CN211420353U - Copper plating device for circuit board printing - Google Patents
Copper plating device for circuit board printing Download PDFInfo
- Publication number
- CN211420353U CN211420353U CN201922418622.7U CN201922418622U CN211420353U CN 211420353 U CN211420353 U CN 211420353U CN 201922418622 U CN201922418622 U CN 201922418622U CN 211420353 U CN211420353 U CN 211420353U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- slide
- electroplating
- centre gripping
- reset spring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses a copper plating device for circuit board printing belongs to circuit board technical field, including depression bar, clamping component, slide, reset spring and electroplating box, the inside both ends of electroplating box are provided with the slide bar, the fixed surface of slide bar has reset spring, reset spring's upper end is connected with the slide, the utility model discloses having set up clamping component, will wait to process the circuit board and place the upper end at the lower plate, rotatory adjusting bolt makes it descend, and the fixed upper plate of adjusting bolt lower extreme slides down along the slide rail, and upper plate and lower plate cooperation are with circuit board centre gripping, quick fixed; the utility model discloses a push down the slide that the depression bar made centre gripping subassembly both ends down and slide down along the slide bar, the fixed circuit board submergence of centre gripping subassembly carries out the copper facing in the plating solution, and depression bar under the pine, the slide at centre gripping subassembly place shifts up through reset spring's spring action, makes the circuit board break away from plating solution labour saving and time saving.
Description
Technical Field
The utility model belongs to the technical field of the circuit board, concretely relates to copper facing device is used in circuit board printing.
Background
The circuit board has the name: ceramic circuit board, alumina ceramic circuit board, aluminum nitride ceramic circuit board, PCB board, aluminum substrate, high frequency board, thick copper board, impedance board, PCB, ultra-thin circuit board, printed (copper etching technology) circuit board, etc. The circuit board enables the circuit to be miniaturized and visualized, and plays an important role in batch production of fixed circuits and optimization of electric appliance layout. The circuit board can be called as a printed circuit board or a printed circuit board, and the FPC circuit board (the FPC circuit board is also called as a flexible circuit board, namely a flexible printed circuit board which is made of polyimide or polyester film as a base material and has the characteristics of high reliability and excellent flexibility, high wiring density, light weight, thin thickness and good bending property) and a soft and hard combination board, namely the birth and development of the FPC and the PCB, promote a new product of the soft and hard combination board. Therefore, the rigid-flex circuit board is a circuit board with FPC (flexible printed circuit) characteristics and PCB (printed circuit board) characteristics, which is formed by combining a flexible circuit board and a rigid circuit board according to relevant process requirements through processes such as pressing and the like.
The prior art has the following problems: the copper plating device for printing of current circuit board has the fixed inconvenient problem of circuit board centre gripping when using, and fixed trouble, wastes time and energy, and there is the inconvenient problem of lift simultaneously the circuit board when descending the copper facing, influences machining efficiency.
SUMMERY OF THE UTILITY MODEL
To solve the problems set forth in the background art described above. The utility model provides a copper facing device is used in circuit board printing has simple structure, and the centre gripping is convenient, goes up and down handy characteristics.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a copper facing device is used in circuit board printing, includes depression bar, centre gripping subassembly, slide, reset spring and electroplating box down, the inside both ends of electroplating box are provided with the slide bar, the fixed surface of slide bar has reset spring, reset spring's upper end is connected with the slide, two be connected with the centre gripping subassembly between the slide, the upper end both sides of centre gripping subassembly are provided with the depression bar down, electroplating box's inside bottom one side is provided with electroplating anode, electroplating box's inside bottom opposite side is provided with electroplating cathode, electroplating box's bottom is provided with electric heating wire.
Preferably, the centre gripping subassembly includes adjusting bolt, punch holder, mount, lower plate and slide rail, wherein, the upper end of mount is fixed with the adjusting bolt, the lower extreme of adjusting bolt is connected with the punch holder, the lower extreme of mount is provided with the lower plate, the both sides of mount are provided with the slide rail.
