CN211351247U

CN211351247U - Semiconductor laser packaging and fixing mechanism

Info

Publication number: CN211351247U
Application number: CN202020471550.2U
Authority: CN
Inventors: 赖思玲
Original assignee: Individual
Current assignee: Individual
Priority date: 2020-04-02
Filing date: 2020-04-02
Publication date: 2020-08-25
Anticipated expiration: 2030-04-02

Abstract

The utility model discloses a semiconductor laser encapsulation fixed establishment, including the encapsulation platform, the draw-in groove has been seted up to one side on encapsulation platform top, and the inside block of draw-in groove is connected with the fixture block, and the top fixed mounting of fixture block has the curb plate, and first spout has been seted up at the middle part of curb plate one side, and the inside sliding connection of first spout has the slider, and the top cell wall and the bottom cell wall of first spout rotate through inlaying the bearing of establishing and are connected with the lead screw, and the middle part fixed mounting on curb plate top has step motor, step motor's output shaft and the one end fixed connection. The utility model discloses a step motor of installation drives the rotation of lead screw, and the lift of rotation drive slider through the lead screw drives the lift of horizontal pole through the lift of slider, and the upgrading through the horizontal pole drives two limiting plate lifts, and through the separation and the closure of two limiting plates of electric telescopic handle's telescopic control, be convenient for carry on spacing fixedly to the semiconductor laser of encapsulation, guarantee the fastness of encapsulation.

Description

Semiconductor laser packaging and fixing mechanism

Technical Field

The utility model relates to a semiconductor laser technical field, in particular to semiconductor laser encapsulation fixed establishment.

Background

Semiconductor lasers, also known as laser diodes, are lasers that use semiconductor materials as the working substance. Due to the difference in material structure, the specific process of generating laser light in different types is more specific. The common working substances include gallium arsenide, cadmium sulfide, indium phosphide, zinc sulfide and the like. The excitation mode includes three modes of electric injection, electron beam excitation and optical pumping. Semiconductor laser devices can be classified into homojunctions, single heterojunctions, double heterojunctions, and the like. The homojunction laser and the single heterojunction laser are mostly pulse devices at room temperature, and the double heterojunction laser can realize continuous work at room temperature.

The existing semiconductor laser needs to be fixedly packaged in order to guarantee packaging firmness, the semiconductor laser is generally fixed by a clamping plate at present, but the clamping of the semiconductor laser is unstable easily due to the fact that the clamping plate cannot be adjusted, and the packaging efficiency of the semiconductor laser is affected.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a semiconductor laser encapsulation fixed establishment to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: a semiconductor laser packaging and fixing mechanism comprises a packaging table, wherein one side of the top end of the packaging table is provided with a clamping groove, the inside of the clamping groove is clamped and connected with a clamping block, the top end of the clamping block is fixedly provided with a side plate, the middle part of one side of the side plate is provided with a first sliding groove, the inside of the first sliding groove is connected with a sliding block in a sliding manner, the top groove wall and the bottom groove wall of the first sliding groove are rotatably connected with a lead screw through embedded bearings, the middle part of the top end of the side plate is fixedly provided with a stepping motor, the output shaft of the stepping motor is fixedly connected with one end of the lead screw, the lead screw is in threaded connection with the middle part of the sliding block, one side of the sliding block is fixedly provided with a cross rod, the two ends of one side of the cross rod are respectively provided with a second, two electric telescopic handle's flexible end and the one side fixed connection who corresponds the limiting plate, the circular slot has been seted up at the middle part on encapsulation bench top, the inside of circular slot is rotated through inlaying the bearing of establishing and is connected with the pivot, the top fixed mounting of pivot has the boss, one side fixed mounting of boss has the connecting block.

Preferably, the bottom of the two sides of the packaging table is fixedly provided with mounting blocks, and the two sides of the top end of each mounting block are in threaded connection with fastening bolts.

Preferably, two the rubber pad is all pasted and is equipped with to limiting plate one side, two evenly distributed's anti-skidding line is seted up to one side of rubber pad.

Preferably, the sides of the circular grooves are engraved with evenly distributed scale marks.

Preferably, the inner diameter of the clamping groove is matched with the size of the clamping block, and the surface of the clamping block is fixedly provided with uniformly distributed bulges.

