed at the top of the support (1), a placing frame (3) is arranged on the inner wall of the cleaning groove (2), connecting rods (4) are symmetrically fixed on two sides of the placing frame (3), sliding plates (5) are fixed at one ends of the two connecting rods (4) at two ends of the placing frame (3), a threaded hole is formed in the middle of each sliding plate (5), a threaded rod (6) is connected to the inner wall of each threaded hole in a threaded manner, the bottom of each threaded rod (6) is rotatably connected with the bottom of the cleaning groove (2) through a bearing, a fixing plate (7) is symmetrically fixed at the top of the inner wall of the cleaning groove (2), the top of each threaded rod (6) is rotatably connected with the fixing plate (7) through a bearing, a lifting motor (8) is fixed at the middle of each fixing plate (7), the output end of, slide bar (9) one end and washing tank (2) bottom fixed connection, and slide bar (9) other end and fixed plate (7) fixed connection, place frame (3) inner wall and placed wafer frame (10).

2. The wet cleaning apparatus for wafer processing according to claim 1, wherein: washing tank (2) bottom is fixed with agitator motor (11), the output of agitator motor (11) passes washing tank (2) and is fixed with stirring rake (12).

3. The wet cleaning apparatus for wafer processing according to claim 1, wherein: and an annular electric heater (13) is fixed at the bottom of the inner wall of the cleaning tank (2).

4. The wet cleaning apparatus for wafer processing according to claim 1, wherein: the lifting motor (8) and the stirring motor (11) are both speed reducing motors.

5. The wet cleaning apparatus for wafer processing according to claim 1, wherein: a control panel (14) is fixed on one side of the cleaning tank (2), and the lifting motor (8), the stirring motor (11) and the annular electric heater (13) are electrically connected with the control panel (14).

6. The wet cleaning apparatus for wafer processing according to claim 1, wherein: a liquid discharge valve (15) is fixed on one side of the cleaning tank (2).