CN211564871U - Double-light-source four-station laser processing equipment - Google Patents
Double-light-source four-station laser processing equipment Download PDFInfo
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- CN211564871U CN211564871U CN201922441567.3U CN201922441567U CN211564871U CN 211564871 U CN211564871 U CN 211564871U CN 201922441567 U CN201922441567 U CN 201922441567U CN 211564871 U CN211564871 U CN 211564871U
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- 230000003287 optical effect Effects 0.000 claims abstract description 20
- 238000005520 cutting process Methods 0.000 claims description 20
- 230000010287 polarization Effects 0.000 claims description 10
- 238000003754 machining Methods 0.000 abstract description 9
- 230000005540 biological transmission Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
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Abstract
The utility model discloses a laser beam machining equipment of two light source quadruplex positions, include: the laser generation module is used for emitting laser beams and comprises a first laser and a second laser; the beam expanding module is used for adjusting the size of a light spot of a laser beam and comprises a first beam expanding lens and a second beam expanding lens; the optical path switching module is used for controlling the propagation path of the laser beam, and the number of the optical path switching modules is at least four; and the processing module is used for carrying out focusing processing on the laser beam and comprises a first processing module and a second processing module. The utility model discloses a light path switches the propagation direction selection processing mode that the module changed the light beam, makes a light source can correspond multiple processing mode.
Description
Technical Field
The utility model relates to a laser beam machining field specifically relates to a laser beam machining equipment of two light source quadruplexes.
Background
In laser processing, according to the requirements of a processing technology, femtosecond lasers and picosecond lasers are required to be subjected to precision processing on products with high requirements, and the most practical laser types are selected on the premise of meeting the technical requirements. In the current laser processing system, only one light source and one processing mode are generally arranged on one equipment platform. If testing of different processing modes is desired for different laser sources, a lot of costs are incurred.
SUMMERY OF THE UTILITY MODEL
An object of the present invention is to solve at least the above problems and/or disadvantages and to provide at least the advantages which will be described later.
The utility model provides a laser beam machining equipment of two light source quadruplexes can be through setting up multiple light source and processing mode on an equipment platform, can realize different processing modes through the propagation path that changes the light beam, reduce the cost.
To achieve these objects and other advantages in accordance with the purpose of the invention, there is provided a dual-light-source quadruplex-position laser processing apparatus, including:
the laser generation module is used for emitting laser beams and comprises a first laser and a second laser;
the beam expanding module is used for adjusting the size of a light spot of a laser beam and comprises a first beam expanding lens and a second beam expanding lens;
the optical path switching module is used for controlling the propagation path of the laser beam, and the number of the optical path switching modules is at least four;
and the processing module is used for carrying out focusing processing on the laser beam and comprises a first processing module and a second processing module.
Preferably, the first laser is a femtosecond laser and the second laser is a picosecond laser.
Preferably, the beam expanding module further comprises a wave plate for adjusting the polarization state of the laser beam, and the wave plate is a quarter wave plate.
Preferably, the optical path switching module includes a pneumatic slide table for controlling a position of the optical path reflecting mirror and an optical path reflecting mirror for changing a propagation path of the laser beam.
Preferably, the first processing module is a galvanometer processing module, and the second processing module is a cutting head processing module.
Preferably, a mirror group is further included.
Preferably, the laser processing system further comprises a PLC control system for controlling the processing mode, and the PLC control system is connected to the laser generating module and the optical path switching module.
Another object of the present invention is to provide a processing method of a dual-light source quadruplex-station laser processing apparatus, comprising the following steps:
s1, controlling a laser generating module to emit picosecond or femtosecond laser beams through a PLC control system according to actual requirements, enabling the laser beams to enter a beam expander through a reflector, and selecting a proper beam expander to change the size of light spots of the laser beams according to the actual requirements;
s2, directing the laser beam changed by the beam expander to a wave plate to adjust the polarization state of the laser beam;
s3, controlling the light path switching module to adjust the propagation path of the laser beam through the PLC control system according to actual requirements, reflecting the laser beam to the processing module through the reflector, and selecting the galvanometer processing module or the cutting head processing module for processing;
and S4, cutting the product by the final processing module.
Preferably, when the processing module is used for processing and cutting, the moving platform drives the product to move so as to finish processing and cutting.
Compared with the prior art, the utility model, beneficial effect does: the light source and the multiple processing modes are set on the same platform, and the processing mode is selected by changing the propagation direction of the light beam through the light path switching module according to actual requirements, so that one light source can correspond to the multiple processing modes.
Additional advantages, objects, and features of the invention will be set forth in part in the description which follows and in part will become apparent to those having ordinary skill in the art upon examination of the following or may be learned from practice of the invention.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
Fig. 1 is a schematic diagram of an optical path structure according to an embodiment of the present invention.
Fig. 2 is the utility model discloses femto second galvanometer processing light path structure sketch map.
Fig. 3 is the utility model discloses femto second cutting head processing light path structure sketch map.
