CN211321672U

CN211321672U - PCB reflow soldering production line

Info

Publication number: CN211321672U
Application number: CN201922491953.3U
Authority: CN
Inventors: 王晓刚
Original assignee: Zhuhai Jili Development Co ltd
Current assignee: Zhuhai Jili Development Co ltd
Priority date: 2019-12-31
Filing date: 2019-12-31
Publication date: 2020-08-21
Anticipated expiration: 2029-12-31

Abstract

The utility model aims at providing a PCB board reflow soldering production line that rational in infrastructure, welding effect is good, welding speed is fast and the product uniformity is high. The utility model discloses a frame, conveyor and along preheating device, heating device, soldering tin device and the cooling device that defeated material direction set gradually, conveyor locates in the frame, conveyor be last be equipped with a plurality of respectively with preheating device heating device with soldering tin device matched with check keep off the subassembly, preheating device heating device soldering tin device and cooling device all is equipped with the heat insulating board each other, be equipped with in the frame with corresponding the driving motor of heat insulating board one-to-one, preheating device with heating device all is equipped with temperature sensor. The utility model discloses be applied to PCB board welding process's technical field.

Description

PCB reflow soldering production line

Technical Field

The utility model relates to a PCB board welding process's technical field, in particular to PCB board reflow soldering production line.

Background

The PCB is also called a printed circuit board and is a provider of electrical connection of electronic components, the PCB enables the circuit to be miniaturized and visualized, plays an important role in batch production of fixed circuits and optimization of electrical appliance layout, and has the characteristics of high wiring density, light weight, thin thickness and good bending property, so the PCB is widely used.

The existing PCB production line sequentially comprises a solder paste printing machine, a chip mounter and a reflow soldering machine, wherein a PCB firstly enters the solder paste printing machine to perform solder paste printing, then enters the chip mounter to mount electronic components, and then enters the reflow soldering machine to perform furnace returning and heating after the mounting is finished, so that the mounted electronic components are better bonded on the PCB. However, the existing reflow soldering machine is communicated with each other in functional areas such as a preheating area, a heating area and the like, and the heat transfer is fast, so that the detection and identification of the temperature sensor are not prepared enough, and the quality of a product is seriously influenced.

SUMMERY OF THE UTILITY MODEL

The utility model aims to solve the technical problem that overcome prior art not enough, provide a PCB board reflow soldering production line rational in infrastructure, that the welding is effectual, welding speed is fast and the product uniformity is high.

The utility model adopts the technical proposal that: the utility model discloses a frame, conveyor and along preheating device, heating device, soldering tin device and the cooling device that defeated material direction set gradually, conveyor locates in the frame, conveyor be last be equipped with a plurality of respectively with preheating device heating device with soldering tin device matched with check keep off the subassembly, preheating device heating device soldering tin device and cooling device all is equipped with the heat insulating board each other, be equipped with in the frame with corresponding the driving motor of heat insulating board one-to-one, preheating device with heating device all is equipped with temperature sensor.

According to the scheme, the PCB is placed on the carrier, the carrier is sequentially conveyed to the preheating device, the heating device, the soldering device and the cooling device for processing by the conveying device, and each processing procedure is provided with the block assembly, so that the PCB can be fully processed in each processing procedure; the heat insulation plates are arranged among the processing procedures, the driving motor drives the heat insulation plates to ascend or descend, and the processing procedures are communicated or isolated, so that the inaccuracy of detection of the temperature sensor caused by heat loss is avoided; and the temperature sensor is used for detecting and monitoring the temperature condition of the corresponding processing procedure area.

One preferred scheme is, conveyor includes conveyor motor and a plurality of transport element who sets gradually along defeated material direction, transport element includes base and a plurality of normal running fit in on the base and with the cylinder of conveyor motor transmission connection.

According to the scheme, the conveying motor drives the roller, so that the roller drives the carrier to move, and the transportation of the PCB materials is realized.

