CN211123387U

CN211123387U - Single-channel on-chip integrated light receiving subassembly

Info

Publication number: CN211123387U
Application number: CN201922387812.7U
Authority: CN
Inventors: 孙涛; 程进; 刘宇飞; 费涛
Original assignee: Xifeng Photoelectric Technology Nanjing Co ltd
Current assignee: Xifeng Photoelectric Technology Nanjing Co ltd
Priority date: 2019-12-26
Filing date: 2019-12-26
Publication date: 2020-07-28
Anticipated expiration: 2029-12-26

Abstract

The application relates to the technical field of optical communication, provides an integrated light receiving subassembly on single channel piece, includes: the device comprises a focusing lens component, a photoelectric chip, a carrier plate and an amplifier; the photoelectric chip and the focusing lens assembly are arranged on the same surface of the carrier plate, and the photoelectric chip is positioned in the emitting direction of the optical signal output by the focusing lens assembly so as to receive the optical signal output by the focusing lens assembly; the amplifier is attached to the carrier plate and connected with the photoelectric chip, and the distance between the edge of the amplifier and the edge of the carrier plate is less than 0.2 mm so as to be connected with the signal receiving bonding pad on the PCB. In the practical application process, the light receiving subassembly and the PCB are in separable connection, so that in the practical application process, the PCB is subjected to reflow soldering firstly, then the light receiving subassembly is assembled, and reflow soldering is not needed in the practical assembly process, so that the UV glue on the PCB cannot be damaged due to high temperature of reflow soldering, and the yield of the light receiving subassembly and the PCB can be improved simultaneously.

Description

Single-channel on-chip integrated light receiving subassembly

Technical Field

The application relates to the technical field of optical communication, in particular to an integrated optical receiving subassembly on a single-channel chip.

Background

A Receiver Optical Subassembly (ROSA) is an Optical communication component that converts an Optical signal into an electrical signal, and includes Optical and electrical elements. Generally, an optical element receives an optical signal, a photoelectric conversion chip converts the received optical signal into an electrical signal, and an electrical element processes, converts or forwards the converted electrical signal to complete the reception of the optical signal in optical communication. With the continuous increase of the transmission rate of optical communication, the requirement of high-speed performance on the optical receiving subassembly is higher and higher.

Currently, in the field of optical communication, a coaxially packaged optical receiving subassembly is mostly used, and coaxial packaging is used to keep a coaxial relationship between a photoelectric conversion chip in the receiving subassembly and an optical transmission line so as to directly receive an optical signal in the optical transmission line. When the applied line distance is longer, and when the optical signal rate is lower, for example, the rate below 10Gb/s, a line with a certain length is set, which has less influence on its ability to receive optical signals, but when the transmission rate of optical signals is increased to the rate above 25 Gb/s. Due to the length of the line and the turning part, the capability of the line for receiving the optical signal deviates from the preset capability.

Moreover, the COB (chip On Board) chip of the conventional optical receiving subassembly needs to adopt a technical scheme of COBO (coherent for On Board Optics, On-chip integrated optical alliance) and is directly placed On a PCB (Printed circuit Board), and precious parts are often welded On the PCB in advance, so that the assembly of the COB chip is difficult. If the valuable parts are welded later, the UV glue (Ultraviolet ray curable glue) on the COB chip is difficult to bear the high temperature of reflow soldering, and the fixing effect of the COB chip is damaged; if the valuable parts are welded firstly, the COB chip is difficult to rework once the installation fails, and the valuable parts are scrapped. That is, on the PCB, the conventional COB optical receiver subassembly is hardly suitable for assembly of expensive components requiring reflow soldering.

SUMMERY OF THE UTILITY MODEL

The application provides a single-channel on-chip integrated light receiving subassembly to solve the problem that traditional light receiving subassemblies are not favorable to assembling.

