CN211566357U - Negative pressure forming die tectorial membrane device - Google Patents
Negative pressure forming die tectorial membrane device Download PDFInfo
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- CN211566357U CN211566357U CN201922006716.3U CN201922006716U CN211566357U CN 211566357 U CN211566357 U CN 211566357U CN 201922006716 U CN201922006716 U CN 201922006716U CN 211566357 U CN211566357 U CN 211566357U
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Abstract
The utility model discloses a negative pressure forming die film covering device, which comprises a film covering platform, wherein a supporting surface for supporting a die is arranged on the film covering platform, the film covering platform is of a hollow structure in which a first gas circuit is arranged, and the film covering platform also comprises a first exhaust pipe connected with the first gas circuit; still be provided with a plurality of first absorption holes on the tectorial membrane platform, first absorption hole is: one end of the first air channel is connected with the first air channel, and the orifice at the other end of the first air channel is positioned on the supporting surface; the orifices are arranged on the supporting surface at intervals, and the area of the supporting surface for supporting the die is positioned in the distribution area of the orifices on the supporting surface. The structural design of the device can achieve the purpose of improving the film covering quality.
Description
Technical Field
The utility model relates to a kiln brick manufacturing technical field based on casting especially relates to a negative pressure forming die tectorial membrane device.
Background
The vacuum negative pressure molding process is a technology for molding by sealing and pumping negative pressure of dry sand and plastic films without using a binder, water and other additives, and has the advantages of precise casting size, clear outline, energy conservation, environmental protection and the like. And the process is praised as the casting technology of the twenty-first century and the green revolution of the casting industry by the casting world at home and abroad. However, the casting technology of metal materials such as cast iron and the like and the casting refractory material technology have obvious differences in material composition, temperature and the like, so that a plurality of problems still need to be solved when the vacuum negative pressure forming process is applied to the casting refractory material industry.
In vacuum negative pressure forming, the application of the coating (wrapping on the mold) can have specific effects, such as: in the sand box, the tectorial membrane of parcel in the mould outside can make the molding sand be difficult to the problem of collapsing after the shaping: after the mould is pulled out, the stability of the sand mould can be kept, and the production efficiency and the product percent of pass are facilitated; after the film is coated, the wall surface of the molding sand of the cavity can have higher surface finish, which is beneficial to the product quality.
The wrapping condition of the film directly affects the production efficiency and the product quality of the final product, and the film wrapping process is further optimized to be beneficial to the final product quality, which is a technical problem to be solved urgently by technical personnel in the field.
SUMMERY OF THE UTILITY MODEL
The parcel condition direct influence production efficiency and the product quality of final product to the tectorial membrane that above-mentioned provided, further optimize tectorial membrane parcel process to do benefit to final product quality, be the technical problem that technical staff in the field awaits treatment urgently, the utility model provides a negative pressure forming die tectorial membrane device, the structural design of this device can reach the purpose that promotes the tectorial membrane quality.
The utility model provides a pair of negative pressure forming die tectorial membrane device comes the problem of solution through following technical essential: a negative pressure forming die film covering device comprises a film covering platform, wherein a supporting surface for supporting a die is arranged on the film covering platform, the film covering platform is of a hollow structure, a first air path is arranged in the film covering platform, and the film covering platform further comprises a first exhaust pipe connected with the first air path;
still be provided with a plurality of first absorption holes on the tectorial membrane platform, first absorption hole is: one end of the first air channel is connected with the first air channel, and the orifice at the other end of the first air channel is positioned on the supporting surface;
the orifices are arranged on the supporting surface at intervals, and the area of the supporting surface for supporting the die is positioned in the distribution area of the orifices on the supporting surface.
This scheme aims at promoting tectorial membrane quality of tectorial membrane device: the first exhaust pipe that sets up is used for linking to each other with negative pressure equipment, if connect the draught fan, at the draught fan during operation, through first exhaust pipe, first gas circuit make and be located first absorption hole on the holding surface obtains the suction. Therefore, through the suction force, after the film to be covered on the mold is laid on the supporting surface and is used for supporting the area of the mold, the film can be tightly attached to the supporting surface under the action of the suction force, and then the mold is placed on the film covering platform, so that at least one side of the mold is tightly attached to the film. Then, the induced draft fan stops working, and after the pressure of the first air path and the external atmosphere is equalized, the film is adsorbed on the supporting surface, and then the film can be uncovered in other areas of the film, so that the film covering of the other areas of the film on the corresponding area of the die is completed.
