CN211240300U - Double-sided flexible circuit board with nickel-plated welding pads and based on aluminum foil - Google Patents
Double-sided flexible circuit board with nickel-plated welding pads and based on aluminum foil Download PDFInfo
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- CN211240300U CN211240300U CN201922015697.0U CN201922015697U CN211240300U CN 211240300 U CN211240300 U CN 211240300U CN 201922015697 U CN201922015697 U CN 201922015697U CN 211240300 U CN211240300 U CN 211240300U
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Abstract
The utility model relates to the technical field of double-sided flexible circuit boards, and discloses a double-sided flexible circuit board based on aluminum foil for pad nickel plating, which comprises an insulating layer, a first aluminum foil layer and a second aluminum foil layer, wherein circuits are respectively etched on the first aluminum foil layer and the second aluminum foil layer, the first aluminum foil layer and the second aluminum foil layer are arranged in a circuit communication way, and the first aluminum foil layer, the second aluminum foil layer and the insulating layer are fixedly arranged in a compounding way; the first aluminum foil layer comprises a first pad with a first nickel-plated layer, the second aluminum foil layer comprises a second pad with a second nickel-plated layer, the first nickel-plated layer is used for welding electronic components, and the second nickel-plated layer is used for welding electronic components. Under the action of the first nickel plating layer and the second nickel plating layer, the welding stability of the electronic component is improved, the double-sided flexible circuit board is convenient to manufacture, and the service life is prolonged; in addition, the first aluminum foil layer and the second aluminum foil layer are adopted, so that the whole weight of the double-sided flexible circuit board is reduced, and meanwhile, the manufacturing cost of the double-sided flexible circuit board is reduced.
Description
Technical Field
The patent of the utility model relates to a two-sided flexible circuit board's technical field particularly, relates to the two-sided flexible circuit board based on the aluminium foil of pad nickel plating.
Background
The flexible printed circuit board is made of polyimide or polyester film as the insulating layer base material and metal foil (mainly copper foil) as the circuit conducting layer.
The double-sided flexible circuit board belongs to one of flexible circuit boards, is a flexible circuit board with double-layer circuit conducting layers, and is widely applied to electronic products such as LED illumination and the like.
In the prior art, the double-sided flexible circuit board mainly adopts copper foil as a circuit conducting layer, and compared with an aluminum material, the double-sided flexible circuit board has the advantages of larger weight and high manufacturing cost.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a two-sided flexible circuit board based on aluminium foil of pad nickel plating aims at solving prior art, and two-sided flexible circuit board's problem that the cost of manufacture is high.
The utility model discloses a realize like this, pad nickel plating's two-sided flexible circuit board based on aluminium foil, including insulating layer, first aluminium foil layer and second aluminium foil layer, first aluminium foil layer with the second aluminium foil layer has etched the circuit respectively, first aluminium foil layer with the second aluminium foil layer is circuit intercommunication and arranges, first aluminium foil layer, the second aluminium foil layer with the insulating layer is compound fixed arrangement in proper order; the first aluminum foil layer comprises a first bonding pad with a first nickel-plated layer, the second aluminum foil layer comprises a second bonding pad with a second nickel-plated layer, the first nickel-plated layer is used for welding electronic components, and the second nickel-plated layer is used for welding electronic components.
Further, the pad nickel-plated aluminum foil-based double-sided flexible circuit board comprises a plurality of layers of insulating ink layers, the first aluminum foil layer has an upper end surface facing away from the insulating layer, the upper end surface of the first aluminum foil layer comprises a first insulating region and a first welding region, and the first welding region forms the first pad; the first insulating region is coated with the insulating ink layer.
Further, along deviating from the insulating layer direction, first pad is the protruding arrangement.
Further, when the electronic component is welded on the first welding disc, the electronic component is attached to the insulating ink layer.
Further, when the electronic component is welded on the second bonding pad, the electronic component is attached to the insulating ink layer.
