CN211578384U - Heat radiation and heat conduction structure of solid chip - Google Patents
Heat radiation and heat conduction structure of solid chip Download PDFInfo
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- CN211578384U CN211578384U CN202020483376.3U CN202020483376U CN211578384U CN 211578384 U CN211578384 U CN 211578384U CN 202020483376 U CN202020483376 U CN 202020483376U CN 211578384 U CN211578384 U CN 211578384U
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- dust cover
- solid state
- hard disk
- cover
- solid
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Abstract
The utility model discloses a heat dissipation heat conduction structure of solid state chip, including hard disk casing, solid state hard drive subassembly, the left side of hard disk casing inner chamber is provided with solid state hard drive subassembly, and the mounting bracket has been cup jointed at solid state hard drive subassembly's middle part, and the middle part on solid state hard drive subassembly right side is provided with the dust cover, and the middle part on dust cover right side is provided with the potsherd, and the venthole of its outside of intercommunication and inner chamber is seted up to the middle part symmetry of dust cover top and bottom, and the inlet port of its outside of intercommunication and inner chamber is. A heat dissipation heat conduction structure of solid state chip, dredge the heat that solid state hard drive subassembly during operation produced through the potsherd that sets up, circulate with the rotatory air current that drives of flabellum simultaneously, dispel the heat to the potsherd to the wind of circulation passes through the inside that the inlet port got into the dust cover, flows by the venthole, takes away the heat of solid state hard drive subassembly, reaches high-efficient radiating effect.
Description
Technical Field
The utility model relates to a solid state disk field, in particular to heat dissipation heat conduction structure of solid state chip.
Background
Some current solid state hard disk devices adopt fan heat dissipation, but the fan usually can bring outside dust into in the casing, if these dust directly fall on the hard disk can cause the dust on inside solid state chip surface to be difficult to wash, long-term accumulation can cause the performance of hard disk to descend, people usually can adopt and embolia some protective sheaths on the hard disk, but because the protective sheath is too sealed with the hard disk, can cause the heat dissipation badly, consequently need a hard disk equipment that both can realize high-efficient heat dissipation and can be dirt-proof now urgently.
SUMMERY OF THE UTILITY MODEL
A primary object of the present invention is to provide a heat dissipation and conduction structure for solid-state chip, which can effectively solve the problems of the background art.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
a heat dissipation and heat conduction structure of a solid chip comprises a hard disk shell and a solid hard disk assembly, wherein the solid hard disk assembly is arranged on the left side of an inner cavity of the hard disk shell, a mounting frame is sleeved in the middle of the solid hard disk assembly, a dust cover is arranged in the middle of the right side of the solid hard disk assembly, a ceramic sheet is arranged in the middle of the right side of the dust cover, air outlet holes communicated with the outside and the inner cavity of the dust cover are symmetrically formed in the middle of the top and the bottom of the dust cover, air inlet holes communicated with the outside and the inner cavity of the dust cover are symmetrically formed in the top and the bottom of the dust cover, a driving motor is arranged on the right side of the inner cavity of the hard disk shell, a fan blade is fixedly installed at one end of the left side of the driving motor, a fixing sleeve is sleeved, the middle part of the rubber column is sleeved with a damping spring, and the center of the right side of the hard disk shell is provided with an air hole communicated with the outside and the inner cavity of the hard disk shell.
Preferably, the solid state hard disk assembly comprises a circuit board and a solid state chip, the solid state chip is fixedly mounted in the center of the right side of the circuit board, the circuit board is closely attached to and fixedly connected with the wall body of the mounting frame, and the top and the bottom of the left side of the mounting frame are fixedly mounted on the inner wall of the left side of the hard disk shell.
Preferably, the inner cavity of the dust cover is communicated with the outside from the center of the left side of the dust cover, the dust cover is sleeved outside the solid chip from an opening of the left side of the dust cover, and the outer wall of the left side of the dust cover is fixedly installed on the outer wall of the right side of the circuit board.
Preferably, the one end that the ceramic wafer is close to the dust cover runs through the outer wall of dust cover and extends to the inside of dust cover, the ceramic wafer closely pastes and fixed connection with the wall body of dust cover, the solid-state chip of the left one end laminating of ceramic wafer.
Preferably, driving motor and the wall body of fixed cover closely laminate and fixed connection, the one end fixed mounting that fixed cover was kept away from to the gluey post is on the wall body of supporting the cover inner circle, damping spring's one end fixed mounting is on the wall body of fixed cover outer lane, and damping spring's other end fixed mounting is on the wall body of supporting the cover inner circle, support the wall body closely laminate and fixed connection of cover and mount, the top and the bottom fixed mounting on mount right side are on the inner wall on hard disk casing right side.
Preferably, the inner chamber fixed mounting of venthole has first dust screen, the inner chamber fixed mounting of inlet port has the second dust screen, the inner chamber fixed mounting of bleeder vent has the third dust screen.
