CN211404478U - Disk transfer clamp for etching - Google Patents
Disk transfer clamp for etching Download PDFInfo
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- CN211404478U CN211404478U CN201922340163.5U CN201922340163U CN211404478U CN 211404478 U CN211404478 U CN 211404478U CN 201922340163 U CN201922340163 U CN 201922340163U CN 211404478 U CN211404478 U CN 211404478U
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- support arm
- ring section
- clamp ring
- etching
- clamping
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Abstract
The utility model discloses a disk shifts anchor clamps for sculpture, including the support arm with install the annular clamp ring of the ring form that is used for the centre gripping disk on the support arm, this clamp ring includes a plurality of sections clamp ring sections, and the one end of every clamp ring section is provided with curved inserted bar, the other end be provided with the jack of arc inserted bar adaptation, in the inserted bar of clamp ring section inserted the jack of another adjacent clamp ring section, the inboard bottom of every clamp ring section all is provided with the block tongue, the bottom of this block tongue and the bottom parallel and level of clamp ring section, the inboard thickness by interior and outer crescent of block tongue, wherein two adjacent clamp ring sections are installed on the support arm, install the mechanism that opens and shuts that the drive clamp ring section opened and shut on support arm and each clamp ring section. This shift anchor clamps centre gripping disk that can be fine avoids the transfer in-process disk not hard up, also can need not to reuse the thimble jacking simultaneously, and the reliability is higher.
Description
Technical Field
The utility model relates to an sculpture shifts anchor clamps with disk belongs to semiconductor technology field.
Background
In the field of semiconductor etching technology, wafers are substrates for "dies" or "chips" of semiconductor components. Typically a wafer or other semiconductor wafer. The wafer is required to be transferred in the whole etching process, the transferring clamp for transferring the wafer in the vacuum cavity is a major arc-shaped supporting ring, the major arc-shaped supporting ring is provided with an opening, the wafer is placed on a platform, the platform is provided with a shallow circular placing groove for placing the wafer, three thimbles are arranged in the platform within the range of the placing groove, when the thimbles jack the wafer, the supporting ring can be inserted from the bottom, and at the moment, the opening avoids the three thimbles. The wafer is thus supported by the support ring and then transferred to another location.
This construction, although it allows the transfer to be carried out, has the drawback that, firstly, the support ring only supports the disc and is not fixed, so that it may come loose during the transfer; secondly, this kind of transfer anchor clamps need set up three thimble on the platform, still need the action of jacking simultaneously, leads to the action more complicated like this, and three thimble is easy to be damaged, and it is very troublesome to maintain.
SUMMERY OF THE UTILITY MODEL
The utility model discloses the technical problem that will solve is: the wafer transferring clamp for the etching is provided, the wafer can be well clamped by the transferring clamp, the wafer is prevented from loosening in the transferring process, jacking of the ejector pins can be avoided, and the reliability is higher.
In order to solve the technical problem, the technical scheme of the utility model is that: the utility model provides a disk shifts anchor clamps for sculpture, includes the support arm and installs the annular binder ring of the ring that is used for the centre gripping disk on the support arm, and this binder ring includes a plurality of sections binder ring sections, and the one end of every binder ring section is provided with curved inserted bar, and the other end is provided with the jack with curved inserted bar adaptation, in the inserted bar of binder ring section inserted the jack of another adjacent binder ring section, the inboard bottom of every binder ring section all is provided with the block tongue, the bottom of this block tongue and the bottom parallel and level of binder ring section, and the inboard thickness of block tongue from inside to outside increases gradually, and wherein two adjacent binder ring sections are installed on the support arm, install the mechanism that opens and shuts that drives the binder ring section and open and shut on support arm and each.
As a preferred scheme, the opening and closing mechanism comprises a compression spring sleeved on each inserted link, a traction steel wire is installed on the periphery of each clamping ring segment, and a winding and unwinding power device for driving the traction steel wire to wind or unwind is installed on the support arm.
As a preferred scheme, the winding and unwinding power device comprises a speed reduction motor arranged on the support arm, a winding wheel is arranged on an output shaft of the speed reduction motor, the traction steel wire is wound on the winding wheel, and the winding wheel is driven by the speed reduction motor to rotate forward and backward.
