CN211295345U - Tiled receiver/transmitter module with high power output - Google Patents
Tiled receiver/transmitter module with high power output Download PDFInfo
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- CN211295345U CN211295345U CN201890000967.1U CN201890000967U CN211295345U CN 211295345 U CN211295345 U CN 211295345U CN 201890000967 U CN201890000967 U CN 201890000967U CN 211295345 U CN211295345 U CN 211295345U
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- ltcc
- ltcc module
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q3/00—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system
- H01Q3/26—Arrangements for changing or varying the orientation or the shape of the directional pattern of the waves radiated from an antenna or antenna system varying the relative phase or relative amplitude of energisation between two or more active radiating elements; varying the distribution of energy across a radiating aperture
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10378—Interposers
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Radar Systems Or Details Thereof (AREA)
- Variable-Direction Aerials And Aerial Arrays (AREA)
Abstract
The present invention is a tile receiver and transmitter module with high power output, multi-channel, sealed, compact, which forms part of a phased array structure used in radar and communication systems; it includes: a first LTCC module (1) on which a high heat dissipation microwave element (1.1) is placed; a second LTCC module (2) on which a microwave element (1.1) is placed; a first insert (1.3) located at the bottom of the first LTCC module (1) and providing radio frequency, dc power and control connections between the first LTCC module (1) and the second LTCC module (2); a PCB board (4) providing necessary DC power and control signals for components in and on the first LTCC module (1) and the second LTCC module (2); and a second interposer (1.3) located between the second LTCC module (2) and the PCB board (4) for transmitting DC power and control signals received from the PCB board (4) to the first LTCC module (1) and the second LTCC module (2).
Description
Technical Field
The present invention relates to the construction of a multi-channel, sealed, high power output and compact tile receiver/transmitter module that forms part of a phased array structure for use in radar and communication systems.
Background
Now, in phased array systems, the number of transmitter/receiver (T/R) modules per system reaches thousands. Thus, the weight, size and cost of the receiver/transmitter module constitute a significant part of the system.
In the prior art, the design and layout of the modules is influenced by system requirements such as operating frequency, scan angle, etc. The required distance between the antennas limits the size of the module in order to obtain the required scanning angle at frequencies in the X-band and above. This requires a high density module architecture design. But high density modules also introduce high operating temperatures and isolation issues. All these factors should be considered in the module design.
Through a literature search, a patent US2010259913 entitled "low temperature co-fired ceramic (LTCC) transmit/receive (T/R) assembly with Ball Grid Array (BGA) technology" was found. The system mentioned in this application is provided by combining microwave components in a low temperature ceramic. However, this system has a low power output and is not a compact structure.
A patent US2007210959(a1) entitled "multi-beam array module for a phased array system" is found in a literature search on this subject. In this application, a control module communicates with each array element to control phase shift and attenuation. This system is advantageous for phased array systems, but still has low power output and a non-compact structure.
As a result, improvements in the art are needed due to the above-mentioned shortcomings and deficiencies of existing solutions.
Disclosure of Invention
The present invention is inspired by the existing situation and aims to solve the above-mentioned drawbacks.
The main object of the present invention is to introduce a multi-channel, high output T/R module by means of microwave elements.
It is another object of the present invention to introduce a compact T/R module structure.
It is another object of the present invention to introduce a T/R module architecture that meets system requirements such as operating frequency and scan angle.
To achieve the above objects, the present invention is a multi-channel, sealed, high power output and compact tile receiver/transmitter module structure forming part of a phased array structure for use in radar and communication systems, comprising:
a first LTCC module on which a microwave element with high heat extraction is placed;
a second LTCC module on which a microwave element is placed;
a first interposer located at a bottom of the first LTCC module and providing radio frequency, Direct Current (DC) power and control connections between the first LTCC module and the second LTCC module;
a Printed Circuit Board (PCB) providing necessary DC power and control signals for components in and on the first and second LTCC modules;
a second interposer located between the second LTCC module and the PCB board for transmitting DC power and control signals received from the PCB board to the first and second LTCC modules.
The structural and characteristic features and all advantages of the present invention, which are summarized in the following drawings and detailed description with reference to the drawings, should be clearly understood and thus evaluated by taking into consideration the drawings and the detailed description.
Drawings
FIG. 1 is a side sectional view of the T/R module structure of the present invention.
Fig. 2 is a top perspective view of a first LTCC module.
Fig. 3 is a view of a plug-in and a frame on a first LTCC module.
Fig. 4 is a top perspective view of a second LTCC module.
