CN211317014U - Combined radiating fin device - Google Patents
Combined radiating fin device Download PDFInfo
- Publication number
- CN211317014U CN211317014U CN201922347520.0U CN201922347520U CN211317014U CN 211317014 U CN211317014 U CN 211317014U CN 201922347520 U CN201922347520 U CN 201922347520U CN 211317014 U CN211317014 U CN 211317014U
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- top panel
- heat
- fin group
- substrate
- fin
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Abstract
The utility model discloses a modular fin device, it includes the radiating seat, the radiating seat is provided with side board and top panel, side board setting is in the top panel both sides, a plurality of grooves have been seted up on the top panel, the groove link up the top panel setting, the top panel encloses with the side board and establishes and form the heat dissipation chamber, be provided with fin group in the heat dissipation chamber, the laminating of fin group sets up in the top panel below, fin group is provided with the substrate, the substrate passes through screw spare lock solid in the top panel below, the interval is provided with a plurality of heat radiation fins on the substrate, be provided with the connection piece between the heat radiation fins. The utility model discloses a set up the cross slot on the top panel of radiating seat, improve the radiating efficiency of top panel, the cooperation is fixed in the top panel below and is set up fin group, utilizes the screw spare to accomplish fin group and top panel's fixed, and the packaging efficiency of improving device utilizes radiating fin to carry out heat conduction with the heat that work substrate produced at last and disperses, has improved radiating efficiency greatly.
Description
Technical Field
The utility model belongs to the technical field of the heat dissipation technique and specifically relates to a modular fin device is related to.
Background
The heat dissipation device can increase the heat dissipation area, reduce the thermal resistance of the convection heat transfer and enhance the heat dissipation capability of the whole heat dissipation device by arranging the heat dissipation fins.
In some application scenarios, the heat dissipation fins need to be arranged on the heat dissipation seat, and the heat dissipation seat absorbs heat and then is dissipated through the heat dissipation fins, but the traditional heat dissipation fins and the heat dissipation seat are manufactured integrally, and are often affected by the space of an inner cavity of the heat dissipation seat or the overall dimension, so that the processing difficulty is increased, and the improvement of the manufacturing efficiency of the heat dissipation device is not facilitated.
SUMMERY OF THE UTILITY MODEL
Therefore, it is necessary to provide a combined heat sink device with convenient installation and good heat dissipation effect to overcome the disadvantages of the prior art.
In order to solve the technical problem, the utility model discloses the technical scheme who adopts is: the utility model provides a modular fin device, its includes the radiating seat, the radiating seat is provided with side board and top panel, the side board sets up in the top panel both sides, a plurality of wearing grooves have been seted up on the top panel, the wearing groove link up the top panel setting, the top panel encloses with the side board and establishes and form the heat dissipation chamber, be provided with the fin group in the heat dissipation chamber, the laminating of fin group sets up in the top panel below, the fin group is provided with the substrate, the substrate passes through screw spare lock solid in the top panel below, the interval is provided with a plurality of heat radiation fins on the substrate, be provided with the connection piece between the heat radiation fins.
In one embodiment, the inner side of the bottom end of the side panel is concavely provided with a clamping groove.
In one embodiment, heat pipes are disposed within the top panel, the heat pipes distributed in a serpentine shape within the top panel.
In one embodiment, two ends of the heat pipe can protrude from the side of the top panel.
In one embodiment, a plurality of fixing holes are formed between the through grooves of the top panel, and the screw pieces are clamped in the fixing holes.
To sum up, the utility model discloses combination formula fin device improves the radiating efficiency of top panel through set up the trough on the top panel of radiating seat, and the cooperation is fixed in the top panel below and is set up fin group, utilizes the screw spare to accomplish fin group and top panel's fixed, improves the packaging efficiency of device, utilizes radiating fin to carry out heat conduction with the heat that work substrate produced at last and disperses, has improved the radiating efficiency greatly.
Drawings
Fig. 1 is a schematic structural view of the combined heat sink device of the present invention;
FIG. 2 is a schematic structural view of another embodiment of the assembled heat sink device of the present invention;
fig. 3 is a top view of the combined heat sink device of the present invention.
Detailed Description
For further understanding of the features and technical means of the present invention, as well as the specific objects and functions attained by the present invention, the present invention will be described in further detail with reference to the accompanying drawings and detailed description.
