CN211102030U - Welded piece with soft solder layer pre-coated on surface - Google Patents
Welded piece with soft solder layer pre-coated on surface Download PDFInfo
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- CN211102030U CN211102030U CN201921245585.8U CN201921245585U CN211102030U CN 211102030 U CN211102030 U CN 211102030U CN 201921245585 U CN201921245585 U CN 201921245585U CN 211102030 U CN211102030 U CN 211102030U
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- 229910000679 solder Inorganic materials 0.000 title claims abstract description 167
- 239000000463 material Substances 0.000 claims description 32
- 230000004907 flux Effects 0.000 claims description 24
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 18
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 14
- 229910052802 copper Inorganic materials 0.000 claims description 14
- 239000010949 copper Substances 0.000 claims description 14
- 229910052759 nickel Inorganic materials 0.000 claims description 9
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 8
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 5
- 229910052737 gold Inorganic materials 0.000 claims description 5
- 239000010931 gold Substances 0.000 claims description 5
- 229910052738 indium Inorganic materials 0.000 claims description 5
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 5
- 229910052709 silver Inorganic materials 0.000 claims description 5
- 239000004332 silver Substances 0.000 claims description 5
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052797 bismuth Inorganic materials 0.000 claims description 4
- JCXGWMGPZLAOME-UHFFFAOYSA-N bismuth atom Chemical compound [Bi] JCXGWMGPZLAOME-UHFFFAOYSA-N 0.000 claims description 4
- 238000005476 soldering Methods 0.000 abstract description 102
- 238000003466 welding Methods 0.000 abstract description 61
- 238000000034 method Methods 0.000 abstract description 42
- 230000009467 reduction Effects 0.000 abstract description 7
- 238000005516 engineering process Methods 0.000 abstract description 2
- 238000005253 cladding Methods 0.000 abstract 1
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 28
- 230000008569 process Effects 0.000 description 26
- 230000000052 comparative effect Effects 0.000 description 18
- 239000011248 coating agent Substances 0.000 description 15
- 238000000576 coating method Methods 0.000 description 15
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 14
- 235000019253 formic acid Nutrition 0.000 description 14
- 239000011800 void material Substances 0.000 description 14
- 238000005520 cutting process Methods 0.000 description 11
- 238000002360 preparation method Methods 0.000 description 11
- 238000010438 heat treatment Methods 0.000 description 10
- 238000012360 testing method Methods 0.000 description 9
- 238000002844 melting Methods 0.000 description 7
- 230000008018 melting Effects 0.000 description 7
- 238000005096 rolling process Methods 0.000 description 7
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 6
- 239000007789 gas Substances 0.000 description 6
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 5
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 5
- 239000000843 powder Substances 0.000 description 5
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 5
- 239000000919 ceramic Substances 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000004806 packaging method and process Methods 0.000 description 4
- 238000003490 calendering Methods 0.000 description 3
- 230000006698 induction Effects 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 229910045601 alloy Inorganic materials 0.000 description 2
- 239000000956 alloy Substances 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 238000007731 hot pressing Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 238000009736 wetting Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 238000012795 verification Methods 0.000 description 1
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Abstract
The utility model relates to an electron device welding technology field specifically provides a soft solder layer's on surface cladding by weldment, and it includes by the weldment and the soft solder layer that covers on its surface in advance. The method mainly comprises the steps of preparing the soldering lug → assembling the soldering lug and the soldered piece → forming the soft solder layer on the surface of the soldered piece. The utility model discloses after being covered soft solder layer in advance by weldment surface, can prevent to be further oxidized by the weldment surface, can effectual reduction welding voidage, can obviously improve the layer quality by the weldment. Moreover, soft solder does not need to be assembled in the later period of a customer, the positioning procedure of the welded piece and the soft solder is omitted, and welding spot dislocation and even bridging short circuit are not easy to cause.
Description
Technical Field
The utility model relates to an electron device welding technology field, in particular to by weldment and preparation method of soft solder layer are covered in advance on surface.