Fig. 4 is the utility model discloses picosecond galvanometer processing light path structure sketch map.
Fig. 5 is the utility model discloses picosecond cutting head processing light path structure sketch map.
Fig. 6 is a schematic structural diagram of an optical path switching module according to an embodiment of the present invention.
Detailed Description
The present invention is further described in detail below with reference to the drawings so that those skilled in the art can implement the invention with reference to the description.
It will be understood that terms such as "having," "including," and "comprising," as used herein, do not preclude the presence or addition of one or more other elements or groups thereof.
The terms "first" and "second" and the like in the description and claims of the embodiments of the present invention are used for distinguishing different objects, not for describing a specific order of the objects.
In the description of the embodiments of the present invention, the meaning of "plurality" or "a plurality" means two or more unless otherwise specified.
The utility model provides a laser beam machining equipment of two light source quadruplex positions, include: the laser generation module is used for emitting laser beams and comprises a first laser and a second laser; the beam expanding module is used for adjusting the size of a light spot of a laser beam and comprises a first beam expanding lens and a second beam expanding lens; the optical path switching module is used for controlling the propagation path of the laser beam, and the number of the optical path switching modules is at least four; and the processing module is used for carrying out focusing processing on the laser beam and comprises a first processing module and a second processing module. The utility model discloses an establish a plurality of light sources and multiple processing mode on same platform, select the processing mode according to the actual demand through the propagation direction that the light path switches the module and changes the light beam, make a light source can correspond multiple processing mode.
The laser processing equipment provided by the utility model is mainly applied to the laser cutting process,
the following describes the processing equipment provided by the embodiments of the present invention in detail through specific embodiments and application scenarios thereof with reference to the accompanying drawings.
The utility model provides a laser beam machining equipment of two light source quadruplex positions, as shown in FIG. 1, this processing equipment includes: the laser generating module is used for emitting laser beams; the beam expanding module is used for adjusting the spot size of the laser beam; the optical path switching module is used for controlling the propagation path of the laser beam; and the processing module is used for focusing the laser beam.
In an embodiment of the present invention, the laser generation module includes a first laser and a second laser; the beam expanding module comprises a first beam expanding lens and a second beam expanding lens; the number of the optical path switching modules is at least four; the focused processing module comprises a first processing module and a second processing module.
It can be understood that, in actual demand, the staff can select different lasers in order to adapt to all kinds of circumstances according to the processing product of difference, the utility model discloses do not do any restriction here.
Optionally, in order to facilitate understanding the technical solution of the present invention, in the embodiment provided by the present invention, the first laser is a femtosecond laser, and the second laser is a picosecond laser.
It can be understood that the beam expanders with proper times are selected according to the sizes of laser spots emitted by the two lasers, so that the expanded laser spots have the same diameter.
Optionally, in order to change the polarization state of the laser beam, in an embodiment of the present invention, the beam expanding module further includes a wave plate for adjusting the polarization state of the laser beam.
Optionally, the wave plate is a quarter wave plate.
As shown in fig. 6, it can be understood that in the technical solution of the present invention, multiple processing modes are realized by changing the propagation direction of the laser beam, so that the light path switching module is required to flexibly change the light path, therefore, in the embodiment of the present invention, the light path switching module includes a pneumatic sliding table 1 for controlling the position of the light path reflector 2 and a light path reflector 2 for changing the propagation path of the laser beam.
It can be understood that the technical scheme of the utility model the processing mode of selecting the difference through switching the light path realizes the multistation processing, consequently the utility model discloses an in the embodiment, first processing module is for shaking mirror processing module, second processing module is cutting head processing module.
It is understood that embodiments of the present invention further include a set of mirrors.
It can be understood that in order to select different laser beams and processing modes according to actual requirements, the control system is required to control so as to realize rapidly, therefore, the embodiment of the utility model discloses an in the embodiment, still including the PLC control system who controls processing modes, PLC control system connects laser generation module and light path switching module.
The utility model also provides a processing method of the laser processing equipment of two light source quadruplex positions, including following step:
s1, controlling a laser generating module to emit picosecond or femtosecond laser beams through a PLC control system according to actual requirements, enabling the laser beams to enter a beam expander through a reflector, and selecting a proper beam expander to change the size of light spots of the laser beams according to the actual requirements;
s2, directing the laser beam changed by the beam expander to a wave plate to adjust the polarization state of the laser beam;
s3, controlling the light path switching module to adjust the propagation path of the laser beam through the PLC control system according to actual requirements, reflecting the laser beam to the processing module through the reflector, and selecting the galvanometer processing module or the cutting head processing module for processing;
and S4, cutting the product by the final processing module.
It can be understood that, in order to facilitate the processing, when the processing module processes and cuts, the moving platform drives the product to move so as to complete the processing and cutting.