Compared with the prior art, the utility model discloses following beneficial effect has:
the utility model discloses in, the heat that produces the solid state hard drive subassembly during operation through the potsherd that sets up is dredged, simultaneously with the rotatory drive air current circulation of flabellum, dispel the heat to the potsherd, and the wind of circulation passes through the inside that the inlet port got into the dust cover, flow by the venthole, take away the heat of solid state hard drive subassembly, reach high-efficient radiating effect, gas pocket department all is provided with the dust screen simultaneously, pile up the dust when avoiding the heat dissipation of solid state hard drive subassembly, provide strong support for reducing the temperature of solid state hard drive subassembly, fixed cover through the setting, glue the post, damping spring, support the cooperation work of cover, form buffer area, absorb the vibrations that pulling driving motor produced when the flabellum is rotatory, improve radiating stability.
Drawings
Fig. 1 is a schematic structural diagram of the present invention;
FIG. 2 is an enlarged view of the present invention at A in FIG. 1;
fig. 3 is an enlarged view of the present invention at B in fig. 1.
In the figure: 1. a hard disk housing; 2. a solid state disk assembly; 3. a mounting frame; 4. a dust cover; 5. a ceramic plate; 6. an air outlet; 7. an air inlet; 8. a drive motor; 9. a fan blade; 10. fixing a sleeve; 11. glue columns; 12. a damping spring; 13. a support sleeve; 14. a fixed mount; 15. and (4) air holes.
Detailed Description
In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.
In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "front end", "rear end", "both ends", "one end", "the other end" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element to which the reference is made must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "disposed," "connected," and the like are to be construed broadly, and for example, "connected" may be either fixedly connected or detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
As shown in FIGS. 1-3, a heat dissipation and heat conduction structure of a solid state chip comprises a hard disk casing 1 and a solid state disk assembly 2, wherein the solid state disk assembly 2 is arranged on the left side of the inner cavity of the hard disk casing 1, a mounting frame 3 is sleeved in the middle of the solid state disk assembly 2, the solid state disk assembly 2 comprises a circuit board and the solid state chip, the solid state chip is fixedly arranged in the center of the right side of the circuit board, the circuit board is closely attached to and fixedly connected with the wall body of the mounting frame 3, the top and the bottom of the left side of the mounting frame 3 are fixedly arranged on the inner wall of the left side of the hard disk casing 1, a dust cover 4 is arranged in the middle of the right side of the solid state disk assembly 2, a ceramic chip 5 is arranged in the middle of the right side of the dust cover, the right side of 1 inner chamber of hard disk casing is provided with driving motor 8, the left one end fixed mounting of driving motor 8 has flabellum 9, fixed cover 10 has been cup jointed at driving motor 8's middle part, the middle part of fixed cover 10 has been cup jointed and has supported cover 13, the middle part of supporting cover 13 has been cup jointed and has been fixed frame 14, the left and right sides symmetry fixedly connected with of fixed cover 10 top and bottom glues post 11, damping spring 12 has been cup jointed at the middle part of gluing post 11, the bleeder vent 15 of its outside of intercommunication and inner chamber is seted up in the centre on hard disk casing 1.
The inner cavity of the dust cover 4 is communicated with the outside from the center of the left side of the dust cover, the dust cover 4 is sleeved outside the solid chip from the opening of the left side of the dust cover, the outer wall of the left side of the dust cover 4 is fixedly arranged on the outer wall of the right side of the circuit board, one end of the ceramic chip 5 close to the dust cover 4 penetrates through the outer wall of the dust cover 4 and extends into the dust cover 4, the ceramic chip 5 is closely attached and fixedly connected with the wall body of the dust cover 4, one end of the left side of the ceramic chip 5 is attached to the solid chip, the driving motor 8 is closely attached and fixedly connected with the wall body of the fixed sleeve 10, one end of the rubber column 11 far away from the fixed sleeve 10 is fixedly arranged on the wall body of the inner ring of the support sleeve 13, one end of the damping spring 12 is fixedly arranged on the, the top and the bottom on mount 14 right side are fixed mounting on the inner wall on hard disk casing 1 right side, and the inner chamber fixed mounting of venthole 6 has first dust screen, and the inner chamber fixed mounting of inlet port 7 has the second dust screen, and the inner chamber fixed mounting of bleeder vent 15 has the third dust screen.
It should be noted that the utility model is a heat dissipation and heat conduction structure of solid chip, when in use, the ceramic sheet 5 is used for dredging the heat generated by the solid hard disk component 2 during working, and the rotation of the fan blades 9 drives the airflow to circulate, the ceramic chip 5 is radiated, and the circulating air enters the dust cover 4 through the air inlet 7 and flows out of the air outlet 6 to take away the heat of the solid hard disk component 2, so as to achieve the effect of high-efficiency heat radiation, meanwhile, dust screens are arranged at the air holes, dust accumulation during heat dissipation of the solid state disk assembly 2 is avoided, powerful support is provided for reducing the temperature of the solid state disk assembly 2, through the cooperation of the fixed sleeve 10, the rubber column 11, the damping spring 12 and the supporting sleeve 13, a buffer area is formed, the vibration generated by pulling the driving motor 8 when the fan blades 9 rotate is absorbed, and the stability of heat dissipation is improved.
