CN211401072U

CN211401072U - Package of flexible sensor

Info

Publication number: CN211401072U
Application number: CN202020022836.2U
Authority: CN
Inventors: 曹永革; 王充; 宋鹤然; 杨灿灿; 曹智泉; 曹智俊
Original assignee: Zero Mirror Shenzhen Technology Co ltd
Current assignee: Zero Mirror Shenzhen Technology Co ltd
Priority date: 2020-01-07
Filing date: 2020-01-07
Publication date: 2020-09-01
Anticipated expiration: 2030-01-07

Abstract

A package for a flexible sensor, comprising: the sensitive region body comprises: the flexible substrate and the metal layer, the thickness of the metal layer is less than millimeter level; the conductive member includes: the conducting sheet is connected with the connecting conducting wire; the conducting plate is electrically connected with the metal layer, the conducting plate is provided with a reinforcing hole, and the overlapped part of the conducting plate and the metal layer forms a connecting part; the connecting conductive wire is electrically connected with the conductive sheet; the flexible packaging layer wraps the sensitive area body and the connecting portion and penetrates through the reinforcing hole. The conductive plate is electrically connected with the sensitive area body, the reinforcing holes are formed in the conductive plate, the reinforcing holes are filled fully by utilizing the flowability characteristic of the flexible packaging layer, the electric connection strength of the conductive plate and the sensitive area body is improved, and the sensitive area body is only designed into a two-layer structure. Therefore, the sensitive region body and the conductive member with simple structures form a package body of the flexible sensor with simple structures.

Description

Package of flexible sensor

Technical Field

The utility model relates to a flexible electron technical field especially relates to flexible sensor's packaging body.

Background

Flexible Electronics (Flexible Electronics) is a generic name for a technology that is an emerging electronic technology for fabricating organic/inorganic material electronic devices on Flexible/ductile substrates. Compared with traditional electronics, the flexible electronics have higher flexibility, can adapt to different working environments to a certain extent, and meet the deformation requirement of equipment.

The corresponding technical requirements also restrict the development of flexible electronics, in particular the development of flexible sensor technology. However, different flexible sensors have different structures and complicated structures, for example, the structure of a signal output end is very complicated, and the like. Therefore, the package structure of the flexible sensor is a technical difficulty in the art.

Disclosure of Invention

In view of this, there is a need for a flexible sensor package with a simple structure.

A package for a flexible sensor, comprising:

a sensitive region body comprising: the flexible substrate and the metal layer are arranged on the flexible substrate, and the thickness of the metal layer is smaller than a millimeter level;

a conductive member comprising: the conducting sheet is connected with the connecting conducting wire; the conducting sheet is electrically connected with the metal layer, the conducting sheet is provided with a reinforcing hole, and the overlapping part of the conducting sheet and the metal layer forms a connecting part; the connecting conductive wire is electrically connected with the conductive sheet; and

and the flexible packaging layer wraps the sensitive region body and the connecting part and penetrates through the reinforcing hole.

In one embodiment, the device further comprises a fixing screw; the conducting strip is also provided with a threaded hole, and the fixing screw penetrates through the flexible packaging layer and is screwed in the threaded hole.

In an embodiment, the metal layer is provided with micro-cracks, which extend along the deformation direction.

In an embodiment, the metal layer includes a first sub-metal layer and a second sub-metal layer, the first sub-metal layer and the second sub-metal layer are both provided with micro cracks, and the directions of the micro cracks of the first sub-metal layer and the directions of the micro cracks of the second sub-metal layer are staggered at an angle.

In an embodiment, the directions of the microcracks of the first sub-metal layer and the microcracks of the second sub-metal layer are staggered by 90 degrees.

In one embodiment, the microcracks are hollowed-out linear structures.

The packaging body of the flexible sensor adopts the scheme, realizes the electric connection with the sensitive region body through the conducting strip in the conducting component, skillfully arranges the reinforcing holes on the conducting strip, utilizes the mobility characteristic of the flexible packaging layer to fill the reinforcing holes, improves the electric connection strength of the conducting strip and the sensitive region body, and finally directly transmits signals through the connecting wires. And the sensitive region body is only designed into a two-layer structure, namely the flexible substrate and the metal layer, so that the stress deformation signal is sensed. Therefore, the sensitive region body and the conductive member with simple structures form a packaging body of the flexible sensor with simple structures, and meanwhile, the connection strength of the output end of the flexible sensor is improved.

[ description of the drawings ]

FIG. 1 is a schematic view of a package of an embodiment flexible sensor;

FIG. 2 is a schematic view of the conductive sheet of FIG. 1;

FIG. 3 is a microdisplay of an embodiment microcrack;

FIG. 4 is an exploded view of the body of one embodiment of a sensitive area;

FIG. 5 is a schematic view of a first sub-metal layer of an embodiment;

FIG. 6 is a diagram of a second sub-metal layer, according to one embodiment.

[ detailed description ] embodiments

Exemplary embodiments that embody features and advantages of the present invention will be described in detail in the following description. It is to be understood that the invention is capable of other and different embodiments and its several details are capable of modification without departing from the scope of the invention, and that the description and drawings are to be regarded as illustrative in nature and not as restrictive.

With reference to fig. 1-6, in one embodiment, a package for a flexible sensor includes: a sensitive area body 1, a conductive member 2 and a flexible encapsulation layer 3. Specifically, the method comprises the following steps:

sensitive area body 1, comprising: a flexible substrate 11 and a metal layer 12 provided on the flexible substrate 11, the metal layer 12 having a thickness of less than a millimeter. Referring to fig. 4, in an embodiment, the flexible substrate 11 is a silicon gel layer, a metal layer 12 is disposed on the silicon gel layer, specifically, metal is sputtered onto the silicon gel layer by a magnetron sputtering method, and the material of the metal layer 12 may be gold, silver, copper, iron, or alloy. In addition, the thickness of the metal layer 12 is less than millimeter level, and the thickness of micrometer level or nanometer level can be set according to the requirement of the product.