Preferably, the sliding seat is connected with the sliding rod in a sliding mode, and the return spring is in an expansion state under a natural state.
Preferably, the return spring, the sliding seat and the electroplating box are fixedly connected through fastening screws.
Preferably, the upper clamp plate is fixedly connected with the slide rail in a sliding manner, and a sliding groove corresponding to the slide rail is formed in the side edge of the upper clamp plate.
Preferably, the adjusting bolt is rotatably connected with the fixing frame through threads, and the length of the adjusting bolt ensures that the upper clamping plate is contacted with the lower clamping plate.
Compared with the prior art, the beneficial effects of the utility model are that:
1. the utility model is provided with the clamping component, the circuit board to be processed is placed at the upper end of the lower clamp plate, the adjusting bolt is rotated to lead the circuit board to descend, the upper clamp plate fixed at the lower end of the adjusting bolt slides down along the slide rail, and the upper clamp plate is matched with the lower clamp plate to clamp and quickly fix the circuit board;
2. the utility model discloses a push down the slide that the depression bar made centre gripping subassembly both ends down and slide down along the slide bar, the fixed circuit board submergence of centre gripping subassembly carries out the copper facing in the plating solution, and depression bar under the pine, the slide at centre gripping subassembly place shifts up through reset spring's spring action, makes the circuit board break away from plating solution labour saving and time saving.
Drawings
Fig. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic structural view of the clamping assembly of the present invention;
in the figure: 1. a lower pressure lever; 2. a clamping assembly; 21. adjusting the bolt; 22. an upper splint; 23. a fixed mount; 24. a lower splint; 25. a slide rail; 3. a slide base; 4. a slide bar; 5. electroplating an anode; 6. an electric heating wire; 7. electroplating a cathode; 8. a return spring; 9. and (4) an electroplating box.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-2, the present invention provides the following technical solutions: a copper plating device for circuit board printing comprises a lower pressure rod 1, a clamping component 2, a slide seat 3, a return spring 8 and an electroplating box 9, wherein two ends inside the electroplating box 9 are provided with slide rods 4, the surface of each slide rod 4 is fixed with the return spring 8, in order to improve the fixing firmness, the reset spring 8 is fixedly connected with the slide seat 3 and the electroplating box 9 through fastening screws, the upper end of the reset spring 8 is connected with the slide seat 3, in order to move and adjust conveniently, the sliding seats 3 are connected with the sliding rods 4 in a sliding mode, the reset spring 8 is in an expansion state in a natural state, the clamping assemblies 2 are connected between the two sliding seats 3, the lower pressing rods 1 are arranged on two sides of the upper end of each clamping assembly 2, the electroplating anode 5 is arranged on one side of the bottom end inside the electroplating box 9, the electroplating cathode 7 is arranged on the other side of the bottom end inside the electroplating box 9, and the electric heating wire 6 is arranged at the bottom of the electroplating box 9.
The utility model discloses a theory of operation and use flow: the utility model discloses during the use, install the device in suitable position, add electroplating solution to electroplating box 9 interior, the upper end at lower plate 24 will be placed to the circuit board of treating processing, rotatory adjusting bolt 21 makes its decline, adjusting bolt 21 lower extreme fixed punch holder 22 moves down along slide rail 25 slides, punch holder 22 and the cooperation of lower plate 24 are with the circuit board centre gripping, it is quick fixed, push down slide 3 that depression bar 1 made 2 both ends of centre gripping subassembly down along slide bar 4 lapse, the circuit board submergence that centre gripping subassembly 2 was fixed is in the plating solution, electroplate the operation through electroplating positive pole 5 and electroplating negative pole 7, the copper-plating is accomplished the back, loosen push down bar 1, slide 3 at centre gripping subassembly 2 place shifts up through reset spring 8's elasticity effect, make the circuit board break away from the plating solution, it is portable to electroplate.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The utility model provides a copper facing device is used in circuit board printing, includes depression bar (1), centre gripping subassembly (2), slide (3), reset spring (8) and electroplating box (9), its characterized in that: the inside both ends of electroplating case (9) are provided with slide bar (4), the fixed surface of slide bar (4) has reset spring (8), the upper end of reset spring (8) is connected with slide (3), two be connected with centre gripping subassembly (2) between slide (3), the upper end both sides of centre gripping subassembly (2) are provided with depression bar (1) down, the inside bottom one side of electroplating case (9) is provided with electroplating positive pole (5), the inside bottom opposite side of electroplating case (9) is provided with electroplating negative pole (7), the bottom of electroplating case (9) is provided with electric heating wire (6).