The application provides a single channel on-chip integrated light-receiving subassembly, includes: the device comprises a focusing lens component, a photoelectric chip, a carrier plate and an amplifier;

the photoelectric chip and the focusing lens assembly are arranged on the same surface of the carrier plate, and the photoelectric chip is positioned in the emitting direction of the optical signal output by the focusing lens assembly so as to receive the optical signal output by the focusing lens assembly;

the amplifier is attached to the carrier plate and connected with the photoelectric chip, and the distance between the edge of the amplifier and the edge of the carrier plate is less than 0.2 mm so as to be connected with a signal receiving bonding pad on the PCB.

Optionally, the focusing lens assembly comprises: the optical fiber module comprises a substrate, an optical fiber module, a collimator, a cushion block and a lens; the optical fiber module, the collimator, the cushion block and the lens are sequentially arranged on the substrate and are positioned on one surface, close to the carrier plate, of the substrate.

Optionally, the substrate is parallel to the carrier plate; one side of the cushion block is connected with the substrate, and the other side of the cushion block is connected with the carrier plate.

Optionally, the cushion block is made of a transparent material.

Optionally, the cushion block is fixed on the carrier plate through UV glue.

Optionally, the focusing lens assembly further comprises a prism; the prism is arranged on one side, far away from the cushion block, of the lens.

Optionally, the optoelectronic chip is disposed between the prism and the carrier.

Optionally, the amplifier is a transimpedance amplifier disposed on the carrier.

According to the above technical solution, the present application provides a single-channel on-chip integrated optical receiving subassembly, including: the device comprises a focusing lens component, a photoelectric chip, a carrier plate and an amplifier; the photoelectric chip and the focusing lens assembly are arranged on the same surface of the carrier plate, and the photoelectric chip is positioned in the emitting direction of the optical signal output by the focusing lens assembly so as to receive the optical signal output by the focusing lens assembly; the amplifier is attached to the carrier plate and connected with the photoelectric chip, and the distance between the edge of the amplifier and the edge of the carrier plate is less than 0.2 mm so as to be connected with a signal receiving bonding pad on the PCB.

In the practical application process, the light receiving subassembly and the PCB are in separable connection, so that the PCB is subjected to reflow soldering firstly and then assembled in the practical application process, the reflow soldering is not needed in the practical assembly process, the UV glue on the PCB cannot be damaged due to the high temperature of the reflow soldering, and the yield of the light receiving subassembly and the PCB can be improved at the same time.

Drawings

In order to more clearly explain the technical solution of the present application, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious to those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a single-channel on-chip integrated optical receiving subassembly according to an embodiment of the present application;

fig. 2 is a schematic front exploded view of a single-channel on-chip integrated optical receiving subassembly according to an embodiment of the present application;

fig. 3 is a schematic top view of a single-channel on-chip integrated optical receiving subassembly according to an embodiment of the present application;

FIG. 4 is an exploded view of a single-channel on-chip integrated focusing lens assembly according to an embodiment of the present application;

fig. 5 is a partial structural schematic diagram of a single-channel on-chip integrated focusing lens assembly according to an embodiment of the present application.

Illustration of the drawings:

the optical fiber amplifier comprises a focusing lens assembly 1, a substrate 11, an optical fiber module 12, a collimator 13, a cushion block 14, a lens 15, a prism 16, a photoelectric chip 2, a carrier plate 3 and an amplifier 4.

Detailed Description

Referring to fig. 1, a schematic structural diagram of a single-channel on-chip integrated light receiving subassembly provided in an embodiment of the present application is shown.

Referring to fig. 2, a schematic view of an orthogonal exploded structure of a single-channel on-chip integrated light-receiving subassembly according to an embodiment of the present application is provided.

Referring to fig. 3, a schematic diagram of a top view structure of a single-channel on-chip integrated light receiving subassembly according to an embodiment of the present application is provided.

In the technical scheme provided by the application, the single-channel on-chip integrated light receiving subassembly can be applied to light receiving equipment. The optical receiving device is an intermediate device for optical fiber communication, and is used for connecting an optical fiber line and communication equipment. The light receiving device is provided with a Printed Circuit Board (PCB) for mounting the light receiving sub-module and other communication related components.

