CN211376654U - Silicon wafer cleaning equipment - Google Patents
Silicon wafer cleaning equipment Download PDFInfo
- Publication number
- CN211376654U CN211376654U CN201922325001.4U CN201922325001U CN211376654U CN 211376654 U CN211376654 U CN 211376654U CN 201922325001 U CN201922325001 U CN 201922325001U CN 211376654 U CN211376654 U CN 211376654U
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- CN
- China
- Prior art keywords
- silicon wafer
- air knife
- set forth
- cleaning apparatus
- walking arm
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 85
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 85
- 239000010703 silicon Substances 0.000 title claims abstract description 85
- 238000004140 cleaning Methods 0.000 title claims abstract description 54
- 230000006698 induction Effects 0.000 claims abstract description 15
- 238000004891 communication Methods 0.000 claims description 4
- 239000002699 waste material Substances 0.000 abstract description 4
- 235000012431 wafers Nutrition 0.000 description 53
- 238000007639 printing Methods 0.000 description 4
- 238000007664 blowing Methods 0.000 description 3
- 230000003749 cleanliness Effects 0.000 description 3
- 230000001939 inductive effect Effects 0.000 description 3
- 238000001035 drying Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000011086 high cleaning Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000005245 sintering Methods 0.000 description 1
Images
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
The utility model provides a silicon chip cleaning device, include the walking arm and install the cleaning device of walking arm side, cleaning device includes fixing device, installs air knife device, silicon chip strutting arrangement on the fixing device, install induction system on the silicon chip strutting arrangement and with induction system telecommunications or signal connection's controlling means, controlling means control the switching of air knife device. Compared with the prior art, the utility model discloses a set up the induction system of response silicon chip on cleaning device to it is clean to make cleaning device carry out the silicon chip automatically through induction system's response, has avoided compressed air's waste, has reduced the noise that compressed air produced and has effectively clear away the dirty on silicon chip surface.
Description
Technical Field
The utility model relates to a silicon chip processing technology field especially relates to a silicon chip cleaning device.
Background
With the vigorous development of new energy, solar energy is paid more and more attention by virtue of the characteristics of reliability, safety, environmental protection, resource sufficiency and the like. Under the background of vigorous popularization and use of green solar energy, the demand of solar cells is also increasing day by day.
In the production process of solar cells, the screen printing of silicon wafers is the most important and the most delicate ring in the whole process, and the requirement on the cleanliness of the surfaces of the silicon wafers is very high. The silk-screen printing comprises a plurality of procedures of printing, drying, printing and sintering, and after the silicon wafer is dried by a drying oven, the surface of the silicon wafer can be adhered to residual organic matters, dust and other dirt inevitably.
Meanwhile, after the silicon wafer moves through the walking arm, the silicon wafer contacts the walking arm to cause the surface of the silicon wafer to be dirty. If the surface of the silicon wafer is dirty, when the silicon wafer moves to a position below the printing screen plate for printing, the silicon wafer is light and causes grid breaking, and heavy and causes grid breaking.
Accordingly, there is a need to provide a silicon wafer cleaning apparatus to solve the above problems.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide an effectively dirty silicon chip cleaning device in clean silicon chip surface.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
the silicon wafer cleaning equipment comprises a walking arm and a cleaning device arranged on the side edge of the walking arm, wherein the cleaning device comprises a fixing device, an air knife device arranged on the fixing device, a silicon wafer supporting device, an induction device arranged on the silicon wafer supporting device and a control device in telecommunication or signal connection with the induction device, and the control device controls the air knife device to be opened and closed.
As the utility model discloses further modified technical scheme, the air knife device provides the gaseous intercommunication of equipment with high-pressure gas, high-pressure gas that high-pressure gas provided equipment blows to the silicon chip through the air knife device.
As the utility model discloses further modified technical scheme, the air knife device includes the air knife main part and installs a plurality of air knife nozzles in the air knife main part, shown air knife main part and the gaseous intercommunication of air knife nozzle.
