CN211297538U - Heat radiation system of motor driver of wafer machine frame box body and air inlet device thereof - Google Patents

Heat radiation system of motor driver of wafer machine frame box body and air inlet device thereof Download PDF

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Publication number
CN211297538U
CN211297538U CN202020247334.XU CN202020247334U CN211297538U CN 211297538 U CN211297538 U CN 211297538U CN 202020247334 U CN202020247334 U CN 202020247334U CN 211297538 U CN211297538 U CN 211297538U
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Prior art keywords
air intake
air inlet
exhaust pipe
cavity
intake portion
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CN202020247334.XU
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Chinese (zh)
Inventor
樊玉勇
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Warship Chip Manufacturing Suzhou Ltd By Share Ltd
Hejian Technology Suzhou Co Ltd
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Warship Chip Manufacturing Suzhou Ltd By Share Ltd
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Priority to CN202020247334.XU priority Critical patent/CN211297538U/en
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  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The utility model relates to an air inlet device, which comprises a first air inlet part, wherein the first air inlet part comprises a cavity; a plurality of second air intake portions each including a cavity and a hole communicating from the cavity to an outside of the second air intake portion; wherein each of the plurality of second air intake portions is connected to the first air intake portion at an angle in the respective extending direction and the cavity of the first air intake portion communicates with the cavity of each of the plurality of second air intake portions. The utility model discloses still relate to a wafer board frame box's motor driver's cooling system, including the blast pipe, the one end intercommunication of blast pipe communicates to as above air inlet unit. The utility model discloses a cooling system inserts air inlet unit with exhaust pipe's air inlet, places air inlet unit in the heat dissipation part position of frame box for can get into exhaust pipe at once with the heat. And an external fan is not needed.