Background
Soft solders are solders whose liquidus temperature (melting point) does not exceed 450 ℃. Soldering is a type of connection method in which connection is achieved by heating molten solder to a temperature lower than the melting point of the work (base material) to be soldered and higher than the melting point of the molten solder. The soft soldering process adopts soft solder to spread on the surface of a workpiece through wetting action or on a closely attached connecting surface through capillary action, and is widely applied to the fields of various electronic devices such as rail transit, communication cables, aerospace, household appliances, new energy automobiles, wind power, photovoltaic power generation and the like.
The existing soldering process is mainly characterized in that a certain welding process is adopted in the later stage to connect welded pieces through soft solder. However, the current soldering process causes the following problems:
(1) the surfaces of some welded parts are very easy to oxidize, and the welded surfaces are seriously oxidized before later soldering, so that the welding voidage is high, and the good welding quality is not favorably achieved.
(2) Due to the particularity of the assembly process, when a customer performs later soldering, the welded piece and the soft solder are inconvenient to position or even cannot be positioned, welding spots are easy to be misplaced, and bridging short circuit is caused by misplacement in a serious case.
(3) Some welded parts have no transition soft solder layer on the surface, and good welding effect cannot be achieved.
(4) Some soft solders have special shapes, are thin or soft, are easy to deform in the packaging, transportation and assembly processes, cause inconvenience to customers, and even affect the welding quality.
(5) Some soft solders have special shapes, ordered packaging cannot be realized, customers cannot perform automatic patch welding on the soft solders, and production efficiency is greatly influenced.
(6) Some soft solders which need to be coated with flux are easily deformed during coating, or are easily adhered to each other due to the viscosity of flux, which makes production, packaging and customer use inconvenient.
SUMMERY OF THE UTILITY MODEL
In view of the above, it is desirable to provide a soldered article with a soft solder layer pre-coated on the surface and a method for preparing the same.
In order to achieve the first objective, the present invention adopts the following technical solutions:
a soldered piece with a soft solder layer pre-coated on the surface comprises the soldered piece and the soft solder layer pre-coated on the surface of the soldered piece.
Furthermore, the material of the surface of the welded piece is at least one of copper, nickel, silver, gold and aluminum.
Further, the soft solder layer is at least one of tin-based, lead-based, indium-based, and bismuth-based soft solders.
Furthermore, the thickness of the soft solder layer is 0.02-0.5 mm.
Further, the surface of the welded piece is a plane or a curved surface.
Further, the surface of the soft solder layer also comprises a flux layer.
In order to achieve the second objective, the present invention adopts the following technical solutions:
a method for preparing a welded piece with a soft solder layer pre-coated on the surface comprises the following steps:
step 1) preparing the prepared soft solder into a material belt with required thickness;
step 2) cutting the material belt in the step 1) into soldering lugs with the size equivalent to the surface size of the welded piece;
step 3) assembling the soldering lug in the step 2) with the welded piece;
step 4) melting the soldering lug and the welded part assembled in the step 3) in a heating mode, and further forming a soft solder layer on the surface of the welded part, or
And attaching the soldering lug and the welded piece together in a physical pressing or bonding mode, so that a soft solder layer is formed on the surface of the welded piece.
The heating and melting temperature in the step 4 is higher than the melting point of the soldering lug and lower than the melting point of the welded piece.
Further, the heating mode may be a normal pressure reflow soldering mode, a vacuum reflow soldering, an induction heating soldering, a hot press soldering, or a common heating stage.
Preferably, when the normal pressure reflow soldering mode, the induction heating soldering mode, the hot press soldering mode and the common heating table mode are adopted, the soldering flux is coated on the soldering lug in the step 2) for soldering assistance; when the vacuum reflow soldering is adopted, the formic acid is added in the soldering process to assist soldering. The utility model discloses when the heating makes by weldment surface formation soft solder layer under the ordinary pressure environment, add the scaling powder and be used for getting rid of the oxide film by welding face and soft solder surface, promote the welding, can also reduce the surface tension after soft solder melts, play the interfacial activity effect, help the wetting and the spreading of soft solder on the welding face. Before welding, the soldering flux can also protect soft solder and a welding surface and prevent secondary oxidation in the welding process. After the soldering is finished, the soldering flux is consumed or volatilized, and little or no residue is left. When the soft solder layer is formed on the surface of the workpiece by heating in a vacuum environment, the formic acid is used for fluxing, and the formic acid can remove the oxide film on the surface to be soldered and the surface of the soft solder and promote soldering.
