CN211124839U - L ED display module with infrared receiving head bracket - Google Patents
L ED display module with infrared receiving head bracket Download PDFInfo
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- CN211124839U CN211124839U CN202020107064.2U CN202020107064U CN211124839U CN 211124839 U CN211124839 U CN 211124839U CN 202020107064 U CN202020107064 U CN 202020107064U CN 211124839 U CN211124839 U CN 211124839U
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- receiving head
- infrared receiving
- pcb
- display screen
- head bracket
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Abstract
The utility model provides a take L ED display module assembly of infrared receiving head support, including the PCB board, link firmly in the display screen of PCB board face, set up in display screen one side and with display screen integrated into one piece's infrared receiving head support, install the infrared receiving head on infrared receiving head support, and be used for the sealing layer of sealed infrared receiving head pin, the utility model discloses a set up one side that keeps away from the PCB board with infrared receiving head support to a plane, and set up a plurality of pin mounting holes on this plane, make infrared receiving head's pin insert can effectively be fixed behind the pin mounting hole, make infrared receiving head installation steadily not have the height unevenness, and adopt the pin to insert the pin and effectively ensure that infrared receiving head's pin does not take place the oxidation corrosion of pin mounting hole and the sealed mode of sealing layer, ensure infrared receiving head signal transmission stable, in addition, because infrared receiving head support is with display screen integrated into one piece's structure, consequently need not to fix the support with the PCB board once more, use more portably.
Description
Technical Field
The utility model relates to an L ED shows the field, concretely relates to take L ED display module group of infrared receiving head support.
Background
The L ED display module with the infrared receiving head in the prior art, wherein the infrared receiving head is installed by sponge, the sponge is made of flexible materials, and after the infrared receiving head is placed in a sponge groove, the phenomenon of unevenness and inconsistent angle easily exists, and the signal receiving effect of the infrared receiving head is influenced.
Among the prior art, still including another kind of display module assembly, this type of display module assembly's infrared receiving head itself has metal support, but the structural constraint by metal support can lead to infrared receiving head pin at the in-process of blacking out gluey, and the pin back can not reach the colloid easily, can not reach sealed effect, consequently the tripod rusts easily in the salt spray test for the contact effect of pin is poor, and infrared receiving head's life is short.
The infrared receiving head mounting structures of the two display module assemblies in the prior art can not fully meet the performance requirements of stable and efficient receiving signals of the infrared receiving heads, long service life and the like, so that the display module assembly with the infrared receiving head mounting support needs to be developed, and the infrared receiving heads in the display module assembly are stably mounted and stably receive signals and are long in service life.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a take L ED display module assembly of infrared receiving head support, solve the height that adopts sponge installation and metal support installation infrared receiving head to bring and the easy rusty technical problem of pin for the stable received signal of infrared receiving head, and life extension.
In order to achieve the purpose, the utility model provides an L ED display module with an infrared receiving head bracket, which comprises a PCB board, a display screen, an infrared receiving head bracket and a sealing layer;
the display screen is fixedly connected to the surface of the PCB, and the infrared receiving head bracket is arranged on one side of the display screen and is integrally formed with the display screen; one side, far away from the PCB, of the infrared receiving head support is provided with a plane, a plurality of pin mounting holes penetrating through the infrared receiving head support are formed in the plane, the end, close to the PCB, of each pin mounting hole is attached to the surface of the PCB, and the pin mounting holes correspond to the positions, on the surface of the PCB, of the mounting holes for mounting the infrared receiving heads one by one;
the infrared receiving head comprises an infrared receiving head main body and a pin connected with the infrared receiving head main body; the number of the pins is equal to that of the pin mounting holes, and the pins are inserted into the pin mounting holes from the side, far away from the PCB, of the plane of the infrared receiving head bracket and then connected to the PCB; the infrared receiving head main body is positioned on the side edge of the infrared receiving head support far away from the PCB, and the infrared receiving head main body is bent from the connecting part of the infrared receiving head main body and the pins to the side of the infrared receiving head support far away from the plane of the PCB to be parallel to the plane; the sealing layer is arranged on the side of the PCB board mounting infrared receiving head bracket and used for sealing pins and the joints of the pins and the pin mounting holes.
Through setting up the infrared receiving head support with display screen integrated into one piece, and set up the mode of pin mounting hole at infrared receiving head support, make the position that can effectively fix infrared receiving head after infrared receiving head's pin inserts the pin mounting hole, avoided infrared receiving head to appear the phenomenon of height unevenness and angle nonconformity after the installation, simultaneously because the pin inserts the pin mounting hole and can effectively avoid the pin to oxidize and rust in the salt spray test, lead to the poor condition of infrared receiving head contact effect to take place.
