CN211352903U - Power amplifier capable of effectively dissipating heat - Google Patents
Power amplifier capable of effectively dissipating heat Download PDFInfo
- Publication number
- CN211352903U CN211352903U CN201922332670.4U CN201922332670U CN211352903U CN 211352903 U CN211352903 U CN 211352903U CN 201922332670 U CN201922332670 U CN 201922332670U CN 211352903 U CN211352903 U CN 211352903U
- Authority
- CN
- China
- Prior art keywords
- power amplifier
- heat
- heat dissipation
- box body
- bolts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses an effective radiating power amplifier, including box subassembly, supporting legs, radiator-grid and heat dissipation fin plate, through setting up box subassembly and heat dissipation fin plate, heat-conducting plate and heat conduction post absorb the heat that the power amplifier mainboard produced, scatter the heat to the outside of box through heat dissipation fin plate, improve the radiating effect of power amplifier, avoid the high temperature to influence the normal work of the inside electronic component of power amplifier; the heat radiation fan assembly is arranged, the temperature sensor detects the temperature value near the power amplifier main board, the temperature value T1 and T2 are arranged on the temperature sensor, wherein T1 is larger than T2, the microcontroller controls the heat radiation fan to operate at high speed when the temperature value is larger than T2, the microcontroller controls the heat radiation fan to operate at low speed when the temperature value is between T1 and T2, the microcontroller controls the heat radiation fan to stop operating when the temperature value is smaller than T2, and the operating state of the heat radiation fan is controlled according to the temperature value near the power amplifier main board, so that the purposes of saving energy and reducing consumption are achieved.
Description
Technical Field
The utility model relates to a power amplifier technical field specifically is an effective radiating power amplifier.
Background
A power amplifier, called power amplifier for short, is an amplifier which can generate maximum power output to drive a certain load under the condition of given distortion rate, the power amplifier plays the role of organization and coordination pivot in the whole sound system, to some extent, the main factor of the whole system is whether to provide good sound quality output, the power amplifier is an important component of the sound system equipment, the internal components of the power amplifier generate a large amount of heat in the use process, when heat cannot be distributed timely, the normal work of electronic circuit components can be influenced by overhigh temperature, the heat radiator and the panel of the conventional power amplifier are unreasonably designed and arranged, so that the heat radiation efficiency is low, the heat radiation effect is unsatisfactory, the normal work and the service life of electronic components of sound equipment are seriously influenced, and an effective heat radiation power amplifier is urgently needed to be developed to solve the problems and facilitate market popularization and application.
Therefore, a power amplifier with effective heat dissipation is provided.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide an effective radiating power amplifier, the box subassembly and the heat dissipation fin board that set up, heat-conducting plate and heat conduction post absorb the heat that the power amplifier mainboard produced, through the heat dissipation fin board with the heat dissipation outside of box, improve the radiating effect of power amplifier, avoid the high temperature to influence the normal work and the life of the inside electronic component of power amplifier, the radiator fan subassembly that sets up, temperature sensor detects the temperature value near the power amplifier mainboard, set up temperature value T1 and T2 on temperature sensor, wherein T1 is greater than T2, when the temperature value is greater than T2 microcontroller control radiator fan high-speed operation, when the temperature value is in between T1 and T2 microcontroller control radiator fan low-speed operation, when the temperature value is less than T2 microcontroller control radiator fan stall, carry out the control of radiator fan running state according to near the temperature value of power amplifier mainboard, reach energy saving and consumption reduction's purpose, and reduce the running cost of power amplifier, the dust screen and the radiator-grid of setting, the radiator-grid is convenient for carry on the circulation of the inside and outside air of box, improves the thermal speed of scattering and disappearing in the box, and the dust screen plays to block the effect to the impurity in the air, avoids the impurity in the air to carry out the inside of box through leading to the groove, guarantees the cleanliness in the box to the problem of mentioning in the solution background art.
In order to achieve the above object, the utility model provides a following technical scheme: the power amplifier capable of effectively dissipating heat comprises a box body assembly, four supporting legs, a heat dissipation net and heat dissipation fin plates, wherein the four supporting legs are fixed at four corners below the box body assembly through bolts, and rubber pads are arranged below the supporting legs; the number of the radiating nets is two, and the radiating nets are fixed above the box body assembly through bolts; the heat dissipation fin plates are multiple and are fixed on the left side and the right side of the box body assembly through bolts.