As a further improved technical scheme of the utility model, the length of air knife main part is unanimous with the length of silicon chip generally.
As a further improved technical solution of the present invention, the fixing device includes an apron located at the side of the walking arm, and two bases on the apron and a connecting rod installed on the two bases.
As the utility model discloses further modified technical scheme, the upper end of apron is towards the direction slope of walking arm, the upper end at the apron is all installed to base and connecting rod.
As a further improved technical scheme of the utility model, the one end and the base swivelling joint of connecting rod, the other end and air knife device swivelling joint.
As a further improved technical scheme of the utility model, be equipped with the slide rail that extends along apron length on the apron, the base can be followed with silicon chip strutting arrangement the slide rail slides.
As a further improved technical solution of the present invention, the control device comprises a signal amplifier and a solenoid valve installed on the high-pressure gas supply device, and the sensing device, the signal amplifier and the solenoid valve are sequentially connected by telecommunication or signal; the sensing device is an infrared sensing device.
As a further improved technical scheme of the utility model, cleaning device is two, two cleaning device set up the both sides at the walking arm respectively.
The utility model has the advantages that: the induction device for inducing the silicon wafer is arranged on the cleaning device, so that the cleaning device can automatically clean the silicon wafer through the induction of the induction device, the waste of compressed air is avoided, the noise generated by the compressed air is reduced, and the dirt on the surface of the silicon wafer is effectively removed.
Drawings
Fig. 1 is a schematic view of the silicon wafer cleaning device of the present invention.
Fig. 2 is a schematic view of the cleaning device of the present invention.
Fig. 3 is an enlarged view of a portion a in fig. 2.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention clearer, the present invention will be described in detail with reference to the accompanying drawings and specific embodiments.
Referring to fig. 1, the silicon wafer cleaning apparatus of the present invention includes a walking arm 1 and a cleaning device 2 installed at the side of the walking arm 1. The silicon wafer 3 is placed on the walking arm 1, the walking arm 1 can drive the silicon wafer 3 to move, and the silicon wafer 3 can be moved to the cleaning device 2 for cleaning.
Referring to fig. 2, the cleaning device 2 includes a fixing device 21, an air knife device 22, a silicon wafer supporting device 23, a sensing device 24 and a control device 25. The cleaning device 2 is mainly used for cleaning dirt on the surface of the silicon wafer 3, and has the advantages of high cleaning efficiency and cleanliness, simple structure and convenience in operation.
Referring to fig. 2 and 3, the fixing device 21 is mainly used for fixing the air knife device 22 on the side of the traveling arm 1, and includes a cover 211, two bases 212, and a connecting rod 213 mounted on the two bases 212. The cover plate 211 is located at the side of the traveling arm 1, and the upper end of the cover plate is inclined towards the traveling arm 1, so that the silicon wafer 3 placed on the silicon wafer supporting device 23 is staggered with the air knife device 22, and the silicon wafer 3 is prevented from colliding with the air knife device 22 when being lifted upwards and moved. In addition, the upper end of the cover 211 is provided with a slide rail 210 extending along the length of the cover 211.
The two bases 212 are mounted on the upper end of the cover plate 211 and can slide along the slide rail 210, so as to drive the air knife device 22 to move along the slide rail 210. One end of the connecting rod 213 is rotatably connected with the base 212 through the bolt 214, and the other end is also rotatably connected with the air knife device 22 through the bolt 214, so that the air knife device 22 rotates 360 degrees, cleaning operation in any direction can be performed, and cleaning of the multi-size and multi-angle silicon wafer 3 is further met.