By adopting the scheme, the film is fixed relative to the supporting surface under the action of the first adsorption holes before the film is contacted with the die, so that the film which is firstly contacted with the die is contacted with the die in a flat state, and the aim of facilitating the film coating quality of the film can be fulfilled; then, the local part of the film which is contacted with the die is used as the basis for positioning the film on the die, and the part of the film is pressed and held below the die at the moment, and the film covering of other areas of the die can be completed by lifting other areas of the film.
When the device is used specifically, a scheme that a fourth adsorption hole is arranged on the die can be adopted: the film is attached to the mold by suction force from the fourth suction hole.
The further technical scheme is as follows:
for the structural feature who adapts to current kiln brick mould for tectorial membrane platform has bigger area of contact with the mould side, sets up to: the supporting surface is a step surface with a step, and the supporting surfaces at different gradients are provided with the orifices.
In order to enable a single aperture to produce a larger suction area while avoiding damage to the membrane under suction, provision is made for: the orifice is in a shape of a screen plate.
As described above, because the completion of the attachment of the film on the mold itself requires a certain time, in order to make the film for the film be prepared in advance, to reduce the film covering platform idle time, do benefit to the promotion tectorial membrane efficiency, set up to: still including spreading platform and transport frame in advance, spread the tiling that the platform is used for accomplishing the film in advance, the transport frame is used for transporting the film of spreading the bench tiling in advance to the tectorial membrane platform. When the scheme is used, the film attached to the die is firstly paved on the pre-paving table, and then the film paved on the pre-paving table is transferred to the film laminating platform through the transfer frame, namely the pre-paving table is used for realizing film flattening preparation.
In the prior art, corresponding film raw materials are generally in rolls, and for improving film preparation efficiency and accurately obtaining films with required shapes and sizes, the film preparation method comprises the following steps: the film cutting device is used for cutting off the film, and the obtained film sheet is used for being paved on the pre-paving table. The film cutting device of the scheme can adopt a cutter with a linear notch, a stretched electric heating wire and the like.
In order to realize the flattening of the film on the pre-laying platform, the device is as follows: the pre-paving table is of a hollow structure with a second air path arranged therein, and also comprises a second air exhaust pipe connected with the second air path;
the pre-paving table is also provided with a plurality of second adsorption holes, and the second adsorption holes are: one end of the second gas path is connected with the second gas path, and the orifice at the other end is positioned on the pre-laying plane of the pre-laying platform;
and the orifices of the second adsorption holes are arranged on the pre-laying plane at intervals, and the distribution area of the orifices on the pre-laying plane is positioned in the coverage area of the film on the pre-laying plane. In this scheme, the theory of operation of second exhaust tube, second gas circuit, second adsorption hole is the same with the theory of operation of above first exhaust tube, first gas circuit, first adsorption hole: and under corresponding negative pressure equipment, the second adsorption hole generates adsorption force acting on the film, and the pre-laying platform is used for restraining the film through the adsorption force.
As a concrete implementation mode of the transfer rack, the transfer rack is provided with the following steps: the transfer frame comprises a frame body with a rectangular frame-shaped bottom surface, the frame body is of a hollow structure with a third air path arranged therein, and the transfer frame further comprises a third air exhaust pipe connected with the third air path;
still be provided with a plurality of third adsorption holes on the transport frame, the third adsorption hole is: one end of the first air channel is connected with the first air channel, and the orifice at the other end of the first air channel is positioned on the bottom surface;
and the orifices of the third adsorption holes are arranged on the bottom surface at intervals, and the orifices of the third adsorption holes are arranged along the circumferential direction of the frame body in the rectangular frame shape. In this scheme, the theory of operation of third exhaust tube, third gas circuit, third adsorption hole is the same with the theory of operation of above first exhaust tube, first gas circuit, first adsorption hole: and under corresponding negative pressure equipment, the third adsorption hole generates adsorption force acting on the film, and the pre-laying platform is used for restraining the film through the adsorption force. After the film is released by the pre-laying platform, the flattened film is adsorbed by the transfer frame, the position of the film is transferred by the transfer frame and is transferred to the film coating platform, then the film is released by the transfer frame, and the film is constrained on the film coating platform under the action of the first adsorption holes.