The utility model has the advantages that:
(1) the soft solder layer is pre-coated on the surface of the welded piece before soldering by a client, so that the surface of the welded piece can be prevented from being further oxidized, the welding voidage can be effectively reduced, and good welding quality is achieved.
(2) The soft solder layer is pre-coated on the surface of the welded piece before soldering by a customer, soft solder does not need to be assembled in the later period of the customer, the positioning procedure of the welded piece and the soft solder is omitted, and the problems of welding spot dislocation and bridging short circuit are not easy to cause.
(3) The problem that the surfaces of certain welded parts cannot be well welded because the surfaces of the welded parts are not provided with the transitional soft solder layers because the surfaces of the welded parts are pre-coated with the soft solder layers is solved.
(4) Because the soft solder is pre-coated on the surface of the welded piece to form the soft solder layer, customers do not need to additionally use the soft solder, and the problems that the appearance of some soft solder is special, thin or soft, the soft solder is easy to deform in the packaging, transporting and assembling process, the inconvenience is caused to the customers, and even the welding quality is influenced are solved.
(5) Because of covering soft solder in advance at the soft solder layer that has formed by weldment surface, the customer need not additionally to use soft solder again, has solved some soft solder appearance special, can't realize orderly packing, and the customer can't carry out automatic paster welded problem with soft solder, has improved production efficiency.
(6) Because of with soft solder pre-coat by the weldment surface formed soft solder layer after, the soft solder layer surface of pre-coating can coat the scaling powder, the customer need not additionally to use the soft solder that the surface coating has the scaling powder again, has solved some soft solder that need coat the scaling powder and has warp easily when coating, or because the scaling powder has the stickness, the easy adhesion between the soft solder each other, the inconvenient production of product, packing and the problem of use.
Drawings
FIG. 1a, FIG. 1b, FIG. 1c, FIG. 1d, FIG. 1e, FIG. 1f are partial cross-sectional views of a soldered part with a soft solder layer pre-coated on one side;
FIGS. 2a, 2b, 2c and 2d are partial cross-sectional views of a dual-sided pre-coated soft solder layer of a workpiece;
FIG. 3 is a graph showing the ultrasonic testing void ratio of a sample after welding in comparative example 1, and FIG. 4 is a graph showing the ultrasonic testing void ratio of a sample after welding in example 1, wherein white parts in FIGS. 3 and 4 show welding voids, and black parts show good welding;
FIG. 5 is a graph showing the ultrasonic testing void ratio of a sample after welding in comparative example 2, and FIG. 6 is a graph showing the ultrasonic testing void ratio of a sample after welding in example 2, wherein white parts in FIGS. 5 and 6 show welding voids, and black parts show good welding;
FIG. 7 is a graph of the operating parameters of the atmospheric pressure reflow soldering process in example 2;
FIG. 8 is a graph of the operating parameters of the vacuum formic acid reduction reflow soldering process in example 4; in the figure: the temperature curve is the set temperature in the welding process, the curves of nitrogen and formic acid are respectively the vacuum degree and the gas pressure of the filled gas, the ordinate 100 represents the normal pressure, and 0 represents the lowest pressure which can be reached by vacuumizing;
FIG. 9 is a graph of the operating parameters of the atmospheric pressure reflow soldering process in example 8;
FIG. 10 is a graph of the operating parameters of the vacuum formic acid reduction reflow soldering process of example 9; in the figure: the temperature curve is the set temperature in the welding process, the curves of nitrogen and formic acid are respectively the vacuum degree and the gas pressure of the filled gas, the ordinate 100 represents the normal pressure, and 0 represents the lowest pressure which can be reached by vacuumizing;
FIG. 11 is a graph of the operating parameters of the vacuum formic acid reduction reflow soldering process of example 10; in the figure: the temperature curve is the set temperature of the welding process, the curves of nitrogen and formic acid are respectively the vacuum degree and the gas pressure of the filled gas, the ordinate 100 represents the normal pressure, and 0 represents the lowest pressure which can be reached by vacuumizing.