The air knife device 22 is installed on the fixing device 21 and is in gas communication with the high-pressure gas supply apparatus 4, and the high-pressure gas supplied from the high-pressure gas supply apparatus 4 can be blown toward the silicon wafer 3 through the air knife device 22. The air knife device 22 includes an air knife main body 221 and a plurality of air knife nozzles 222 installed on the air knife main body 221, and the air knife main body 221 is in gas communication with the air knife nozzles 222. The length of the air knife main body 221 is substantially consistent with that of the silicon wafer 3, so that each area on the silicon wafer 3 can be cleaned at one time, and the cleaning efficiency is high. Compared with a common air knife blowing hole, the air knife nozzle 222 can effectively increase the air speed of compressed air blowing, so that certain firmer dirt on the surface of the silicon wafer 3 can be removed, and the silicon wafer has higher cleanliness.
Referring to fig. 2, the silicon wafer supporting device 23 is mounted on the upper end of the cover plate 211, and is mainly used for supporting the silicon wafer 3. The induction device 24 is installed on the silicon wafer supporting device 23 and is mainly used for inducing whether the silicon wafer 3 is loaded on the silicon wafer supporting device 23. In addition, the sensing device 24 is an infrared sensing device, and the sensing is sensitive.
The control device 25 is mainly used for controlling the opening and closing of the air knife device 22, and includes a signal amplifier 251 and an electromagnetic valve 252 installed on the high-pressure gas supply device 4, and the sensing device 24, the signal amplifier 251 and the electromagnetic valve 252 are sequentially connected by telecommunication or signal. The sensing device 24 transmits a sensing signal to the signal amplifier 251, the signal amplifier 251 amplifies the signal and transmits the signal to the electromagnetic valve 252, and the electromagnetic valve 252 controls the high-pressure gas supply device 4 to be opened and closed through different sensing signals, so as to control the air knife device 22 to be opened and closed.
When the silicon wafer 3 does not move onto the silicon wafer supporting device 23, the electromagnetic valve 252 is closed, and the air knife device 22 stops blowing; when the silicon wafer 3 moves to the silicon wafer supporting device 23, the electromagnetic valve 252 is opened, and the air knife device 22 starts to blow, so that the waste of compressed air is avoided, and the noise generated by the compressed air is reduced.
The utility model discloses in, cleaning device 2 is two, and two cleaning device 2 set up the both sides at walking arm 1 respectively. When the walking arm 1 drives the silicon wafer 3 to move to the cleaning device 2, the cleaning device 2 cleans the silicon wafer 3 from two ends to the middle part. By adopting the cleaning mode, on one hand, the cleaning device 2 can clean the whole surface of the silicon wafer 3; on the other hand, the two ends of the silicon wafer 3 are the supporting positions of the silicon wafer supporting device 23, so that the silicon wafer 3 can be effectively prevented from being damaged when high-pressure gas is cleaned.
To sum up, the utility model provides a silicon chip cleaning device, include walking arm 1 and install the cleaning device 2 at 1 side of walking arm. The silicon wafer cleaning equipment is characterized in that the induction device 224 for inducing the silicon wafer 3 is arranged on the cleaning device 2, so that the cleaning device 2 can automatically clean the silicon wafer 3 through the induction of the induction device 24, the waste of compressed air is avoided, the noise generated by the compressed air is reduced, and the dirt on the surface of the silicon wafer 3 is effectively removed.
Terms such as "upper," "lower," "left," "right," "front," "rear," and the like, used herein to denote relative spatial positions, are used for ease of description to describe one feature's relationship to another feature as illustrated in the figures. It will be understood that the spatially relative positional terms may be intended to encompass different orientations than those shown in the figures depending on the product presentation position and should not be construed as limiting the claims.
In addition, the above embodiments are only used for illustrating the present invention and not for limiting the technical solutions described in the present invention, and the understanding of the present specification should be based on the technical personnel in the technical field, and although the present specification has described the present invention in detail with reference to the above embodiments, the person of ordinary skill in the art should understand that the person of ordinary skill in the art can still modify the present invention or substitute the same, and all the technical solutions and modifications that do not depart from the spirit and scope of the present invention should be covered within the scope of the claims of the present invention.
