CN211400158U - Semiconductor heat recovery system and air conditioner - Google Patents
Semiconductor heat recovery system and air conditioner Download PDFInfo
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- CN211400158U CN211400158U CN201922438896.2U CN201922438896U CN211400158U CN 211400158 U CN211400158 U CN 211400158U CN 201922438896 U CN201922438896 U CN 201922438896U CN 211400158 U CN211400158 U CN 211400158U
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Abstract
The utility model discloses a semiconductor heat recovery system and air conditioner, include: the semiconductor heat exchange module is arranged on the heat dissipation module at the hot end of the semiconductor heat exchange module, and the heat storage module is used for storing heat through heat storage media and the heat dissipation module in a heat exchange manner and is used for exchanging heat with the heat storage module and switching the heat supply pipeline. The utility model discloses the heat that the semiconductor heat transfer module hot junction gived off absorbs and transports to the storage of heat accumulation module through the heat accumulation medium, makes the heat in semiconductor heat transfer module hot junction be saved for subsequent use when the refrigeration. The operation environment of the semiconductor during refrigeration is improved, and the efficiency of the semiconductor refrigeration is improved; meanwhile, the energy utilization rate is improved, and the waste heat in the semiconductor air conditioner is subjected to heat recovery treatment.
Description
Technical Field
The utility model relates to an air conditioner field especially relates to a semiconductor heat recovery system and air conditioner.
Background
In recent years, with the development of materials and the development of air conditioners, a new semiconductor is now being developed on the market, and a power supply is connected to the semiconductor, so that one side of the semiconductor can be used for cooling and the other side can be used for heating. By utilizing the characteristics of such semiconductors, a semiconductor kitchen air conditioner has been developed.
When the semiconductor is used for refrigerating, the heat generated by heating the other surface of the semiconductor needs to be discharged, the conventional air conditioner generally does not process the hot end or directly radiates the heat, and the heat generated by the hot end cannot be recycled.
SUMMERY OF THE UTILITY MODEL
The utility model discloses a solve among the above-mentioned prior art semiconductor air conditioner hot junction produced heat and not by the technical problem who retrieves, provide a semiconductor heat recovery system and air conditioner.
The utility model adopts the technical proposal that:
the utility model provides a semiconductor heat recovery system, include: the semiconductor heat exchange module is arranged on the heat dissipation module at the hot end of the semiconductor heat exchange module, and the heat storage module is used for storing heat through heat storage media and the heat dissipation module in a heat exchange manner and is used for exchanging heat with the heat storage module and switching the heat supply pipeline.
Furthermore, the heat storage module and the heat dissipation module are communicated in a circulating mode through a pipeline, and a pump body is arranged on the pipeline.
The heat dissipation module includes: and the first heat exchange branch circuits are in contact heat exchange with the hot ends of the semiconductor heat exchange modules and are communicated with the pipeline.
The semiconductor heat exchange module comprises a plurality of semiconductor heat exchange units arranged side by side, and each semiconductor heat exchange unit corresponds to one or more first heat exchange branches.
The heat storage module includes: the heat storage box body is filled with a heat storage medium in the heat storage box body, and a plurality of second heat exchange branches which are arranged in the heat storage box body and communicated with the pipeline and a plurality of third heat exchange branches which are circularly communicated with the heating pipeline which can be disconnected.
The utility model discloses still including setting up the temperature sensor group in the inlet pipeline of thermal module, outlet pipe and the heat accumulation box.
The utility model also provides an air conditioner, including foretell semiconductor heat recovery system.
Compared with the prior art, the utility model discloses the heat that the semiconductor heat transfer module hot junction gived off absorbs and transports to the storage of heat storage module through the heat accumulation medium, makes the heat in semiconductor heat transfer module hot junction get up by the storage reserve when the refrigeration. The operation environment of the semiconductor during refrigeration is improved, and the efficiency of the semiconductor refrigeration is improved; meanwhile, the energy utilization rate is improved, and the waste heat in the semiconductor air conditioner is subjected to heat recovery treatment.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required for the embodiments or the prior art descriptions will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without inventive labor.
Fig. 1 is a schematic structural diagram in an embodiment of the present invention.
Detailed Description
In order to make the technical problem, technical solution and advantageous effects to be solved by the present invention more clearly understood, the following description is given in conjunction with the accompanying drawings and embodiments to illustrate the present invention in further detail. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
The principles and structure of the present invention will be described in detail below with reference to the accompanying drawings and examples.
As shown in fig. 1, the utility model provides a semiconductor heat recovery system, include: semiconductor heat exchange module 1, heat dissipation module 2 and thermal storage module 3, the one end of semiconductor heat exchange module 1 is the cold junction, fin heat exchanger and fan are installed to semiconductor heat exchange module 1's cold junction, see off the cold volume of semiconductor heat exchange module cold junction, the other end of semiconductor heat exchange module 1 is the hot junction, heat dissipation module 2 sets up the hot junction at semiconductor heat exchange module 1, carry out the heat exchange with semiconductor heat exchange module 1's hot junction, thermal storage module 3 passes through pipeline 4 and 2 circulation intercommunications of heat dissipation module, be equipped with the pump body on pipeline 4, the heat that semiconductor heat exchange module 1 hot junction gived off is absorbed and is transported to thermal storage module 3 storage through the heat accumulation medium, the heat that makes semiconductor heat exchange module hot junction get up the. The operation environment of the semiconductor during refrigeration is improved, and the efficiency of the semiconductor refrigeration is improved; meanwhile, the energy utilization rate is improved, and the waste heat in the semiconductor air conditioner is subjected to heat recovery treatment.