Reference numerals: 1-a soft solder layer; 2-the welded piece; 3-soldering flux layer.
Detailed Description
For making the purpose, technical scheme and advantage of the utility model clearer, will combine below the utility model discloses an embodiment is right the technical scheme of the utility model make further clear, describe completely. It should be noted that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Example 1
The material of the surface of the welded part 2in fig. 1a is copper, the soft solder layer 1 is composed of Pb92.5Sn5Ag2.5 in lead-based solder, the thickness of the soft solder layer 1 is 0.06mm, and the preparation method comprises the following steps:
step 1), preparing the prepared Pb92.5Sn5Ag2.5 soft solder into a material belt with required thickness by a calendering method;
step 2) cutting the material belt in the step 1) into soldering pieces with the size equivalent to the surface size of the welded piece, and coating rosin type soldering flux suitable for welding the copper piece on the soldering pieces;
step 3) assembling the soldering lug in the step 2) with the welded piece;
step 4), carrying out a hot-press welding process on the soldering lug and the welded part assembled in the step 3): preheating at 220 ℃ for 30 seconds, then contacting the assembled soldering lug and the welded part by a graphite hot pressing head with the temperature of 400 ℃, keeping for 20 seconds, removing the hot pressing head after the welding lug is melted, and then air-cooling the welded part until a soft solder layer is solidified, thereby metallurgically combining the soldering lug and the welded part together to form a Pb92.5Sn5Ag2.5 soft solder layer 1 on the surface of the welded part 2.
Example 2
The material of the surface of the welded part 2in the figure 1b is nickel, the component of the soft solder layer 1 is Sn96.5Ag3Cu0.5 in the tin-based solder, the thickness of the soft solder layer 1 is 0.1mm, and the preparation method comprises the following steps:
step 1) preparing the prepared Sn96.5Ag3Cu0.5 soft solder into a material belt with required thickness by a calendering method;
step 2) cutting the material belt in the step 1) into soldering pieces with the size equivalent to the surface size of the piece to be soldered, and coating rosin type soldering flux suitable for soldering the nickel-plated piece on the soldering pieces;
step 3) assembling the soldering lug in the step 2) with the welded piece;
and 4) metallurgically combining the soldering lug and the welded part assembled in the step 3) by using a normal-pressure reflow soldering process shown in figure 7, and forming a Sn96.5Ag3Cu0.5 soft solder layer on the surface of the welded part.
And step 5), coating the surface of the Sn96.5Ag3Cu0.5 soft solder layer 1 formed in the step 4) with a soldering flux layer 3.
Example 3
The material of the surface of the welded part 2in fig. 1c is aluminum, the component of the soft solder layer 1 is Sn83.6In8.8Zn7.6 in tin-based solder, the thickness of the soft solder layer 1 is 0.4mm, and the preparation method comprises the following steps:
step 1) preparing the prepared Sn83.6In8.8Zn7.6 soft solder into a material belt with required thickness by a rolling method;
step 2) cutting the material belt in the step 1) into soldering pieces with the size equivalent to the surface size of the welded piece, and coating rosin type soldering flux suitable for welding the aluminum piece on the soldering pieces;
step 3) assembling the soldering lug in the step 2) with the welded piece;
and 4) welding the soldering lug and the welded part assembled in the step 3) by an induction welding process: the temperature is controlled to be 230-250 ℃, the welded piece is removed after being melted, then the welded piece is cooled by air until the soft solder layer is solidified, so that the welded piece and the welded piece are metallurgically combined together, and the Sn83.6In8.8Zn7.6 soft solder layer 1 is formed on the surface of the welded piece 2.
