CN211235714U - Full-automatic calibration and calibration equipment based on air quality sensor module - Google Patents
Full-automatic calibration and calibration equipment based on air quality sensor module Download PDFInfo
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- CN211235714U CN211235714U CN201920274667.9U CN201920274667U CN211235714U CN 211235714 U CN211235714 U CN 211235714U CN 201920274667 U CN201920274667 U CN 201920274667U CN 211235714 U CN211235714 U CN 211235714U
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Abstract
The utility model discloses a full automatic calibration and equipment of maring based on air quality sensor module, the load simulator comprises a case, the support is installed to quick-witted incasement bottom, installs test bottom plate and test mother board on the support, and test bottom plate passes through circuit and test mother board communication connection, and first fan is installed to quick-witted incasement lateral wall, this first fan pass through the circuit with test bottom board connect. This equipment based on full-automatic calibration and calibration of air quality sensor module adopts the mode of bottom plate and mother board separation, has realized the stack of a plurality of bottom plates and mother board, make test module's quantity can double increase, thereby improve the efficiency of batch production air quality sensor module, and adopt the communication of host computer and next computer, can be more convenient more comprehensive perception every module concrete state in work, correct judgement to module test result is more accurate, effective, product quality has been guaranteed.
Description
Technical Field
The utility model relates to an artificial intelligence technical field specifically is a full automatic calibration and equipment of maring based on air quality sensor module.
Background
Because the air quality sensor technology of the domestic MEMS technology is developed later, a plurality of testing and production devices are incomplete, and the whole prior art is more primary and has no great reference significance. The prior art is basically a relatively original technology, and each module is adopted for independent calibration and calibration, so that a lot of defects and inconvenience are caused, and the defects are mainly reflected in that: (1) time consumption is as follows: single module calibration or within 8 module calibrations: the calibration is long in time consumption and poor in calibration consistency, and single or 8 pieces are somewhat correlated, but the correlation is not enough or poor. (2) The consistency is poor: the calibration result is poor in consistency ratio: the difference between different batches is relatively large. (3) The efficiency is low: only within 1 or 8 is calibrated each time. (4) The artificial interference factors are many: a different reference gas needs to be updated manually.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a full automatic calibration and equipment of demarcation based on air quality sensor module, adopt the mode of bottom plate and mother board separation, the stack of a plurality of bottom plates and mother board has been realized, make test module's quantity increase at double, thereby improve the efficiency of batch production air quality sensor module, and adopt the communication of host computer and next machine, can make things convenient for the concrete state of every module of more comprehensive perception in work, correct judgement to module test result is more accurate, it is effective, the product quality is guaranteed, the problem among the prior art is solved.
In order to achieve the above object, the utility model provides a following technical scheme: a full-automatic calibration and calibration device based on an air quality sensor module comprises a case, wherein a support is arranged at the bottom in the case, a test bottom plate and a test mother plate are arranged on the support, the test bottom plate is in communication connection with the test mother plate through a circuit, and a first fan is arranged on the side wall in the case and is connected with the test bottom plate through a circuit; the bottom in the case is also provided with a heater and a second fan, the heater is connected with a liquid heating circuit contained on the testing bottom plate through a circuit, and the second fan is connected with a fan driving circuit contained on the testing bottom plate through a circuit; the machine case is also internally provided with a gas phase/liquid phase sample injection fixing device which is connected with a socket J02 of a motor driving circuit contained on the test bottom plate through a circuit; one end of the first fan is also provided with a closed door device of an air inlet and an air outlet, and the closed door device is connected with a DC motor pin of a motor driving circuit contained on the test bottom plate through a circuit; the testing bottom plate is provided with a data transmission circuit, a fan driving circuit, a key communication circuit, a motor driving circuit, a buzzer circuit, a testing bottom plate MCU chip circuit, a liquid heating circuit, a communication expansion circuit, a testing mother plate main control chip circuit, a gas mixing fan driving circuit and a battery charging and discharging circuit.