FIG. 5 is a top view of the T/R module structure of the present invention.
FIG. 6 is a box inside view of the T/R module configuration of the present invention.
Reference numerals
1. First LTCC module
1.1. Microwave element
1.2. Radio Frequency (RF) connector
1.3. First plug-in component
1.3.1. Hole(s)
1.4. Carrier
1.5. Frame structure
1.6. Peripheral element
1.7. Converter
2. Second LTCC module
2.1. Bonding pad
2.2. Second plug-in component
3. Pin
3.1. Pin space
PCB board
PCB connector
5. Box
LTCC: low temperature co-fired ceramic
Detailed Description
In this detailed description, preferred embodiments of the T/R-receiver/transmitter module with high power output of the present invention are explained only for better understanding of the present subject matter.
The architecture of the present invention comprises a combination of microwave elements (1.1), mechanical components and spacers on low temperature co-fired ceramics (LTCC). The architecture comprises dielectric layers formed by LTCC technology, cavities in the layers, microwave elements (1.1) in the cavities, and RF converters (1.7) extending to the elements, DC power and control signals.
As shown in fig. 1, the present invention is a multi-channel, sealed, high power output and compact tile receiver/transmitter module structure forming part of a phased array structure for use in radar and communication systems, comprising:
a first LTCC module (1) on which a microwave element (1.1) with a high heat extraction is placed,
a second LTCC module (2) on which a microwave element (1.1) is placed,
a first insert (1.3) located at the bottom of the first LTCC module (1) and providing radio frequency, DC power and control connections between the first LTCC module (1) and the second LTCC module (2),
a PCB board (4) providing necessary DC power and control signals for components in and on the first LTCC module (1) and the second LTCC module (2),
a second plug-in (2.2) located between the second LTCC module (2) and the PCB board (4) for transmitting DC power and control signals received from the PCB board (4) to the first LTCC module (1) and the second LTCC module (2).
Fig. 1 shows a side sectional view of a receiver/transmitter module. The microwave elements (1.1) in the T/R module are arranged in a first LTCC module (1) and a second LTCC module (2). The antenna and manifold connection can be made by the first LTCC module (1) via an RF connector (1.2). RF (radio frequency), DC power and control connections between the first (1) and second (2) LTCC modules may be provided with non-soldered spring "hair button" connectors in the first insert (1.3). The DC power and control signals required by the devices in and on the first (1) and second (2) LTCC modules can be provided by the PCB board (4) via non-soldered spring connectors in the second card (2.2). Alignment of the entire structure is provided by pins (3).
The first LTCC module (1) can be provided with a microwave element (1.1) emitting high heat. The microwave element (1.1) can be arranged on the first LTCC module (1) or can be arranged on the carrier (1.4). For this purpose, the carrier (1.4) can be mounted by soldering to the middle of the base of the first LTCC module (1). The carrier (1.4) can transport high heat to the cooler (heat sink). In addition, the first LTCC module in the vicinity of the antenna (1) can contain low-noise microwave elements (1.1) in order to reduce the possible noise figure.
The microwave elements (1.1) of Monolithic Microwave Integrated Circuits (MMICs) on the first (1) and second (2) LTCC modules can be encapsulated in a sealed box with a kovar frame (5).
The first LTCC module (1) shown in fig. 2 comprises in its most basic form: more than one dielectric layer providing miniaturization, more than one window providing isolation, a cavity and a plurality of microwave elements (1.1) located within the cavity. High thermal conductivity is achieved by placing a microwave element (1.1) with high heat dissipation on the lowermost ceramic layer (first LTCC module (1)) or preferably on the carrier (1.4). Other microwave elements (1.1) may be placed on the higher ceramic layer. The microwave element (1.1) is connected to peripheral elements (1.6), such as capacitors, coils and resistors. The RF microwave elements (1.1) of the first LTCC module (1) are designed to be switched and connected from these switches (1.7) to gold wires on the microwave elements (1.1). For the alignment, a pin space (3.1) can be formed on the first LTCC module (1).