In order to solve the problem that the conventional light receiving subassembly is not convenient for assembly, as shown in fig. 1, the embodiment of the present application provides a light receiving subassembly, which can be connected with an optical fiber line and convert a received light signal into an electrical signal to realize a light transmission process. The light receiving subassembly is a single-channel on-chip integrated light receiving subassembly and comprises a focusing lens component 1, an optoelectronic chip 2, a carrier plate 3 and an amplifier 4.

The focusing lens assembly 1 is used for converting divergent light into parallel light, and the divergent light is changed into parallel light Gaussian beam through a similar convex lens arranged in front. Its function is to enable the coupling of maximum efficiency of the optical signal into the desired device or to enable the maximum efficiency of the optical signal to be accepted.

In practical applications, as shown in fig. 2, the optoelectronic chip 2 and the focusing lens assembly 1 are disposed on the same surface of the carrier plate 3, and the optoelectronic chip 2 is located in an emitting direction of an optical signal output by the focusing lens assembly 1 to receive the optical signal output by the focusing lens assembly 1. The focusing lens assembly 1 converts input divergent light into parallel light and outputs the parallel light to the photoelectric chip 2, the photoelectric chip 2 is used for converting received optical signals into electric signals, the photoelectric chip 2 is connected with an amplifier 4 attached to the carrier plate 3 so as to transmit the converted electric signals to the amplifier 4, and the transmission quality of the signals is improved through the amplification of the amplifier 4.

In order to output the converted electrical signal, in the embodiment of the present application, the amplifier 4 is attached to the carrier plate 3 and connected to the optoelectronic chip 2, and a distance between an edge of the amplifier 4 and an edge of the carrier plate 3 is less than 0.2 mm, so as to connect a signal receiving pad on a PCB. In practical application, the edge of the light receiving subassembly and the edge of the PCB can be aligned, the distance between the edge of the amplifier 4 and the edge of the carrier plate 3 is not less than 0.2 mm, so that the welding precision requirement is met, and the connection is directly carried out through the pins and the internal routing, therefore, the connection distance is extremely short, namely, no soft board, tube seat and other connecting devices exist, and the light receiving subassembly provided by the application is more suitable for the requirement of high-speed transmission.

In practical application, the laminating of 3 another sides of support plate is treating the installation the PCB board of light receiving subassembly, promptly in the technical scheme that the application provided, focus lens subassembly 1 not directly sets up on the PCB board, through set up between focus lens subassembly 1 and the PCB board support plate 3 in the assembly process, earlier with photoelectricity chip 2 welds on the support plate, and will focus lens subassembly 1 laminating is placed and is installed on support plate 3, and the small transfer focus lens subassembly 1 for the position of photoelectricity chip 2, treat photoelectricity chip 2 with the light signal coupling effect of focus lens subassembly 1 output is the biggest, will focus lens subassembly 1 fixes completely on support plate 3, will at last support plate 3 assembles on the PCB board.

The embodiment of the application provides a single-channel on-chip integrated optical receiving subassembly, including: the focusing lens assembly 1, the photoelectric chip 2, the carrier plate 3 and the amplifier 4; the photoelectric chip 2 and the focusing lens assembly 1 are arranged on the same surface of the carrier plate 3, and the photoelectric chip 2 is positioned in the emitting direction of the optical signal output by the focusing lens assembly 1 so as to receive the optical signal output by the focusing lens assembly 1; the amplifier 4 is attached to the carrier plate 3 and connected with the photoelectric chip 2, and the distance between the edge of the amplifier 4 and the edge of the carrier plate 3 is less than 0.2 mm so as to be connected with a signal receiving pad on a PCB.

Referring to fig. 4, an exploded structural diagram of a single-channel on-chip integrated focusing lens assembly according to an embodiment of the present application is shown.