Further, the second aluminum foil layer has a lower end surface facing away from the insulating layer, the lower end surface of the second aluminum foil layer includes a second insulating region and a second welding region, and the second welding region forms the second pad; the second insulating region is coated with the insulating ink layer.
Furthermore, a riveting piece is arranged between the first aluminum foil layer and the second aluminum foil layer, and the riveting piece is made of a metal material; and the two ends of the riveting piece are respectively riveted with the first aluminum foil layer and the second aluminum foil layer.
Further, the first aluminum foil layer is provided with a first communicating portion, the second aluminum foil layer is provided with a second communicating portion, and the first communicating portion and the second communicating portion are in circuit communication through stamping.
Further, the insulating layer is a PET insulating layer.
Compared with the prior art, the utility model provides a pad nickel plating's two-sided flexible circuit board based on aluminium foil, when two-sided flexible circuit board was made, with the first aluminium foil layer of etching circuit, second aluminium foil layer respectively with the insulating layer complex and be fixed arrangement, and first aluminium foil layer with second aluminium foil layer is the circuit intercommunication and arranges, first aluminium foil layer becomes first pad, second aluminium foil layer becomes second pad, first pad and second pad can be used to weld electronic components respectively; under the action of the first nickel plating layer and the second nickel plating layer, the welding stability of the electronic component is improved, the double-sided flexible circuit board is convenient to manufacture, and the service life is prolonged; in addition, the first aluminum foil layer and the second aluminum foil layer are adopted, so that the whole weight of the double-sided flexible circuit board is reduced, and meanwhile, the manufacturing cost of the double-sided flexible circuit board is reduced.
Drawings
Fig. 1 is a schematic cross-sectional view of a double-sided flexible circuit board with a nickel-plated pad and based on aluminum foil provided by the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
The following describes the implementation of the present invention in detail with reference to specific embodiments.
The same or similar reference numerals in the drawings of the present embodiment correspond to the same or similar components; in the description of the present invention, it should be understood that if there are the terms "upper", "lower", "left", "right", etc. indicating the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, it is only for convenience of description and simplification of the description, but it is not intended to indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and therefore the terms describing the positional relationship in the drawings are only for illustrative purposes and are not to be construed as limitations of the present patent, and those skilled in the art can understand the specific meanings of the terms according to specific situations.
Referring to fig. 1, the preferred embodiment of the present invention is shown.
The utility model provides a two-sided flexible circuit board based on aluminium foil of pad nickel plating for solve the problem that two-sided flexible circuit board's cost of manufacture is high.
The double-sided flexible circuit board comprises an insulating layer 10, a first aluminum foil layer 20 and a second aluminum foil layer 30, wherein circuits are etched on the first aluminum foil layer 20 and the second aluminum foil layer 30 respectively, the first aluminum foil layer 20 and the second aluminum foil layer 30 are arranged in a circuit communication mode, and the first aluminum foil layer 20, the second aluminum foil layer 30 and the insulating layer 10 are sequentially compounded and fixedly arranged; first aluminum foil layer 20 includes first pads 22 having a first nickel plating layer for soldering electronic component 50, and second aluminum foil layer 30 includes second pads 32 having a second nickel plating layer for soldering electronic component 50.
When the double-sided flexible circuit board is manufactured, the first aluminum foil layer 20 and the second aluminum foil layer 30 of the etched circuit are respectively compounded with the insulating layer 10 and fixedly arranged, the first aluminum foil layer 20 and the second aluminum foil layer 30 are arranged in a circuit communication manner, the first aluminum foil layer 20 forms a first bonding pad 22, the second aluminum foil layer 30 forms a second bonding pad 32, and the first bonding pad 22 and the second bonding pad 32 can be respectively used for welding the electronic component 50; under the action of the first nickel plating layer and the second nickel plating layer, the welding stability of the electronic component 50 is improved, the flexible circuit board is convenient to manufacture, and the service life is prolonged; in addition, the first aluminum foil layer 20 and the second aluminum foil layer 30 are adopted, so that the whole weight of the double-sided flexible circuit board is reduced, and meanwhile, the manufacturing cost of the double-sided flexible circuit board is reduced.