Further, in connection with fig. 3, the metal layer 12 is provided with micro-cracks 121, the micro-cracks 121 extending in the deformation direction. Of course, in other embodiments, the micro-cracks 121 are hollowed out and have a linear structure, and may have other shapes, such as a diamond shape, a circular shape, a linear shape, an irregular shape, and the like. The core of the structural design of the microcracks 121 is: in the process of stretching deformation, a space is provided for stretching deformation by a gap in the microcrack 121, and meanwhile, in the process of stretching deformation, the length (horizontal direction) or the thickness (longitudinal direction) of the metal layer 12 deforms, and it is known that the resistance value will change along with the deformation of the metal layer 12 by R = ρ L/S (where ρ represents the resistivity of the resistance and is determined by the property of itself, L represents the length of the resistance, and S represents the cross-sectional area of the resistance), and the correlation relationship between the resistance value and the deformation is established, so that the deformation monitoring of the object to be detected can be realized, and the method belongs to the sensing technology for sensing the deformation of the object to be detected based on the stress change in the field of flexible electronics.

With reference to fig. 1 to 2, the conductive member 2 includes: the conductive sheet 21 and the connecting conductive line 22; the conducting strip 21 is electrically connected with the metal layer 12, the conducting strip 21 is provided with a reinforcing hole 211, and the overlapping part of the conducting strip 21 and the metal layer 12 forms a connecting part 4; the connecting conductive line 22 is electrically connected to the conductive sheet 21.

The flexible packaging layer 3 wraps the sensitive region body 1 and the connecting portion 4 and penetrates through the reinforcing hole 211. Specifically, the flexible encapsulating layer 3 is silica gel or rubber, encapsulates the sensitive region body 1 and the connecting portion 4 integrally, and when the silica gel or the rubber is at a certain temperature (for example, 180-. In addition, the silicon rubber can protect the metal layer 12 from being damaged, so that the service life of the flexible sensor is longer, and the cost is lower.

The packaging body of the flexible sensor of this scheme of adoption has realized the electricity through conducting strip 21 among the conducting component 2 and has been connected with sensitive region body 1, and ingenious seting up on conducting strip 21 strengthens hole 211 moreover, utilizes the mobility characteristics of flexible packaging layer 3, fills up and is full of strengthening hole 211, plays the electric connection intensity who improves conducting strip 21 and sensitive region body 1, passes through connecting wire 22 at last signal transmission. Moreover, the sensitive region body 1 only has a two-layer structure design, namely the flexible substrate 11 and the metal layer 12, so that the sensing of the stress deformation signal is realized. Therefore, the sensitive region body 1 and the conductive member 2 which are simple in structure form a packaging body of the flexible sensor, and meanwhile, the connection strength of the output end of the flexible sensor is improved.

With reference to fig. 1-2, in an embodiment, the package of the flexible sensor further includes: a set screw 5; the conducting strip 21 is further provided with a threaded hole 212, and the fixing screw 5 penetrates through the flexible packaging layer 3 and is screwed in the threaded hole 212. The connection strength of the conductive member 2 and the sensitive area body 1 is strengthened by the physical starting of the threaded hole 212 and by one step.

In an embodiment, with reference to fig. 5 and 6, the metal layer 12 includes a first sub-metal layer 122 and a second sub-metal layer 123, the first sub-metal layer 122 and the second sub-metal layer 123 are both provided with micro cracks 121, and directions of the micro cracks 121 of the first sub-metal layer 122 and directions of the micro cracks 121 of the second sub-metal layer 123 are staggered at an angle. The advantage of this design is that it can be ensured that in case of a break or damage in the first sub-metal layer 122 or the second sub-metal layer 123, the further sub-metal layer thereof can play a backup role. In addition, the directions of the microcracks 121 of the different sub-metal layers 12 may also play a role of "supplementing" the microcracks 121 of the different sub-metal layers 12 when the microcracks 121 "break". In other embodiments, the directions of the microcracks 121 of the first sub-metal layer 122 and the microcracks 121 of the second sub-metal layer 123 are staggered by 90 degrees, so that the large-scale deformation of the flexible sensor packaging structure during transverse and longitudinal stretching deformation can be effectively met, and the stability in a multi-angle deformation process can be effectively maintained.

The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.

Claims

1. A package for a flexible sensor, comprising:

2. The flexible sensor package of claim 1, further comprising a set screw; the conducting strip is also provided with a threaded hole, and the fixing screw penetrates through the flexible packaging layer and is screwed in the threaded hole.

3. The package for a flexible sensor according to claim 1, wherein the metal layer is provided with micro-cracks, the micro-cracks extending along the deformation direction.

4. The package of a flexible sensor according to claim 1, wherein the metal layer comprises a first sub-metal layer and a second sub-metal layer, each of the first sub-metal layer and the second sub-metal layer is provided with micro cracks, and the directions of the micro cracks of the first sub-metal layer and the directions of the micro cracks of the second sub-metal layer are staggered at an angle.

5. The package of a flexible sensor according to claim 4, wherein the directions of the microcracks of the first sub-metal layer and the microcracks of the second sub-metal layer are staggered by 90 degrees.

6. The package of the flexible sensor according to any one of claims 3 to 5, wherein the micro-cracks have a hollowed linear structure.