Preferably, the data transmission circuit is composed of an RS232 serial port JS1, a resistor R17, a resistor R20, a resistor R19, an RXD1 terminal, a TXD1 terminal, a resistor R18 and a VDD _ MCU terminal, wherein a pin 6 of the RS232 serial port JS1 is connected with the RXD1 terminal after being connected with the resistor R19 in series, a pin 7 of the RS232 serial port JS1 is connected with the TXD1 terminal after being connected with the resistor R20 in series, one ends of the resistor R17 and the resistor R18 are electrically connected to a pin 6 and a pin 7 circuit interface of the RS232 serial port JS1 respectively, and the other ends of the resistor R17 and the resistor R18.
Preferably, the FAN driving circuit comprises a transistor Q6, a transistor Q7, a resistor R21, a resistor R22, a resistor R23, a resistor R24, a first VDC _ IN terminal, a 5V _ FAN3 terminal, a FAN3 terminal, and a second VDC _ IN terminal, wherein an S electrode of the transistor Q6 is connected to the first VDC _ IN terminal, a D electrode of the transistor Q6 is connected to the 5V _ FAN3 terminal, a G electrode of the transistor Q6 is connected IN series with the resistor R22 and then connected to a collector of the transistor Q7, a base electrode of the transistor Q7 is connected IN series with the resistor R24 and then connected to the FAN3 terminal, two ends of the resistor R21 are connected IN parallel to an S electrode and G circuit interface of the transistor Q6, one end of the resistor R23 is electrically connected to a circuit interface of the resistor R24, and the other end of the resistor R23 is connected to the second VDC _ IN terminal.
Preferably, the key communication circuit is composed of a key switch K1, a key switch K2, a key switch K3, communication interfaces SIP3, a K _ CHE CK terminal, a K _ CHE CK1 terminal, a K _ CHE CK2 terminal, a TXD1 terminal and an RXD1 terminal, wherein the key switch K1 is connected to the K _ CHE CK terminal, the key switch K2 is connected to the K _ CHE CK1 terminal, one end of the key switch K3 is connected to the circuit interface of the key switch K2, the other end is connected to the K _ CHE CK2 terminal, a pin 1 of the communication interface SIP3 is connected to the TXD1 terminal, and a pin 2 of the communication interface SIP3 is connected to the RXD1 terminal.
Preferably, the test backplane MCU chip circuit is composed of a main control chip U1, an RXD terminal, a TXD terminal, a K _ CHECK1 terminal, a FAN1 terminal, a P00 terminal, a P01 terminal, a P002 terminal and a VDD _ MCU terminal, wherein pins 19 and 20 of the main control chip U1 are respectively connected to the RXD terminal and the TXD terminal, pins 23 and 24 of the main control chip U1 are respectively connected to the K _ CHECK terminal and the K _ CHECK1 terminal, pin 36 of the main control chip U1 is connected to the FAN1 terminal, pins 37, 38 and 39 of the main control chip U1 are respectively connected to the P00 terminal, the P01 terminal and the P002 terminal, and pin 12 of the main control chip U1 is connected to the VDD _ MCU terminal.
Preferably, the buzzer circuit is composed of a triode Q9, a buzzer BL1, a resistor R133, a BUZ/PWN terminal and a BAT _5V terminal, the base of the triode Q9 is connected with the resistor R133 in series and then connected with the BUZ/PWN terminal, the collector of the triode Q9 is connected with a pin 2 of the buzzer BL1, and a pin 1 of the buzzer BL1 is connected with the BAT _5V terminal.
Preferably, the motor driving circuit is composed of a motor driving chip U9, a socket J01, a socket J02, a socket J03, a motor DC and a loudspeaker SPKR, the socket J01 is connected with the MCU chip circuit 12 of the test base plate through a circuit, the socket J02 is connected with a motor for controlling the gas phase/liquid phase sample injection fixing device through a circuit, and the socket J03 is connected with a sealing door device for controlling the air inlet and the air outlet through a circuit.
Preferably, the gas hybrid fan driving circuit is composed of a triode Q3, a triode Q4, a socket CN1, a resistor R4, a resistor R2, a power source VDC _ IN port and a socket CN1, a base of the triode Q4 is connected IN series with the resistor R4 and then connected to the MCU chip circuit 12 of the test board through a line, a collector of the triode Q4 is connected IN series with the resistor R2 and then connected to a G pole of the triode Q3, an S pole of the triode Q3 is connected to the power source VDC _ IN port through a line, a D pole of the triode Q3 is connected to the socket CN1, and the socket CN1 is connected to the second fan through a line.