The basic principles and the main features of the invention and the advantages of the invention have been shown and described above. It will be understood by those skilled in the art that the present invention is not limited to the above embodiments, and that the foregoing embodiments and descriptions are provided only to illustrate the principles of the present invention without departing from the spirit and scope of the present invention. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (6)
1. The utility model provides a heat dissipation heat conduction structure of solid state chip, includes hard disk casing (1), solid state hard drive subassembly (2), its characterized in that: the hard disk drive comprises a hard disk shell (1), and is characterized in that a solid hard disk component (2) is arranged on the left side of an inner cavity of the hard disk shell (1), a mounting frame (3) is sleeved at the middle part of the solid hard disk component (2), a dust cover (4) is arranged at the middle part of the right side of the solid hard disk component (2), a ceramic plate (5) is arranged at the middle part of the right side of the dust cover (4), air outlet holes (6) communicating the outside of the dust cover with the inner cavity are symmetrically formed in the middle parts of the top and the bottom of the dust cover (4), air inlet holes (7) communicating the outside of the dust cover with the inner cavity are symmetrically formed in the top and the bottom of the right side of the dust cover (4), a driving motor (8) is arranged on the right side of the inner cavity of the hard disk shell (1, support the middle part of cover (13) and cup jointed mount (14), fixed cover (10) top and the left and right sides symmetry fixedly connected with of bottom glue post (11), damping spring (12) have been cup jointed at the middle part of gluing post (11), bleeder vent (15) of its outside of intercommunication and inner chamber are seted up to the centre on hard disk casing (1) right side.
2. The heat dissipating and conducting structure of a solid state chip of claim 1, wherein: solid state hard disk subassembly (2) include circuit board and solid-state chip, and solid-state chip fixed mounting is in the centre on circuit board right side, and the wall body close-fitting of circuit board and mounting bracket (3) is fixed connection, and the left top of mounting bracket (3) and bottom fixed mounting are on the left inner wall of hard disk casing (1).
3. The heat dissipating and conducting structure of a solid state chip of claim 1, wherein: the inner cavity of the dust cover (4) is communicated with the outside from the center of the left side of the dust cover, the dust cover (4) is sleeved outside the solid chip through an opening on the left side of the dust cover, and the outer wall on the left side of the dust cover (4) is fixedly installed on the outer wall on the right side of the circuit board.
4. The heat dissipating and conducting structure of a solid state chip of claim 1, wherein: the one end that ceramic wafer (5) are close to dust cover (4) runs through the outer wall of dust cover (4) and extends to the inside of dust cover (4), the close laminating of wall body of ceramic wafer (5) and dust cover (4) and fixed connection, the solid-state chip of the left one end laminating of ceramic wafer (5).
5. The heat dissipating and conducting structure of a solid state chip of claim 1, wherein: driving motor (8) and the close laminating of the wall body of fixed cover (10) and fixed connection, glue one end fixed mounting that fixed cover (10) was kept away from in post (11) and on the wall body of supporting cover (13) inner circle, the one end fixed mounting of damping spring (12) is on the wall body of fixed cover (10) outer lane, and the fixed mounting of the other end of damping spring (12) is on the wall body of supporting cover (13) inner circle, support the close laminating of wall body of cover (13) and mount (14) and fixed connection, top and bottom fixed mounting on mount (14) right side are on the inner wall on hard disk casing (1) right side.
6. The heat dissipating and conducting structure of a solid state chip of claim 1, wherein: the inner chamber fixed mounting of venthole (6) has first dust screen, the inner chamber fixed mounting of inlet port (7) has the second dust screen, the inner chamber fixed mounting of bleeder vent (15) has the third dust screen.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020483376.3U CN211578384U (en) | 2020-04-03 | 2020-04-03 | Heat radiation and heat conduction structure of solid chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020483376.3U CN211578384U (en) | 2020-04-03 | 2020-04-03 | Heat radiation and heat conduction structure of solid chip |
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| Publication Number | Publication Date |
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| CN211578384U true CN211578384U (en) | 2020-09-25 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202020483376.3U Active CN211578384U (en) | 2020-04-03 | 2020-04-03 | Heat radiation and heat conduction structure of solid chip |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115547374A (en) * | 2022-11-08 | 2022-12-30 | 深圳泰思特半导体有限公司 | Dampproofing solid state hard drives of high-efficient heat dissipation |
-
2020
- 2020-04-03 CN CN202020483376.3U patent/CN211578384U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115547374A (en) * | 2022-11-08 | 2022-12-30 | 深圳泰思特半导体有限公司 | Dampproofing solid state hard drives of high-efficient heat dissipation |
| CN115547374B (en) * | 2022-11-08 | 2024-05-17 | 深圳泰思特半导体有限公司 | Dampproofing solid state hard disk of high-efficient heat dissipation |
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