On the first LTCC module (1) shown in fig. 3, a kovar alloy frame (1.5) with a Coefficient of Thermal Expansion (CTE) of ceramic material is preferably welded to the middle of the LTCC module (1). The frame (1.5) may be covered by a cover to protect the MMIC based microwave component (1.1) from external influences. On the bottom and edges of the first LTCC module (1) there are first inserts (1.3) preferably selected from materials with low expansion coefficient, compatible in form with the kovar frame (1.5) so as not to exceed the T/R module dimensions. A non-soldered connector suitable for reworking is inserted into a hole (1.3.1) provided on the first insert (1.3). These connectors provide power and control signals for the microwave elements (1.1) and vertical RF conversion between the first (1) and second (2) LTCC modules. In order to ensure an effective connection, the height of the kovar frame (1.5) is slightly smaller than the height of the first insert (1.3). For alignment, a pin space (3.1) can be formed on the first insert (1).
The second LTCC module (2) shown in fig. 4 comprises in its most basic form: more than one dielectric layer is provided for miniaturization, and a plurality of microwave elements (1.1) located within these layers. Encapsulated microwave components (1.1), such as MMIC devices, and peripheral components (1.6), such as resistors and capacitors, may also be located on the second LTCC module (2). A signal conversion line is arranged between the microwave elements (1.1). In the area near the edge of the second LTCC module (2) a pad (2.1) is provided which is pressed by a non-soldered connector. For alignment, a pin space (3.1) can be formed on the second LTCC module (2).
For the RF connection of the T/R module shown in fig. 5 with possible antennas and manifold cards, there are a number of subminiature SMP RF connectors (1.2) at the base of the first LTCC based module (1). The architecture has a 4-channel T/R modular structure. From this side, a carrier (1.4) capable of carrying high power output microwave elements is connected to the cooler. The PCB board (4), the second insert (2.2), the second LTCC module (2), the first insert (1.3), the first LTCC module (1) are aligned as shown in fig. 5 and placed in the mechanical box (5) as shown in fig. 6.
The T/R module in the mechanical box (5) shown in fig. 6 is attached to the motherboard by means of a PCB connector (4.1).
Claims (16)
1. A tiled receiver/transmitter module with high power output, said module forming part of a phased array structure for use in radar and communication systems, characterized in that: the module comprises:
a first LTCC (Low temperature Co-fired ceramic) module (1) on which a high heat dissipating microwave element (1.1) is placed,
a second LTCC module (2) on which the microwave element (1.1) is also placed,
a first insert (1.3) located at the bottom of the first LTCC module (1) and providing radio frequency, DC power and control connections between the first LTCC module (1) and the second LTCC module (2),
a PCB board (4) providing the necessary DC power and control signals for components in and on the first LTCC module (1) and the second LTCC module (2),
a second insert (2.2) located between the second LTCC module (2) and the PCB board (4) for transmitting the DC power and the control signal received from the PCB board (4) to the first LTCC module (1) and the second LTCC module (2).
2. The module of claim 1, wherein: the module comprises the microwave element (1.1) providing noise reduction located on the first LTCC module (1).
3. The module of claim 1, wherein: the module comprises a carrier (1.4) arranged on the first LTCC module (1), on which carrier the microwave element (1.1) can be placed.
4. The module of claim 3, wherein: the carrier (1.4) allows high heat to be transferred to the cooler.
5. The module of claim 1, wherein: the module comprises a kovar frame (1.5) on the first LTCC module (1) to protect the microwave element from external influences by closing a lid on the frame.
6. The module of claim 5, wherein: the height of the kovar alloy frame (1.5) is made slightly smaller than the height of the first insert (1.3) to provide vertical RF conversion between the first LTCC module (1) and the second LTCC module (2).
7. The module of claim 1, wherein: the module comprises an RF connector (1.2) on the first LTCC module (1), the RF connector providing antenna and manifold connections.
8. The module of claim 1, wherein: the module comprises a hole (1.3.1) on the first insert (1.3), in which hole a non-soldered connector is placed.
9. The module of claim 8, wherein: the module comprises pads (2.1) on the first and second LTCC modules (1, 2), in which the non-soldered connectors are placed.
10. The module of claim 1, wherein: the module comprises peripheral elements (1.6) placed on the first (1) and second (2) LTCC modules.
11. The module of claim 10, wherein: the peripheral elements (1.6) are resistors and capacitors.
12. The module of claim 1, wherein: the module includes pins (3) that provide alignment.
13. The module of claim 12, wherein: the module comprises pin spaces (3.1) placed on the first LTCC module (1), the second LTCC module (2), the first insert (1.3), the second insert (2.2) and the PCB board (4), wherein the pins (3) pass through the pin spaces to provide alignment.
14. The module of claim 1, wherein: the module comprises a transducer (1.7) on the first LTCC module (1), the transducer (1.7) providing a connection to the microwave element (1.1).