Preferably, the liquid heating circuit consists of a triode Q1, a triode Q2, a resistor R8, a HEAT1 terminal and a socket CN5, the base of the triode Q1 is connected in series with the resistor R8 and then connected with the HEAT1 terminal, the D pole of the triode Q2 is connected with a pin 1 of the socket CN5, and the socket CN5 is connected with the heating device through a line.
Preferably, the clamping circuits of the modules to be tested are uniformly arranged on the test motherboard, the clamping circuits are composed of spring test pins S1, CN1 and CN2, the spring test pins S1 clamp the air quality sensor module, CN1 is connected to pins 3 and 4 of the test module, and CN2 is connected to the main control chip circuit of the test motherboard through a circuit.
Preferably, the test motherboard also comprises a display screen circuit, the display screen circuit is composed of an FPC board, and the FPC board is in circuit connection with the test motherboard main control chip through a circuit.
Preferably, the communication expansion circuit 14 is composed of a switch chip U10, the pin 3 and the pin 13 of the switch chip U10 are connected to the port of the test motherboard main control chip circuit through wires, the pins 1, 5, 2, 4 and the pins 12, 14, 15, 11 of the switch chip U10 are connected to the pin 3 and the pin 4 of the terminal SI of the clamping circuit of the module to be tested through wires, respectively, and the pins 9, 10, 6 of the switch chip U10 are connected to the port of the test motherboard main control chip circuit through wires.
Preferably, the battery charging and discharging circuit is composed of a charging and discharging management chip U3 and a socket CN4, a pin 5 of the charging and discharging management chip U3 is connected to the socket CN4, the socket CN4 is connected to the battery, and a pin 4 of the charging and discharging management chip U3 is connected to the power input end through resistors R176 and R171.
Compared with the prior art, the beneficial effects of the utility model are as follows:
this equipment based on full-automatic calibration and calibration of air quality sensor module adopts the mode that test bottom plate and test mother board separate, the stack of a plurality of test bottom plates and test mother board has been realized, make the quantity of test module multiply increase, thereby improve the efficiency of batch production air quality sensor module, and adopt test bottom plate and test mother board communication connection, can be more convenient more comprehensive perception every module concrete state in work, correct judgement to module test result is more accurate, effective, product quality has been guaranteed.
Drawings
FIG. 1 is a front view of the overall structure of the present invention;
fig. 2 is a circuit diagram of the data transmission circuit of the present invention;
FIG. 3 is a circuit diagram of the fan driving circuit of the present invention;
fig. 4 is a circuit diagram of the key communication of the present invention;
fig. 5 is a circuit diagram of the motor driving circuit of the present invention;
FIG. 6 is a circuit diagram of the buzzer of the present invention;
fig. 7 is a circuit diagram of the display screen of the present invention;
FIG. 8 is a circuit diagram of the MCU chip of the testing bottom plate of the present invention;
FIG. 9 is a circuit diagram of the liquid heating apparatus of the present invention;
fig. 10 is a circuit diagram of the module communication expansion circuit of the present invention;
fig. 11 is a circuit diagram of a main control chip of the test motherboard of the present invention;
fig. 12 is a circuit diagram of a gas hybrid fan according to the present invention;
fig. 13 is a circuit diagram of a clamping circuit of a module to be tested according to the present invention;
fig. 14 is a circuit diagram of the battery charging and discharging circuit of the present invention.