Preferably, the box body assembly comprises a box body, a bottom plate, a power amplifier main board, a temperature sensor, a heat conducting plate, a heat conducting column, a mounting groove, a radiating fan assembly and a junction box, wherein the bottom plate is fixed at the middle position below the inner part of the box body through a bolt; the power amplifier main board is fixed above the bottom board through bolts; the junction box is fixed above the bottom plate through bolts and is positioned on the front side of the power amplifier main board; the temperature sensor is fixed above the bottom plate through a bolt and is positioned on the left side of the power amplifier main board; the two heat conducting plates are fixed on the left side and the right side of the interior of the box body through bolts; the heat conducting columns are multiple and are welded on the inner side of the heat conducting plate; the mounting grooves are multiple and are arranged on the left side and the right side of the box body; the cooling fan assembly is arranged above the interior of the box body.
Preferably, the temperature sensor is connected with the junction box through a wire, and the temperature sensor is of a CWDZ11 type; the outer side of the heat conducting plate is attached to the inner side of the heat dissipation fin plate; the size of the mounting groove is matched with that of the heat dissipation fin, and the mounting groove is aligned with the heat dissipation fin; the junction box is connected with the mains supply through a wire.
Preferably, the cooling fan assembly comprises two through grooves, a dust screen, a cooling fan and a microcontroller, and the through grooves are formed above the box body; the number of the dust screens is two, and the dust screens are fixed inside the through grooves through bolts; the number of the heat dissipation fans is two, the heat dissipation fans are fixed above the interior of the box body through bolts, and the heat dissipation fans are aligned with the through grooves; the microcontroller is fixed in the middle of the upper portion inside the box body through bolts.
Preferably, the through grooves are aligned with the heat dissipation net, and the size of the through grooves is matched with that of the heat dissipation net; the size of the dust screen is matched with that of the through groove; the heat dissipation fan is respectively connected with the microcontroller and the junction box through wires, and the heat dissipation fan is in an ASRQ-024S2 type; the microcontroller is respectively connected with the temperature sensor and the junction box through wires, and the microcontroller is of a WQGPRS-323 type.
Compared with the prior art, the beneficial effects of the utility model are that:
1. the utility model discloses, through setting up box subassembly and heat dissipation fin board, heat-conducting plate and heat conduction post absorb the heat that the power amplifier mainboard produced, scatter the heat to the outside of box through heat dissipation fin board, improve the radiating effect of power amplifier, avoid the high temperature to influence the normal work and the life of the electronic component in the power amplifier;
2. the utility model discloses, through setting up radiator fan subassembly, temperature sensor detects the temperature value near the power amplifier mainboard, set up temperature value T1 and T2 on temperature sensor, wherein T1 is greater than T2, microcontroller control radiator fan high-speed operation when the temperature value is greater than T2, microcontroller control radiator fan low-speed operation when the temperature value is between T1 and T2, microcontroller control radiator fan out-of-service when the temperature value is less than T2, the control of radiator fan running state is carried out according to the temperature value near the power amplifier mainboard, reach energy saving and consumption reduction's purpose, and reduce the running cost of power amplifier;
3. the utility model discloses, through setting up dust screen and radiator-grid, the radiator-grid is convenient for carry on the circulation of box inside and outside air, improves the thermal speed that scatters and disappears in the box, and the dust screen plays the effect of blockking to the impurity in the air, avoids the impurity in the air to carry out the inside of box through leading to the groove, guarantees the cleanliness in the box.
Drawings
Fig. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic structural view of the case assembly of the present invention;
fig. 3 is a schematic structural diagram of the cooling fan assembly of the present invention.
