CN211507631U

CN211507631U - TOP type packaging support and packaging body

Info

Publication number: CN211507631U
Application number: CN202020542236.9U
Authority: CN
Inventors: 魏亚河; 许思琦; 林志龙; 林梦潺; 饶臻然; 高铭选; 吴书麟
Original assignee: Xiamen Xindeco Optoelectronics Co ltd
Current assignee: Xiamen Xindeco Optoelectronics Co ltd
Priority date: 2020-04-14
Filing date: 2020-04-14
Publication date: 2020-09-15
Anticipated expiration: 2030-04-14

Abstract

The utility model relates to a TOP type encapsulation support and packaging body, wherein TOP type encapsulation support includes insulating plastic-sealed body and fixes on plastic-sealed body and as the metal support of positive and negative electrode, have first bowl cup and the second bowl cup that sets up side by side on the plastic-sealed body, the metal support has included six electrodes altogether from first to sixth; the first electrode, the second electrode, the fifth electrode and the sixth electrode are respectively provided with a solid crystal area positioned in the first bowl cup or the second bowl cup and an electrode pin respectively extending out of the plastic package body, the third electrode and the fourth electrode are respectively provided with a solid crystal area in the first bowl cup and the second bowl cup, and the two solid crystal areas of the third electrode and the fourth electrode respectively share one electrode pin so as to solve the problems that the existing chip type RGB lamp bead is easy to damage and the bonding pad is designed densely.

Description

TOP type packaging support and packaging body

Technical Field

The utility model relates to a LED encapsulates the field, specifically relates to a TOP type encapsulation support and packaging body.

Background

The size of the current chip type 1010 lamp bead is 1.00mm x 0.85mm, and the chip type 1010 lamp bead is mainly used for full-color display screens. The packaging colloid of the chip lamp bead usually adopts a compression molding mode, the semi-finished product after compression molding can slightly deform, the cutting process of the finished product is not easy to control, the problems of cutting damage, damage caused by external force of stripping and the like easily occur, the problems all result in higher manufacturing process cost, the disadvantages of higher product cost, low yield and the like are finally caused, and the problems of damage and the like easily caused in the processes of manufacturing and using due to the small size of the lamp bead also exist on the application end.

And chip type's RGB lamp pearl when being applied to the display screen of booth apart from on, each lamp pearl all has four pads, therefore when the application end sets up welded circuit board, the pad design is very intensive, causes the problem of even tin between the pad easily at reflow soldering's in-process, leads to the lamp pearl to become invalid. In addition, because there is the technology clearance between the RGB lamp pearl, the space that every RGB lamp pearl unit occupy is great, therefore the display screen can have great pixel.

SUMMERY OF THE UTILITY MODEL

The utility model aims at providing a TOP type encapsulation support to solve current chip type RGB lamp pearl fragile and the intensive problem of pad design.

The specific scheme is as follows:

a TOP type packaging support comprises an insulating plastic packaging body and a metal support which is fixed on the plastic packaging body and used as a positive electrode and a negative electrode, wherein a first bowl cup and a second bowl cup are arranged on the plastic packaging body side by side, and the metal support comprises six electrodes from a first electrode to a sixth electrode; the first electrode and the second electrode are respectively provided with a first solid crystal area and a second solid crystal area which are positioned in the first bowl cup and a first electrode pin and a second electrode pin which extend out of the plastic package body, the third electrode is provided with a third solid crystal area which is positioned in the first bowl cup, a fourth solid crystal area which is positioned in the second bowl cup and a third electrode pin which extends out of the plastic package body, the fourth electrode is provided with a fifth solid crystal area which is positioned in the first bowl cup, a sixth solid crystal area which is positioned in the second bowl cup and a fourth electrode pin which extends out of the plastic package body, and the fifth electrode and the sixth electrode are respectively provided with a seventh solid crystal area and an eighth solid crystal area which are positioned in the first bowl cup and a fifth electrode pin and a sixth electrode pin which extend out of the plastic package body.

In some embodiments, the plastic package body is in a long strip shape, the first bowl cup and the second bowl cup are arranged along the length direction of the plastic package body, the first electrode pin, the second electrode pin, the third electrode pin, the fourth electrode pin, the fifth electrode pin and the sixth electrode pin are oppositely arranged in the width direction of the plastic package body to form three pairs of electrode pins, and the third electrode pin and the fourth electrode pin are located between the other two pairs of electrode pins.