Claims (10)
1. The utility model provides a silicon chip cleaning equipment, includes the walking arm and installs the cleaning device of walking arm side, its characterized in that: the cleaning device comprises a fixing device, an air knife device arranged on the fixing device, a silicon wafer supporting device, an induction device arranged on the silicon wafer supporting device and a control device in telecommunication or signal connection with the induction device, wherein the control device controls the air knife device to be opened and closed.
2. The silicon wafer cleaning apparatus as set forth in claim 1, wherein: the air knife device is in gas communication with the high-pressure gas supply equipment, and the high-pressure gas supplied by the high-pressure gas supply equipment is blown to the silicon wafer through the air knife device.
3. The silicon wafer cleaning apparatus as set forth in claim 1, wherein: the air knife device comprises an air knife main body and a plurality of air knife nozzles arranged on the air knife main body, and the air knife main body is in gas communication with the air knife nozzles.
4. The silicon wafer cleaning apparatus as set forth in claim 3, wherein: the length of the air knife main body is approximately consistent with that of the silicon wafer.
5. The silicon wafer cleaning apparatus as set forth in claim 1, wherein: the fixing device comprises a cover plate positioned on the side edge of the walking arm, two bases arranged on the cover plate and connecting rods arranged on the two bases.
6. The silicon wafer cleaning apparatus as set forth in claim 5, wherein: the upper end of apron is towards the direction slope of walking arm, base and connecting rod are all installed in the upper end of apron.
7. The silicon wafer cleaning apparatus as set forth in claim 5, wherein: one end of the connecting rod is rotatably connected with the base, and the other end of the connecting rod is rotatably connected with the air knife device.
8. The silicon wafer cleaning apparatus as set forth in claim 5, wherein: the silicon wafer support device comprises a base, a silicon wafer support device and a cover plate, wherein the cover plate is provided with a slide rail extending along the length of the cover plate, and the base and the silicon wafer support device can slide along the slide rail.
9. The silicon wafer cleaning apparatus as set forth in claim 2, wherein: the control device comprises a signal amplifier and an electromagnetic valve arranged on the high-pressure gas supply equipment, and the sensing device, the signal amplifier and the electromagnetic valve are sequentially in telecommunication or signal connection; the sensing device is an infrared sensing device.
10. The silicon wafer cleaning apparatus as set forth in claim 1, wherein: the number of the cleaning devices is two, and the two cleaning devices are respectively arranged on two sides of the walking arm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922325001.4U CN211376654U (en) | 2019-12-23 | 2019-12-23 | Silicon wafer cleaning equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922325001.4U CN211376654U (en) | 2019-12-23 | 2019-12-23 | Silicon wafer cleaning equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211376654U true CN211376654U (en) | 2020-08-28 |
Family
ID=72151386
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922325001.4U Expired - Fee Related CN211376654U (en) | 2019-12-23 | 2019-12-23 | Silicon wafer cleaning equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211376654U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111940114A (en) * | 2020-09-15 | 2020-11-17 | 亚洲硅业(青海)股份有限公司 | Polycrystalline silicon lump material crusher |
-
2019
- 2019-12-23 CN CN201922325001.4U patent/CN211376654U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111940114A (en) * | 2020-09-15 | 2020-11-17 | 亚洲硅业(青海)股份有限公司 | Polycrystalline silicon lump material crusher |
| CN111940114B (en) * | 2020-09-15 | 2021-08-31 | 亚洲硅业(青海)股份有限公司 | Polycrystalline silicon lump material crusher |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: No. 199, Lushan Road, Suzhou hi tech Zone, Suzhou City, Jiangsu Province Patentee after: CSI Cells Co.,Ltd. Patentee after: Atlas sunshine Power Group Co.,Ltd. Address before: No. 199, Lushan Road, Suzhou hi tech Zone, Suzhou City, Jiangsu Province Patentee before: CSI Cells Co.,Ltd. Patentee before: CSI SOLAR POWER GROUP Co.,Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200828 Termination date: 20211223 |