The pad nickel-plated aluminum foil-based double-sided flexible circuit board comprises a plurality of layers of insulating ink layers 40, a first aluminum foil layer 20 is provided with an upper end face departing from an insulating layer 10, the upper end face of the first aluminum foil layer 20 comprises a first insulating area and a first welding area 21, and the first welding area 21 forms a first pad 22; the first insulating region is coated with an insulating ink layer 40; under the effect of insulating ink layer 40, play insulating effect to first aluminium foil layer 20, avoid circuit and outside misleading, play the guard action to the circuit of first aluminium foil layer 20.
Under the action of the insulating layer 10, the misconduction between the first aluminum foil layer 20 and the second aluminum foil layer 30 is avoided, which results in short circuit and other faults.
The first bonding pad 22 is formed on the first bonding pad 21 by nickel plating, which facilitates the manufacture of double-sided flexible circuit board and reduces the manufacturing cost.
The first bonding pad 22 is formed by performing a nickel plating process along the first land 21, and the nickel plating process is facilitated by the first land 21 as a reference.
The nickel plating treatment is a method type treatment, which does not belong to the protection object and the protection scope of the application, so the steps of the nickel plating treatment and the realization method are not correspondingly explained.
The first welding area 21 is circularly arranged, so that the first welding pad 22 subjected to nickel plating treatment is more uniform as a whole, and has the largest welding space under the condition that the occupied areas are the same, and the electronic component 50 is convenient to weld and fix.
In a direction away from the insulating layer 10, the first pads 22 are arranged in a convex manner; the influence of the electronic component 50 on the first aluminum foil layer 20 is reduced, and the electronic component 50 is convenient to weld and fix.
When the electronic component 50 is welded on the first bonding pad 22, the electronic component 50 is attached to the insulating ink layer 40; the reinforced electronic component 50 is matched with the insulating ink layer 40, so that the welding effect of the electronic component 50 and the first aluminum foil layer 20 is improved.
The first insulating area and the first welding area 21 are arranged in an included manner, the first insulating area surrounds the first welding area 21, and the insulating ink layer 40 is coated on the first insulating area on the whole surface; this has the advantage of ensuring a full coverage of the first aluminium foil layer 20 except for the first welding area 21, ensuring an insulating effect and a full protection of the circuit.
The coating is to coat the paste or melt or molten insulating ink on the first aluminum foil layer 20, so that the insulating ink layer 40 and the first aluminum foil layer 20 are arranged in a composite opposite manner, and the manufacturing cost and the manufacturing steps are simplified.
When the electronic component 50 is welded on the second bonding pad 32, the electronic component 50 is attached to the insulating ink layer 40; the electronic component 50 is enhanced to be matched with the insulating ink layer 40, and the welding effect of the electronic component 50 and the second aluminum foil layer 30 is improved.
The second aluminum foil layer 30 has a lower end surface facing away from the insulating layer 10, the lower end surface of the second aluminum foil layer 30 including a second insulating region and a second welding region 31, the second welding region 31 forming a second pad 32; the second insulating region is coated with an insulating ink layer 40; under the effect of insulating ink layer 40, play insulating effect to second aluminium foil layer 30, avoid circuit and outside misleading, play the guard action to the circuit of second aluminium foil layer 30.
The second insulating area and the second welding area 31 are arranged in an included mode, the second insulating area surrounds the second welding area 31 in a surrounding mode, and the second insulating area is coated on the whole surface of the insulating ink layer 40; this arrangement is advantageous in that the overall coating of the second aluminum foil layer 30 except for the second welding area 31 is ensured, the insulation effect is ensured, and the circuit is fully protected.