In the figure: 1. a case assembly; 11. a box body; 12. a base plate; 13. a power amplifier main board; 14. a temperature sensor; 15. a heat conducting plate; 16. a heat-conducting column; 17. mounting grooves; 18. a heat dissipation fan assembly; 181. a through groove; 182. a dust screen; 183. a heat radiation fan; 184. a microcontroller; 19. a junction box; 2. supporting legs; 3. a heat-dissipating web; 4. a heat dissipation fin plate.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Example 1:
referring to fig. 1-3, the present invention provides a technical solution: a power amplifier capable of effectively dissipating heat is shown in figure 1 and comprises a box body assembly 1, four supporting legs 2, a heat dissipation net 3 and heat dissipation fin plates 4, wherein the number of the supporting legs 2 is four, the supporting legs 2 are fixed at four corners below the box body assembly 1 through bolts, and rubber pads are arranged below the supporting legs 2; the number of the radiating nets 3 is two, and the radiating nets 3 are fixed above the box body assembly 1 through bolts; the heat dissipation fin plates 4 are multiple, and the heat dissipation fin plates 4 are fixed on the left side and the right side of the box body assembly 1 through bolts.
Specifically, as shown in fig. 2, the box assembly 1 includes a box 11, a bottom plate 12, a power amplifier main board 13, a temperature sensor 14, a heat conducting plate 15, a heat conducting column 16, a mounting groove 17, a cooling fan assembly 18 and a junction box 19, wherein the bottom plate 12 is fixed at a middle position below the inside of the box 11 by bolts; the power amplifier main board 13 is fixed above the bottom board 12 through bolts; the junction box 19 is fixed above the bottom plate 12 through bolts, and the junction box 19 is positioned on the front side of the power amplifier main board 13; the temperature sensor 14 is fixed above the bottom plate 12 through a bolt, and the temperature sensor 14 is located on the left side of the power amplifier main board 13; the number of the heat conducting plates 15 is two, and the heat conducting plates 15 are fixed on the left side and the right side inside the box body 11 through bolts; the heat conducting columns 16 are multiple, and the heat conducting columns 16 are welded on the inner side of the heat conducting plate 15; the number of the mounting grooves 17 is multiple, and the mounting grooves 17 are formed in the left side and the right side of the box body 11; the heat dissipation fan assembly 18 is disposed above the inside of the case 11.
By adopting the technical scheme, the heat conducting plate 15 and the heat conducting columns 16 absorb heat generated by the power amplifier main board 13, and the heat is dissipated to the outer side of the box body 11 through the heat dissipation fin plate 4, so that the heat dissipation effect of the power amplifier is improved, and the influence of overhigh temperature on the normal work and the service life of electronic elements in the power amplifier is avoided.
Example 2:
specifically, as shown in fig. 2, the temperature sensor 14 is connected to the junction box 19 through a wire, and the temperature sensor 14 is of a CWDZ11 type; the outer side of the heat conducting plate 15 is attached to the inner side of the heat dissipation fin plate 4; the size of the mounting groove 17 is matched with that of the radiating fin plate 4, and the mounting groove 17 is aligned with the radiating fin plate 4; the junction box 19 is connected with the commercial power through a wire.
By adopting the above technical scheme, the junction box 19 is connected with the mains supply to supply power to the cooling fan 183, the temperature sensor 14 and the like, and the temperature sensor 14 detects the temperature value near the power amplifier main board 13.
Example 3:
specifically, as shown in fig. 3, the cooling fan assembly 18 includes two through slots 181, a dust screen 182, a cooling fan 183, and a microcontroller 184, where the through slots 181 are opened above the box body 11; two dust screens 182 are adopted, and the dust screens 182 are fixed inside the through grooves 181 through bolts; the number of the heat dissipation fans 183 is two, the heat dissipation fans 183 are fixed above the inside of the box body 11 through bolts, and the heat dissipation fans 183 are aligned with the through grooves 181; the microcontroller 184 is fixed at an intermediate position above the inside of the case 11 by bolts.
By adopting the technical scheme, the temperature sensors 14 are provided with the temperature values T1 and T2, wherein T1 is greater than T2, the microcontroller 184 controls the cooling fan 183 to operate at a high speed when the temperature value is greater than T2, the microcontroller 184 controls the cooling fan 183 to operate at a low speed when the temperature value is between T1 and T2, the microcontroller 184 controls the cooling fan 183 to stop operating when the temperature value is less than T2, the operating state of the cooling fan 183 is controlled according to the temperature value near the power amplifier main board 13, the purposes of saving energy and reducing consumption are achieved, and the operating cost of the power amplifier is reduced.