As a preferred scheme, the support arm includes first support arm and second support arm, and the leading wheel is just installed respectively in the one end slidable mounting of this first support arm and second support arm on the installation base, sets up the guide structure who makes things convenient for first support arm and second support arm mutual slip between first support arm and the second support arm, the other end of first support arm and second support arm and the one end fixed connection of two adjacent ring clamping segments, draw the wire around the periphery round of each ring clamping segment after through the leading wheel after the winding on the winding wheel again.
Preferably, each of the ring segments has a wire through hole formed in an outer periphery thereof, the first and second arms have wire passing passages extending in a longitudinal direction thereof, and the traction wire passes through the wire through holes and the wire passing passages.
Preferably, the guide structure includes a guide rod extending between the first arm and the second arm.
Preferably, the latch is a triangular latch, and the upper surface of the latch is arranged to be a plane.
As a preferred scheme, the specific structure that one end of the first support arm and one end of the second support arm are slidably mounted on the mounting base is as follows: the upper surface at the installation base is provided with two stands, and the level and the installation pole that is parallel to each other are installed to the upper end of stand, the bottom of first support arm and second support arm is provided with two installation section of thick bamboos, first support arm and second support arm realize sliding on the installation pole through installation section of thick bamboo suit, the contained angle of first support arm and second support arm is between 1-2.
After the technical scheme is adopted, the utility model discloses an effect is: because the wafer transfer fixture for etching comprises a support arm and a circular ring-shaped clamping ring which is arranged on the support arm and used for clamping the wafer, the clamping ring comprises a plurality of clamping ring sections, one end of each clamping ring section is provided with an arc-shaped inserted bar, the other end of each clamping ring section is provided with a jack matched with the arc-shaped inserted bar, the inserted bar of each clamping ring section is inserted into the jack of another adjacent clamping ring section, the bottom of the inner side of each clamping ring section is provided with a clamping tongue, the bottom of the clamping tongue is flush with the bottom of the clamping ring section, the thickness of the inner side of the clamping tongue is gradually increased from inside to outside, wherein the two adjacent clamping ring sections are arranged on the support arm, and an opening and closing mechanism for driving the clamping ring sections to open and close is arranged on the support arm and each clamping ring section, therefore, in the actual transfer process, the edge of a placing groove on a platform is only required to be provided with a notch corresponding to the position, then after the clamping tongue falls into the notch, the clamping ring sections are mutually folded, so that the clamping tongue pushes the wafer from the bottom of the wafer, the original wafer enters a supporting area of the clamping tongue, the wafer is lifted for a short distance, meanwhile, the clamping ring sections are continuously drawn close and clamp the edge of the wafer, clamping is completed, the wafer can be clamped well by the transfer clamp, the wafer is prevented from loosening in the transfer process, meanwhile, jacking of a thimble is not needed, and the reliability is higher.
The opening and closing mechanism comprises compression springs sleeved on each inserting rod, traction steel wires are installed on the peripheries of the clamping ring sections, and the supporting arms are provided with winding and unwinding power devices for driving the traction steel wires to wind or unwind, so that the winding and unwinding power devices can wind the traction steel wires, the clamping ring sections are folded, when the traction steel wires are unwound, the clamping ring sections expand under the elastic force of the compression springs, opening and closing are achieved, the clamping force can be well controlled through the length of the wound traction steel wires, meanwhile, the compression springs are sleeved on the inserting rods, and therefore when the compression springs are completely contracted, the compression springs cannot be compressed, the limit clamping force of the clamping ring sections can be controlled, and overlarge clamping force is avoided. The drawing or expanding stroke of the clamping ring segment is smaller, so that the drawing or expanding of the clamping ring segment can be met only by slightly increasing the diameter of the jack than that of the insertion rod, and the clamping is convenient.
And because the support arms comprise a first support arm and a second support arm, one ends of the first support arm and the second support arm are slidably mounted on the mounting base and are respectively provided with a guide wheel, a guide structure which is convenient for the first support arm and the second support arm to slide mutually is arranged between the first support arm and the second support arm, the other ends of the first support arm and the second support arm are fixedly connected with one ends of two adjacent clamping ring sections, the traction steel wire is wound around the periphery of each clamping ring section for a circle and then is wound on the winding wheel through the guide wheels, the support arms can well support the whole clamping ring, meanwhile, the first support arm and the second support arm can slide with the clamping ring sections in a small range, and in the action process, the traction steel wire is used as power transmission, so that even if the first support arm and the second support arm slide relatively, the power transmission is very stable.