Example 4
The material of the surface of the welded piece 2in fig. 1d is silver, the soft solder layer 1 comprises Sn95Sb5 in tin-based solder, and the thickness of the soft solder layer 1 is 0.2mm, and the preparation method comprises the following steps:
step 1), preparing the prepared Sn95Sb5 soft solder into a material belt with required thickness by a rolling method;
step 2) cutting the material belt in the step 1) into soldering lugs with the size equivalent to the surface size of the welded piece;
step 3) assembling the soldering lug in the step 2) with the welded piece;
and 4) metallurgically bonding the soldering lug and the welded part assembled in the step 3) together by a vacuum formic acid reduction reflow soldering process as shown in figure 8, and forming a Sn95Sb5 soft solder layer on the surface of the welded part.
And step 5), coating the flux layer 3 on the surface of the soft solder layer 1 formed in the step 4).
Example 5
The material of the surface of the welded piece 2In fig. 1e is gold, the component of the soft solder layer 1 is In60Pb40 In the indium-based solder, the thickness of the soft solder layer 2 is 0.25mm, and the preparation method comprises the following steps:
step 1), preparing the prepared In60Pb40 soft solder into a material belt with the required thickness by a rolling method;
step 2) cutting the material belt in the step 1) into soldering lugs with the size equivalent to the surface size of the welded piece;
step 3) assembling the soldering lug in the step 2) with the welded piece;
and 4) pressing the soldering lug assembled In the step 3) and the welded piece together by using a punch press, and forming the In60Pb40 soft solder layer 1 on the surface of the welded piece 2.
Example 6
The material of the surface of the welded piece 2in fig. 1f is nickel, the component of the soft solder layer 1 is Sn63Pb37 in tin-based solder, the thickness of the soft solder layer 1 is 0.2mm, and the preparation method comprises the following steps:
step 1), preparing the prepared Sn63Pb37 soft solder into a material belt with the required thickness by a rolling method;
step 2) cutting the material belt in the step 1) into soldering pieces with the size equivalent to the surface size of the welded piece, and coating soldering flux on the soldering pieces;
step 3) assembling the soldering lug in the step 2) with the welded piece;
and 4) bonding the soldering lug and the welded piece assembled in the step 3) together through the soldering flux which is suitable for welding the nickel-plated piece and has viscosity, and forming a Sn63Pb37 soft solder layer on the surface of the welded piece.
And step 5), coating the flux layer 3 on the surface of the soft solder layer 1 formed in the step 4).
Example 7
The material of both sides of the surface of the workpiece 2in fig. 2a is copper, the composition of the soft solder layer 1 on both sides is Pb88Sn10Ag 2in lead-based solder, the thickness of the soft solder layer 1 is 0.1mm, and the preparation method comprises the following steps:
step 1), preparing the prepared Pb88Sn10Ag2 soft solder into a material belt with the required thickness by a rolling method;
step 2) cutting the material belt in the step 1) into soldering lugs with the size equivalent to the surface size of the welded piece;
step 3) assembling the soldering lug in the step 2) with the welded piece;
and 4) pressing the soldering lug assembled in the step 3) and the welded piece together by using a punch press, and forming Pb88Sn10Ag2 soft solder layers 1 on both sides of the welded piece 2.