15. The module of claim 1, wherein: the structure comprises a PCB connector (4.1), the PCB connector (4.1) allowing the tile receiver/transmitter module to be mounted on a motherboard.
16. Module according to any of the preceding claims, characterized in that the structure comprises a box (5), in which box (5) the tile receiver/transmitter module is placed.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TR201720500 | 2017-12-15 | ||
| TR2017/20500 | 2017-12-15 | ||
| PCT/TR2018/050640 WO2019168484A2 (en) | 2017-12-15 | 2018-10-31 | Structure of a tile receiver/transmitter module with high power output |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211295345U true CN211295345U (en) | 2020-08-18 |
Family
ID=67805483
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201890000967.1U Active CN211295345U (en) | 2017-12-15 | 2018-10-31 | Tiled receiver/transmitter module with high power output |
Country Status (3)
| Country | Link |
|---|---|
| CN (1) | CN211295345U (en) |
| DE (1) | DE212018000237U1 (en) |
| WO (1) | WO2019168484A2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114421111A (en) * | 2021-12-14 | 2022-04-29 | 中国电子科技集团公司第二十九研究所 | Three-layer tile type TR (transmitter-receiver) assembly adopting fuzzy buttons |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111025235B (en) * | 2019-12-16 | 2022-04-12 | 南京吉凯微波技术有限公司 | Microwave TR assembly with ultra-wide working bandwidth |
| CN111525284B (en) * | 2020-07-03 | 2020-09-22 | 成都雷电微力科技股份有限公司 | Multi-frequency composite high-power tile type active phased array antenna |
| CN111835376A (en) * | 2020-08-10 | 2020-10-27 | 航天科工通信技术研究院有限责任公司 | High-integration multi-channel tile type T/R assembly and arrangement method |
| CN112114290A (en) * | 2020-09-25 | 2020-12-22 | 中国电子科技集团公司第四十三研究所 | Miniaturized four passageway TR subassemblies in X wave band |
| CN116545466B (en) * | 2023-07-04 | 2023-08-29 | 成都锐芯盛通电子科技有限公司 | High-power tile type TR component |
| CN116583096B (en) * | 2023-07-14 | 2023-09-12 | 四川天中星航空科技有限公司 | Totally-enclosed radio frequency comprehensive test equipment |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6580402B2 (en) * | 2001-07-26 | 2003-06-17 | The Boeing Company | Antenna integrated ceramic chip carrier for a phased array antenna |
| US7046195B2 (en) * | 2001-12-14 | 2006-05-16 | Itt Manufacturing Enterprises, Inc. | Single Ku-band multi-polarization gallium arsenide transmit chip |
| US6975267B2 (en) * | 2003-02-05 | 2005-12-13 | Northrop Grumman Corporation | Low profile active electronically scanned antenna (AESA) for Ka-band radar systems |
| US7671696B1 (en) * | 2006-09-21 | 2010-03-02 | Raytheon Company | Radio frequency interconnect circuits and techniques |
| US9172145B2 (en) * | 2006-09-21 | 2015-10-27 | Raytheon Company | Transmit/receive daughter card with integral circulator |
| EP2642587B1 (en) * | 2012-03-21 | 2020-04-29 | LEONARDO S.p.A. | Modular active radiating device for electronically scanned array aerials |
| CN105356051B (en) * | 2015-11-16 | 2018-02-23 | 中国电子科技集团公司第十研究所 | High-power target seeker tile style active phase array antenna |
| CN105958214B (en) * | 2016-05-09 | 2018-08-10 | 中国电子科技集团公司第三十八研究所 | A kind of expansible highly integrated active phase array antenna |
| CN105914476A (en) * | 2016-05-20 | 2016-08-31 | 中国电子科技集团公司第十研究所 | Ka-band tilt-structure active phased array antenna |
-
2018
- 2018-10-31 DE DE212018000237.1U patent/DE212018000237U1/en active Active
- 2018-10-31 WO PCT/TR2018/050640 patent/WO2019168484A2/en active Application Filing
- 2018-10-31 CN CN201890000967.1U patent/CN211295345U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114421111A (en) * | 2021-12-14 | 2022-04-29 | 中国电子科技集团公司第二十九研究所 | Three-layer tile type TR (transmitter-receiver) assembly adopting fuzzy buttons |
Also Published As
| Publication number | Publication date |
|---|---|
| DE212018000237U1 (en) | 2020-01-21 |
| WO2019168484A3 (en) | 2019-11-14 |
| WO2019168484A2 (en) | 2019-09-06 |
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