And because the guide structure comprises the guide rod which penetrates between the first support arm and the second support arm, the first support arm and the second support arm can slide on the guide rod in a guiding mode, and therefore the movement is more reliable.
And because the clamping tongue is a triangular clamping tongue, and the upper surface of the clamping tongue is arranged to be a plane, the upper surface of the clamping tongue can better support the wafer.
Drawings
The present invention will be further explained with reference to the drawings and examples.
FIG. 1 is a perspective view of an embodiment of the present invention;
fig. 2 is a top view of an embodiment of the invention;
FIG. 3 is a perspective view of a binder ring segment;
FIG. 4 is a perspective view of another angle of a binder ring segment;
FIG. 5 is a schematic view of the placement slot on the platform;
FIG. 6 is a perspective view of the latch;
in the drawings: 1. a support arm; 2. a clamping ring; 21. a binder ring segment; 22. a latch; 221. a tip; 222. a plane; 23. a compression spring; 24. a steel wire through hole portion; 25. a jack; 26. inserting a rod; 3. a base; 4. a reduction motor; 5. a guide wheel; 6. a column; 7. mounting the cylinder; 8. a guide bar; 9. a traction wire; 10. a winding wheel; 11. a placement groove; 12. a notch; 13. mounting a rod; 14. and (4) carrying out wafer forming.
Detailed Description
The present invention will be described in further detail with reference to the following examples.
As shown in fig. 1 to 6, an etching wafer transferring clamp includes a support arm 1 and an annular clamp ring 2 mounted on the support arm 1 for clamping a wafer 14, where the clamp ring 2 includes a plurality of clamp ring segments 21, one end of each clamp ring segment 21 is provided with an arc-shaped insertion rod 26, the other end is provided with a socket 25 adapted to the arc-shaped insertion rod 26, the insertion rod 26 of the clamp ring segment 21 is inserted into the socket 25 of another adjacent clamp ring segment 21, the bottom of the inner side of each clamp ring segment 21 is provided with a latch 22, the bottom of the latch 22 is flush with the bottom of the clamp ring segment 21, the thickness of the inner side of the latch 22 is gradually increased from inside to outside, as shown in fig. 6, an enlarged structure of the latch 22 is shown in fig. 6, where the thickness of the inner side of the latch 22 is gradually increased from inside to outside, so that a tip 221 is formed at the inner side end of the latch 22, and the latch 22 is a triangular latch 22, the upper surface of the latch 22 is arranged as a flat surface 222.
As shown in fig. 5, with the transfer fixture in this embodiment, only a slight modification needs to be made on the structure of the placement groove 11 of the platform for placing the silicon wafer, and the circular placement groove 11 of the placement groove 11 needs only to be provided with several notches 12 adapted to the latch 22 on the groove wall of the placement groove 11, so that when the latch 22 enters the placement groove 11 from the outside of the placement groove 11 through the notches 12, the latch 22 will gradually enter the bottom of the wafer 14, and finally the wafer 14 is lifted by the plane 222 on the upper surface of the latch 22, and the latch segment contacts with the edge of the wafer 14, thereby completing the clamping. Therefore, the wafer 14 is not easy to drop, and meanwhile, a plurality of ejector pins and jacking mechanisms are not required to be arranged on the platform, so that the reliability is greatly improved, the ejector pins are not required to be replaced during maintenance, and the maintenance cost is greatly saved.
Two adjacent clamping ring segments 21 are mounted on the support arm 1, and an opening and closing mechanism for driving the clamping ring segments 21 to open and close is mounted on the support arm 1 and each clamping ring segment 21.