Preferably, the positive fixed mounting of encapsulation platform has flush mounting plate of switch, step motor control switch and electric telescopic handle control switch are installed respectively to flush mounting plate of switch's surface, step motor and electric telescopic handle are respectively through step motor control switch and electric telescopic handle control switch and external power supply electric connection.

The utility model discloses a technological effect and advantage:

(1) the rotation of the screw rod is driven by the installed stepping motor, the lifting of the sliding block is driven by the rotation of the screw rod, the lifting of the cross rod is driven by the lifting of the sliding block, the lifting of the cross rod is driven by the lifting of the cross rod to lift two limiting plates, and the separation and the closing of the two limiting plates are controlled by the extension and retraction of the electric telescopic rod, so that the packaged semiconductor laser is conveniently limited and fixed, and the packaging firmness is ensured;

(2) the connecting block through the installation is convenient for drive the rotation of boss, simultaneously through the scale mark that circular slot avris was carved and is established, is convenient for audio-visual observation boss pivoted angle, and rotation through the boss drives semiconductor laser and rotates, guarantees the encapsulation at the different positions of semiconductor laser, improves encapsulation efficiency.

Drawings

Fig. 1 is a schematic structural diagram of the present invention.

Fig. 2 is a schematic view of a local structure of the present invention.

Fig. 3 is a schematic view of the internal structure of the first chute of the present invention.

In the figure: 1. a packaging stage; 2. mounting blocks; 3. fastening a bolt; 4. a circular groove; 5. scale lines; 6. a rotating shaft; 7. a boss; 8. connecting blocks; 9. a card slot; 10. a clamping block; 11. a side plate; 12. a first chute; 13. a stepping motor; 14. a cross bar; 15. a screw rod; 16. a second chute; 17. a limiting plate; 18. an electric telescopic rod; 19. a rubber pad; 20. a switch panel; 21. a slide block.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

The utility model provides a semiconductor laser packaging fixing mechanism as shown in figures 1-3, which comprises a packaging table 1, a clamping groove 9 is arranged on one side of the top end of the packaging table 1, a clamping block 10 is connected with the internal block of the clamping groove 9, the internal diameter of the clamping groove 9 is matched with the size of the clamping block 10, and the surface of the clamping block 10 is fixedly provided with evenly distributed bulges, a side plate 11 is fixedly arranged on the top end of the clamping block 10, a first sliding groove 12 is arranged in the middle of one side of the side plate 11, a sliding block 21 is connected with the inside of the first sliding groove 12 in a sliding way, the top groove wall and the bottom groove wall of the first sliding groove 12 are rotatably connected with a screw rod 15 through embedded bearings, a stepping motor 13 is fixedly arranged in the middle of the top end of the side plate 11, the output shaft of the stepping motor 13 is fixedly connected with one end, the two ends of one side of the cross bar 14 are respectively provided with a second sliding chute 16, the two second sliding chutes 16 are respectively connected with two limiting plates 17 in a sliding manner, one side of each of the two limiting plates 17 is adhered with a rubber pad 19, one side of each of the two rubber pads 19 is provided with anti-skid lines which are uniformly distributed, the groove walls of one side of each of the two second sliding chutes 16 are respectively and fixedly provided with an electric telescopic rod 18, the telescopic ends of the two electric telescopic rods 18 are fixedly connected with one side of the corresponding limiting plate 17, the screw rod 15 is driven to rotate by the installed stepping motor 13, the slide block 21 is driven to lift by the rotation of the screw rod 15, the lifting of the sliding block 21 drives the lifting of the cross rod 14, the lifting of the cross rod 14 drives the lifting of the two limit plates 17, the telescopic electric telescopic rod 18 can be used for pushing the two limiting plates 17 to be separated and closed, so that the packaged semiconductor laser is convenient to limit and fix, and the stability of the packaged semiconductor laser is ensured.

Circular slot 4 has been seted up at the middle part on 1 top of encapsulation platform, the avris of circular slot 4 is carved with evenly distributed's scale mark 5, the inside of circular slot 4 is rotated through inlaying the bearing of establishing and is connected with pivot 6, the top fixed mounting of pivot 6 has boss 7, one side fixed mounting of boss 7 has connecting block 8, rotate the rotation that drives boss 7 through connecting block 8, rotate the rotation that drives semiconductor laser through boss 7, the control encapsulation position is adjusted well with operation workman's position.