In the figure: 1. a chassis; 2. a support; 3. testing the bottom plate; 4. testing the motherboard; 5. a first fan; 6. A data transmission circuit; 7. a fan drive circuit; 8. a key communication circuit; 9. a motor drive circuit; 10. A buzzer circuit; 11. a display screen circuit; 12. testing a bottom plate MCU chip circuit; 13. a liquid heating circuit; 14. a communication expansion circuit; 15. testing a motherboard main control chip circuit; 16. a gas mixing fan drive circuit; 17. a clamping circuit; 18. a battery charge and discharge circuit; 19. a heater; 20. a second fan; 21. a gas phase/liquid phase sample injection fixing device; 22. a door device is closed.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1, 7 and 13, an apparatus for full-automatic calibration and calibration based on an air quality sensor module includes a case 1, a bracket 2 is installed at the bottom inside the case 1, a test base plate 3 and a test mother plate 4 are installed on the bracket 2, the test base plate 3 is in communication connection with the test mother plate 4 through a line, a first fan 5 is installed on a side wall inside the case 1, and the first fan 5 is connected with the test base plate 3 through a line; a heater 19 and a second fan 20 are further mounted at the bottom in the case 1, the heater 19 is connected with the liquid heating circuit 13 contained on the testing base plate 3 through a circuit, and the second fan 20 is connected with the fan driving circuit 7 contained on the testing base plate 3 through a circuit; the cabinet 1 is also internally provided with a gas phase/liquid phase sample injection fixing device 21, and the gas phase/liquid phase sample injection fixing device 21 is connected with a socket J02 of a motor driving circuit 9 contained on the test bottom plate 3 through a circuit; a sealed door device 22 of an air inlet and an air outlet is further arranged at one end of the first fan 5, and the sealed door device 22 is connected with a DC motor pin of a motor driving circuit 9 contained on the test bottom plate 3 through a circuit; the testing bottom plate 3 comprises a data transmission circuit 6, a fan driving circuit 7, a key communication circuit 8, a motor driving circuit 9, a buzzer circuit 10, a testing bottom plate MCU chip circuit 12, a liquid heating circuit 13, a communication expansion circuit 14, a testing mother plate main control chip circuit 15, a gas mixing fan driving circuit 16 and a battery charging and discharging circuit 18; clamping circuits 17 of modules to be tested are uniformly arranged on the test mother board 4, each clamping circuit 17 consists of a spring test pin S1, a CN1 and a CN2, each spring test pin S1 clamps the air quality sensor module, each CN1 is connected to a pin 3 and a pin 4 of the test module, each CN1 can be connected to a computer or other equipment for burning software programs of the modules to be tested, each CN2 is connected to the test mother board main control chip circuit 15 through a circuit, and each CN2 can be connected to the computer or other equipment for reading data transmitted by the test module; the test mother board 4 also comprises a display screen circuit 11, the display screen circuit 11 is composed of an FPC board, and the FPC board is connected with a test mother board main control chip circuit 15 through a circuit.
Referring to fig. 2, the data transmission circuit 6 is composed of an RS232 serial port JS1, a resistor R17, a resistor R20, a resistor R19, an RXD1 terminal, a TXD1 terminal, a resistor R18, and a VDD _ MCU terminal, wherein a pin 6 of the RS232 serial port JS1 is connected in series with the resistor R19 and then connected with an RXD1 terminal, a pin 7 of the RS232 serial port JS1 is connected in series with the resistor R20 and then connected with the TXD1 terminal, one ends of the resistor R17 and the resistor R18 are respectively and electrically connected to a pin 6 and a pin 7 circuit interface of the RS232 serial port JS1, and the other ends of the resistor R17 and the; the data transmission circuit 6 is used for realizing the communication connection between the upper computer and the lower computer, so that the data transmission is facilitated.
Referring to fig. 3, the FAN driving circuit 7 is composed of a transistor Q6, a transistor Q7, a resistor R21, a resistor R22, a resistor R23, a resistor R24, a first VDC _ IN terminal, a 5V _ FAN3 terminal, a FAN3 terminal, and a second VDC _ IN terminal, wherein an S electrode of the transistor Q6 is connected to the first VDC _ IN terminal, a D electrode of the transistor Q6 is connected to the 5V _ FAN3 terminal, a G electrode of the transistor Q6 is connected to a collector of the transistor Q7 after being connected to the resistor R22 IN series, a base electrode of the transistor Q7 is connected to the FAN3 after being connected to the resistor R24 IN series, two ends of the resistor R21 are connected to an S electrode and G circuit interface of the transistor Q6 IN parallel, one end of the resistor R23 is electrically connected to a circuit interface of the resistor R24, and the other end of the resistor R23 is connected to the second VDC _ IN; the operation of the fan 5 is initiated by the fan drive circuit 7 to ensure a thorough and homogeneous mixing of the concentration gas and the air in the cabinet 1.