Example 4:
specifically, as shown in fig. 3, the through groove 181 is aligned with the heat dissipation net 3, and the size of the through groove 181 matches the size of the heat dissipation net 3; the size of the dust screen 182 is matched with that of the through groove 181; the heat radiation fan 183 is respectively connected with the microcontroller 184 and the junction box 19 through wires, and the heat radiation fan 183 is in an ASRQ-024S2 type; the microcontroller 184 is connected with the temperature sensor 14 and the junction box 19 through wires, and the microcontroller 184 is of a WQGPRS-323 type.
Through adopting above-mentioned technical scheme, radiator-grid 3 is convenient for carry on the inside and outside air's of box 11 circulation, improves the interior thermal scattered and disappearing speed of box 11, and dust screen 182 plays the effect of blockking to the impurity in the air, avoids the impurity in the air to carry out the inside of box 11 through leading to groove 181, guarantees the cleanliness in the box 11.
The working principle is as follows: the heat conducting plate 15 and the heat conducting column 16 absorb heat generated by the power amplifier main board 13, the heat is dissipated to the outer side of the box body 11 through the heat dissipating fin plate 4, the heat dissipating effect of the power amplifier is improved, the influence of overhigh temperature on the normal work and the service life of electronic components inside the power amplifier is avoided, the junction box 19 is connected with mains supply to supply power for the heat dissipating fan 183, the temperature sensor 14 and the like, the temperature sensor 14 detects the temperature value near the power amplifier main board 13, the temperature value T1 and the temperature value T2 are arranged on the temperature sensor 14, wherein T1 is larger than T2, the microcontroller 184 controls the heat dissipating fan 183 to run at high speed when the temperature value is larger than T2, the microcontroller 184 controls the heat dissipating fan 183 to run at low speed when the temperature value is between T1 and T2, the microcontroller 184 controls the heat dissipating fan 183 to stop running when the temperature value is smaller than T2, the control of the running state of, reach energy saving and consumption reduction's purpose, and reduce the running cost of power amplifier, radiator-grid 3 is convenient for carry on the inside and outside air's of box 11 circulation, improves the interior thermal speed of scattering and disappearing of box 11, and dust screen 182 plays the effect of blockking to the impurity in the air, avoids the impurity in the air to carry out the inside of box 11 through leading to groove 181, guarantees the cleanliness in the box 11.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (5)
1. An effective radiating power amplifier, its characterized in that: the box body assembly comprises a box body assembly (1), four supporting legs (2), a radiating net (3) and radiating fin plates (4), wherein the supporting legs (2) are fixed at four corners below the box body assembly (1) through bolts, and rubber pads are arranged below the supporting legs (2); the number of the radiating nets (3) is two, and the radiating nets (3) are fixed above the box body assembly (1) through bolts; the heat dissipation fin plates (4) are multiple, and the heat dissipation fin plates (4) are fixed on the left side and the right side of the box body assembly (1) through bolts.
2. The power amplifier of claim 1, wherein: the box body assembly (1) comprises a box body (11), a bottom plate (12), a power amplifier main board (13), a temperature sensor (14), a heat conducting plate (15), a heat conducting column (16), a mounting groove (17), a radiating fan assembly (18) and a junction box (19), wherein the bottom plate (12) is fixed at the middle position below the inner part of the box body (11) through a bolt; the power amplifier main board (13) is fixed above the bottom board (12) through bolts; the junction box (19) is fixed above the bottom plate (12) through bolts, and the junction box (19) is positioned on the front side of the power amplifier main board (13); the temperature sensor (14) is fixed above the bottom plate (12) through a bolt, and the temperature sensor (14) is positioned on the left side of the power amplifier main board (13); the number of the heat conduction plates (15) is two, and the heat conduction plates (15) are fixed on the left side and the right side inside the box body (11) through bolts; the heat conducting columns (16) are multiple, and the heat conducting columns (16) are welded on the inner side of the heat conducting plate (15); the number of the mounting grooves (17) is multiple, and the mounting grooves (17) are formed in the left side and the right side of the box body (11); the heat radiation fan component (18) is arranged above the inner part of the box body (11).