The equal fixed mounting in bottom of encapsulation platform 1 both sides has installation piece 2, the equal threaded connection in both sides on 2 tops of two installation pieces has fastening bolt 3, fastening bolt 3 through threaded connection, be convenient for encapsulate 1 fixed of platform, the positive fixed mounting of encapsulation platform 1 has flush mounting plate of switch 20, flush mounting plate of switch 20's surface is installed step motor control switch and electric telescopic handle control switch respectively, step motor 13 and electric telescopic handle 18 are respectively through step motor control switch and electric telescopic handle control switch and external power supply electric connection.

The utility model discloses the theory of operation: when the semiconductor laser packaging and fixing mechanism needs to be used, firstly, a semiconductor laser to be packaged is manually placed at the top end of a boss 7, then, the boss 7 is manually rotated through a connecting block 8, the semiconductor laser packaging part is aligned with the position of an operator, then, a stepping motor 13 is turned on, a screw rod 15 is driven to rotate through the rotation of the stepping motor 13, a sliding block 21 is driven to descend through the rotation of the screw rod 15, a cross rod 14 is driven to descend through the descent of the sliding block 21, two limiting plates 17 are driven to descend through the descent of the cross rod 14, when the two limiting plates 17 descend to be aligned with the positions of the two sides of the semiconductor laser, the stepping motor 13 is turned off in right time, then, an electric telescopic rod 18 is controlled to be turned on through an electric telescopic rod control switch, the two limiting plates 17 are pushed to be, therefore, the limiting and fixing of the semiconductor laser are completed, and the stable packaging of the semiconductor laser is ensured.

In the description of the present invention, unless expressly stated or limited otherwise, the terms "disposed," "mounted," "connected," and "fixed" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral part; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.

The utility model discloses the standard parts that use all can purchase from the market, and dysmorphism piece all can be customized according to the record of the description with the drawing.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a semiconductor laser encapsulation fixed establishment, includes encapsulation platform (1), its characterized in that, draw-in groove (9) have been seted up to one side on encapsulation platform (1) top, the inside block of draw-in groove (9) is connected with fixture block (10), the top fixed mounting of fixture block (10) has curb plate (11), first spout (12) have been seted up at the middle part of curb plate (11) one side, the inside sliding connection of first spout (12) has slider (21), the top cell wall and the bottom cell wall of first spout (12) are connected with lead screw (15) through the bearing rotation of inlaying, the middle part fixed mounting on curb plate (11) top has step motor (13), the output shaft of step motor (13) and the one end fixed connection of lead screw (15), the middle part threaded connection of lead screw (15) and slider (21), one side fixed mounting of slider (21) has horizontal pole (14), second spout (16), two have all been seted up at the both ends of horizontal pole (14) one side the equal sliding connection in inside of second spout (16) has two limiting plates (17), two the equal fixed mounting in one side cell wall of second spout (16) has electric telescopic handle (18), two the flexible end of electric telescopic handle (18) and the one side fixed connection who corresponds limiting plate (17), circular slot (4) have been seted up at the middle part on encapsulation platform (1) top, the inside of circular slot (4) is rotated through the bearing of inlaying establishing and is connected with pivot (6), the top fixed mounting of pivot (6) has boss (7), one side fixed mounting of boss (7) has connecting block (8).

2. A semiconductor laser package mounting mechanism as claimed in claim 1, wherein: the bottom of encapsulation platform (1) both sides is equal fixed mounting has installation piece (2), two the equal threaded connection in both sides on installation piece (2) top has fastening bolt (3).

3. A semiconductor laser package mounting mechanism as claimed in claim 1, wherein: rubber pads (19) are attached to one sides of the two limiting plates (17), and anti-skid grains which are uniformly distributed are arranged on one sides of the two rubber pads (19).

4. A semiconductor laser package mounting mechanism as claimed in claim 1, wherein: and scale marks (5) which are uniformly distributed are carved on the side of the circular groove (4).

5. A semiconductor laser package mounting mechanism as claimed in claim 1, wherein: the inner diameter of the clamping groove (9) is matched with the size of the clamping block (10), and the surface of the clamping block (10) is fixedly provided with bulges which are uniformly distributed.

6. A semiconductor laser package mounting mechanism as claimed in claim 1, wherein: the front fixed mounting of encapsulation platform (1) has flush mounting plate of switch (20), step motor control switch and electric telescopic handle control switch are installed respectively to the surface of flush mounting plate of switch (20), step motor (13) and electric telescopic handle (18) are respectively through step motor control switch and electric telescopic handle control switch and external power supply electric connection.