Example 8
In fig. 2b, the surface of the workpiece 2 is made of copper and nickel. Wherein, the component of the soft solder layer 1 outside the copper layer is Sn96.5Ag3.5 in the tin-based solder, and the thickness of the soft solder layer 1 is 0.2 mm; the soft solder layer 1 outside the nickel layer has the components of Sn99.3Cu0.7 in the tin-based solder, and the thickness of the soft solder layer 1 is 0.15mm, and the preparation method comprises the following steps:
step 1) preparing prepared Sn96.5Ag3.5 soft solder and Sn99.3Cu0.7 soft solder into a material belt with required thickness by a calendering method;
step 2) cutting the material belt in the step 1) into soldering pieces with the size equivalent to the surface size of the piece to be soldered, coating rosin type soldering flux suitable for soldering a copper piece on the soldering piece with the Sn96.5Ag3.5 component, and coating the rosin type soldering flux suitable for soldering a nickel piece on the soldering piece with the Sn99.3Cu0.7 component;
step 3) assembling the soldering lug in the step 2) with the welded piece;
and 4) metallurgically combining the soldering lug and the welded part assembled in the step 3) by using a normal-pressure reflow soldering process shown in figure 9, and respectively forming a Sn96.5Ag3.5 soft solder layer with the thickness of 0.2mm and a Sn99.3Cu0.7 soft solder layer with the thickness of 0.15mm on two surfaces of the welded part.
And step 5), coating the flux layer 3 on the surface of the soft solder layer 1 formed in the step 4).
Example 9
In fig. 2c, the surface of the workpiece 2 is made of copper and gold. Wherein the soft solder layer 1 outside the copper layer comprises Sn77.2In20Ag2.8 in the bismuth-based solder, and the thickness of the soft solder layer 1 is 0.2 mm; the soft solder layer 1 outside the gold layer has the composition of In60Pb40 In the indium-based solder, and the thickness of the soft solder layer 1 is 0.05mm, and the preparation method comprises the following steps:
step 1) preparing the prepared Sn77.2In20Ag2.8 soft solder and In60Pb40 soft solder into a material belt with the required thickness by a rolling method;
step 2) cutting the material belt in the step 1) into soldering lugs with the size equivalent to the surface size of the welded piece;
step 3) assembling the soldering lug in the step 2) with the welded piece;
and 4) metallurgically bonding the soldering lug and the welded part assembled In the step 3) together by a vacuum formic acid reduction reflow soldering process shown In figure 10, and respectively forming a Sn77.2In20Ag2.8 soft solder layer with the thickness of 0.2mm and an In60Pb40 soft solder layer with the thickness of 0.05mm on two sides of the welded part.
Example 10
In fig. 2d, the surface of the workpiece 2 is made of nickel and silver. Wherein the soft solder layer 1 outside the nickel layer is composed of In97Ag3 In the indium-based solder, and the thickness of the soft solder layer 1 is 0.2 mm; the soft solder layer 1 outside the silver layer comprises Sn42Bi57Ag1 in bismuth-based solder, and the thickness of the soft solder layer 1 is 0.1mm, and the preparation method comprises the following steps:
step 1) preparing the prepared In97Ag3 soft solder and Sn42Bi57Ag1 soft solder into a material belt with required thickness by a rolling method;
step 2) cutting the material belt in the step 1) into soldering lugs with the size equivalent to the surface size of the welded piece;
step 3) assembling the soldering lug in the step 2) with the welded piece;
and 4) metallurgically bonding the soldering lug and the welded part assembled In the step 3) together by a vacuum formic acid reduction reflow soldering process as shown In figure 11, and respectively forming an In97Ag3 soft solder layer with the thickness of 0.2mm and a Sn42Bi57Ag1 soft solder layer with the thickness of 0.15mm on two sides of the welded part.
And step 5), coating the flux layer 3 on the surface of the soft solder layer 1 formed in the step 4).
For further verification the utility model discloses the effect, it is following right the utility model discloses a surface pre-cover soft solder layer weld the void ratio detection test by the weldment:
experimental example 1
Sample base case and experimental procedure:
comparative example 1: a member to be soldered whose surface is not pre-coated with a soft solder layer, i.e., a 2mm thick oxygen-free copper plate, is commercially available.
The welding mode is as follows: and a soldering lug of Pb92.5Sn5Ag2.5 alloy components with the thickness of 0.12mm is clamped between the two oxygen-free copper plates, and the vacuum formic acid reflow soldering process is carried out for soldering.
The utility model discloses embodiment 1: the surface of the soldered piece of example 1, which was previously coated with a soft solder layer, was previously coated with a 0.06mm thick layer of Pb92.5Sn5Ag2.5 soft solder on the surface of a commercially available oxygen-free copper plate having a thickness of 2 mm.