In this embodiment, the opening and closing mechanism includes a compression spring 23 sleeved on each insertion rod 26, a traction steel wire 9 is installed on the periphery of each clamping ring segment 21, and a winding and unwinding power device for driving the traction steel wire 9 to wind or unwind is installed on the support arm 1. The opening and closing mechanism utilizes the traction of the traction steel wire 9 to realize the closing of the clamping ring sections 21, and utilizes the self elastic force of the compression spring 23 to realize the opening of the clamping ring sections 21.
In the embodiment, the change of the diameter generated by the opening and closing of the clip segment 21 does not need to be large, as shown by a dotted circle in fig. 2, the opening and closing of the clip segment 21 only needs the radial length of one latch 22, and therefore, the sliding fit between the insertion rod 26 and the insertion rod 26 can be satisfied only by slightly increasing the size of the insertion hole 25 compared with the size of the insertion rod 26.
As shown in fig. 1, the winding and unwinding power device includes a speed reduction motor 4 mounted on the support arm 1, a winding wheel 10 is mounted on an output shaft of the speed reduction motor 4, the traction steel wire 9 is wound on the winding wheel 10, and the winding wheel 10 is driven by the speed reduction motor 4 to rotate forward and backward.
In this embodiment, the support arm 1 includes first support arm and second support arm, and the one end slidable mounting of this first support arm and second support arm just installs leading wheel 5 respectively on installation base 3, sets up the guide structure who makes things convenient for first support arm and second support arm mutual slip between first support arm and the second support arm, the other end of first support arm and second support arm and two adjacent ring binder sections 21's one end fixed connection, draw the steel wire 9 around each ring binder section 21's periphery after the round again through leading wheel 5 after the winding on winding wheel 10. In this embodiment, the both ends of traction wire 9 all convolute on different rolling wheel 10, two rolling wheel 10 by gear motor 4 drive can, gear motor 4 is servo gear motor 4, the distance of control rolling that can be fine, and then control clamping-force. The guide structure comprises a guide rod 8, and the guide rod 8 penetrates between the first support arm and the second support arm. The one end slidable mounting of this first support arm and second support arm is in the concrete structure of installation base 3: the upper surface at installation base 3 is provided with two stands 6, and the level and the installation pole 13 that is parallel to each other are installed to the upper end of stand 6, the bottom of first support arm and second support arm is provided with two installation section of thick bamboos 7, first support arm and second support arm realize sliding on installation pole 13 through installation section of thick bamboo 7 suit, the contained angle of first support arm and second support arm is between 1-2. The first arm and the second arm have a certain angle, so that when the clamping ring section 21 is folded or unfolded, the sliding amplitude between the first arm and the second arm at the end with the guide wheel 5 is smaller, and the running and the winding of the steel wire are more facilitated.
In the embodiment, in the aspect of controlling the clamping force, the clamping force can be controlled by the servo speed reduction motor 4 and the length of the compression spring 23, because the compression spring 23 is located between the adjacent ring clamping segments 21, when the ring clamping segments 21 are folded, the compression spring 23 is continuously compressed and shortened, and when the compression spring 23 is compressed to the limit, the compression spring 23 cannot be compressed any more, and at the moment, the clamping force is also the limit clamping force, and at the moment, the clamping force can be further controlled by only selecting the proper compression spring 23, so that the wafer 14 is prevented from being damaged.
As shown in fig. 3 and 4, each of the ring segments 21 has a wire through hole 24 formed in an outer periphery thereof, the first and second arms have wire passages extending in a longitudinal direction thereof, and the traction wire 9 passes through the wire through holes 24 and the wire passages. Therefore, the traction steel wire 9 can be wound and drawn more smoothly, and the steel wires exposed outside are more regular.
The specific structures of the servo reducing motor 4, the winding wheel 10 and the transition wheel mentioned in the embodiment are the conventional technologies at present, and the detailed control of the motor, the specific structure and the principle and the corresponding servo motor are disclosed in detail in the mechanical design manual fifth edition printed in the twenty-eighth edition of Beijing fifth edition in 2008, 4 months, and the structures of the motor, the winding wheel and the transition wheel belong to the prior art.
The above-mentioned embodiments are merely descriptions of the preferred embodiments of the present invention, and are not intended to limit the scope of the present invention, and various modifications and alterations made to the technical solution of the present invention without departing from the spirit of the present invention are intended to fall within the scope of the present invention defined by the claims.
