CN211265513U

CN211265513U - Anti-cold-solder-joint surface-mounted light-emitting diode

Info

Publication number: CN211265513U
Application number: CN202020197664.2U
Authority: CN
Inventors: 刘红利
Original assignee: Shenzhen Haozhi Technology Co ltd
Current assignee: Shenzhen Haozhi Technology Co ltd
Priority date: 2020-02-23
Filing date: 2020-02-23
Publication date: 2020-08-14
Anticipated expiration: 2030-02-23

Abstract

The utility model belongs to the technical field of the emitting diode technique and specifically relates to a prevent rosin joint paster emitting diode, which comprises a substrate, inside one side of base plate is connected with first conductive seat, one side that first conductive seat was kept away from to the inside of base plate is connected with the second conductive seat, be equipped with paster emitting diode chip on the base plate, the outside of paster emitting diode chip is equipped with the conducting strip, the outside of conducting strip is equipped with the reflector groove, the outside of reflector groove is equipped with the heat-conducting layer, the outside of heat-conducting layer is equipped with a plurality of radiating fin, the internal surface of reflector groove is equipped with the reflector layer, the top cover of reflector groove is equipped with lens, and the device reasonable in design simple structure has outstanding radiating effect and quick radiating ability, and effectual rosin joint that avoids appearing is fit for promoting.

Description

Anti-cold-solder-joint surface-mounted light-emitting diode

Technical Field

The utility model relates to a light emitting diode technical field especially relates to a prevent rosin joint paster emitting diode.

Background

An LCD (liquid crystal display) is a non-luminous display device, the display function can be achieved only by means of a backlight source, the quality of the light source performance can directly influence the display quality of the LCD, a Light Emitting Diode (LED) is taken as one of the backlight sources, the LED is a solid semiconductor device capable of converting electric energy into visible light, the LED can directly convert electricity into light, and has the advantages of long service life, low heat generation and the like, and no environmental pollution, the existing LED is mainly divided into a direct insertion type LED, a patch type LED, a piranha and a high-power type LED, wherein the patch LED is also called as a patch LED, has the advantages of ultrathin shape and high brightness and is widely applied, but along with the increase of the current intensity and the light emitting quantity of the patch LED, the heat generation quantity of the patch LED is increased, but the common patch LED on the market has the problems of poor heat dissipation effect and rapid heat dissipation, therefore, the situation of welding spot oxidation and fusion welding can be caused, so that the cold joint is caused, the service life is reduced, and the cold joint prevention paster light-emitting diode is provided.

SUMMERY OF THE UTILITY MODEL

The utility model aims at solving the shortcoming that the radiating effect is poor and can not fast dispel the heat that exists among the prior art, and the utility model provides a prevent rosin joint paster emitting diode.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

the utility model provides a prevent rosin joint paster emitting diode, includes the base plate, inside one side of base plate is connected with first conductive seat, the inside one side of keeping away from first conductive seat of base plate is connected with the second conductive seat, be equipped with paster emitting diode chip on the base plate, the outside of paster emitting diode chip is equipped with the conducting strip, the outside of conducting strip is equipped with the reflector slot, the outside of reflector slot is equipped with the heat-conducting layer, the outside of heat-conducting layer is equipped with a plurality of radiating fin, the internal surface of reflector slot is equipped with the reflector layer, the top cover of reflector slot is equipped with lens.

Preferably, the first conductive seat and the second conductive seat are both red copper metal plates, the bottom of the chip of the surface mount light emitting diode is attached to the surface of the first conductive seat and fixed through silver glue, and the second conductive seat is electrically connected with the chip of the surface mount light emitting diode through a wire.

Preferably, the radiating fins are bowl-shaped metal radiating fins, the radiating fins are symmetrically arranged on the outer side of the heat conducting layer at equal intervals, and the heat conducting layer is heat conducting silica gel.

Preferably, the substrate is a plate of insulating and heat-resistant material, and the chip of the chip light-emitting diode is connected with the substrate through a clamping groove.

The utility model provides a prevent rosin joint paster emitting diode, beneficial effect lies in: the bottom of the chip of the surface-mounted light-emitting diode is attached to the surface of the first conductive seat and fixed through silver adhesive, the light reflecting groove, the heat conducting sheet, the radiating fins and the lens are sequentially installed and fixed to finish installation, heat generated by the chip of the surface-mounted light-emitting diode is transferred to the first conductive seat and the heat conducting layer by the heat conducting sheet when in use, the heat exchange area is increased through the radiating fins on the heat conducting layer to realize rapid heat dissipation, the first conductive seat is a red copper metal plate, the heat dissipation area is further increased by a plate body exposed outside, the heat dissipation effect is further improved, the problem that the heat accumulated by the chip cannot be dissipated when the chip is used for a long time is avoided, welding spots at the joint are oxidized and peeled off to further cause a non-through false soldering state when the device is powered on is solved, and the problem of false soldering is effectively avoided, the device is reasonable in design and simple in structure, and has, effectively avoiding the occurrence of insufficient solder and being suitable for popularization.