Description

Heat radiation system of motor driver of wafer machine frame box body and air inlet device thereof
Technical Field
The utility model belongs to the technical field of the wafer board, especially, relate to a motor driver's of wafer board frame box cooling system and air inlet unit thereof.
Background
In the prior art, the air inlet of the exhaust pipeline of the AMP (power amplifier) rack box of the wafer machine is designed to the top of the machine, the distance from the heating component is far, the heat dissipation effect is poor, heat is accumulated in the AMP rack box, the service life of the component is shortened, and the abnormal rate is increased.
When the heat dissipation problem causes the driving motor in the AMP rack box to be in failure, each driving motor in the AMP rack box uses an external fan to accelerate the heat dissipation speed in the AMP rack box. But the disadvantage of this approach is that the door of the AMP rack box cannot be closed due to the presence of the external fan; and the external fan is messy and has no protective measures, so that the risk hidden danger exists.
Therefore, an improved heat dissipation system is needed, so that on the basis of good heat dissipation of the AMP rack box body, the door of the AMP rack box body can be closed, and the risk potential that the external fan is messy does not exist.
SUMMERY OF THE UTILITY MODEL
In view of the above, it is a need to solve the above technical problems, and an object of the present invention is to provide a heat dissipation system for a motor driver of a wafer machine rack box and an air inlet device thereof.
Based on the purpose, the following technical scheme is adopted:
according to the utility model discloses, a gas inlet unit is provided, include:
a first air intake portion including a cavity;
a plurality of second air intake portions each including a cavity and a hole communicating from the cavity to an outside of the second air intake portion;
wherein each of the plurality of second air intake portions is connected to the first air intake portion at an angle in the respective extending direction and the cavity of the first air intake portion communicates with the cavity of each of the plurality of second air intake portions.
Further, the first air inlet portion further comprises a side wall, a top wall and a bottom wall, the cavity is enclosed by the side wall, the bottom wall and the top wall, and the bottom wall of the first air inlet portion is provided with an opening.
Further, the hole of the second air intake portion is provided on at least one surface of the second air intake portion.
Further, the diameter of the hole is 5-6 mm.
Further, the number of the holes provided on at least one surface is plural, and the hole-to-hole interval is 8-9 mm.
Further, each of the plurality of second air intake portions is perpendicularly connected to the first air intake portion in the respective extending direction.
Further, the material of the first air inlet portion and the plurality of second air inlet portions is the same, and the material is stainless steel, polypropylene, polyethylene terephthalate, polyamide or polyether ether ketone.
According to the utility model discloses, still provide a wafer board frame box's motor driver's cooling system, include:
the rack box body comprises a plurality of partition plates which are arranged in parallel and divide the rack box body into a plurality of spaces;
the exhaust pipe base is arranged on the bottom plate at one side of the rack box body and is provided with an opening through which airflow passes;
one end of the exhaust pipe is communicated with the opening of the exhaust pipe base, and the other end of the exhaust pipe is communicated to the air inlet device;
and the air inlet device communicated with the exhaust pipe is arranged on the partition plate of the frame box body.
Further, the material of the exhaust pipe is a rubber pipe, a PVC plastic pipe or a polypropylene pipe.
Further, the other end of the exhaust pipe is communicated to the opening of the bottom wall of the first air inlet part of the air inlet device.
The utility model discloses following beneficial technological effect has: the utility model discloses a cooling system inserts air inlet unit with exhaust pipe's air inlet, places air inlet unit in the position that the radiating part of frame box was located for can get into exhaust pipe at once with the heat, and need not to set up external fan and dispel the heat.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other embodiments can be obtained according to the drawings without creative efforts.
FIG. 1 is a schematic front view of a housing of a wafer machine rack of the prior art;
FIG. 2 is a schematic left side view of the housing of the wafer tool rack of FIG. 1;
fig. 3 is (a) a schematic view of an air intake apparatus according to an embodiment of the present invention; (b) is a schematic view of a first exhaust pipe of an embodiment of the present invention.
[ description of reference ]
1: a rack box body; 11: an exhaust pipe top seat; 12: an exhaust pipe base; 13: a first exhaust pipe; 14: a second exhaust pipe; 15: a third exhaust pipe; 16: a first opening; 17: a second opening; 18: a first air inlet; 19: a second air inlet; 111: a first separator; 112: a second separator; 113: a third partition plate; 114: a fourth separator; 115: a six-axis controller; 116: an illumination platform driver; 117: a machine horizontal driver; 118 a wafer driver;
2: an air intake device;
21: a first air intake portion; 211: a first air intake cavity; 212: a first inlet sidewall; 213: a first inlet portion top wall; 214: a first air intake bottom wall;
22: a second air intake section I; 221: a second air inlet part I cavity; 222: a second air intake portion I side; 223: the top surface of the second air inlet part I; 224: the bottom surface of the second air inlet part I; 225: the front surface of the second air inlet part I; 226: the back of the second air inlet part I;
23: a second air intake section II; 231: the top surface of the second air inlet part II; 232: the bottom surface of the second air inlet part II;
24: an aperture;
25, a partition plate insertion area;
31: the upper end of the first exhaust pipe; 32: the lower end of the first exhaust pipe.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the embodiments of the present invention are further described in detail below with reference to the accompanying drawings.
It should be noted that all expressions using "first" and "second" etc. in the embodiments of the present invention are used for distinguishing two entities with the same name but different names or different parameters, and it is understood that "first" and "second" are only used for convenience of expression and should not be understood as limitations to the embodiments of the present invention, and the following embodiments do not describe the embodiments one by one.
Referring to fig. 1-2, a wafer machine rack box 1 and a heat dissipation system thereof in the prior art are shown, and the improvement of the heat dissipation system of the present invention is based on the wafer machine rack box 1 shown in fig. 1-2.
As shown in fig. 1, the wafer machine rack box 1 includes four layers of spaces separated by four parallel partitions (a first partition 111, a second partition 112, a third partition 113, and a fourth partition 114), in which a six-axis controller 115(6CH piezo driver), an illumination stage driver 116(RC AMP), an apparatus horizontal driver 117(ADE AMP), and a wafer driver 118(WX/WY AMP) are sequentially disposed from top to bottom, and the illumination stage driver 116, the apparatus horizontal driver 117, and the wafer driver 118 all dissipate a large amount of heat during operation, so that a specific heat dissipation system is required to dissipate heat.
The system for preventing heat radiation at the position where the side portions of the four partition plates are close to the side walls of the rack case 1 is composed of an exhaust pipe top seat 11 disposed closer to the top plate of the rack case 1, an exhaust pipe base 12 disposed at the bottom plate of the rack case 1, and three exhaust pipes disposed between the exhaust pipe top seat 11 and the exhaust pipe base 12 (as shown in fig. 2). The third exhaust pipe 15 does not participate in the heat dissipation of the illumination platform driver 116, the machine horizontal driver 117, and the wafer driver 118, and therefore, the description thereof is omitted here. The exhaust pipe base 12 and the exhaust pipe top base 11 are arranged in parallel up and down in a common plane where they are located.