Further, defining that one side, close to the display screen, of the plane, far away from the PCB, of the infrared receiving head bracket is the left side, one side, far away from the PCB, of the infrared receiving head bracket, provided with the pin mounting hole, of the plane is the front side, and the opposite sides are the right side and the rear side respectively; the infrared receiving head support is far away from the end part of the plane of the PCB board, close to the pin mounting hole, from the lap joint of the rear side of the infrared receiving head support and the display screen to the right side of the infrared receiving head support, and the height of the baffle on the PCB board is not more than the height of the display screen on the PCB board.
Further, the height of the infrared receiving head on the PCB is defined as H1, the height of the baffle on the PCB is defined as H2, and H2 is more than or equal to 1/2H 1.
Furthermore, the pin mounting holes are positioned on the same straight line of the plane side of the infrared receiving head bracket, and the pin mounting holes are square holes, circular holes or semicircular holes.
Further, the plane that PCB board was kept away from to baffle, display screen lateral wall and infrared receiving head support constitutes a lateral wall open-ended square groove structure jointly, the pin mounting hole sets up and is close to the opening side at square groove bottom, and infrared receiving head main part is installed at square inslot.
Further, the baffle and the infrared receiving head bracket are integrally formed.
Further, the sealing layer is a black glue sealing layer.
Further, display screen, infrared receiving head support and the integrative injection moulding of baffle, consequently can with display screen integrated into one piece, it is fixed when the display screen, infrared receiving head support also directly fixed, need not to increase other fixed knot and construct.
According to the technical scheme provided by the utility model, the utility model discloses a L ED display module group of taking infrared receiving head support that technical scheme provided has obtained following beneficial effect:
the utility model discloses a take L ED display module group of infrared receiving head support, including the PCB board, link firmly in the display screen of PCB board face, set up in display screen one side and with display screen integrated into one piece's infrared receiving head support, install the infrared receiving head on infrared receiving head support, and be used for the sealing layer of sealed infrared receiving head pin, the utility model discloses a set up one side that keeps away from the PCB board with infrared receiving head support into a plane to set up a plurality of pin mounting holes on this plane, can effectively be fixed after infrared receiving head's pin inserts the pin mounting hole, and make infrared receiving head installation steady, it is poor to avoid appearing the infrared receiving effect that the uneven and the inconsistent phenomenon of angle leads to, adopt the combination of modes such as pin insertion pin mounting hole and sealing layer sealed to effectively ensure infrared receiving head's pin in salt fog test and follow-up use not take place oxidation corrosion, infrared receiving head's contact effect is good, and signal transmission is stable.
In addition, because the utility model discloses an infrared receiving head support is with display screen integrated into one piece's structure, consequently need not to fix the support with the PCB board once more, uses more portably, simultaneously, other electronic component can not touch infrared receiving head when guaranteeing L ED display module assembly equipment, is provided with the baffle in infrared receiving head support's plane side, maintains infrared receiving head's safety through the baffle.
It should be understood that all combinations of the foregoing concepts and additional concepts described in greater detail below can be considered as part of the inventive subject matter of the present disclosure unless such concepts are mutually inconsistent.
The foregoing and other aspects, embodiments and features of the present teachings can be more fully understood from the following description taken in conjunction with the accompanying drawings. Additional aspects of the present invention, such as features and/or advantages of exemplary embodiments, will be apparent from the description which follows, or may be learned by practice of the specific embodiments in accordance with the teachings of the present invention.
Drawings
The drawings are not intended to be drawn to scale. In the drawings, each identical or nearly identical component that is illustrated in various figures may be represented by a like numeral. For purposes of clarity, not every component may be labeled in every drawing. Embodiments of various aspects of the present invention will now be described, by way of example, with reference to the accompanying drawings, in which:
fig. 1 is a specific structure diagram of the present invention.
In the figure, the specific meaning of each mark is:
the display device comprises a PCB (printed circuit board), 2-pin mounting holes, 3-infrared receiving head brackets, 4-a display screen, 5-infrared receiving heads and 6-baffles.
Detailed Description
For a better understanding of the technical content of the present invention, specific embodiments are described below in conjunction with the accompanying drawings.
In this disclosure, aspects of the present invention are described with reference to the accompanying drawings, in which a number of illustrative embodiments are shown. Embodiments of the present disclosure are not intended to be limited to including all aspects of the present disclosure. It should be appreciated that the various concepts and embodiments described above, as well as those described in greater detail below, may be implemented in any of numerous ways, as the disclosed concepts and embodiments are not limited to any implementation. Additionally, some aspects of the present disclosure may be used alone or in any suitable combination with other aspects of the present disclosure.
The utility model aims at providing a L ED display module of new construction, this L ED display module design has the infrared receiving head support 3 with display screen integrated into one piece, and this support realizes not taking place oxidation corrosion to infrared receiving head 5's steady fixed and effectively guaranteeing that infrared receiving head 5's pin does not take place oxidation corrosion.