One preferred scheme is, the soldering tin device includes that soldering tin machine and cooperation are located jacking subassembly and the centre gripping subassembly of soldering tin machine below, the jacking subassembly include the jacking cylinder and with the jacking cylinder transmission is connected and with the ejector pin of carrier looks adaptation, the quantity of centre gripping subassembly is two, two the centre gripping subassembly is located respectively conveyor's both sides, the centre gripping subassembly include the centre gripping cylinder and with the centre gripping cylinder transmission is connected and with the splint of carrier looks adaptation.

According to the scheme, the carrier is conveyed into the soldering device, the grid block assembly blocks the carrier, then the jacking cylinder drives the ejector rod to jack upwards, the carrier is separated from the conveying device, then the clamping cylinder drives the clamping plate to fix the carrier, and finally the soldering machine performs soldering operation on the PCB products on the carrier.

One preferred scheme is, the top of ejector pin is round platform column structure, be equipped with on the carrier with the guiding hole of ejector pin looks adaptation, the bottom of guiding hole is radius platform column structure.

According to the scheme, the jacking cylinder drives the ejector rod to move upwards, the ejector rod is attached to the guide hole, and finally the carrier is jacked; in addition, the arrangement of the circular truncated cone-shaped structure plays a role in guiding and prevents over-hard collision.

One preferred scheme is, the check keep off the subassembly including check keep off the cylinder and a plurality of all with the check keep off the shelves pole that the cylinder transmission is connected, be equipped with the buffer layer on the outer wall of shelves pole.

According to the scheme, the buffer layer is arranged on the stop rod and used for buffering the carriers of the incoming materials and stopping the carriers in a blocking mode.

The cooling device comprises a shell with a hollow structure inside, cooling water arranged in the shell and a refrigerating device communicated with the inside of the shell, wherein a pipeline is arranged on the refrigerating device, the water inlet end of the pipeline is arranged at the top of the shell, the water outlet end of the pipeline is arranged at the bottom end of the shell, and the cooling water circularly flows in the shell and among the pipelines.

According to the scheme, the refrigerating device cools the cooling water, and the low-temperature state of the shell is ensured through the flowing cooling water.

According to a preferable scheme, the preheating device and the heating device are both provided with heating devices, and the heating devices are heating plates or infrared heat pipes.

Drawings

Fig. 1 is a schematic structural diagram of the present invention;

fig. 2 is a schematic structural view of the jacking assembly.

Detailed Description

As shown in fig. 1 and fig. 2, in this embodiment, the present invention includes a frame 1, a conveying device 2, and a preheating device 3, a heating device 4, a soldering device 5, and a cooling device 6 sequentially arranged along a feeding direction, wherein the conveying device 2 is arranged in the frame 1, the conveying device 2 is provided with a plurality of blocking components 7 respectively matched with the preheating device 3, the heating device 4, and the soldering device 5, the preheating device 3, the heating device 4, the soldering device 5, and the cooling device 6 are all provided with heat insulation plates 8, the frame 1 is provided with driving motors 10 corresponding to the heat insulation plates 8 one to one, and the preheating device 3 and the heating device 4 are both provided with temperature sensors 9; in the design, the utility model also comprises a control system which is respectively connected with the equipment electric signals of each processing station; an alarm is arranged on the machine frame 1.

Further, conveyor 2 includes conveyor motor and a plurality of along the conveying subassembly 11 that the material direction set gradually, conveyor subassembly 11 includes that base 12 and a plurality of normal running fit are in on the base 12 and with the cylinder that the conveyor motor transmission is connected, in this design, the surface of cylinder is equipped with prevents scraping the layer, prevent scraping the layer and adopt rubber material to make.

Further, the soldering device 5 comprises a soldering machine 13, and a jacking assembly 14 and a clamping assembly 15 which are arranged below the soldering machine 13 in a matching manner, wherein the jacking assembly 14 comprises a jacking cylinder 16 and ejector rods 18 which are in transmission connection with the jacking cylinder 16 and are matched with a carrier 17, the number of the clamping assemblies 15 is two, the two clamping assemblies 15 are respectively arranged on two sides of the conveying device 2, and each clamping assembly 15 comprises a clamping cylinder 19 and a clamping plate 20 which is in transmission connection with the clamping cylinder 19 and is matched with the carrier 17; in this design, the soldering machine 13 is an existing soldering device.