Example 1: femtosecond galvanometer processing mode
As shown in fig. 2, the utility model provides a femto second shakes mirror processing mode, by femto second laser instrument transmission femto second laser beam, adjust the polarization state of femto second laser beam in the facula size, the first wave plate B1 of femto second laser beam in getting into first beam expander in proper order through speculum M2 reflection, pass through speculum M7, M8 reflection again and get into shake mirror processing module, shake mirror processing module at last and process the product on to the motion platform.
Example 2: femtosecond cutting head machining mode
As shown in fig. 3, the utility model provides a femto second cutting head processing mode, by femto second laser instrument transmission femto second laser beam, adjust the facula size of femto second laser beam in getting into first beam expander in proper order through speculum M2 reflection, adjust the polarization state of femto second laser beam in the first wave plate B1, loop through the reflection of light path speculum 2 among third light path switching module G3 again, the reflection of light path speculum 2 among the fourth light path switching module G4, change the direction of propagation of femto second laser beam, then through speculum M5, M6 reflects and gets into in the cutting head processing module, the product of cutting head processing module on to the motion platform at last is processed.
Example 3: picosecond galvanometer machining mode
As shown in fig. 4, the utility model provides a picosecond galvanometer processing mode that shakes, by picosecond laser instrument transmission picosecond laser beam, once get into the facula size of adjustment picosecond laser beam in the second beam expander through speculum M1 reflection, adjust the polarization state of picosecond laser beam in the second wave plate B2, in reflector M3 reflection only second light path switching module G2, reflect through light path speculum 2 in the second light path switching module G2, change the direction of propagation of picosecond laser beam, then through speculum M7, M8 reflection gets into among the galvanometer processing module that shakes, the product of mirror processing module that shakes on to the motion platform at last is processed.
Example 4: picosecond cutting head machining module
As shown in fig. 5, the utility model provides a picosecond cutting head processing mode, by picosecond laser instrument transmission picosecond laser beam, once get into the facula size of adjustment picosecond laser beam in the second beam expander through speculum M1 reflection, adjust the polarization state of picosecond laser beam in the second wave plate B2, the direction of propagation that changes the picosecond laser beam through the 2 reflections of light path speculum in the first light path switching module G1, then through speculum M4, M5, during M6 reflection gets into cutting head processing module, the product of cutting head processing module on to the motion platform at last is processed.
The technical scheme of the utility model among, through the change to beam transmission path, make two kinds of light beams can both transmit the focus module of difference, reach the effect of switching different light source different processing modes.
While embodiments of the invention have been disclosed above, it is not limited to the applications listed in the description and the embodiments. It can be applicable to various and be fit for the utility model discloses a field completely. Additional modifications will readily occur to those skilled in the art. The invention is therefore not to be limited to the specific details and illustrations shown and described herein, without departing from the general concept defined by the claims and their equivalents.
Claims (7)
1. A dual-light source quadruplex-station laser processing device, comprising:
the laser generation module is used for emitting laser beams and comprises a first laser and a second laser;
the beam expanding module is used for adjusting the size of a light spot of a laser beam and comprises a first beam expanding lens and a second beam expanding lens;
the optical path switching module is used for controlling the propagation path of the laser beam, and the number of the optical path switching modules is at least four;
and the processing module is used for carrying out focusing processing on the laser beam and comprises a first processing module and a second processing module.
2. The apparatus of claim 1, wherein the first laser is a femtosecond laser and the second laser is a picosecond laser.
3. The apparatus of claim 1, wherein the beam expanding module further comprises a wave plate for adjusting the polarization state of the laser beam, and the wave plate is a quarter wave plate.
4. The apparatus of claim 1, wherein the optical path switching module comprises a pneumatic stage for controlling the position of the optical path reflecting mirror and an optical path reflecting mirror for changing the propagation path of the laser beam.
5. The apparatus of claim 1, wherein the first processing module is a galvanometer processing module and the second processing module is a cutting head processing module.
6. A dual-source four-station laser processing apparatus as claimed in claim 1, further comprising a mirror group.
7. The apparatus of claim 1, further comprising a PLC control system for controlling a processing mode, the PLC control system connecting the laser generating module and the optical path switching module.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922441567.3U CN211564871U (en) | 2019-12-26 | 2019-12-26 | Double-light-source four-station laser processing equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922441567.3U CN211564871U (en) | 2019-12-26 | 2019-12-26 | Double-light-source four-station laser processing equipment |
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| Publication Number | Publication Date |
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| CN211564871U true CN211564871U (en) | 2020-09-25 |
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| CN201922441567.3U Expired - Fee Related CN211564871U (en) | 2019-12-26 | 2019-12-26 | Double-light-source four-station laser processing equipment |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110893519A (en) * | 2019-12-26 | 2020-03-20 | 深圳中科光子科技有限公司 | Double-light-source four-station laser processing equipment and processing method |
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2019
- 2019-12-26 CN CN201922441567.3U patent/CN211564871U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110893519A (en) * | 2019-12-26 | 2020-03-20 | 深圳中科光子科技有限公司 | Double-light-source four-station laser processing equipment and processing method |
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200925 |
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| CF01 | Termination of patent right due to non-payment of annual fee |