The use of "including" or "comprising" and like terms in the description and claims of this patent application is intended to mean that the element or item presented before "comprising" or "comprises" includes "or" comprising "is inclusive of the feature, integer, step, operation, element, and/or component presented after" comprising "or" comprising, "and does not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof. "front", "back", "left", "right", etc. are used only to indicate relative positional relationships, and when the absolute position of the object being described changes, the relative positional relationships may also change accordingly.
The L ED display module with IR receiving head bracket according to the present invention will be further described with reference to the embodiments shown in the drawings.
As shown in a combined figure 1, the L ED display module with the infrared receiving head support comprises a PCB (printed circuit board) 1, a display screen 4, an infrared receiving head 5, an infrared receiving head support 3 and a sealing layer, wherein the display screen 4 is fixedly connected to the surface of the PCB 1, the infrared receiving head support 3 is arranged on one side of the display screen 4 and is integrally formed with the display screen 4, one side, far away from the PCB 1, of the infrared receiving head support 3 is provided with a plane, a plurality of pin mounting holes 2 penetrating through the infrared receiving head support 3 are formed in the plane, the end portions, close to the PCB 1, of the pin mounting holes 2 are attached to the surface of the PCB 1, the pin mounting holes correspond to the positions, on the surface of the PCB, of the mounting holes for mounting the infrared receiving heads 5 one by one, the infrared receiving head 5 comprise infrared receiving head main bodies and pins connected to the infrared receiving head main bodies, the number of the pins is equal to the number of the pin mounting holes 2, the pins are inserted into the pin mounting holes 2 from the side, far away from the PCB 1, the infrared receiving head support 2, the pins are connected to the PCB 1, the black-proof glue sealing layer is arranged at the side of the infrared receiving head support, the black-proof glue sealing layer, the pins, the black-proof glue sealing layer is arranged at the side far away from the side of the PCB, the infrared receiving head support, the black-proof glue sealing layer is used for preventing glue sealing layer, the black-proof glue sealing.
The utility model discloses a make infrared receiving head support 3 and 4 integrated into one piece of display screen, set up one side that keeps away from PCB board 1 with infrared receiving head support 3 to a plane, and set up the mode of pin mounting hole 2 on this plane, provide a steady and effectively fixed mounting platform for infrared receiving head 3, can effectively fix infrared receiving head 3's position after infrared receiving head 3's pin inserts pin mounting hole 2, avoided infrared receiving head 3 to appear the phenomenon of uneven and the angle nonconformity after the installation, because the pin inserts pin mounting hole 2 and can effectively avoid the pin to take place the oxidation rust in salt spray test and follow-up use after the black glue is sealed again, consequently, the L ED display module of taking infrared receiving head support disclosed in this application, both can solve the uneven problem of sponge installation, can solve fixed and pin oxidation problem again, and the convenience of use is higher.
In the further combination of the embodiment shown in fig. 1, the side of the infrared receiving head bracket 3 away from the plane of the PCB 1, which is close to the display screen 4, is defined as the left side, the side of the infrared receiving head bracket 3 away from the plane of the PCB 1, which is provided with the pin mounting hole 2, is defined as the front side, and the opposite sides are respectively the right side and the rear side, the baffle 6 is arranged on the end of the infrared receiving head bracket 3 away from the plane of the PCB 1, which is close to the pin mounting hole 2, from the overlapping position of the rear side and the display screen 4 to the right side of the infrared receiving head bracket 3, which is close to the pin mounting hole 2, and the height of the baffle 6 on the PCB 1 is not more than the height of the display screen 4 on the PCB 1, in the embodiment shown in fig. 1, the baffle 6, the side wall of the display screen 4, and the plane of the infrared receiving head bracket 3 away from the PCB 1 jointly form a square groove structure with an opening on a side wall, the pin mounting hole 2 is arranged at the bottom of the square groove, and the infrared receiving head body is arranged in the square groove, so.
For the convenience degree that improves baffle 6 production, baffle 6 generally adopts the production mode with 3 integrated into one piece of infrared receiving head support, adopts baffle 6, infrared receiving head support 3 and 4 integrated into one piece of display screen can effectively avoid setting up the fixed connection between a plurality of production moulds and the part many times, targets in place in one step, and processing is simple and reduction in production cost. Generally, under the comprehensive consideration of insulation and production cost, the display screen 4, the infrared receiving head bracket 3 and the baffle 6 are all made of plastic materials and are formed by injection molding, when the display screen 4 is fixed, the infrared receiving head bracket 3 is also directly fixed, and the fixing with the PCB 1 is realized without adding other fixing structures like a metal bracket. The embodiment is made of plastic, but the present invention is not limited to the embodiment, and other insulating materials, such as wood, rubber, etc., may be used.