In some embodiments of the present application, as shown in fig. 4, the focusing lens assembly 1 comprises: the optical fiber module comprises a substrate 11, an optical fiber module 12, a collimator 13, a cushion block 14 and a lens 15; the optical fiber module 12, the collimator 13, the cushion block 14 and the lens 15 are sequentially arranged on the substrate 11 and are located on one surface of the substrate 11 close to the carrier plate 3. In the practical application process, the optical fiber module 12 serves as a connector of an optical fiber circuit, and can transmit an optical signal to a collimator 13 connected to the optical fiber module, the collimator 13 converts divergent light output from an optical fiber into parallel light, the pad 14 is used for connecting the carrier plate 3, and in order to ensure that the pad 14 does not affect optical fiber transmission, further, the material of the pad 14 may be selected to be a transparent material, so that the optical signal passes through the transparent pad 14; or the cushion block 14 is provided with a hollow structure, so that the optical signal passes through the hollow structure of the cushion block 14.

The optical signal output from the collimator 13 is transmitted to the lens 15, and the lens 15 refracts the optical signal to transmit to the optoelectronic chip 2.

The substrate 11 is not only used for supporting and protecting other components, but in this embodiment, the optical fiber module 12, the collimator 13, the spacer 14, and the lens 15 are sequentially disposed on the substrate 11 and located on one surface of the substrate 11 close to the carrier 3. That is, in practical application, the optical fiber module 12, the collimator 13 and the lens 15 may be mounted on the bottom surface of the substrate 11, and the entire focusing lens assembly 1 is mounted upside down, so as to reduce the overall height of the focusing lens assembly 1; moreover, the inverted installation mode can also shorten the distance between the focusing lens assembly 1 and the photoelectric chip 2, namely, the propagation distance of optical signals is shortened, and the defects that the optical signals are scattered and the like to influence the signal transmission quality are reduced.

In practical applications, in order not to affect the performance of the device when the detachment occurs, as shown in fig. 4, in some embodiments of the present application, the substrate 11 is parallel to the carrier plate 3; one side of the cushion block 14 is connected with the substrate 11, and the other side is connected with the carrier plate 3. The focusing lens assembly 1 is installed on the prime number carrier plate 3 through the cushion block 14, when the assembling is carried out, the assembling connecting part is the cushion block 14, even if the cushion block 14 has shape defects, the defects can be repaired through UV glue, or the cushion block 14 is directly replaced, so that the damage to devices is reduced.

In some embodiments provided in the present application, the pad 14 is fixed on the carrier plate 3 by UV glue. In the process that the focusing lens assembly 1 is installed on the carrier plate 3, firstly, UV glue is densely distributed at the connecting part of the carrier plate 3 and the cushion block 14, then, by finely adjusting the relative position of the focusing lens assembly 1 and the photoelectric chip 2, when the intensity of a light signal received by the photoelectric chip 2 is maximum, the focusing lens assembly 1 is stopped moving, and UV glue is irradiated by UV and the like, so that the UV glue is rapidly solidified, and the focusing lens assembly 1 is fixed. It should be noted that, the judgment of the maximum intensity of the optical signal received by the optoelectronic chip 2 is based on the intensity of the electrical signal converted by the optoelectronic chip 2, and the maximum intensity of the output electrical signal indicates that the received signal intensity is maximum, which is colloquially said to be that the optical signal output by the focusing lens assembly 1 is completely aligned with the optoelectronic chip 2.

In practical application, as shown in fig. 4, the focusing lens assembly 1 further includes a prism 16; the prism 16 is arranged on the side of the lens 15 remote from the pad 14. Further, the optoelectronic chip 2 is disposed between the prism 16 and the carrier plate 3. In this embodiment, the cross-section of prism 16 can be isosceles right triangle, and two right-angle sides of isosceles right triangle are on a parallel with lens 15 and photoelectric chip 2 respectively to the mirror surface that corresponds through the hypotenuse reflects light signal, changes light signal's transmission direction, for example reflects the light signal of horizontal direction for vertical direction, so that light signal can transmit to photoelectric chip 2's position.

Referring to fig. 5, a partial structural diagram of a single-channel on-chip integrated focusing lens assembly according to an embodiment of the present application is provided.