The welding mode is as follows: two oxygen-free copper plates, each of which had a soft solder layer of 0.06mm thickness on the surface thereof, were pre-coated, the soft solder layers were stacked, and then subjected to vacuum formic acid reflow soldering to ensure that the height of the soldered joint was the same as that of comparative example 1.
Welding area: the weld area for both comparative example 1 and example 1 was 38.5mm by 31.5 mm.
And (3) equipment for detecting the void ratio: provided is an ultrasonic detector.
Comparative example 1 and the present invention example 1 each weld 20 groups of data, then use the ultrasonic detector to detect the welding void ratio, record, calculate each group average. The results are shown in Table 1.
Table 1 test results of example 1 and comparative example 1
| No. (comparative example 1) | Weld void ratio (%) | Numbering (example 1) | Weld void ratio (%) |
| 1# | 1.79 | 21# | 0.61 |
| 2# | 1.52 | 22# | 0.76 |
| 3# | 1.75 | 23# | 0.52 |
| 4# | 1.67 | 24# | 0.68 |
| 5# | 1.90 | 25# | 0.73 |
| 6# | 1.91 | 26# | 0.58 |
| 7# | 1.33 | 27# | 0.77 |
| 8# | 1.92 | 28# | 0.65 |
| 9# | 1.88 | 29# | 0.61 |
| 10# | 1.66 | 30# | 0.75 |
| 11# | 1.62 | 31# | 0.72 |
| 12# | 1.48 | 32# | 0.67 |
| 13# | 1.81 | 33# | 0.75 |
| 14# | 1.94 | 34# | 0.78 |
| 15# | 1.63 | 35# | 0.74 |
| 16# | 1.73 | 36# | 0.58 |
| 17# | 1.94 | 37# | 0.75 |
| 18# | 1.76 | 38# | 0.69 |
| 19# | 1.80 | 39# | 0.53 |
| 20# | 1.43 | 40# | 0.71 |
| Mean value of | 1.72 | Mean value of | 0.68 |
In order to more visually represent the comparison of the welding voidage results, fig. 3 and 4 are graphs of the voidage of ultrasonic testing after welding of samples of comparative example 1 and example 1, respectively, wherein white parts in fig. 3 and 4 represent welding voids, and black parts represent good welding. The contrast can obviously be seen, the utility model discloses a surface pre-cover soft solder layer by weldment welding void ratio obviously be less than not pre-cover soft solder layer by the weldment, show that the welding quality by the weldment after the surface pre-cover soft solder layer is obviously superior to not pre-cover soft solder layer by the welding quality of the weldment.
Experimental example 2
Sample base case and experimental procedure:
comparative example 2: a member to be soldered whose surface is not precoated with a soft solder layer, i.e., a 1.5mm thick nickel-plated ceramic plate, is commercially available.
The welding mode is as follows: a soldering lug made of Sn96.5Ag3Cu0.5 alloy with the thickness of 0.2mm is clamped between the two nickel-plated ceramic plates, the two surfaces of the soldering lug are respectively coated with 0.5 percent of soldering flux, and then normal pressure reflow soldering process welding is carried out.
The utility model discloses embodiment 2: the soldered piece whose surface was previously coated with a soft solder layer of example 2, that is, the surface of a commercially available 1.5 mm-thick nickel-plated ceramic plate was previously coated with a 0.1 mm-thick sn96.5ag3cu0.5 soft solder layer, and the surface of the soft solder layer was coated with the same flux as that of comparative example, with a flux content of 0.5%, to ensure that the flux content before soldering was the same as that of comparative example.
The welding mode is as follows: two nickel-plated ceramic plates, each of which had a soft solder layer of 0.1mm thickness pre-coated on the surface thereof, were stacked with the soft solder layer, and then subjected to normal pressure reflow soldering to secure the same height of the soldered joint as in comparative example 2.