In combination with the specific embodiment, in order to ensure that the baffle 6 can achieve protection of the infrared receiving head 3, the height of the infrared receiving head 3 on the PCB board 1 is defined as H1, the height of the baffle 6 on the PCB board 1 is defined as H2, and H2 is selected to be equal to or greater than 1/2H 1.
Observing the embodiment shown in the attached drawing, the pin mounting hole 2 is positioned on the same straight line of the plane side of the infrared receiving head bracket 3, the pin mounting hole 2 can be a square hole, a circular hole or a semicircular hole when being designed, and the sealing effect with the black glue sealing layer is best when the pin is mounted on the circular hole through mounting tests on the pin mounting holes 2 with different hole types.
Although the present invention has been described with reference to the preferred embodiments, it is not intended to limit the present invention. The present invention is intended to cover by those skilled in the art various modifications and adaptations of the invention without departing from the spirit and scope of the invention. Therefore, the protection scope of the present invention is subject to the claims.
Claims (8)
1. An L ED display module with an infrared receiving head bracket is characterized by comprising a PCB, a display screen, an infrared receiving head bracket and a sealing layer;
the display screen is fixedly connected to the surface of the PCB, and the infrared receiving head bracket is arranged on one side of the display screen and is integrally formed with the display screen;
one side, far away from the PCB, of the infrared receiving head support is provided with a plane, a plurality of pin mounting holes penetrating through the infrared receiving head support are formed in the plane, the end, close to the PCB, of each pin mounting hole is attached to the surface of the PCB, and the pin mounting holes correspond to the positions, on the surface of the PCB, of the mounting holes for mounting the infrared receiving heads one by one;
the infrared receiving head is arranged on the infrared receiving head bracket and comprises an infrared receiving head main body and a pin connected with the infrared receiving head main body; the number of the pins is equal to that of the pin mounting holes, and the pins are inserted into the pin mounting holes from the side, far away from the PCB, of the plane of the infrared receiving head bracket and then connected to the PCB; the infrared receiving head main body is positioned on the side edge of the infrared receiving head support far away from the PCB, and the infrared receiving head main body is bent from the connecting part of the infrared receiving head main body and the pins to the side of the infrared receiving head support far away from the plane of the PCB to be parallel to the plane;
the sealing layer is arranged on the side of the PCB board mounting infrared receiving head bracket and used for sealing pins and the joints of the pins and the pin mounting holes.
2. The L ED display module with IR receiving head bracket of claim 1, wherein the side of the IR receiving head bracket facing away from the PCB board and close to the display screen is defined as the left side, the side of the IR receiving head bracket facing away from the PCB board and provided with pin mounting holes is defined as the front side, and the opposite sides are the right side and the back side, respectively;
the infrared receiving head support is far away from the end part of the plane of the PCB board, close to the pin mounting hole, from the lap joint of the rear side of the infrared receiving head support and the display screen to the right side of the infrared receiving head support, and the height of the baffle on the PCB board is not more than the height of the display screen on the PCB board.
3. The L ED display module with IR receiving head bracket of claim 2, wherein the height of the IR receiving head on the PCB is defined as H1, the height of the baffle on the PCB is defined as H2, and H2 is 1/2H1 or more.
4. The L ED display module with IR receiving head bracket of claim 1, wherein the pin mounting holes are aligned on the same line of the planar side of the IR receiving head bracket and are square, circular or semicircular.
5. The L ED display module with IR receiving head bracket of claim 2, wherein the baffle, the display screen side wall and the plane of the IR receiving head bracket away from the PCB board together form a square groove structure with an open side wall, the pin mounting holes are disposed at the bottom of the square groove near the open side, and the IR receiving head main body is mounted in the square groove.
6. The L ED display module with IR receiving head bracket of claim 2, wherein the bezel is integrally formed with the IR receiving head bracket.
7. The L ED display module with IR receiving head bracket of claim 1, wherein the sealing layer is a black glue sealing layer.
8. The L ED display module with IR receiving head bracket of claim 2, wherein the display screen, IR receiving head bracket and bezel are integrally injection molded.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020107064.2U CN211124839U (en) | 2020-01-17 | 2020-01-17 | L ED display module with infrared receiving head bracket |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020107064.2U CN211124839U (en) | 2020-01-17 | 2020-01-17 | L ED display module with infrared receiving head bracket |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211124839U true CN211124839U (en) | 2020-07-28 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020107064.2U Active CN211124839U (en) | 2020-01-17 | 2020-01-17 | L ED display module with infrared receiving head bracket |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211124839U (en) |
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2020
- 2020-01-17 CN CN202020107064.2U patent/CN211124839U/en active Active
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