In some embodiments of the present application, as shown in fig. 1 and 5, the amplifier 4 is a transimpedance amplifier disposed on the carrier board 3. Furthermore, one side of the amplifier 4 is connected with the photoelectric chip 2, and the other side is provided with a metal point for routing. In practical applications, the transimpedance amplifier (OTA) can convert an input current into a differential voltage, thereby facilitating the transmission of an electrical signal. Correspondingly, one side of the amplifier 4 is connected with the photoelectric chip 2, and the other side is provided with a metal point for external routing. In practical application, after the optical signal is converted into an electrical signal by the photoelectric chip 2, the converted voltage signal is amplified by the amplifier 4, so as to output a signal with better quality.

In some embodiments of the present application, the substrate 11 and/or the carrier 3 may be made of a soft board or a combination of soft and hard boards, and is connected to the PCB board, so as to further facilitate assembly. A soft board or a soft and hard board may be provided as an intermediate layer between the connection of the substrate 11 and the spacer 14, so that the spacer 14 may be replaced when necessary.

As can be seen from the above technical solutions, the embodiment of the present application provides a single-channel on-chip integrated optical receiving subassembly, including: the focusing lens assembly 1, the photoelectric chip 2, the carrier plate 3 and the amplifier 4; the photoelectric chip 2 and the focusing lens assembly 1 are arranged on the same surface of the carrier plate 3, and the photoelectric chip 2 is positioned in the emitting direction of the optical signal output by the focusing lens assembly 1 so as to receive the optical signal output by the focusing lens assembly 1; the amplifier 4 is attached to the carrier plate 3 and connected with the photoelectric chip 2, and the distance between the edge of the amplifier 4 and the edge of the carrier plate 3 is less than 0.2 mm so as to be connected with a signal receiving pad on a PCB.

The embodiments provided in the present application are only a few examples of the general concept of the present application, and do not limit the scope of the present application. Any other embodiments extended according to the scheme of the present application without inventive efforts will be within the scope of protection of the present application for a person skilled in the art.

Claims

1. A single channel on-chip integrated light receiving subassembly, comprising: the device comprises a focusing lens assembly (1), a photoelectric chip (2), a carrier plate (3) and an amplifier (4);

the photoelectric chip (2) and the focusing lens assembly (1) are arranged on the same surface of the carrier plate (3), and the photoelectric chip (2) is positioned in the emitting direction of the optical signal output by the focusing lens assembly (1) so as to receive the optical signal output by the focusing lens assembly (1);

the amplifier (4) is attached to the carrier plate (3) and connected with the photoelectric chip (2), and the distance between the edge of the amplifier (4) and the edge of the carrier plate (3) is less than 0.2 mm so as to be connected with a signal receiving pad on the PCB.

2. The single channel on-chip integrated light receiving subassembly of claim 1, wherein the focusing lens assembly (1) comprises: the device comprises a substrate (11), an optical fiber module (12), a collimator (13), a cushion block (14) and a lens (15); the optical fiber module (12), the collimator (13), the cushion block (14) and the lens (15) are sequentially arranged on the substrate (11) and are positioned on one surface, close to the carrier plate (3), of the substrate (11).

3. The single channel on-chip integrated light receiving subassembly of claim 2, characterized in that the substrate (11) is parallel to the carrier plate (3); one side of the cushion block (14) is connected with the substrate (11), and the other side of the cushion block is connected with the carrier plate (3).

4. The on-chip integrated optical receiver subassembly of claim 2, wherein the spacer (14) is a transparent material.

5. The integrated light-receiving subassembly of claim 2, characterized in that the spacer block (14) is fixed to the carrier plate (3) by UV glue.

6. The single channel on-chip integrated light receiving subassembly of claim 2, wherein the focusing lens assembly (1) further comprises a prism (16); the prism (16) is arranged on the side of the lens (15) far away from the cushion block (14).

7. The single channel on-chip integrated light receiving subassembly of claim 6, characterized in that an optoelectronic chip (2) is arranged between the prism (16) and the carrier plate (3).

8. The single channel on-chip integrated light receiving subassembly of claim 1, characterized in that the amplifier (4) is a transimpedance amplifier arranged on the carrier board (3).