Further, the top of ejector pin 18 is round platform column structure 21, be equipped with on the carrier 17 with the guiding hole of ejector pin 18 looks adaptation, the bottom of guiding hole is inverted round platform column structure 22.

Further, check keep off subassembly 7 including check keep off cylinder 23 and a plurality of all with the shelves pole 24 that check keep off cylinder 23 transmission is connected, be equipped with the buffer layer on the outer wall of shelves pole 24, in this design, the buffer layer adopts the rubber material to make.

Further, the cooling device 6 includes a housing 25 with a hollow structure inside, cooling water disposed in the housing 25, and a refrigerating device 26 communicated with the inside of the housing 25, a pipeline is disposed on the refrigerating device 26, a water inlet end of the pipeline is disposed at the top of the housing 25, a water outlet end of the pipeline is disposed at the bottom end of the housing 25, and the cooling water circulates between the inside of the housing 25 and the pipeline; in this design, the refrigeration device 26 is an existing refrigeration appliance.

Further, a temperature raising device is arranged on each of the preheating device 3 and the heating device 4, and the temperature raising device is one of a heating plate and an infrared heat pipe.

The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the described embodiments. It will be apparent to those skilled in the art that various changes, modifications, substitutions and alterations can be made in the embodiments without departing from the principles and spirit of the invention, and the scope of the invention is to be accorded the full scope of the claims.

Claims

1. The utility model provides a PCB board reflow soldering production line which characterized in that: it comprises a frame (1), a conveying device (2), and a preheating device (3), a heating device (4), a soldering device (5) and a cooling device (6) which are arranged in sequence along the conveying direction, the conveying device (2) is arranged in the frame (1), a plurality of block components (7) which are respectively matched with the preheating device (3), the heating device (4) and the soldering device (5) are arranged on the conveying device (2), heat insulation plates (8) are arranged among the preheating device (3), the heating device (4), the soldering tin device (5) and the cooling device (6), the frame (1) is provided with driving motors (10) which correspond to the heat insulation plates (8) one by one, and the preheating device (3) and the heating device (4) are both provided with temperature sensors (9).

2. The PCB reflow soldering line of claim 1, wherein: conveyor (2) are including conveying motor and a plurality of conveying subassembly (11) that set gradually along defeated material direction, conveying subassembly (11) include base (12) and a plurality of normal running fit be in on base (12) and with the cylinder that the conveying motor transmission is connected.

3. The PCB reflow soldering line of claim 1, wherein: soldering tin device (5) are located including soldering tin machine (13) and cooperation jacking subassembly (14) and centre gripping subassembly (15) of soldering tin machine (13) below, jacking subassembly (14) including jacking cylinder (16) and with jacking cylinder (16) transmission connect and with ejector pin (18) of carrier (17) looks adaptation, the quantity of centre gripping subassembly (15) is two, two centre gripping subassembly (15) are located respectively the both sides of conveyor (2), centre gripping subassembly (15) including centre gripping cylinder (19) and with centre gripping cylinder (19) transmission connect and with splint (20) of carrier (17) looks adaptation.

4. The PCB reflow soldering line of claim 3, wherein: the top of ejector pin (18) is round platform column structure (21), be equipped with on carrier (17) with the guiding hole of ejector pin (18) looks adaptation, the bottom of guiding hole is radius platform column structure (22).

5. The PCB reflow soldering line of claim 1, wherein: the check block assembly (7) comprises a check block cylinder (23) and a plurality of check block rods (24) which are in transmission connection with the check block cylinder (23), and buffer layers are arranged on the outer walls of the check block rods (24).

6. The PCB reflow soldering line of claim 1, wherein: the cooling device (6) comprises a shell (25) with a hollow structure inside, cooling water arranged in the shell (25) and a refrigerating device (26) communicated with the inside of the shell (25), a pipeline is arranged on the refrigerating device (26), the water inlet end of the pipeline is arranged at the top of the shell (25), the water outlet end of the pipeline is arranged at the bottom end of the shell (25), and the cooling water is circulated between the inside of the shell (25) and the pipeline.

7. The PCB reflow soldering line of claim 1, wherein: and the preheating device (3) and the heating device (4) are both provided with heating devices, and the heating devices are heating plates or infrared heat pipes.