Claims (8)
1. The utility model provides a disc shifts anchor clamps for sculpture which characterized in that: including the support arm with install the annular binder ring of the ring form that is used for the centre gripping disk on the support arm, this binder ring includes a plurality of sections binder ring sections, the one end of every binder ring section is provided with curved inserted bar, the other end be provided with the jack of arc inserted bar adaptation, in the inserted bar of binder ring section inserted the jack of another adjacent binder ring section, the inboard bottom of every binder ring section all is provided with the block tongue, the bottom of this block tongue and the bottom parallel and level of binder ring section, the inboard thickness of block tongue from inside to outside crescent, wherein two adjacent binder ring sections install on the support arm, install the mechanism that opens and shuts that drive binder ring section opened and shut on support arm and each binder ring section.
2. A wafer transfer jig for etching as set forth in claim 1, wherein: the opening and closing mechanism comprises a compression spring sleeved on each inserted rod, traction steel wires are installed on the peripheries of the clamping ring segments, and a winding and unwinding power device for driving the traction steel wires to wind or unwind is installed on the support arms.
3. A wafer transfer jig for etching as set forth in claim 2, wherein: the winding and unwinding power device comprises a speed reducing motor arranged on the support arm, a winding wheel is arranged on an output shaft of the speed reducing motor, the traction steel wire is wound on the winding wheel, and the winding wheel is driven by the speed reducing motor to rotate forward and backward.
4. A wafer transfer jig for etching as set forth in claim 3, wherein: the support arm includes first support arm and second support arm, and the leading wheel is just installed respectively to the one end slidable mounting of this first support arm and second support arm on the installation base, sets up the guide structure who makes things convenient for first support arm and second support arm mutual slip between first support arm and the second support arm, the other end of first support arm and second support arm and two adjacent ring binder's one end fixed connection, draw the wire around each ring binder's periphery round after pass through behind the leading wheel winding on the rolling wheel.
5. A wafer transfer jig for etching as set forth in claim 4, wherein: the periphery of each clamping ring section is provided with a steel wire through hole, the first support arm and the second support arm are provided with threading channels extending along the length direction of the first support arm and the second support arm, and the traction steel wire penetrates through the steel wire through holes and the threading channels.
6. A wafer transfer jig for etching as set forth in claim 5, wherein: the guide structure comprises a guide rod, and the guide rod penetrates through the space between the first support arm and the second support arm.
7. A wafer transfer jig for etching as set forth in claim 6, wherein: the clamping tongue is a triangular clamping tongue, and the upper surface of the clamping tongue is arranged to be a plane.
8. A wafer transfer jig for etching as set forth in claim 7, wherein: the one end slidable mounting of this first support arm and second support arm is in the concrete structure of installation base: the upper surface at the installation base is provided with two stands, and the level and the installation pole that is parallel to each other are installed to the upper end of stand, the bottom of first support arm and second support arm is provided with two installation section of thick bamboos, first support arm and second support arm realize sliding on the installation pole through installation section of thick bamboo suit, the contained angle of first support arm and second support arm is between 1-2.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201922340163.5U CN211404478U (en) | 2019-12-24 | 2019-12-24 | Disk transfer clamp for etching |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201922340163.5U CN211404478U (en) | 2019-12-24 | 2019-12-24 | Disk transfer clamp for etching |
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Publication Number | Publication Date |
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CN211404478U true CN211404478U (en) | 2020-09-01 |
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Family Applications (1)
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CN201922340163.5U Active CN211404478U (en) | 2019-12-24 | 2019-12-24 | Disk transfer clamp for etching |
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CN (1) | CN211404478U (en) |
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2019
- 2019-12-24 CN CN201922340163.5U patent/CN211404478U/en active Active
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Address after: 215600 Fuxin Road, Zhangjiagang economic and Technological Development Zone, Suzhou, Jiangsu 2 Patentee after: Jiangsu jinyuda Semiconductor Co.,Ltd. Address before: 215600 Suzhou jinyuda Industrial Co., Ltd., No.2, Fuxin Road, Zhangjiagang Economic and Technological Development Zone, Suzhou City, Jiangsu Province Patentee before: SUZHOU JYD INDUSTRIAL Co.,Ltd. |
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