2. The copper plating apparatus for circuit board printing according to claim 1, wherein: the clamping assembly (2) comprises an adjusting bolt (21), an upper clamping plate (22), a fixing frame (23), a lower clamping plate (24) and a sliding rail (25), wherein the adjusting bolt (21) is fixed at the upper end of the fixing frame (23), the lower end of the adjusting bolt (21) is connected with the upper clamping plate (22), the lower end of the fixing frame (23) is provided with the lower clamping plate (24), and the sliding rail (25) is arranged on two sides of the fixing frame (23).
3. The copper plating apparatus for circuit board printing according to claim 1, wherein: the sliding seat (3) is connected with the sliding rod (4) in a sliding mode, and the return spring (8) is in an expansion state in a natural state.
4. The copper plating apparatus for circuit board printing according to claim 1, wherein: the reset spring (8) is fixedly connected with the sliding seat (3) and the electroplating box (9) through fastening screws.
5. The copper plating apparatus for circuit board printing according to claim 2, wherein: the upper clamping plate (22) is fixedly connected with the sliding rail (25) in a sliding mode, and sliding grooves corresponding to the sliding rail (25) are formed in the side edge of the upper clamping plate (22).
6. The copper plating apparatus for circuit board printing according to claim 2, wherein: the adjusting bolt (21) is rotatably connected with the fixing frame (23) through threads, and the length of the adjusting bolt (21) ensures that the upper clamping plate (22) is contacted with the lower clamping plate (24).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922418622.7U CN211420353U (en) | 2019-12-27 | 2019-12-27 | Copper plating device for circuit board printing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922418622.7U CN211420353U (en) | 2019-12-27 | 2019-12-27 | Copper plating device for circuit board printing |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211420353U true CN211420353U (en) | 2020-09-04 |
Family
ID=72249750
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922418622.7U Expired - Fee Related CN211420353U (en) | 2019-12-27 | 2019-12-27 | Copper plating device for circuit board printing |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211420353U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112312702A (en) * | 2020-10-26 | 2021-02-02 | 沈阳天鹰工控科技有限公司 | Power dispatching communication management machine |
| CN115852348A (en) * | 2022-12-20 | 2023-03-28 | 品翔电子元件（漳州）有限公司 | Circuit deposition equipment and deposition process thereof |
| CN117440608A (en) * | 2023-10-24 | 2024-01-23 | 惠州市兴顺和电子有限公司 | Processing equipment and processing method for PCB |
-
2019
- 2019-12-27 CN CN201922418622.7U patent/CN211420353U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112312702A (en) * | 2020-10-26 | 2021-02-02 | 沈阳天鹰工控科技有限公司 | Power dispatching communication management machine |
| CN115852348A (en) * | 2022-12-20 | 2023-03-28 | 品翔电子元件（漳州）有限公司 | Circuit deposition equipment and deposition process thereof |
| CN117440608A (en) * | 2023-10-24 | 2024-01-23 | 惠州市兴顺和电子有限公司 | Processing equipment and processing method for PCB |
| CN117440608B (en) * | 2023-10-24 | 2024-05-17 | 惠州市兴顺和电子有限公司 | Processing equipment and processing method for PCB |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200904 Termination date: 20211227 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |