CN211404696U - Communication device and low-pass filter - Google Patents
Communication device and low-pass filter Download PDFInfo
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- CN211404696U CN211404696U CN202020310520.3U CN202020310520U CN211404696U CN 211404696 U CN211404696 U CN 211404696U CN 202020310520 U CN202020310520 U CN 202020310520U CN 211404696 U CN211404696 U CN 211404696U
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Abstract
The utility model discloses a communication device and low pass filter. The low-pass filter comprises a circuit board and a dielectric filter, wherein the circuit board is provided with a low-pass microstrip line, the dielectric filter comprises a resonance block and a contact pin, a first conducting layer is arranged on the outer surface of the resonance block, the resonance block is provided with a coupling counter bore and a second conducting layer arranged on the inner surface of the coupling counter bore, the second conducting layer is arranged in a surrounding mode to form a matching hole matched with the contact pin, an avoiding area is arranged between the second conducting layer and the first conducting layer, the contact pin is electrically connected with the low-pass microstrip line, and the first conducting layer and the low-pass. The low-pass filter reduces the manufacturing cost under the condition of ensuring low loss. The communication device adopts the low-pass filter, can adapt to the miniaturization development of the antenna, and is favorable for reducing the construction cost.
Description
Technical Field
The utility model relates to the field of communication technology, especially, relate to a communication device and low pass filter.
Background
With the rapid development of communication systems, the 5G era is entered, and the existing iron tower has limited resources, so that the 5G base station is required to be miniaturized. The low-pass filter is a frequency-selecting device, is an indispensable part of communication equipment, and is an important device for miniaturization of 5G equipment.
In the traditional low-pass filter, the loss is low due to the structural defects, and the cost is high.
SUMMERY OF THE UTILITY MODEL
Accordingly, there is a need for a communication device and a low pass filter. The low-pass filter reduces the manufacturing cost under the condition of ensuring low loss. The communication device adopts the low-pass filter, can adapt to the miniaturization development of the antenna, and is favorable for reducing the construction cost.
The technical scheme is as follows:
on the one hand, the application provides a low pass filter, including circuit board and dielectric filter, the circuit board is equipped with low pass microstrip line, dielectric filter includes resonance piece and contact pin, the surface of resonance piece is equipped with first conducting layer, the resonance piece is equipped with the coupling counter bore and sets up in the second conducting layer of the internal surface of coupling counter bore, the second conducting layer encloses to establish and forms and is used for with contact pin complex mating holes, be equipped with between second conducting layer and the first conducting layer and dodge the district, the contact pin is connected with low pass microstrip line electricity, first conducting layer and the insulating setting of low pass microstrip line.
When the low-pass filter is manufactured, the dielectric filter and the circuit board can be manufactured respectively, and then the contact pin is electrically connected with the low-pass microstrip line, so that the dielectric filter has low-pass performance, the manufacturing difficulty is reduced, and the cost is saved. And through optimizing the structure, make first conducting layer and low pass microstrip line insulation setting, avoid low pass microstrip line and dielectric filter short circuit. Thus, the low-pass filter reduces the manufacturing cost under the condition of ensuring low loss.
The technical solution is further explained below:
in one embodiment, the resonant block is provided with an insulating protrusion protruding from the first conductive layer, and the insulating protrusion abuts against the first conductive layer to insulate the first conductive layer from the low-pass microstrip line.
In one embodiment, a conductive pad is disposed between the pin and the low-pass microstrip line.
In one embodiment, the second conductive layer is further surrounded by a venting structure in communication with the mating hole.
In one embodiment, the vent structure opens on an inner sidewall of the mating hole.
In one embodiment, the circuit board further includes a substrate, a first ground layer, a second ground layer and a pad layer, the substrate includes a first board surface and a second board surface opposite to the first board surface, the first ground layer is disposed on the first board surface, the first ground layer is surrounded to form a space avoiding region, and the second ground layer is disposed on the second board surface; the low-pass microstrip line is arranged in the keep-out area and is insulated from the first grounding layer; the pad layer is arranged on the second plate surface and is arranged in an insulating mode with the second grounding layer, and the pad layer is electrically connected with the low-pass microstrip line.
In one embodiment, the low-pass microstrip line is electrically connected with the pad layer through a metal via.
In one embodiment, the keep-out region is recessed into the substrate.
In one embodiment, the number of the pad layers is at least two, the pad layers are arranged on the second plate surface at intervals, and one of the pad layers is electrically connected with the first grounding layer.
In another aspect, the present application further provides a communication device including the low-pass filter in any of the above embodiments.
The communication device adopts the low-pass filter, can adapt to the miniaturization development of the antenna, and is favorable for reducing the construction cost.
Drawings
FIG. 1 is a schematic half-sectional view of a circuit board in an embodiment;
FIG. 2 is a schematic bottom view of the circuit board shown in FIG. 1;
FIG. 3 is a schematic half-sectional view of a circuit board in an embodiment;
FIG. 4 is a schematic partially enlarged top view of a dielectric waveguide filter in one embodiment;
FIG. 5 is an enlarged schematic half-sectional view of the dielectric waveguide filter shown in FIG. 4;
FIG. 6 is a schematic diagram of the circuit board and the dielectric filter shown in FIG. 1;
FIG. 7 is an enlarged view of A shown in FIG. 6;
FIG. 8 is an enlarged schematic view of B shown in FIG. 6;
FIG. 9 is a schematic diagram of the circuit board and the dielectric filter shown in FIG. 3;
fig. 10 is an enlarged schematic view of C shown in fig. 9.
Description of reference numerals:
100. a circuit board; 110. a substrate; 120. a first ground plane; 122. avoiding an empty area; 130. a second ground plane; 140. a low-pass microstrip line; 150. a pad layer; 160. a metal via; 200. a dielectric filter; 210. a resonance block; 211. a first conductive layer; 212. coupling the counter bore; 213. a second conductive layer; 214. a mating hole; 215. an exhaust structure; 216. an avoidance zone; 217. a protrusion; 220. inserting a pin; 230. and a conductive cushion block.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention will be further described in detail with reference to the accompanying drawings and the following detailed description. It should be understood that the detailed description and specific examples, while indicating the scope of the invention, are intended for purposes of illustration only and are not intended to limit the scope of the invention.
It will be understood that when an element is referred to as being "secured to," "disposed on," "secured to," or "disposed on" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. Further, when one element is considered as "fixed transmission connection" with another element, the two elements may be fixed in a detachable connection manner or in an undetachable connection manner, and power transmission can be achieved, such as sleeving, clamping, integrally-formed fixing, welding and the like, which can be achieved in the prior art, and is not cumbersome. When an element is perpendicular or nearly perpendicular to another element, it is desirable that the two elements are perpendicular, but some vertical error may exist due to manufacturing and assembly effects. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
The references to "first" and "second" in the present invention do not denote any particular quantity or order, but rather are merely used to distinguish one name from another.
The low-pass filter is a frequency-selecting device, is an indispensable part of communication equipment, and is also an important device for miniaturization of 5G equipment. At present, a large number of 5G base stations are built, so that a large number of low-pass filters are also applied, how to reduce the cost of the low-pass filters and how to improve the performance are more and more important.
Based on this, as shown in fig. 4 to 6, there is provided a low-pass filter including a wiring board 100 for providing a low-pass, and a dielectric filter 200.
The circuit board 100 is provided with a low-pass microstrip line 140.
The dielectric filter 200 includes a resonator 210 and a pin 220, the outer surface of the resonator 210 is provided with a first conductive layer 211, the resonator 210 is provided with a coupling counterbore 212 and a second conductive layer 213 disposed on the inner surface of the coupling counterbore 212, the second conductive layer 213 surrounds a matching hole 214 for matching with the pin 220, an avoiding region 216 is disposed between the second conductive layer 213 and the first conductive layer 211, the pin 220 is electrically connected with the low-pass microstrip line 140, and the first conductive layer 211 and the low-pass microstrip line 140 are arranged in an insulating manner.
It should be noted that the material of the "resonant block 210" can be any material that can meet the use requirement, such as ceramic.
The "coupling counterbore 212" includes, but is not limited to, press forming during the manufacture of the resonator mass 210, or sintering and machining the resonator mass 210.