In some embodiments, the first bowl cup and the second bowl cup have a plurality of fixing portions integrally formed with the plastic package body, and each fixing portion extends at least into at least one die bonding area in the bowl cup and abuts against a die bonding surface of the die bonding area.

In some embodiments, the fixing portion is combined with at least the side wall of the bowl cup and the insulating region between the adjacent die bonding areas.

In some embodiments, one of the die attach regions in the first bowl has an embossed groove for marking.

In some embodiments, the back surface of the plastic package body is provided with a marking groove for identification.

The utility model also provides a packaging body, including packaging support and the chip of encapsulation on packaging support, packaging support is above-mentioned arbitrary TOP type packaging support, and all be packaged with a red light chip, a green glow chip and a blue light chip in this TOP type packaging support's first bowl cup and second bowl cup.

In some embodiments, all the chips in the first bowl cup are arranged in a common anode mode, all the chips in the second bowl cup are arranged in a common anode mode, the blue light chip in the first bowl cup and the blue light chip in the second bowl cup are arranged in a common cathode mode, and the green light chip in the first bowl cup and the green light chip in the second bowl cup are arranged in a common cathode mode.

The utility model provides a TOP type encapsulation support compares with prior art and has following advantage: the utility model provides a TOP type encapsulation support forms two bowl cups on a support to two electrode pins are shared between two bowl cups and make two sets of RGB lamp pearl only have six electrode pins, eight pins have been saved for eight pins altogether compared with two RGB lamp pearls at present, therefore when the application sets up the welded circuit board, the interval between the pad can be designed bigger, avoid causing the problem of continuous tin between the pad in the process of reflow soldering; meanwhile, the design of the bowl cup protects the RGB chip and the packaging colloid inside, and the defects caused by the damage of the packaging colloid in the process of manufacturing and using are greatly reduced.

Drawings

Figure 1 shows a perspective view of a TOP type package support.

Figure 2 shows a schematic view of the front of a TOP type package support.

Figure 3 shows a schematic view of the back of a TOP type package support.

Fig. 4 shows a schematic diagram of a TOP type package support with RGB chips packaged thereon.

Fig. 5 shows a circuit diagram of TOP type package support packaging RGB chips.

Detailed Description

To further illustrate the embodiments, the present invention provides the accompanying drawings. The accompanying drawings, which are incorporated in and constitute a part of this disclosure, illustrate embodiments of the invention and, together with the description, serve to explain the principles of the embodiments. With these references, one of ordinary skill in the art will appreciate other possible embodiments and advantages of the present invention. Elements in the figures are not drawn to scale and like reference numerals are generally used to indicate like elements.

The present invention will now be further described with reference to the accompanying drawings and detailed description.

As shown in fig. 1 to 3, the present embodiment provides a TOP type package support including an insulating plastic package body 1 and a metal support 2 fixed on the plastic package body 1 and serving as a positive electrode and a negative electrode.

The plastic package body 1 is made of an insulating plastic by injection Molding, such as PPA (polyphthalamide), EMC (Epoxy Molding Compound), and the like, the plastic package body 1 is substantially in a rectangular parallelepiped shape, and further has a first bowl 11 and a second bowl 12 which are arranged separately from each other, and the first bowl 11 and the second bowl 12 are arranged side by side in a length direction of the plastic package body 1. In the present embodiment, the first bowl 11 and the second bowl 12 have the same shape and structure, and both have a round rectangular cross section, and the bowl having a round rectangular cross section is only a preferred embodiment, and is not limited thereto, and may have other shapes, such as a circle, a polygon, and the like.

The metal holder 2 is generally made of a conductive metal plate of copper, iron, or the like as a base material, and a silver layer is plated on the outer surface. In this embodiment, the metal frame 2 on the plastic package body 1 includes six electrodes, namely a first electrode 21, a second electrode 22, a third electrode 23, a fourth electrode 24, a fifth electrode 25 and a sixth electrode 26, each of which has a die attach region located in the first bowl 11 or the second bowl 12 and an electrode pin extending out of the plastic package body 1. Specifically, the first electrode 21 has a first die attach region 211 located in the first bowl 11 and a first electrode pin 212 extending out of the plastic package body 1, the second electrode 22 has a second die attach region 221 located in the first bowl 11 and a second electrode pin 222 extending out of the plastic package body 1, the third electrode 23 has a third die attach region 231 located in the first bowl 11, a fourth die attach region 232 located in the second bowl 12 and a third electrode pin 233 extending out of the plastic package body 1, the fourth electrode 24 has a fifth die attach region 241 located in the first bowl 11, a sixth die attach region 242 located in the second bowl cup 12 and a fourth electrode lead 243 extending to the outside of the plastic package body 1, the fifth electrode 25 has a seventh die attach region 251 located in the second bowl cup 12 and a fifth electrode lead 252 extending to the outside of the plastic package body 1, and the sixth electrode 26 has an eighth die attach region 261 located in the second bowl cup 12 and a sixth electrode lead 262 extending to the outside of the plastic package body 1.