The second bonding pad 32 is formed on the second bonding pad 31 by nickel plating, which facilitates the manufacture of the double-sided flexible circuit board and reduces the manufacturing cost.
The second bonding pad 32 is formed by performing a nickel plating process along the second land 31, and the nickel plating process is facilitated by the second land 31 as a reference.
A riveting piece is arranged between the first aluminum foil layer 20 and the second aluminum foil layer 30, and the riveting piece is made of metal materials; the two ends of the riveting piece are respectively riveted with the first aluminum foil layer 20 and the second aluminum foil layer 30; through the riveting piece, the circuit of the first aluminum foil layer 20 and the second aluminum foil layer 30 is conducted, and the use of the double-sided flexible circuit board is realized.
The riveting piece can be made of metal materials such as aluminum, copper and iron, and only needs to have a conductive function, so that the material is not limited in the application.
The first aluminum foil layer 20 has a first communicating portion, the second aluminum foil layer 30 has a second communicating portion, and the first communicating portion and the second communicating portion are in circuit communication by stamping; the operation is simple and convenient, and the double-sided flexible circuit board is convenient to manufacture.
The insulating layer 10 is a PET insulating layer 10; the physical property, chemical property, stability, transparency, recoverability and insulativity of the insulating layer 10 are guaranteed.
The electronic component 50 has a pin, and the pin is welded with the first pad 22 or the second pad 32 through soldering tin; the electronic component 50 is connected with the first bonding pad 22 or the second bonding pad 32 by welding, and the welding mode is more convenient to manufacture and lower in cost.
Soldering is a process type process, which is not the subject of protection and scope of the present application, and therefore, will not be described in detail.
The first bonding pad 22 and the second bonding pad 32 are correspondingly arranged, so that the integral balance weight is more uniform, and the integral stability is improved.
Along the direction from the insulating ink layer 40, the first aluminum foil layer 20, the insulating layer 10 to the second aluminum foil layer 30, the insulating ink layer 40 has a first thickness, the first aluminum foil layer 20 has a second thickness, the second aluminum foil layer 30 has a third thickness, and the insulating layer 10 has a fourth thickness; insulating ink layer 40, first aluminium foil layer 20, second aluminium foil layer 30 are compound fixed in proper order with insulating layer 10 and arrange, make two-sided flexible circuit board overall structure compacter, the preparation is more convenient, and the cost is lower.
The second thickness is consistent with the third thickness, so that the whole structure is more uniform, circuit etching is facilitated, and the manufacturing cost of the whole flexible circuit board is reduced.
The fourth thickness is greater than the third thickness and the second thickness, so that the riveting piece is convenient to arrange.
The first thickness is less than the third thickness and the second thickness, thus, the use thickness of the insulating ink layer 40 is reduced, the insulating effect is ensured, and the arrangement of the first aluminum foil layer 20 and the second aluminum foil layer 30 is ensured.
The first aluminum foil layer 20 has a first positive pad and a first negative pad, and the two ends of the electronic component 50 are respectively welded and fixed with the first positive pad and the first negative pad to realize circuit communication.
The second aluminum foil layer 30 has a second positive pad and a second negative pad, and the two ends of the electronic component 50 are respectively welded and fixed with the second positive pad and the second negative pad to realize circuit communication.
The first bonding pad is provided with a welding surface deviating from the base layer, and the welding surface of the first bonding pad is higher than the insulating ink layer 40 along the direction from the insulating ink layer 40 to the base layer; thus, the insulating ink layer 40 is prevented from being worn and affecting the installation of the electronic component 50 during welding.
When soldering tin welding is carried out, the first bonding pads are softened, the bottoms of the two ends of the electronic component 50 are respectively embedded into the first bonding pads, after solidification, the installation stability of the electronic component 50 is enhanced, and the service life is prolonged.