Be different from above tectorial membrane platform and shop's platform in advance, because the position transfer process exists in the frame of transporting, so preferentially set up to transport that the frame quality is littleer, specifically, set up to: the frame body is formed by welding the rectangular pipes, the bottom of the frame body is also provided with an annular hole extending along the circumferential direction of the frame body, and the annular hole is communicated with the inner hole of the rectangular pipe;
still including inlay in inlay the strip in the annular hole, the third adsorbs the hole setting to be in on the inlay the strip, inlay the strip and enclose into annular mosaic structure. In the scheme, after the third adsorption hole is manufactured, that is, the inlaid strip with the third adsorption hole is manufactured separately, for example, the inlaid strip is installed in the annular hole by welding, bonding and other methods. For the third adsorption hole is directly formed in the rectangular tube, if the influence of material selection on the service life of the third adsorption hole is considered, the material selection of the rectangular tube mainly considers cost, rigidity, weight and the like, and the structure or the size stability and the bottom surface smoothness of the third adsorption hole are considered by the inlaid strip. When the process is adjusted, the inlaid strip is replaced. When concrete application, can adopt the template if the shrouding of shop's platform top side in advance, when the mould is wooden structure, the tectorial membrane platform can also adopt the template as top side shrouding, inlays the strip and adopts the template, adopts this scheme promptly, corresponding absorption hole all set up on the plank can.
Be different from the film and adsorbed on the tectorial membrane platform and spread the platform in advance, when the film is adsorbed on the top side of tectorial membrane platform and spread the platform in advance, the film need be adsorbed in the bottom side of transporting the frame, for making the film can be more stable realize transporting through transporting the frame, set up to: the surface of the inlaid strip is concave relative to the bottom surface of the frame body. This scheme is when realizing spreading the bench film in advance and adsorbing, and the edge of film has ascending tensile process at the frame absorption film of transporting, this moment, like the film tiling on the tectorial membrane platform, owing to have the ladder that is brought for the bottom surface indent of support body by the surface of inlaying strip, the frame of transporting this moment has taut film action, can make the film can be by the tensioning on the frame of transporting, avoids the effort of film between transportation and air to lead to film fold, dislocation etc..
For avoiding the corner on the transport rack to lead to the film to break, set up as: and on the frame body, the corner of the frame body, which is positioned at the bottom side of the frame body and is used as the inner side edge of the annular hole, is an arc-shaped chamfer.
Preferably, the orifices of the second adsorption hole, the third adsorption hole and the fourth adsorption hole are all in the shape of a net plate consistent with the orifice of the first adsorption hole.
The utility model discloses following beneficial effect has:
this scheme aims at promoting tectorial membrane quality of tectorial membrane device: the first exhaust pipe that sets up is used for linking to each other with negative pressure equipment, if connect the draught fan, at the draught fan during operation, through first exhaust pipe, first gas circuit make and be located first absorption hole on the holding surface obtains the suction. Therefore, through the suction force, after the film to be covered on the mold is laid on the supporting surface and is used for supporting the area of the mold, the film can be tightly attached to the supporting surface under the action of the suction force, and then the mold is placed on the film covering platform, so that at least one side of the mold is tightly attached to the film. Then, the induced draft fan stops working, and after the pressure of the first air path and the external atmosphere is equalized, the film is adsorbed on the supporting surface, and then the film can be uncovered in other areas of the film, so that the film covering of the other areas of the film on the corresponding area of the die is completed.
By adopting the scheme, the film is fixed relative to the supporting surface under the action of the first adsorption holes before the film is contacted with the die, so that the film which is firstly contacted with the die is contacted with the die in a flat state, and the aim of facilitating the film coating quality of the film can be fulfilled; then, the local part of the film which is contacted with the die is used as the basis for positioning the film on the die, and the part of the film is pressed and held below the die at the moment, and the film covering of other areas of the die can be completed by lifting other areas of the film.
Drawings
Fig. 1 is a schematic structural view of an embodiment of a vacuum forming die film covering device according to the present invention, which is used for showing a top view structure of a film covering platform;
fig. 2 is a schematic structural view of an embodiment of a vacuum forming die film covering device according to the present invention, which is used for showing a front sectional structure of a film covering platform;
fig. 3 is a schematic structural view of a specific embodiment of a negative pressure forming die film covering device according to the present invention, which is used for showing the overlooking structure of the film covering platform, the pre-laying platform and the transfer frame;
FIG. 4 is a partial bottom view of portion A of FIG. 3;
fig. 5 is a schematic structural diagram of an embodiment of a vacuum forming die film covering device according to the present invention, which is used for showing a structure of a first adsorption hole orifice.