Namely, the third die bonding region 231 in the first bowl 11 and the fourth die bonding region 232 in the second bowl 12 share the third electrode pin 233, and the fifth die bonding region 241 in the first bowl 11 and the sixth die bonding region 242 in the second bowl 12 share the fourth electrode pin 243, so that each bowl has four die bonding regions, but the TOP type packaging bracket has only six electrode pins in total, and two pins are saved compared with eight pins in total of two existing RGB beads, therefore, when a circuit board is welded at an application end, the distance between pads can be designed to be larger, and the problem of tin connection between pads in the reflow soldering process is avoided; meanwhile, the design of the bowl cup protects the RGB chip and the packaging colloid inside, and the defects caused by the damage of the packaging colloid in the process of manufacturing and using are greatly reduced.

Referring to fig. 1-3, the first to sixth electrode pins form three pairs of electrode pin pairs arranged in pairs, the three pairs of electrode pin pairs are arranged side by side in the length direction of the plastic package body 1, wherein the first and second electrode pins form an electrode pin pair, the third and fourth electrode pins form an electrode pin pair, the fifth and sixth electrode pins form an electrode pin pair, and the electrode pin pair formed by the third and fourth electrode pins is located between the other two electrode pin pairs, so that the third electrode 23 located in the third die bonding region 231 in the first bowl 11 and the fourth die bonding region 232 located in the second bowl 12 can be formed by regions on both ends of the same metal plate, the fourth electrode 24 located in the fifth die bonding region 241 in the first bowl 11 and the sixth die bonding region 242 located in the second bowl 12 can also be formed by regions on both ends of the same metal plate, which not only facilitates the design of the third electrode 23 and the fourth electrode 24, and because the combination area between the third electrode 23 and the fourth electrode 24 and the plastic package body 1 is increased, the TOP type packaging bracket can have a better thrust value after being welded on a circuit board of an application terminal. In addition, the six electrode pins are uniformly distributed on the peripheral edge of the plastic package body, so that the stress after soldering can be increased, and the thrust value after soldering on a circuit board of an application terminal is further improved.

Referring to fig. 4, the first bowl 11 and the second bowl 12 are packaged with an RGB chip set, each of which includes a red chip 31, a green chip 32, and a blue chip 33. All the chips in each bowl cup are arranged in a common anode manner, the blue light chip in the first bowl cup 11 and the blue light chip in the second bowl cup 12 are arranged in a common cathode manner, and the green light chip in the first bowl cup 11 and the green light chip in the second bowl cup 12 are arranged in a common cathode manner, so that a circuit diagram shown in fig. 5 is formed. Specifically, the first electrode pin 212 is a common anode pin for all chips in the first bowl 11, the second electrode pin 222 is a cathode pin for a red light chip in the first bowl 11, the third electrode pin 233 is a common cathode pin for a blue light chip in the first bowl 11 and a blue light chip in the second bowl 12, the fourth electrode pin 243 is a common cathode pin for a green light chip in the first bowl 11 and a green light chip in the second bowl 12, the fifth electrode pin 252 is a cathode pin for a red light chip in the second bowl 12, and the sixth electrode pin 262 is a common anode pin for all chips in the second bowl 12.

In this embodiment, the blue light chips in the first bowl cup and the second bowl cup share one electrode pin, and the green light chips in the first bowl cup and the second bowl cup share the other electrode pin, so that the difference of the luminous fluxes of the chips caused by different driving voltages is avoided, and the consistency of the colors of the emergent light in the first bowl cup and the second bowl cup can be ensured.