The first exhaust pipe 13 and the second exhaust pipe 14 are arranged in parallel, and the exhaust pipe top seat 11 comprises a first air inlet 18 and a second air inlet 19 which are arranged to allow air flow to pass through; the exhaust pipe base 12 includes a first opening 16 and a second opening 17 configured to allow airflow therethrough; one end of the first exhaust pipe 13 is connected to the first opening 16 of the exhaust pipe base 12, and the other end is connected to the first air inlet 18 of the exhaust pipe top seat 11; the second exhaust pipe 14 has one end connected to the second opening 17 of the exhaust pipe base 12 and the other end connected to the second air inlet 19 of the exhaust pipe top base 11.
External fans (not shown) are added to the heat dissipation portions of the illumination platform driver 116, the machine platform driver 117, and the wafer driver 118 to generate airflow within the rack, so that heat can more easily reach the first and second air inlets 18 and 19 near the top of the rack. And heat is drawn away by the air extraction device of the exhaust pipe base 12.
In order to solve the technical problem that the door of the rack box body 1 can be closed without the risk of disorder of the external fan, the embodiment of the present invention improves the first exhaust pipe 13 and the second exhaust pipe 14 in the rack box body 1 shown in fig. 1-2, and other components and setting positions of the rack box body 1 are the same as those in fig. 1-2.
First, the embodiment of the present invention adjusts the positions of the air inlets of the first exhaust pipe 13 and the second exhaust pipe 14, and employs the air intake device 2 as shown in fig. 3 (a).
The air intake device 2 comprises a first air intake part 21 and two second air intake parts, wherein the first air intake part 21 comprises a side wall 212, a top wall 213, a bottom wall 214, and a cavity 211 surrounded by the side wall 212, the bottom wall 214, and the top wall 213, and the bottom wall 214 of the first air intake part 21 is provided with an opening, and the size of the opening is the same as that of the bottom wall, that is, the bottom wall 214 is open.
The second intake section I22 and the second intake section II23 have the same configuration. Only the second air intake portion I will be described in detail. In the present embodiment, the second air inlet portion I22 is a rectangular parallelepiped with a cavity 221 therein, and includes a second air inlet portion I side 222, a second air inlet portion I top 223, a second air inlet portion I bottom 224, a second air inlet portion I front 225, and a second air inlet portion I back 226.
The second air inlet portion I and the second air inlet portion II are connected to the first air inlet portion 21 perpendicularly to the extending direction of the first air inlet portion 21 (i.e., the second air inlet portion I22 is in right-angle communication with the first air inlet portion 21 in a horizontal or vertical section, and the second air inlet portion II23 has the same arrangement position) at an interval of 30mm in the vertical direction, wherein a surface opposite to the side surface of the second air inlet portion I23 is in communication with the first air inlet portion 21. And the cavity of the first air intake portion 21 communicates with the cavity of each of the second air intake portion I22 and the second air intake portion II 23.
The top surface of the second air inlet part I22 is provided with a hole 24 communicated with the cavity of the second air inlet part I; the bottom surface of the second air inlet part II23 is provided with a hole (not shown) communicated with the cavity thereof; in other embodiments, the holes 24 may be provided on other surface or surfaces of the second air intake portion I22 and the second air intake portion II 23.
The diameter of the holes 24 is 5-6 mm. The number of the holes is multiple, 5-6 rows are preferred, the number of each row is not limited, and the distance between the holes is 8-9 mm.
The materials of the first air inlet 21, the second air inlet I22 and the second air inlet II23 are the same, and the materials are stainless steel (type is preferably 95), polypropylene, polyethylene terephthalate, polyamide or polyether ether ketone.
In the present embodiment, the length of the rectangular parallelepiped of the second air intake section I22 and the second air intake section II23 is 500mm, the height is 60mm, and the width is 60 mm. The distance between the bottom surface of the second air inlet part I and the top surface of the second air inlet part II is 30 mm.
As shown in fig. 3(a) and (b), in the present embodiment, the first exhaust pipe upper end 31 connecting the first exhaust pipe 13 in fig. 2 to the first air inlet 18 of the exhaust pipe top seat 11 is removed and communicated with the first air inlet bottom wall 214 of the air intake device 2, and preferably, when the first exhaust pipe 13 is a rubber pipe, it wraps the first air inlet bottom wall 214; the first exhaust pipe lower end 32 remains connected to the first opening 16 of the exhaust pipe base 12. The second exhaust pipe 14 is also connected to the intake device 2 with the same modification.
The air inlet device 2 connected to the exhaust pipe may be disposed at any position of the partition of the rack housing 1, preferably at the heat dissipation positions of the illumination stage driver 116, the machine horizontal driver 117, and the wafer driver 118, due to the flexibility of the exhaust pipe. For fixing, the air inlet device 2 can be glued to the wall of the rack housing 1. In a preferred embodiment, the second air intake portion I22 and the second air intake portion II23 in the air intake device 2 connected to the first exhaust pipe 13 may be inserted into the second partition 112, that is, the second partition 112 is inserted into the partition insertion region 25 at a distance of 30mm and joined to the bottom surface of the second air intake portion I and the top surface of the second air intake portion II. In a preferred embodiment, the air intake device 2 connected to the second exhaust pipe 14 may be adhered to the bottom of the third partition 113.
Preferably, the material of the exhaust pipe is a rubber pipe, a PVC plastic pipe or a polypropylene pipe.
The effect after heat dissipation by using the heat dissipation system of the present embodiment is shown in table 1 below:
TABLE 1
Improving pre-temperature Improvement of post-temperature Improved effect of temperature difference
WX/WY AMP 43℃ 37℃ 6℃
ADE AMP 45℃ 38℃ 7℃
RC AMP 40℃ 36℃ 4℃
6CH piezo driver 25 25℃ 0℃
As described above, the temperatures of the illumination stage driver 116, the stage level driver 117, and the wafer driver 118 are all decreased, thereby achieving an effective cooling effect.
The foregoing is an exemplary embodiment of the present disclosure, but it should be noted that various changes and modifications could be made herein without departing from the scope of the disclosure as defined by the appended claims. Although elements disclosed in the embodiments of the invention may be described or claimed in the singular, the plural is contemplated unless limitation to the singular is explicitly stated.
Those of ordinary skill in the art will understand that: the discussion of any embodiment above is meant to be exemplary only, and is not intended to suggest that the scope of the disclosure of embodiments of the present invention (including the claims) is limited to these examples; within the idea of embodiments of the invention, also combinations between technical features in the above embodiments or in different embodiments are possible, and there are many other variations of different aspects of embodiments of the invention as described above, which are not provided in detail for the sake of brevity. Therefore, any omission, modification, equivalent replacement, improvement, etc. within the spirit and principle of the embodiments of the present invention should be included in the protection scope of the embodiments of the present invention.