The reference numbers in the figures are in order: 1. tectorial membrane platform, 2, first absorption hole, 3, step face, 4, first exhaust tube, 5, pre-paving platform, 6, transport frame, 7, inlay strip, 8, first gas circuit.
Detailed Description
The present invention will be described in further detail with reference to the following examples, but the present invention is not limited to the following examples.
Example 1:
as shown in fig. 1 to 5, a negative pressure forming die film covering device includes a film covering platform 1, a supporting surface for supporting a die is provided on the film covering platform 1, the film covering platform 1 is a hollow structure in which a first air path 8 is provided, and further includes a first air suction pipe 4 connected to the first air path 8;
still be provided with a plurality of first adsorption holes 2 on the tectorial membrane platform 1, first adsorption hole 2 is: one end is connected with the first air path 8, and the orifice of the other end is positioned on the supporting surface;
the orifices are arranged on the supporting surface at intervals, and the area of the supporting surface for supporting the die is positioned in the distribution area of the orifices on the supporting surface.
This scheme aims at promoting tectorial membrane quality of tectorial membrane device: the first exhaust pipe 4 that sets up is used for linking to each other with negative pressure equipment, if connect the draught fan, at the draught fan during operation, through first exhaust pipe 4, first gas circuit 8 make and be located first absorption hole 2 on the holding surface obtains the suction. Thus, through the suction force, after the film to be covered on the mold is laid on the supporting surface and is used for supporting the area of the mold, the film can be tightly attached to the supporting surface under the action of the suction force, and then the mold is placed on the film covering platform 1, so that at least one side of the mold is tightly attached to the film. Then, the induced draft fan stops working, and after the pressure of the first air path 8 and the external atmosphere is equalized, the relation that the film is adsorbed on the supporting surface is removed, so that other areas of the film can be uncovered, and the film covering of the other areas of the film on the corresponding area of the die is completed.
By adopting the scheme, the film is fixed relative to the supporting surface under the action of the first adsorption holes 2 before the film is contacted with the die, so that the film which is firstly contacted with the die is contacted with the die in a flat state, and the aim of facilitating the film coating quality of the film can be fulfilled; then, the local part of the film which is contacted with the die is used as the basis for positioning the film on the die, and the part of the film is pressed and held below the die at the moment, and the film covering of other areas of the die can be completed by lifting other areas of the film.
When the device is used specifically, a scheme that a fourth adsorption hole is arranged on the die can be adopted: the film is attached to the mold by suction force from the fourth suction hole.
Example 2:
as shown in fig. 1 to 5, the present embodiment is further detailed based on embodiment 1:
for the structural feature who adapts to current kiln brick mould for tectorial membrane platform 1 has bigger area of contact with the mould side, sets up to: the supporting surface is a step surface 3 with a step, and the supporting surfaces at different gradients are provided with the orifices.
In order to enable a single aperture to produce a larger suction area while avoiding damage to the membrane under suction, provision is made for: the orifice is in a shape of a screen plate.
As described above, because the completion of the attachment of the film on the mold itself requires a certain time, in order to make the film for the film be prepared in advance, to reduce the idle time of the film laminating platform 1, it is favorable to promoting the film laminating efficiency, and the setting is: still including spreading the platform 5 in advance and transporting frame 6, spread the tiling that the platform 5 is used for accomplishing the film in advance, transport frame 6 is used for transporting the film that spreads the on the platform 5 in advance to tectorial membrane platform 1. When the film laminating machine is applied, a film attached to a mold is firstly paved on the pre-paving table 5, and then the film paved on the pre-paving table 5 is transferred to the film laminating platform 1 through the transfer frame 6, namely the pre-paving table 5 is used for realizing film flattening preparation.
In the prior art, corresponding film raw materials are generally in rolls, and for improving film preparation efficiency and accurately obtaining films with required shapes and sizes, the film preparation method comprises the following steps: the film cutting device is used for cutting the film, and the obtained film sheet is used for being laid on the pre-laying platform 5. The film cutting device of the scheme can adopt a cutter with a linear notch, a stretched electric heating wire and the like.
In order to realize the flattening of the film on the pre-laying platform 5, the arrangement is as follows: the pre-paving table 5 is of a hollow structure, a second air path is arranged in the pre-paving table, and the pre-paving table further comprises a second air exhaust pipe connected with the second air path;
still be provided with a plurality of second adsorption holes on the pre-paved table 5, the second adsorption hole is: one end of the gas pipe is connected with the second gas circuit, and the orifice at the other end is positioned on the pre-laying plane of the pre-laying platform 5;
and the orifices of the second adsorption holes are arranged on the pre-laying plane at intervals, and the distribution area of the orifices on the pre-laying plane is positioned in the coverage area of the film on the pre-laying plane. In this scheme, the theory of operation of second exhaust tube, second gas circuit, second adsorption hole is the same with the theory of operation of above first exhaust tube 4, first gas circuit 8, first adsorption hole 2: under the corresponding negative pressure equipment, the second adsorption hole generates adsorption force acting on the film, and the pre-paving table 5 restrains the film through the adsorption force.