The heat dissipation module 2 comprises a plurality of first heat exchange branches, the heat exchange branches are communicated with the pipeline and are connected in parallel side by side, the first heat exchange branches can be arranged in a micro-channel mode and are uniformly distributed at the hot end of the semiconductor heat exchange module, and heat exchange efficiency is improved. The semiconductor heat exchange module 1 comprises a plurality of semiconductor heat exchange units arranged side by side, and each semiconductor heat exchange unit corresponds to one heat exchange branch and also can correspond to a plurality of heat exchange branches.
The heat storage module 3 includes: the heat storage box, many second heat transfer branch roads, the heat accumulation medium of third heat transfer branch road and splendid attire in the heat storage box, second heat transfer branch road and third heat transfer branch road all set up in the box, second heat transfer branch road and third heat transfer branch road also all adopt the form setting of microchannel, second heat transfer branch road transports the heat accumulation medium with the pipeline intercommunication, third heat transfer branch road and heat supply pipeline 5 intercommunication, heat supply pipeline 5 intercommunication domestic water pipeline, be equipped with the ooff valve on the heat supply pipeline and open the heat supply pipeline, make the heat of storage can be used for heating domestic water, be used for washing dishes laundry etc..
The utility model discloses still include temperature sensor group and controller, temperature sensor group contains that three temperature sensor sets up respectively in heat radiation module's inlet line, outlet pipe and box, can be arranged to the temperature of heat accumulation medium in heat radiation module inlet line and the outlet pipe in the pipeline to and the temperature of the heat accumulation medium of splendid attire in the box, wherein the temperature of inlet line is T1, and the temperature of outlet pipe is T2, and the temperature of the heat accumulation medium that holds in the box is T0.
The control is as follows: when the difference between the temperature T1 of the inlet pipeline and the temperature T2 of the outlet pipeline is smaller than a first preset value C1, or when the difference between the temperature T1 of the inlet pipeline and the temperature T0 of a heat storage medium contained in the box body is smaller than a second preset value C2, or when the difference between the temperature in the heat storage module within a preset time delta T (namely delta T0/. delta.t) is smaller than a third preset value C3, the situation that the heat storage medium is basically close to a state incapable of storing heat energy is indicated, at the moment, the heat storage module cannot exchange heat with the heat dissipation module, the semiconductor heat exchange module cannot normally perform cooling operation is caused, and at the moment, the controller automatically opens a switch valve of the heat supply pipeline, so that the normal operation of the semiconductor air conditioner is ensured.
The utility model also provides an air conditioner, including above-mentioned semiconductor heat recovery system, specifically be semiconductor kitchen air conditioner. By adopting the heat recovery system, the heat generated by the semiconductor kitchen air conditioner can be taken away in time without accumulation, the operation environment of the semiconductor during refrigeration is improved, and the efficiency of the semiconductor refrigeration is improved; meanwhile, the energy utilization rate is improved, and the waste heat in the semiconductor air conditioner is subjected to heat recovery treatment.
The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, as any modifications, equivalents, improvements and the like made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.
Claims (7)
1. A semiconductor heat recovery system comprising: semiconductor heat exchange module, its characterized in that still includes: the heat dissipation module is arranged at the hot end of the semiconductor heat exchange module, the heat storage module exchanges heat with the heat dissipation module through the heat storage medium to store heat, and the heat supply pipeline can exchange heat with the heat storage module and can be switched.
2. The semiconductor heat recovery system of claim 1, wherein the thermal storage module and the heat dissipation module are in circulating communication through a pipe, and a pump body is provided on the pipe.
3. The semiconductor heat recovery system of claim 2, wherein the heat dissipation module comprises: and the first heat exchange branch circuits are in contact heat exchange with the hot ends of the semiconductor heat exchange modules and are communicated with the pipeline.
4. The semiconductor heat recovery system of claim 3, wherein the semiconductor heat exchange module comprises a plurality of semiconductor heat exchange units arranged side by side, each semiconductor heat exchange unit corresponding to one or more first heat exchange branches.
5. The semiconductor heat recovery system of claim 2, wherein the thermal storage module comprises: the heat storage box body is filled with a heat storage medium in the heat storage box body, and a plurality of second heat exchange branches which are arranged in the heat storage box body and communicated with the pipeline and a plurality of third heat exchange branches which are circularly communicated with the heating pipeline which can be disconnected.
6. The semiconductor heat recovery system of claim 5, further comprising a set of temperature sensors disposed in the inlet line, the outlet line, and the thermal storage tank of the heat dissipation module.
7. An air conditioner characterized by comprising the semiconductor heat recovery system according to any one of claims 1 to 6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922438896.2U CN211400158U (en) | 2019-12-30 | 2019-12-30 | Semiconductor heat recovery system and air conditioner |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922438896.2U CN211400158U (en) | 2019-12-30 | 2019-12-30 | Semiconductor heat recovery system and air conditioner |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211400158U true CN211400158U (en) | 2020-09-01 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
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| CN201922438896.2U Active CN211400158U (en) | 2019-12-30 | 2019-12-30 | Semiconductor heat recovery system and air conditioner |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211400158U (en) |
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2019
- 2019-12-30 CN CN201922438896.2U patent/CN211400158U/en active Active
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