Welding area: the weld area for both comparative example 2 and example 2 was 57mm 48.5 mm.
And (3) equipment for detecting the void ratio: provided is an ultrasonic detector.
Comparative example 2 and the utility model discloses example 2 each welds 20 groups of data, then adopts ultrasonic detector to detect respectively and weld the voidage, records, calculates each group's average value. The results are shown in Table 2.
Table 2 test results of example 2 and comparative example 2
| Numbering (comparative example 2) | Weld void ratio (%) | Numbering (example 2) | Weld void ratio (%) |
| 1# | 12.37 | 21# | 6.74 |
| 2# | 12.18 | 22# | 6.66 |
| 3# | 12.62 | 23# | 6.11 |
| 4# | 13.6 | 24# | 6.61 |
| 5# | 14.53 | 25# | 6.75 |
| 6# | 14.31 | 26# | 6.79 |
| 7# | 15.51 | 27# | 7.00 |
| 8# | 14.98 | 28# | 7.22 |
| 9# | 13.14 | 29# | 6.76 |
| 10# | 14.58 | 30# | 6.04 |
| 11# | 12.17 | 31# | 6.81 |
| 12# | 14.07 | 32# | 6.90 |
| 13# | 12.84 | 33# | 7.10 |
| 14# | 13.34 | 34# | 7.02 |
| 15# | 14.87 | 35# | 6.84 |
| 16# | 16.14 | 36# | 6.35 |
| 17# | 12.51 | 37# | 7.40 |
| 18# | 13.11 | 38# | 7.08 |
| 19# | 14.73 | 39# | 6.77 |
| 20# | 15.11 | 40# | 7.03 |
| Mean value of | 13.84 | Mean value of | 6.80 |
In order to more visually represent the comparison of the welding voidage results, fig. 5 and 6 are graphs of the voidage of ultrasonic testing after welding of samples of comparative example 2 and example 2, respectively, wherein white parts in fig. 5 and 6 represent welding voids, and black parts represent good welding. The contrast can obviously be seen, the utility model discloses a surface pre-cover soft solder layer by weldment welding void ratio obviously be less than not pre-cover soft solder layer by the weldment, show that the welding quality by the weldment after the surface pre-cover soft solder layer is obviously superior to not pre-cover soft solder layer by the welding quality of the weldment.
The above-mentioned embodiments only represent some embodiments of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention. It should be noted that, for those skilled in the art, without departing from the spirit of the present invention, several changes and modifications can be made, which are within the scope of the present invention. Therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (6)
1. A welded piece with a soft solder layer pre-coated on the surface is characterized by comprising the welded piece and the soft solder layer pre-coated on the surface of the welded piece.
2. A member to be soldered having a surface pre-coated with a soft solder layer according to claim 1, wherein the material of the surface of the member to be soldered is at least one of copper, nickel, silver, gold and aluminum.
3. A member to be soldered having a soft solder layer pre-coated thereon as set forth in claim 1, wherein the soft solder layer is at least one of tin-based, lead-based, indium-based and bismuth-based soft solders.
4. A member to be soldered having a surface pre-coated with a soft solder layer as defined in claim 1, wherein the soft solder layer has a thickness of 0.02 to 0.5 mm.
5. A workpiece with a surface pre-coated with a soft solder layer as claimed in claim 1, wherein the surface of the workpiece is flat or curved.
6. A member to be soldered having a surface pre-coated with a soft solder layer as defined in claim 1, wherein said soft solder layer further comprises a flux layer.
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Effective date of registration: 20240326 Address after: No. 58, South Yun'er Road, Science City, Huangpu District, Guangzhou City, Guangdong Province, 510000 Patentee after: Guangzhou Hanyuan microelectronic packaging material Co.,Ltd. Country or region after: China Address before: 510663 No.58, Nanyun 2nd Road, Science City, Guangzhou hi tech Industrial Development Zone, Guangdong Province Patentee before: GUANGZHOU SOLDERWELL ADVANCED MATERIALS Co.,Ltd. Country or region before: China |