As shown in fig. 1 to 3, the combined heat sink device of the present invention includes a heat sink 10, the heat sink 10 is used for being fixed on a working substrate (not shown), the heat sink 10 is provided with a side panel 11 and a top panel 12, the side panel 11 is disposed on two sides of the top panel 12, a clamping groove 111 is disposed in the inner side of the bottom end of the side panel 11, the two sides of the working substrate are respectively clamped in the clamping groove 111, so as to facilitate the stable butt joint of the heat sink 10 and the working substrate.
In one embodiment, the top panel 12 is provided with a plurality of through grooves 121, and the through grooves 121 may be disposed through the top panel 12, so as to ensure the convection property of air and improve the heat dissipation performance of the top panel 12.
A plurality of fixing holes (not shown) are formed between the through grooves 121 of the top panel 12, screw pieces 13 are clamped in the fixing holes, the top panel 12 and the side panel 11 are surrounded to form a heat dissipation cavity 14, a heat dissipation fin group 20 is arranged in the heat dissipation cavity 14, the heat dissipation fin group 20 is attached to the lower portion of the top panel 12, a substrate 21 is arranged on the heat dissipation fin group 20, and the substrate 21 is fixedly locked below the top panel 12 through the screw pieces 13, so that the mounting is convenient; a plurality of radiating fins 22 are arranged on the substrate 21 at intervals, and the heights of the radiating fins 22 can be designed into different sizes according to actual requirements, so that the radiating fins 22 can be closer to a working substrate, and the radiating efficiency of the working panel is effectively ensured; specifically, the heat dissipation fins 22 can be adjusted according to the height of the heat dissipation device on the working substrate, so that heat can be effectively dissipated without affecting the normal operation of the heat dissipation device on the working substrate, and the service life of the working substrate is prolonged.
The connecting pieces 23 are arranged between the radiating fins 22, and the connecting pieces 23 are used for being attached to a radiating device, so that the contact area between the radiating fins and the radiating device is increased, heat emitted by the radiating device is absorbed and dissipated through the radiating fins 22, and the radiating efficiency of the radiating fin group 20 is improved.
In one embodiment, the heat conducting pipes 30 are arranged in the top panel 12, the heat conducting pipes 30 are distributed in a serpentine shape in the top panel 12, and heat conduction between different heat dissipation seats 10 can be completed through the heat conducting pipes 30, so that the utilization rate of the device is improved; specifically, the two ends of the heat conductive pipe 30 may protrude from the side of the top panel 12.
To sum up, the utility model discloses combination formula fin device is through offering wearing groove 121 on the top panel 12 of radiating seat 10, improves the radiating efficiency of top panel 12, and the cooperation is fixed in top panel 12 below and is set up fin group 20, utilizes screw 13 to accomplish fin group 20 and top panel 12's fixed, improves the packaging efficiency of device, utilizes radiating fin 22 to carry out the heat conduction with the heat that work substrate produced at last and disperses, has improved radiating efficiency greatly.
The above-described embodiments are merely illustrative of several embodiments of the present invention, which are described in detail and specific, but not intended to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several variations and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (5)
1. A combined type cooling fin device is characterized in that: including the radiating seat, the radiating seat is provided with side board and top panel, the side board sets up in the top panel both sides, a plurality of grooves of wearing have been seted up on the top panel, wear the groove and link up the top panel setting, the top panel encloses with the side board and establishes and form the heat dissipation chamber, be provided with fin group in the heat dissipation chamber, fin group laminating sets up in the top panel below, fin group is provided with the substrate, the substrate passes through screw spare lock solid in the top panel below, the interval is provided with a plurality of heat radiation fins on the substrate, be provided with the connection piece between the heat radiation fin.
2. The modular heat sink device of claim 1, wherein: and a clamping groove is concavely arranged on the inner side of the bottom end of the side panel.
3. The modular heat sink device of claim 1 or 2, wherein: the heat conduction pipe is arranged in the top panel and distributed in the top panel in a snake shape.
4. The modular heat sink device of claim 3, wherein: two ends of the heat conducting pipe can protrude out from the side surface of the top panel.
5. The modular heat sink device of claim 1 or 2, wherein: the top panel is provided with a plurality of fixing holes between the through grooves, and the screw piece is clamped in the fixing holes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922347520.0U CN211317014U (en) | 2019-12-24 | 2019-12-24 | Combined radiating fin device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922347520.0U CN211317014U (en) | 2019-12-24 | 2019-12-24 | Combined radiating fin device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211317014U true CN211317014U (en) | 2020-08-21 |
Family
ID=72082732
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922347520.0U Active CN211317014U (en) | 2019-12-24 | 2019-12-24 | Combined radiating fin device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211317014U (en) |
-
2019
- 2019-12-24 CN CN201922347520.0U patent/CN211317014U/en active Active
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