As shown in fig. 1 and fig. 2, the circuit board 100 further includes a substrate 110, a first ground layer 120, a second ground layer 130 and a pad layer 150, the substrate 110 includes a first board surface and a second board surface opposite to the first board surface, the first ground layer 120 is disposed on the first board surface, the first ground layer 120 surrounds the space-avoiding region 122, and the second ground layer 130 is disposed on the second board surface; the low-pass microstrip line 140 is disposed in the keep-out area 122 and is disposed in an insulating manner with the first ground plane 120; the pad layer 150 is disposed on the second board surface and is insulated from the second ground layer 130, and the pad layer 150 is electrically connected to the low-pass microstrip line 140.
When the low-pass filter is manufactured, the dielectric filter 200 and the circuit board 100 can be manufactured respectively, and then the contact pin 220 is electrically connected with the low-pass microstrip line 140, so that the dielectric filter 200 has low-pass performance, the manufacturing difficulty is reduced, and the cost is saved. And by optimizing the structure, the first conductive layer 211 and the low-pass microstrip line 140 are arranged in an insulating manner, so as to avoid short circuit between the low-pass microstrip line 140 and the dielectric filter 200. Thus, the low-pass filter reduces the manufacturing cost under the condition of ensuring low loss.
Optionally, after the coupling counterbore 212 is manufactured in the resonant block 210, the first conductive layer 211, the second conductive layer 213 and the avoiding region 216 are formed by any one of the prior art, for example, after electroplating, the avoiding region 216 is formed; or printed and developed.
On the basis of the above-mentioned embodiments of the resonator block 210, as shown in fig. 6 to 8, in an embodiment, the resonator block 210 is provided with an insulating protrusion 217 protruding from the first conductive layer 211, and the insulating protrusion 217 abuts against the first conductive layer 211 to insulate the first conductive layer 211 from the low-pass microstrip line 140. Thus, by providing the insulating protrusion 217, there is a sufficient gap between the first conductive layer 211 and the low-pass microstrip line 140 for insulation, so as to avoid an accidental short circuit between the first conductive layer 211 and the low-pass microstrip line 140 when the low-pass microstrip line 140 and the pin 220 are reflowed.
As shown in fig. 9 and 10, in another embodiment, a conductive pad 230 is disposed between the pin 220 and the low-pass microstrip line 140. Thus, by providing the conductive pad 230, there is a sufficient gap between the first conductive layer 211 and the low-pass microstrip line 140 for insulation, so as to avoid an accidental short circuit between the first conductive layer 211 and the low-pass microstrip line 140 when the low-pass microstrip line 140 and the pin 220 are reflowed.
In addition to any of the embodiments of the resonator mass 210 described above, as shown in fig. 4 and 5, in one embodiment, the second conductive layer 213 further encloses a venting structure 215 that communicates with the mating hole 214. In this way, in the manufacturing of the dielectric filter 200, since the exhaust structure 215 similar to the fitting hole 214 is provided in the resonator block 210, the pin 220 is directly inserted into the fitting hole 214 without performing a planar cutting process, and is fixed to the second conductive layer 213 by solder reflow using solder paste. In the process, rosin volatilized by the solder paste heated at high temperature can be removed through the exhaust structure 215, so that the welding effect is ensured. Machining holes in the resonating block 210 is easier and yields higher than machining planar cuts in small-sized pins 220, as compared to conventional techniques. And the dielectric waveguide filter has lower manufacturing cost and higher processing efficiency and yield. Thus, the manufacturing cost of the low-pass filter can be further reduced.
In addition to the above embodiments, in one embodiment, the exhaust structure 215 is an exhaust groove and is opened on the inner sidewall of the matching hole 214. Thus, the manufacturing difficulty is reduced, and the alloy can be directly injection molded and then electroplated.
It should be noted that there are various schemes for manufacturing the "mating hole 214 and the venting structure 215", including but not limited to laser processing the mating hole 214 and the venting structure 215 after forming the second conductive layer 213; or directly after plating a uniform second conductive layer with the coupling counterbore 212. As long as it can satisfy the use requirement, it is not limited too much here.
It should be noted that the low-pass microstrip line 140 and the pad layer 150 may be electrically connected by welding with a feed pin, or may be electrically connected by a metal via 160.
Specifically, in the present embodiment, the low-pass microstrip line 140 is electrically connected to the pad layer 150 through the metal via 160. Thus, the number of soldering processes can be reduced, and the wiring board 100 can be directly manufactured in the manufacturing process.