As a specific implementation manner of the transfer rack 6, the following are provided: the transfer frame 6 comprises a frame body with a rectangular frame-shaped bottom surface, the frame body is of a hollow structure with a third air path arranged therein, and the transfer frame further comprises a third air exhaust pipe connected with the third air path;
still be provided with a plurality of third adsorption holes on the transport frame 6, the third adsorption hole is: one end of the first air channel is connected with the first air channel, and the orifice at the other end of the first air channel is positioned on the bottom surface;
and the orifices of the third adsorption holes are arranged on the bottom surface at intervals, and the orifices of the third adsorption holes are arranged along the circumferential direction of the frame body in the rectangular frame shape. In this scheme, the theory of operation of third exhaust tube, third gas circuit, third adsorption hole is the same with the theory of operation of above first exhaust tube 4, first gas circuit 8, first adsorption hole 2: under the corresponding negative pressure equipment, the third adsorption hole generates adsorption force acting on the film, and the pre-laying platform 5 restrains the film through the adsorption force. Namely, after the film is released from the pre-laying platform 5, the flattened film is adsorbed by the transfer frame 6, the position of the film is transferred by the transfer frame 6 and transferred to the film coating platform 1, then the film is released by the transfer frame 6, and the film is constrained on the film coating platform 1 under the action of the first adsorption holes 2.
Be different from above tectorial membrane platform 1 and pre-spread platform 5, because transfer frame 6 has the position transfer process, so preferentially set up to transfer frame 6 quality littleer, specifically, set up to: the frame body is formed by welding the rectangular pipes, the bottom of the frame body is also provided with an annular hole extending along the circumferential direction of the frame body, and the annular hole is communicated with the inner hole of the rectangular pipe;
still including inlay in inlay strip 7 in the annular hole, the third adsorbs the hole setting to be in on the inlay strip 7, inlay strip 7 encloses into annular mosaic structure. In this embodiment, after the third suction hole is formed, that is, the inlaid strip 7 having the third suction hole is separately manufactured, for example, by welding or bonding, the inlaid strip 7 is mounted in the annular hole. For the third adsorption hole directly formed in the rectangular tube, if the influence of material selection on the service life of the third adsorption hole is considered, the rectangular tube material selection mainly considers cost, rigidity, weight and the like, and the inlaid strip 7 considers the structure or dimensional stability and bottom surface flatness of the third adsorption hole. When the process is adjusted, the mosaic strip 7 is replaced. When concrete application, can adopt the template if the shrouding on 5 top sides of pre-paving platform, when the mould was wooden structure, tectorial membrane platform 1 can also adopt the template as top side shrouding, inlays 7 adoption templates, adopts this scheme promptly, and corresponding absorption hole all set up on the plank can.
Be different from the film and adsorbed on tectorial membrane platform 1 and pre-spread platform 5, when the top side of platform 5 is spread in tectorial membrane platform 1 and pre-spread to the film adsorbed, the film need be adsorbed in the bottom side of transporting frame 6, for making the film can be more stable realize transporting through transporting frame 6, set up as: the surface of the inlaid strip 7 is concave relative to the bottom surface of the shelf body. This scheme is when realizing that the film adsorbs on the pre-paved table 5, and the edge of film has ascending tensile process at transport frame 6 absorption film, this moment, like the film tiling on tectorial membrane platform 1, owing to have the ladder that is brought for the bottom surface indent of support body by the surface of inlaying strip 7, transport frame 6 has taut film action this moment, can make the film can be by the tensioning on transport frame 6, avoid the film in the transportation and the effort between the air to lead to the film fold, dislocation etc..
To avoid corners on the transfer frame 6 causing the film to break, the arrangement is: and on the frame body, the corner of the frame body, which is positioned at the bottom side of the frame body and is used as the inner side edge of the annular hole, is an arc-shaped chamfer.
The orifices of the second adsorption hole, the third adsorption hole and the fourth adsorption hole are preferably in the shape of a net plate consistent with the orifice of the first adsorption hole 2.