Referring to fig. 4, the key communication circuit 8 is composed of a key switch K1, a key switch K2, a key switch K3, a communication interface SIP3, a K _ CHE CK terminal, a K _ CHE CK1 terminal, a K _ CHE CK2 terminal, a TXD1 terminal, and an RXD1 terminal, wherein the key switch K1 is connected to the K _ CHE CK terminal, the key switch K2 is connected to the K _ CHE CK1 terminal, one end of the key switch K3 is connected to the circuit interface of the key switch K2, the other end is connected to the K _ CHE CK2 terminal, a pin 1 of the communication interface SIP3 is connected to the TXD1 terminal, and a pin 2 of the communication interface SIP3 is connected to the RXD1 terminal; human-computer interaction is realized through the key communication circuit 8, and people can operate the human equipment conveniently.
Referring to fig. 5, the motor driving circuit 9 is composed of a motor driving chip U9, a socket J01, a socket J02, a socket J03, a motor DC and a horn SPKR, the socket J01 is connected to the MCU chip circuit 12 of the test board through a circuit, the socket J02 is connected to the motor controlling the gas/liquid phase sample injection fixing device 21 through a circuit, and the socket J03 is connected to the sealing door device 22 controlling the air inlet and outlet through a circuit; the control and operation of the connected equipment are realized through the motor driving circuit 9.
Referring to fig. 6, the buzzer circuit 10 is composed of a transistor Q9, a buzzer BL1, a resistor R133, a BUZ/PWN terminal, and a BAT _5V terminal, wherein a base of the transistor Q9 is connected in series with the resistor R133 and then connected with the BUZ/PWN terminal, a collector of the transistor Q9 is connected with a pin 2 of the buzzer BL1, and a pin 1 of the buzzer BL1 is connected with the BAT _5V terminal; the buzzer circuit 10 provides warning, and safety accidents happen.
Referring to fig. 8, the MCU chip circuit 12 includes a main control chip U1, an RXD terminal, a TXD terminal, a K _ CHECK1 terminal, a FAN1 terminal, a P00 terminal, a P01 terminal, a P002 terminal, and a VDD _ MCU terminal, wherein the pins 19 and 20 of the main control chip U1 are respectively connected to the RXD and TXD terminals, the pins 23 and 24 of the main control chip U1 are respectively connected to the K _ CHECK and K _ CHECK1 terminals, the pin 36 of the main control chip U1 is connected to the FAN1 terminal, the pins 37, 38 and 39 of the main control chip U1 are respectively connected to the P00, P01, and P002 terminals, and the pin 12 of the main control chip U1 is connected to the VDD _ MCU terminal.
Referring to fig. 9, the liquid heating circuit 13 is composed of a transistor Q1, a transistor Q2, a resistor R8, a HEAT1 terminal, and a socket CN5, a base of the transistor Q1 is connected in series with the resistor R8 and then connected with the HEAT1 terminal, a D pole of the transistor Q2 is connected to a pin 1 of the socket CN5, and the socket CN5 is connected to the heating device through a line.
Referring to fig. 10, the communication expansion circuit 14 is composed of a switch chip U10, and completes expansion from 1 path to 4 paths and expansion from 1 path to multiple paths, the pin 3 and the pin 13 of the switch chip U10 are connected to the port of the test motherboard main control chip circuit 15 through lines, the pins 1, 5, 2, 4 and the pins 12, 14, 15, 11 of the switch chip U10 are connected to the pin 3 and the pin 4 of the terminal SI of the clamp circuit 17 of the module to be tested through lines, respectively, and the pins 9, 10, 6 of the switch chip U10 are connected to the port of the test motherboard main control chip circuit 15 through lines;
referring to fig. 12, the gas hybrid fan driving circuit 16 includes a transistor Q3, a transistor Q4, a socket CN1, a resistor R4, a resistor R2, a power VDC _ IN port, and a socket CN1, wherein a base of the transistor Q4 is connected IN series with the resistor R4 and then connected to the MCU chip circuit 12 of the test board MCU through a circuit, a collector of the transistor Q4 is connected IN series with the resistor R2 and then connected to a G-pole of the transistor Q3, an S-pole of the transistor Q3 is connected to the power VDC _ IN port through a circuit, a D-pole of the transistor Q3 is connected to the socket CN1, and the socket CN1 is connected to the second fan 20 through.