The above description is only exemplary of the present invention and should not be construed as limiting the present invention, and any modifications, equivalents and improvements made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.
Claims (9)
1. The double-sided flexible circuit board is characterized by comprising an insulating layer, a first aluminum foil layer and a second aluminum foil layer, wherein circuits are etched on the first aluminum foil layer and the second aluminum foil layer respectively, the first aluminum foil layer and the second aluminum foil layer are arranged in a circuit communication manner, and the first aluminum foil layer, the second aluminum foil layer and the insulating layer are sequentially compounded and fixedly arranged; the first aluminum foil layer comprises a first bonding pad with a first nickel-plated layer, the second aluminum foil layer comprises a second bonding pad with a second nickel-plated layer, the first nickel-plated layer is used for welding electronic components, and the second nickel-plated layer is used for welding electronic components.
2. The land nickel-plated aluminum foil-based double-sided flexible circuit board of claim 1, wherein the land nickel-plated aluminum foil-based double-sided flexible circuit board comprises a plurality of layers of insulating ink, the first aluminum foil layer having an upper end surface facing away from the insulating layer, the upper end surface of the first aluminum foil layer comprising a first insulating region and a first weld region, the first weld region forming the first land; the first insulating region is coated with the insulating ink layer.
3. The land nickel plated aluminum foil based double-sided flexible circuit board of claim 2, wherein the first land is in a raised arrangement in a direction away from the insulating layer.
4. The land nickel plated aluminum foil based double-sided flexible circuit board of claim 2, wherein said electronic component is attached to said insulating ink layer when said electronic component is soldered to said first land.
5. The land nickel plated aluminum foil based double-sided flexible circuit board of claim 2, wherein said electronic component is attached to said insulating ink layer when said electronic component is soldered to said second land.
6. The land nickel plated aluminum foil based double-sided flexible circuit board of any one of claims 2-5, wherein the second aluminum foil layer has a lower end face facing away from the insulating layer, the lower end face of the second aluminum foil layer including a second insulating region and a second weld region, the second weld region forming the second land; the second insulating region is coated with the insulating ink layer.
7. The pad nickel-plated aluminum foil-based double-sided flexible circuit board according to any one of claims 1 to 5, wherein a rivet is provided between the first aluminum foil layer and the second aluminum foil layer, the rivet being made of a metal material; and the two ends of the riveting piece are respectively riveted with the first aluminum foil layer and the second aluminum foil layer.
8. The land nickel plated aluminum foil based double-sided flexible circuit board of any one of claims 1 to 5, wherein the first aluminum foil layer has a first communication portion, the second aluminum foil layer has a second communication portion, and the first communication portion and the second communication portion are brought into circuit communication by punching.
9. The nickel pad plated double sided flexible circuit board based on aluminum foil according to any one of claims 1 to 5, wherein the insulating layer is a PET insulating layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922015697.0U CN211240300U (en) | 2019-11-20 | 2019-11-20 | Double-sided flexible circuit board with nickel-plated welding pads and based on aluminum foil |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922015697.0U CN211240300U (en) | 2019-11-20 | 2019-11-20 | Double-sided flexible circuit board with nickel-plated welding pads and based on aluminum foil |
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| Publication Number | Publication Date |
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| CN211240300U true CN211240300U (en) | 2020-08-11 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201922015697.0U Active CN211240300U (en) | 2019-11-20 | 2019-11-20 | Double-sided flexible circuit board with nickel-plated welding pads and based on aluminum foil |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116867167A (en) * | 2023-06-13 | 2023-10-10 | 太仓神连科技有限公司 | Aluminum flexible printed circuit board assembly and preparation method thereof |
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- 2019-11-20 CN CN201922015697.0U patent/CN211240300U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116867167A (en) * | 2023-06-13 | 2023-10-10 | 太仓神连科技有限公司 | Aluminum flexible printed circuit board assembly and preparation method thereof |
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