CN211238290U

CN211238290U - CSP packaging structure and lamp strip based on CSP packaging structure

Info

Publication number: CN211238290U
Application number: CN201922107875.2U
Authority: CN
Inventors: 刘国旭; 李德建; 申崇渝
Original assignee: Shineon Beijing Technology Co Ltd
Current assignee: Shineon Beijing Technology Co Ltd
Priority date: 2019-11-29
Filing date: 2019-11-29
Publication date: 2020-08-11
Anticipated expiration: 2029-11-29

Abstract

The utility model discloses a CSP packaging structure and lamp strip based on CSP packaging structure, this CSP packaging structure includes: the chip, the packaging adhesive and the light blocking adhesive are arranged; the packaging adhesive is coated on the side face and the top face of the chip; the light blocking glue covers a local area of the top surface of the packaging glue, and the local area comprises an area right above the top surface of the packaging glue corresponding to the chip. The utility model provides a technical scheme glues through the local region coating of the encapsulation glue top surface directly over the chip and blocks out light, shelters from the regional light directly over the chip for regional and chip light-emitting all around are unanimous or close directly over the chip, reach the purpose of even light-emitting promptly.

Description

CSP packaging structure and lamp strip based on CSP packaging structure

Technical Field

The utility model relates to a semiconductor lighting technology field especially relates to a CSP packaging structure and lamp strip based on CSP packaging structure.

Background

The CSP packaging is a chip-scale packaging, and the packaging size and the chip core size are basically the same, so the CSP packaging has the advantage of small volume, and the CSP packaging structure also has the advantages of light weight, good electrical performance and the like, and the CSP packaging structure is applied to various fields due to a plurality of advantages.

The current CSP structure mainly includes a flip chip and a packaging adhesive packaged on the flip chip. Light that flip chip sent can demonstrate directly over the chip and the uneven phenomenon of chip brightness all around on the surface of encapsulation glue, and current CSP packaging structure exists the inhomogeneous shortcoming of light-emitting distribution promptly.

SUMMERY OF THE UTILITY MODEL

The utility model provides a CSP packaging structure and lamp strip based on CSP packaging structure, the local region coating that glues the top surface through the encapsulation directly over the chip blocks light and glues, shelters from the light in the region directly over the chip for regional and chip light-emitting all around are unanimous or close directly over the chip, reach the purpose of even light-emitting promptly.

In a first aspect, the present invention provides a CSP packaging structure, including: the chip, the packaging adhesive and the light blocking adhesive are arranged;

the packaging adhesive is coated on the side face and the top face of the chip;

the light blocking glue covers a local area of the top surface of the packaging glue, and the local area comprises an area right above the top surface of the packaging glue corresponding to the chip.

Preferably, the first and second electrodes are formed of a metal,

the size of the light blocking glue is 1-5 times of that of the chip.

Preferably, the first and second electrodes are formed of a metal,

the thickness range of the light-blocking glue is 1-500 micrometers.

Preferably, the first and second electrodes are formed of a metal,

the light blocking glue comprises white glue.

Preferably, the first and second electrodes are formed of a metal,

the packaging adhesive is made of a luminescent material or a transparent material.

Preferably, the first and second electrodes are formed of a metal,

when the packaging adhesive is a luminescent material, the luminescent material comprises fluorescent powder adhesive.

Preferably, the first and second electrodes are formed of a metal,

when the packaging adhesive is a transparent material, the luminescent material comprises transparent silica gel.

Preferably, the first and second electrodes are formed of a metal,

the chip comprises a chip with a positive structure, a chip with a reverse structure or a chip with a vertical structure.

Preferably, the first and second electrodes are formed of a metal,

the chip comprises a blue light chip, an ultraviolet chip, a green light chip or a red light chip.

In a second aspect, the utility model provides a lamp strip based on CSP packaging structure, include: a substrate and at least one CSP packaging structure as defined by the first aspect.

The utility model provides a CSP packaging structure and lamp strip based on CSP packaging structure, this CSP packaging structure is by the chip, the encapsulation glue is glued and is constituteed with being in the light, wherein the encapsulation is glued the parcel and is glued the side and the top surface at the chip, the local region coating that glues the top surface at the encapsulation has the light-blocking glue, wherein the local region includes that the chip is glued the top surface and is corresponded directly over regional at the encapsulation, be higher than the regional sheltering from of chip luminance all around to luminance directly over the chip promptly, make regional and chip light-emitting all around unanimously or close directly over the chip, reach the purpose of even light-emitting promptly.

Drawings

In order to more clearly illustrate the embodiments or prior art solutions of the present invention, the drawings needed to be used in the description of the embodiments or prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments described in the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without inventive exercise.

Fig. 1 is a schematic structural diagram of a CSP packaging structure according to an embodiment of the present invention;

fig. 2 is a schematic structural diagram of another CSP packaging structure according to an embodiment of the present invention;

wherein, in the figures, the respective reference numerals:

1-chip;

2-packaging glue;

3-light blocking glue;

4-substrate.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention clearer, the technical solutions of the present invention will be clearly and completely described below with reference to the specific embodiments and the corresponding drawings. It is to be understood that the embodiments described are only some embodiments of the invention, and not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly or indirectly secured to the other element. When an element is referred to as being "connected to" another element, it can be directly or indirectly connected to the other element. The terms "upper", "lower", "left", "right", "front", "rear", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positions based on the orientations or positions shown in the drawings, and are for convenience of description only and not to be construed as limiting the technical solution. The terms "first", "second" and "first" are used merely for descriptive purposes and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features. The meaning of "plurality" is two or more unless specifically limited otherwise.