Claims (10)

1. An air intake apparatus, comprising:
a first air intake portion including a cavity;
a plurality of second air intake portions each including a cavity and a hole communicated to an outside of the second air intake portion by the cavity;
wherein each of the plurality of second air intake portions is connected to the first air intake portion at an angle in the respective extending direction and the cavity of the first air intake portion communicates with the cavity of each of the plurality of second air intake portions.
2. The air intake apparatus of claim 1, wherein the first air intake portion further comprises a side wall, a top wall, and a bottom wall, and the cavity is enclosed by the side wall, the bottom wall, and the top wall, wherein the bottom wall of the first air intake portion is provided with an opening.
3. The air intake apparatus according to claim 1, wherein the hole of the second air intake portion is provided on at least one surface of the second air intake portion.
4. An air inlet arrangement according to claim 3, characterised in that the diameter of the holes is 5-6 mm.
5. An air inlet arrangement according to claim 3, characterised in that the number of apertures provided in at least one surface is plural and that the spacing between apertures is 8-9 mm.
6. The air intake apparatus according to claim 1, wherein each of the plurality of second air intake portions is perpendicularly connected to the first air intake portion in the respective extending direction.
7. The air intake apparatus of claim 1, wherein the first air intake portion and the plurality of second air intake portions are the same material, and the material is stainless steel, polypropylene, polyethylene terephthalate, polyamide, or polyetheretherketone.
8. A heat dissipation system for a motor driver of a frame box of a wafer machine is characterized by comprising:
the rack box body comprises a plurality of partition plates which are arranged in parallel and divide the rack box body into a plurality of spaces;
the exhaust pipe base is arranged on a bottom plate on one side of the rack box body and is provided with an opening through which airflow passes;
an exhaust pipe having one end communicating with the opening of the exhaust pipe base and the other end communicating with the intake device according to any one of claims 1 to 7;
and the air inlet device communicated with the exhaust pipe is arranged on the partition plate of the rack box body.
9. The heat dissipation system of claim 8, wherein the material of the exhaust pipe is a rubber pipe, a PVC plastic pipe or a polypropylene pipe.
10. The heat dissipating system of claim 8, wherein the other end of the exhaust pipe communicates with an opening of a bottom wall of the first air intake portion of the air intake device.
CN202020247334.XU 2020-03-03 2020-03-03 Heat radiation system of motor driver of wafer machine frame box body and air inlet device thereof Active CN211297538U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202020247334.XU CN211297538U (en) 2020-03-03 2020-03-03 Heat radiation system of motor driver of wafer machine frame box body and air inlet device thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202020247334.XU CN211297538U (en) 2020-03-03 2020-03-03 Heat radiation system of motor driver of wafer machine frame box body and air inlet device thereof

Publications (1)

Publication Number Publication Date
CN211297538U true CN211297538U (en) 2020-08-18

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