On the basis of any of the above embodiments, as shown in fig. 3, in an embodiment, the keep-out area 122 is formed to be recessed toward the substrate 110. Thus, the insulation reliability between the low-pass microstrip line 140 and the first ground layer 120 is higher, and the low-pass microstrip line 140 is not short-circuited when the circuit board 100 is connected to the dielectric filter 200.
In any of the above embodiments, as shown in fig. 6 to 8, at least two pad layers 150 are disposed on the second plate surface at intervals. Thus, the pad layer 150 can be disposed as desired. If the pins 220 are used to form two signal terminals, one pin 220 is electrically connected to the low-pass microstrip line 140, so that the pad layer 150 connected to the low-pass microstrip line 140 becomes one interface, and the other pin 220 is electrically connected to the pad layer 150, so that the other pad layer 150 becomes the other interface.
In one embodiment, a communication device is further provided, which includes the low-pass filter in any of the above embodiments.
The communication device adopts the low-pass filter, can adapt to the miniaturization development of the antenna, and is favorable for reducing the construction cost.
The technical features of the above embodiments can be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the above embodiments are not described, but should be considered as the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above examples only represent some embodiments of the present invention, and the description thereof is more specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (10)
1. The utility model provides a low pass filter, its characterized in that includes circuit board and dielectric filter, the circuit board is equipped with low pass microstrip line, dielectric filter includes resonance piece and contact pin, the surface of resonance piece is equipped with first conducting layer, the resonance piece be equipped with the coupling counter bore and set up in the second conducting layer of the internal surface of coupling counter bore, the second conducting layer enclose establish be used for with contact pin complex mating holes, the second conducting layer with be equipped with between the first conducting layer and dodge the district, the contact pin with low pass microstrip line electricity is connected, first conducting layer with low pass microstrip line insulation sets up.
2. The low-pass filter according to claim 1, wherein the resonator block is provided with an insulating protrusion protruding from the first conductive layer, and the insulating protrusion abuts against the first conductive layer to insulate the first conductive layer from the low-pass microstrip line.
3. The low pass filter of claim 1, wherein a conductive pad is disposed between the pin and the low pass microstrip line.
4. A low-pass filter as claimed in claim 1, characterized in that the second conductive layer is further surrounded by a venting structure communicating with the mating hole.
5. A low pass filter as claimed in claim 4, wherein the vent structure opens on an inner side wall of the mating hole.
6. The low-pass filter according to any one of claims 1 to 5, wherein the circuit board further comprises a substrate, a first ground layer, a second ground layer and a pad layer, the substrate comprises a first board surface and a second board surface arranged opposite to the first board surface, the first ground layer is arranged on the first board surface, the first ground layer surrounds the space to form a space, and the second ground layer is arranged on the second board surface; the low-pass microstrip line is arranged in the keep-out area and is insulated from the first grounding layer; the pad layer is arranged on the second plate surface and is insulated from the second grounding layer, and the pad layer is electrically connected with the low-pass microstrip line.
7. The low pass filter of claim 6, wherein the low pass microstrip line is electrically connected to the pad layer by a metal via.
8. The low pass filter according to claim 6, wherein the keep-out area is recessed into the substrate.
9. The low pass filter according to claim 6, wherein the number of the pad layers is at least two, and the pad layers are disposed at intervals on the second plate surface.
10. A communication apparatus characterized by a low-pass filter according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020310520.3U CN211404696U (en) | 2020-03-13 | 2020-03-13 | Communication device and low-pass filter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020310520.3U CN211404696U (en) | 2020-03-13 | 2020-03-13 | Communication device and low-pass filter |
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| CN211404696U true CN211404696U (en) | 2020-09-01 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112615113A (en) * | 2020-12-28 | 2021-04-06 | 京信射频技术(广州)有限公司 | Dielectric filter assembly |
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- 2020-03-13 CN CN202020310520.3U patent/CN211404696U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112615113A (en) * | 2020-12-28 | 2021-04-06 | 京信射频技术(广州)有限公司 | Dielectric filter assembly |
| CN112615113B (en) * | 2020-12-28 | 2022-05-20 | 京信射频技术(广州)有限公司 | Dielectric filter assembly |
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