Referring to fig. 14, the battery charging/discharging circuit 18 is composed of a charging/discharging management chip U3 and a socket CN4, a pin 5 of the charging/discharging management chip U3 is connected to the socket CN4, the socket CN4 is connected to the battery, and a pin 4 of the charging/discharging management chip U3 is connected to the power input terminal through resistors R176 and R171.
In summary, the following steps: this equipment based on full automatic calibration and calibration of air quality sensor module, adopt the mode of test bottom plate 3 and test mother board 4 separation, the stack of a plurality of test bottom plates 3 and test mother board 4 has been realized, make the quantity of test module multiply increase, thereby improve the efficiency of batch production air quality sensor module, and adopt test bottom plate 3 and test mother board 4 communication connection, can be more convenient more comprehensive perception every module concrete state in work, correct judgement to module test result is more accurate, effective, product quality has been guaranteed, therefore the effectual problem of having solved among the prior art.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (9)
1. The utility model provides a full-automatic calibration and demarcation equipment based on air quality sensor module, includes quick-witted case (1), its characterized in that: the testing device is characterized in that a support (2) is mounted at the bottom in the case (1), a testing bottom plate (3) and a testing mother plate (4) are mounted on the support (2), the testing bottom plate (3) is in communication connection with the testing mother plate (4) through a circuit, a first fan (5) is mounted on the side wall in the case (1), and the first fan (5) is connected with the testing bottom plate (3) through a circuit; a heater (19) and a second fan (20) are further mounted at the bottom in the case (1), the heater (19) is connected with a liquid heating circuit (13) contained on the testing bottom plate (3) through a circuit, and the second fan (20) is connected with a fan driving circuit (7) contained on the testing bottom plate (3) through a circuit; a gas phase/liquid phase sample injection fixing device (21) is also installed in the case (1), and the gas phase/liquid phase sample injection fixing device (21) is connected with a socket J02 of a motor driving circuit (9) contained on the test bottom plate (3) through a circuit; one end of the first fan (5) is also provided with a sealing door device (22) of an air inlet and an air outlet, and the sealing door device (22) is connected with a DC motor pin of a motor driving circuit (9) contained on the test bottom plate (3) through a circuit; the testing base plate (3) is provided with a data transmission circuit (6), a fan driving circuit (7), a key communication circuit (8), a motor driving circuit (9), a buzzer circuit (10), a testing base plate MCU chip circuit (12), a liquid heating circuit (13), a communication expansion circuit (14), a testing mother board main control chip circuit (15), a gas mixing fan driving circuit (16) and a battery charging and discharging circuit (18).
2. The apparatus according to claim 1, wherein the apparatus comprises: data transmission circuit (6) is by RS232 serial ports JS1, resistance R17, resistance R20, resistance R19, RXD1 terminal, TXD1 terminal, resistance R18, VDD _ MCU terminal is constituteed, wherein, connect RXD1 terminal behind RS232 serial ports JS 1's the foot 6 concatenates resistance R19, connect TXD1 terminal behind RS232 serial ports JS 1's foot 7 concatenates resistance R20, resistance R17 is connected on RS232 serial ports JS 1's foot 6 and foot 7 circuit interface with the one end of resistance R18 electricity respectively, the other end all is connected in VDD _ MCU terminal.