As shown in fig. 1, the present embodiment provides a CSP packaging structure, including: the chip comprises a chip 1, packaging glue 2 and light blocking glue 3; the packaging adhesive 2 is coated on the side surface and the top surface of the chip 1; the light blocking glue 3 covers a local area of the top surface of the packaging glue 2, and the local area comprises an area right above the top surface of the packaging glue 2 corresponding to the chip 1.

In the above embodiment, the light blocking glue 3 is coated on the region of the chip 1 directly above the top surface of the packaging glue 2, that is, when the light blocking glue 3 is not coated on the CSP packaging structure, the luminance of the region directly above the chip 1 is greater than the surrounding luminance of the chip, and the region directly above the chip 1, in which the luminance is greater than the surrounding luminance of the chip, is shielded, so that the light emitted from the region directly above the chip 1 and the surrounding luminance of the chip are consistent or similar, thereby achieving the purpose of uniform light emission.

In an embodiment of the present invention, the size of the light-blocking glue 3 is 1 to 5 times of the size of the chip 1, for example, the size of the light-blocking glue 3 is 1, 1.5, 2, 3 or 5 times of the size of the chip 1. When the size of the light blocking glue 3 is too small, namely smaller than the size of the chip 1, the light blocking glue 3 does not completely cover the area of the chip 1 right above the top surface of the packaging glue 2, and the brightness of part of the area is still higher than that of other areas; when the size of the light blocking glue 3 is too large, namely, the size of the light blocking glue is 5 times larger than that of the chip 1, the original area which does not belong to the area with relatively high brightness can be shielded, so that the brightness of the area is lower than that of other areas, and the phenomenon of uneven light emitting can also occur. Consequently, the size of light-blocking glue 3 is set to 1 time to 5 times of the size of chip 1, so as to achieve the purpose that the CSP packaging structure can uniformly emit light after the light-blocking glue 3 is shielded, and a user can determine the size of the light-blocking glue according to the size of the chip and the size of the packaging glue.

The utility model discloses an embodiment, the thickness scope of the glue 3 that keeps off light is 1 micron ~ 500 micron, for example, the thickness that 3 was glued to the light that keeps off light is 1 micron, 50 microns, 100 microns, 200 microns or 500 microns etc, the glue 3 that is in the light shelters from the region that luminance is higher than luminance all around the chip directly over chip 1, the thickness that 3 was glued in the light is too thin promptly to be less than 1 micron, the effect of being in the light is not good, the condition that luminance is higher than luminance all around the chip still can appear directly over the chip, when the thickness that 3 was glued in the light is too thick promptly to be greater than 500 microns, the effect of being in the light is too good, so that luminance is less than the condition that luminance all around the chip directly over the chip can appear, consequently, the thickness scope of gluing 3 that will be in the light is controlled between 1 micron to 500 microns.

The utility model discloses an embodiment, the light blocking glue 3 is including the white glue, and the white glue extinction is few, has the reflex action moreover to light, consequently utilizes the white glue to glue 3 utilization ratio that can not obviously reduce light as the light blocking glue, and the light blocking glue 3 of course also can be other opaque material, and the user can select according to actual conditions.

In an embodiment of the present invention, the packaging adhesive 2 is a luminescent material or a transparent material, and when the color of the light emitted from the chip 1 needs to be changed, a luminescent material with a luminescent function, such as a phosphor adhesive, can be selected, specifically, when the chip 1 is a blue chip 1, the phosphor adhesive is used as the packaging adhesive 2, and the light emitted from the phosphor adhesive is white light; if the color of the light emitted by the chip 1 does not need to be changed, a transparent material can be selected as the packaging adhesive, such as transparent silica gel, epoxy adhesive and the like, and a user can select the packaging adhesive from the luminescent material or the transparent material according to actual requirements.

The utility model discloses an embodiment, chip 1 is including just adorning structure chip, flip structure chip or vertical structure chip, and the mounting means user that corresponds the chip can select according to actual conditions. Specifically, when the chip 1 is a flip chip, the chip is often fixed on the substrate by die bonding, so as to obtain the CSP package structure shown in fig. 1, and when the chip 1 is a flip chip, the chip is often fixed on the substrate 4 by die bonding and wire bonding, so as to obtain the CSP package structure shown in fig. 2.

The utility model discloses an embodiment, chip 1 includes blue light chip, ultraviolet chip, green glow chip or ruddiness chip, can select according to actual need to the chip user.

In a second aspect, the present embodiment provides a light bar based on a CSP packaging structure, including: the light bar comprises a substrate and at least one CSP packaging structure as described in the first aspect, and the light bar can achieve the effect of uniform light emission.

The above description is only exemplary of the present invention and should not be taken as limiting the scope of the present invention, as any modifications, equivalents, improvements and the like made within the spirit and principles of the present invention are intended to be included within the scope of the present invention.

Claims

1. A CSP packaging structure, comprising: the chip, the packaging adhesive and the light blocking adhesive are arranged;

the packaging adhesive is coated on the side face and the top face of the chip;

2. The CSP package structure of claim 1,

the size of the light blocking glue is 1-5 times of that of the chip.

3. The CSP package structure of claim 1,

the thickness range of the light-blocking glue is 1-500 micrometers.

4. The CSP package structure of claim 1,

the light blocking glue comprises white glue.

5. The CSP package structure of claim 1,

6. The CSP package structure of claim 5,

7. The CSP package structure of claim 5,

8. The CSP package structure of claim 1,

9. The CSP package structure of any one of claims 1 to 8,

10. A kind of light strip based on CSP packaging structure, comprising: a substrate and at least one CSP packaging structure as defined by any one of claims 1 to 9.