3. The power amplifier of claim 2, wherein: the temperature sensor (14) is connected with the junction box (19) through a wire, and the temperature sensor (14) is of a CWDZ11 type; the outer side of the heat conducting plate (15) is attached to the inner side of the heat radiating fin plate (4); the size of the mounting groove (17) is matched with that of the heat dissipation fin plate (4), and the mounting groove (17) is aligned with the heat dissipation fin plate (4); the junction box (19) is connected with commercial power through a wire.
4. The power amplifier of claim 2, wherein: the heat dissipation fan assembly (18) comprises two through grooves (181), a dust screen (182), a heat dissipation fan (183) and a microcontroller (184), wherein the through grooves (181) are formed in the upper portion of the box body (11); the number of the dust screens (182) is two, and the dust screens (182) are fixed in the through grooves (181) through bolts; the number of the heat dissipation fans (183) is two, the heat dissipation fans (183) are fixed above the interior of the box body (11) through bolts, and the heat dissipation fans (183) are aligned with the through grooves (181); the microcontroller (184) is fixed at the middle position above the inner part of the box body (11) through bolts.
5. The power amplifier of claim 4, wherein: the through groove (181) is aligned with the heat dissipation net (3), and the size of the through groove (181) is matched with that of the heat dissipation net (3); the size of the dust screen (182) is matched with that of the through groove (181); the heat dissipation fan (183) is respectively connected with the microcontroller (184) and the junction box (19) through wires, and the heat dissipation fan (183) is in an ASRQ-024S2 type; the microcontroller (184) is respectively connected with the temperature sensor (14) and the junction box (19) through wires, and the microcontroller (184) is of a WQGPRS-323 type.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922332670.4U CN211352903U (en) | 2019-12-23 | 2019-12-23 | Power amplifier capable of effectively dissipating heat |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922332670.4U CN211352903U (en) | 2019-12-23 | 2019-12-23 | Power amplifier capable of effectively dissipating heat |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211352903U true CN211352903U (en) | 2020-08-25 |
Family
ID=72096203
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922332670.4U Expired - Fee Related CN211352903U (en) | 2019-12-23 | 2019-12-23 | Power amplifier capable of effectively dissipating heat |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211352903U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114430282A (en) * | 2020-10-29 | 2022-05-03 | 唐小兰 | Wireless data receiver who possesses from cooling function |
-
2019
- 2019-12-23 CN CN201922332670.4U patent/CN211352903U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114430282A (en) * | 2020-10-29 | 2022-05-03 | 唐小兰 | Wireless data receiver who possesses from cooling function |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN110519967B (en) | Power module | |
| CN211352903U (en) | Power amplifier capable of effectively dissipating heat | |
| CN203433456U (en) | Water-cooling heat dissipation device for notebook computer | |
| CN210742807U (en) | Self-cooling type computer mainframe | |
| CN206115350U (en) | Heat dissipation type IPC industrial computer | |
| CN213517858U (en) | Projector light source with efficient heat dissipation system | |
| CN210166749U (en) | Hardware heat dissipation tool for computer network | |
| CN214170075U (en) | Fan room capable of quickly dissipating heat | |
| CN211579733U (en) | Motor heat dissipation frame device for new energy automobile | |
| CN211047657U (en) | L ED is heat sink for display screen | |
| CN212586825U (en) | Dustproof heat abstractor suitable for computer CPU | |
| CN213693731U (en) | Firewall equipment | |
| CN217115342U (en) | Sewage treatment switch board initiative heat abstractor | |
| CN210537216U (en) | Circuit board cooling device | |
| CN211293827U (en) | Quick radiating computer machine case | |
| CN220509339U (en) | Tablet personal computer with efficient heat dissipation function | |
| CN217333280U (en) | Heat radiation structure for CPU chip | |
| CN215987223U (en) | High-performance computer heat dissipation support | |
| CN214540700U (en) | Encircling computer cooling fan with noise reduction function | |
| CN217133664U (en) | Water-cooled heat abstractor for computer | |
| CN209358339U (en) | A kind of insulation hood of Mechatronic motor | |
| CN219395419U (en) | Internet server | |
| CN214795842U (en) | Automatic change computer constant temperature equipment | |
| CN218512917U (en) | Computer host radiating structure | |
| CN212910505U (en) | Intelligent device radiator |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200825 Termination date: 20211223 |