3. The apparatus according to claim 1, wherein the apparatus comprises: the FAN driving circuit (7) is composed of a triode Q6, a triode Q7, a resistor R21, a resistor R22, a resistor R23, a resistor R24, a first VDC _ IN terminal, a 5V _ FAN3 terminal, a FAN3 terminal and a second VDC _ IN terminal, wherein the S pole of the triode Q6 is connected with the first VDC _ IN terminal, the D pole of the triode Q6 is connected with the 5V _ FAN3 terminal, the G pole of the triode Q6 is connected with the collector of the triode Q7 after being connected with the resistor R22 IN series, the base stage of the triode Q7 is connected with the FAN3 terminal after being connected with the resistor R24 IN series, two ends of the resistor R21 are connected with the interface between the S pole and the G pole of the triode Q6 IN parallel, one end of the resistor R23 is electrically connected with the circuit interface of the resistor R24, and the other end of the resistor R23 is connected.
4. The apparatus according to claim 1, wherein the apparatus comprises: the key communication circuit (8) is composed of a key switch K1, a key switch K2, a key switch K3, a communication interface SIP3, a K _ CHE CK terminal, a K _ CHE CK1 terminal, a K _ CHE CK2 terminal, a TXD1 terminal and an RXD1 terminal, wherein the key switch K1 is connected to the K _ CHE CK terminal, the key switch K2 is connected to the K _ CHE CK1 terminal, one end of the key switch K3 is connected to the circuit interface of the key switch K2, the other end of the key switch K3 is connected to the K _ CHE CK2 terminal, a pin 1 of the communication interface SIP3 is connected to the TXD1 terminal, and a pin 2 of the communication interface SIP3 is connected to the RXD1 terminal.
5. The apparatus according to claim 1, wherein the apparatus comprises: the buzzer circuit (10) is composed of a triode Q9, a buzzer BL1, a resistor R133, a BUZ/PWN terminal and a BAT _5V terminal, the base electrode of the triode Q9 is connected with the BUZ/PWN terminal after being connected with the resistor R133 in series, the collector electrode of the triode Q9 is connected with a pin 2 of the buzzer BL1, and a pin 1 of the buzzer BL1 is connected with the BAT _5V terminal.
6. The apparatus according to claim 1, wherein the apparatus comprises: motor drive circuit (9) comprise motor drive chip U9 and socket J01, socket J02, socket J03, motor DC and loudspeaker SPKR, and socket J01 is connected with test bottom plate MCU chip circuit (12) through the circuit, and socket J02 is connected with the motor of control gaseous phase/liquid phase advance kind fixing device (21) through the circuit, and socket J03 is connected with sealing door device (22) of control business turn over wind gap through the circuit.
7. The apparatus according to claim 1, wherein the apparatus comprises: the gas mixing fan driving circuit (16) is composed of a triode Q3, a triode Q4, a socket CN1, a resistor R4, a resistor R2, a power supply VDC _ IN port and a socket CN1, wherein the base electrode of the triode Q4 is connected with the resistor R4 IN series and then is connected to the MCU chip circuit (12) of the testing bottom plate through a line, the collector electrode of the triode Q4 is connected with the resistor R2 IN series and then is connected to the G electrode of the triode Q3, the S electrode of the triode Q3 is connected to the power supply VDC _ IN port through a line, the D electrode of the triode Q3 is connected to the socket CN1, and the socket CN1 is connected to the second.
8. The apparatus according to claim 1, wherein the apparatus comprises: the liquid heating circuit (13) consists of a triode Q1, a triode Q2, a resistor R8, a HEAT1 terminal and a socket CN5, wherein the base electrode of the triode Q1 is connected with the resistor R8 in series and then connected with the HEAT1 terminal, the D pole of the triode Q2 is connected with a pin 1 of the socket CN5, and the socket CN5 is connected to a heating device through a line.
9. The apparatus according to claim 1, wherein the apparatus comprises: the testing motherboard (4) is also provided with a display screen circuit (11), the display screen circuit (11) is composed of an FPC board, and the FPC board is connected with a testing motherboard main control chip circuit (15) through a circuit.
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CN109725115A (en) * | 2019-03-05 | 2019-05-07 | 深圳市申思科技有限公司 | A kind of equipment of Full-automatic calibration and calibration based on air quality sensor module |
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2019
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Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109725115A (en) * | 2019-03-05 | 2019-05-07 | 深圳市申思科技有限公司 | A kind of equipment of Full-automatic calibration and calibration based on air quality sensor module |
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