Drawings

Fig. 1 is the utility model provides a prevent rosin joint paster emitting diode's section structure schematic diagram.

In the figure: the LED packaging structure comprises a light reflecting groove 1, a heat conducting layer 2, a heat conducting fin 3, a substrate 4, a first conducting seat 5, a light reflecting layer 6, a lens 7, a radiating fin 8, a chip light emitting diode chip 9, a tin coating 10 and a second conducting seat 11.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments.

Referring to fig. 1, a prevent rosin joint paster emitting diode, including base plate 4, inside one side of base plate 4 is connected with first conductive seat 5, the inside one side of keeping away from first conductive seat 5 of base plate 4 is connected with second conductive seat 11, be equipped with paster emitting diode chip 9 on the base plate 4, the outside of paster emitting diode chip 9 is equipped with conducting strip 3, the outside of conducting strip 3 is equipped with reflector groove 1, the outside of reflector groove 1 is equipped with heat-conducting layer 2, the outside of heat-conducting layer 2 is equipped with a plurality of radiating fin 8, the internal surface of reflector groove 1 is equipped with reflector layer 6, the top cover of reflector groove 1 is equipped with lens 7.

The first conductive seat 5 and the second conductive seat 11 are both red copper metal plates, the bottom of the chip 9 of the surface mount light emitting diode is attached to the surface of the first conductive seat 5 and fixed by silver adhesive, the second conductive seat 11 is electrically connected with the chip 9 of the surface mount light emitting diode by a lead, the radiating fins 8 are bowl-shaped metal radiating fins, the radiating fins 8 are symmetrically arranged at the outer side of the heat conducting layer 2 at equal intervals, the heat conducting layer 2 is heat conducting silica gel, the substrate 4 is an insulating heat-resistant material plate, the chip 9 of the surface mount light emitting diode is connected with the substrate 4 by a clamping groove, when in use, the heat generated by the chip 9 of the surface mount light emitting diode is transferred to the first conductive seat 5 and the heat conducting layer 2 by the radiating fins 3, the heat exchange area is increased by the radiating fins 8 on the heat conducting layer 2, and quick heat radiation is realized, because the first conductive seat 5 is a red copper, further improved the radiating effect, avoided the heat that the chip gathered can't give off when using for a long time, lead to the solder joint of junction to appear the oxidation and peel off and then arouse the device to appear the problem of leading to when leading to the time unable rosin joint state, the effectual rosin joint that avoids appearing.

Above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the design of the present invention, equivalent replacement or change should be covered within the protection scope of the present invention.

Claims

1. The utility model provides a prevent rosin joint paster emitting diode, includes base plate (4), its characterized in that, the inside one side of base plate (4) is connected with first conductive seat (5), the inside one side of keeping away from first conductive seat (5) of base plate (4) is connected with second conductive seat (11), be equipped with paster emitting diode chip (9) on base plate (4), the outside of paster emitting diode chip (9) is equipped with heat-conducting strip (3), the outside of heat-conducting strip (3) is equipped with reflector groove (1), the outside of reflector groove (1) is equipped with heat-conducting layer (2), the outside of heat-conducting layer (2) is equipped with a plurality of radiating fin (8), the internal surface of reflector groove (1) is equipped with layer (6), the top cover of reflector groove (1) is equipped with lens (7).

2. The cold-solder-proof patch light-emitting diode of claim 1, wherein the first conductive seat (5) and the second conductive seat (11) are both red copper metal plates, the first conductive seat (5) is attached to the patch light-emitting diode chip (9), and the second conductive seat (11) is electrically connected to the patch light-emitting diode chip (9) through a wire.

3. The cold-solder-proof patch light-emitting diode of claim 1, wherein the heat dissipation fins (8) are bowl-shaped metal heat dissipation fins, the heat dissipation fins (8) are symmetrically arranged at equal intervals on the outer side of the heat conduction layer (2), and the heat conduction layer (2) is heat conduction silica gel.

4. A cold-solder-proof patch led according to claim 1, wherein the substrate (4) is a board of insulating and heat-resistant material, and the patch led chip (9) and the substrate (4) are connected by a card slot.