Referring to fig. 2, in the embodiment, the plastic package body 1 has a plurality of fixing portions 13 extending into the bowl cup, each fixing portion is integrally formed with the plastic package body 1, and each fixing portion 13 abuts against a solid crystal face of at least one solid crystal region in the bowl cup where the fixing portion is located, so as to increase a bonding force between the solid welding region and the plastic package body 1, so that the fixing portion is more uniformly stressed, the high flatness of the solid welding region can be maintained, problems of wire breakage, insufficient welding and the like of a chip bonding wire caused by thermal warping of the solid welding region are avoided, and stability and reliability of the chip bonding wire are increased.

Preferably, each fixing portion is combined with at least the side wall of the bowl cup and the insulating area between the adjacent die bonding areas, so as to further increase the combining force between the die bonding area and the plastic package body 1.

In this embodiment, referring to fig. 2, an imprinting groove 14 for identification is formed on one of the die bonding regions in the first bowl 11, and the imprinting groove 14 can be used as an identification point of the automatic die bonding machine to identify the die bonding position of the chip and avoid the die bonding direction.

In this embodiment, referring to fig. 3, the back surface of the plastic package body 1 has a mark slot 15, so that back surface identification can be realized in the taping process, and reverse placement in the taping process is avoided; in addition, when the client uses an SMT chip mounter to automatically mount chips, the mark groove 15 can also be used as a back identification mark during chip mounting to avoid reverse mounting.

While the invention has been particularly shown and described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.

Claims

1. A TOP type packaging support comprises an insulating plastic packaging body and a metal support which is fixed on the plastic packaging body and used as a positive electrode and a negative electrode, and is characterized in that: the plastic package body is provided with a first bowl cup and a second bowl cup which are arranged side by side, and the metal support comprises six electrodes from the first electrode to the sixth electrode; the first electrode and the second electrode are respectively provided with a first solid crystal area and a second solid crystal area which are positioned in the first bowl cup and a first electrode pin and a second electrode pin which extend out of the plastic package body, the third electrode is provided with a third solid crystal area which is positioned in the first bowl cup, a fourth solid crystal area which is positioned in the second bowl cup and a third electrode pin which extends out of the plastic package body, the fourth electrode is provided with a fifth solid crystal area which is positioned in the first bowl cup, a sixth solid crystal area which is positioned in the second bowl cup and a fourth electrode pin which extends out of the plastic package body, and the fifth electrode and the sixth electrode are respectively provided with a seventh solid crystal area and an eighth solid crystal area which are positioned in the first bowl cup and a fifth electrode pin and a sixth electrode pin which extend out of the plastic package body.

2. A TOP type package support according to claim 1, wherein: the plastic package body is in a strip shape, the first bowl cup and the second bowl cup are arranged along the length direction of the plastic package body, the first electrode pin, the second electrode pin, the third electrode pin, the fourth electrode pin, the fifth electrode pin and the sixth electrode pin are oppositely arranged in the width direction of the plastic package body to form three pairs of electrode pins, and the third electrode pin and the fourth electrode pin are located between the other two pairs of electrode pins.

3. A TOP type package support according to claim 1, wherein: the first bowl cup and the second bowl cup are internally provided with a plurality of fixing parts which are integrally formed with the plastic package body, and each fixing part at least extends into at least one crystal fixing area in the bowl cup and is abutted against the crystal fixing surface of the crystal fixing area.

4. A TOP type package support according to claim 3, wherein: the fixing part is at least combined with the side wall of the bowl cup and the insulating area between the adjacent solid crystal areas.

5. A TOP type package support according to claim 1, wherein: and an embossing groove for identification is formed in one of the die bonding areas in the first bowl cup.

6. A TOP type package support according to claim 1, wherein: the back of the plastic package body is provided with a marking groove for identification.

7. The utility model provides a packaging body, includes the encapsulation support and encapsulates the chip on the encapsulation support, its characterized in that: the packaging support is the TOP type packaging support of any one of claims 1-6, and a red light chip, a green light chip and a blue light chip are packaged in the first bowl cup and the second bowl cup of the TOP type packaging support.

8. The package of claim 7, wherein: all chips in the first bowl cup are arranged in a common anode mode, all chips in the second bowl cup are arranged in a common anode mode, the blue light chips in the first bowl cup and the blue light chips in the second bowl cup are arranged in a common cathode mode, and the green light chips in the first bowl cup and the green light chips in the second bowl cup are arranged in a common cathode mode.