The foregoing is a more detailed description of the present invention, taken in conjunction with the specific preferred embodiments thereof, and it is not intended that the invention be limited to the specific embodiments thereof. To the utility model belongs to the technical field of the ordinary skilled person say, do not deviate from the utility model discloses a other embodiments that reach under the technical scheme all should be contained the utility model discloses a within the scope of protection.
Claims (10)
1. A negative pressure forming die film covering device comprises a film covering platform (1), wherein a supporting surface for supporting a die is arranged on the film covering platform (1), and the negative pressure forming die film covering device is characterized in that the film covering platform (1) is of a hollow structure in which a first air path (8) is arranged, and the negative pressure forming die film covering device also comprises a first exhaust pipe (4) connected with the first air path (8);
still be provided with a plurality of first adsorption holes (2) on tectorial membrane platform (1), first adsorption hole (2) are: one end of the first air channel is connected with the first air channel (8), and the orifice of the other end of the first air channel is positioned on the supporting surface;
the orifices are arranged on the supporting surface at intervals, and the area of the supporting surface for supporting the die is positioned in the distribution area of the orifices on the supporting surface.
2. A negative pressure forming die membrane covering device according to claim 1, wherein the supporting surface is a step surface (3) having a step, and the supporting surfaces at different gradients have the opening.
3. The negative pressure forming die membrane covering device according to claim 1, wherein the orifice is in a shape of a net plate.
4. The negative pressure forming die film covering device according to claim 1, further comprising a pre-laying table (5) and a transfer frame (6), wherein the pre-laying table (5) is used for completing the laying of the thin film, and the transfer frame (6) is used for transferring the thin film laid on the pre-laying table (5) onto the film covering platform (1).
5. A negative pressure forming die membrane covering device according to claim 4, characterized by further comprising a membrane cutting device arranged on the side of the pre-laying table (5), wherein the membrane cutting device is used for cutting the membrane, and the obtained membrane is used for laying on the pre-laying table (5).
6. The negative pressure forming die film covering device according to claim 4, wherein the pre-laying table (5) is a hollow structure provided with a second air path therein, and further comprises a second air suction pipe connected with the second air path;
still be provided with a plurality of second adsorption holes on the platform (5) of paving in advance, the second adsorbs the hole and is: one end of the gas pipe is connected with the second gas circuit, and the orifice at the other end is positioned on the pre-laying plane of the pre-laying platform (5);
and the orifices of the second adsorption holes are arranged on the pre-laying plane at intervals, and the distribution area of the orifices on the pre-laying plane is positioned in the coverage area of the film on the pre-laying plane.
7. The negative pressure forming die film covering device according to claim 4, wherein the transfer frame (6) comprises a frame body with a rectangular frame-shaped bottom surface, the frame body is a hollow structure with a third air path arranged therein, and the transfer frame further comprises a third air suction pipe connected with the third air path;
still be provided with a plurality of third adsorption holes on transport frame (6), the third adsorption hole is: one end of the first air channel is connected with the first air channel, and the orifice at the other end of the first air channel is positioned on the bottom surface;
and the orifices of the third adsorption holes are arranged on the bottom surface at intervals, and the orifices of the third adsorption holes are arranged along the circumferential direction of the frame body in the rectangular frame shape.
8. The negative pressure forming die film covering device according to claim 7, wherein the frame body is formed by welding a rectangular tube, and the bottom of the frame body is further provided with an annular hole extending along the circumferential direction of the frame body, and the annular hole is communicated with an inner hole of the rectangular tube;
still including inlay in inlay strip (7) in the annular hole, the third adsorbs the hole setting to be in on the inlay strip (7), inlay strip (7) enclose into annular mosaic structure.
9. A negative pressure forming die membrane covering device according to claim 8, characterized in that the surface of the mosaic strip (7) is concave relative to the bottom surface of the frame body.
10. The negative pressure forming die coating device according to claim 9, wherein the frame body corners on the frame body at the bottom side of the frame body as the inner side edges of the annular holes are rounded off.
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| CN201922006716.3U CN211566357U (en) | 2019-11-19 | 2019-11-19 | Negative pressure forming die tectorial membrane device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110666955A (en) * | 2019-11-19 | 2020-01-10 | 都江堰瑞泰科技有限公司 | Negative pressure forming die tectorial membrane device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110666955A (en) * | 2019-11-19 | 2020-01-10 | 都江堰瑞泰科技有限公司 | Negative pressure forming die tectorial membrane device |
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