CN211074564U - Demoulding device for demoulding integrated circuit packaging product - Google Patents
Demoulding device for demoulding integrated circuit packaging product Download PDFInfo
- Publication number
- CN211074564U CN211074564U CN201921918167.0U CN201921918167U CN211074564U CN 211074564 U CN211074564 U CN 211074564U CN 201921918167 U CN201921918167 U CN 201921918167U CN 211074564 U CN211074564 U CN 211074564U
- Authority
- CN
- China
- Prior art keywords
- template
- demoulding
- ejector
- ejector rod
- integrated circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
The utility model discloses an integrated circuit encapsulation product demoulding is with shedder, its characterized in that: the structure of the device comprises a base, a template, a mold core and a support column, wherein the mold core is fixedly arranged at the top of the template, one end of the support column is fixedly connected with the bottom surface of the template, the other end of the support column is fixedly connected with the base, a backing plate is fixedly arranged at the top surface of the middle of the base, a hydraulic column is arranged on the backing plate, a top plate is fixedly arranged at the top end of the hydraulic column, loading and unloading mechanisms are respectively arranged at two sides of the top plate and comprise a connecting block, a supporting plate and a spring, the spring is fixedly arranged at the top surface of the top plate, the connecting block is rotatably connected with the supporting plate, a demoulding mechanism is fixedly arranged on the loading and unloading mechanism and is in through connection with the template, the demoulding mechanism comprises an ejector rod, an ejector sleeve and a, the demoulding efficiency is improved.
Description
Technical Field
The utility model relates to an integrated circuit encapsulation product demoulding is with shedder belongs to the shedder field.
Background
An integrated circuit is a miniature electronic device or component, and the components such as transistors, resistors, capacitors and inductors and wiring required in a circuit are interconnected together by adopting a certain process, and are manufactured above a small or a plurality of small semiconductor wafers or medium substrates and then packaged in a tube shell to form a miniature structure with the required circuit function.
The prior art discloses a L ED semiconductor packaging mold demoulding device with the application number of CN207190189U, which structurally comprises an upper template 1 and a lower template 3 and is characterized in that an upper cavity 2 is arranged on the lower side of the upper template 1, a lower cavity 4 is arranged below the upper cavity 2, the lower template 3 is arranged on the lower side of the lower cavity 4, and a frame body 5 is arranged between the upper cavity 2 and the lower cavity 4.
SUMMERY OF THE UTILITY MODEL
The utility model aims at providing a demoulding device for integrated circuit encapsulation product demoulding to solve current problem to prior art exists not enough.
In order to achieve the above purpose, the present invention is realized by the following technical solution: a demoulding device for demoulding of integrated circuit packaging products is characterized in that: the structure of the device comprises a base, a template, a mold core and a support, wherein the mold core is fixedly arranged at the top of the template, one end of the support is fixedly connected with the bottom surface of the template, the other end of the support is fixedly connected with the base, a backing plate is fixedly arranged at the top surface of the middle part of the base, a hydraulic column is arranged on the backing plate, a top plate is fixedly arranged at the top end of the hydraulic column, loading and unloading mechanisms are respectively arranged at two sides of the top plate and comprise a connecting block, a supporting plate and a spring, the spring is fixedly arranged at the top surface of the top plate, the connecting block is rotatably connected with the supporting plate, a demoulding mechanism is fixedly arranged on the loading and unloading mechanism and is in the template in a penetrating way, the demoulding mechanism comprises an ejector rod, an ejector sleeve, the ejector sleeve is sleeved on the ejector rod, and the lower end of the ejector rod is in threaded connection with the connecting block.
Further, the ejector rod penetrates through the template and extends to the top surface of the mold core, an ejector block is fixedly mounted at the top end of the ejector rod, and a groove corresponding to the ejector block is formed in the top surface of the mold core.
Furthermore, the ball encircles the inner wall of the top barrel and is arranged, the ball is hinged with the inner wall of the top barrel, and the half part of the ball is arranged on the outer side of the inner wall of the top barrel and clings to the ejector rod.
Furthermore, the ejector rod is made of stainless steel materials and is firm and not easy to bend.
Furthermore, the top block is made of carbon steel and is high-temperature resistant and wear-resistant.
The utility model has the advantages that: promote the ejector pin through the hydraulic pressure post and rise and break away from the die cavity with the finished product, and the design of kicking block can increase area of contact, reduce pressure and avoid the finished product to damage, the roller roll through the ball on the inner wall when the ejector pin removes in the ejector cylinder reduces the frictional force that receives, thereby reduce the problem that the card went up when the ejector pin removes, when the ejector pin carelessly damages, through swivelling joint block holding down spring, let the ejector pin break away from fixed back, take out the ejector pin of damage and replace new ejector pin again, swivelling joint block fix can, can reduce the rejection rate that causes the shaping product because of the card went up through this design, save the time of maintenance change, drawing of patterns efficiency improves.
Drawings
Other features, objects and advantages of the invention will become more apparent upon reading of the detailed description of non-limiting embodiments with reference to the following drawings:
FIG. 1 is a schematic structural view of a demolding device for integrated circuit package product demolding according to the present invention;
FIG. 2 is a perspective view of the demolding device for integrated circuit package products of the present invention;
fig. 3 is a sectional view of the demolding mechanism of the demolding device for integrated circuit packaged products of the present invention;
fig. 4 is a top view of the demolding mechanism of the demolding device for integrated circuit packaged products of the present invention;
fig. 5 is a schematic structural diagram of a mounting and dismounting mechanism of a demolding device for integrated circuit packaged product demolding according to the present invention.
In the figure: the device comprises a base-1, a template-2, a mold core-3, a support-4, a backing plate-5, a hydraulic column-6, a top plate-7, a loading and unloading mechanism-8, a connecting block-801, a supporting plate-802, a spring-803, a demoulding mechanism-9, a push rod-901, a push cylinder-902, a ball-903, a push block-904 and a groove-905.
Detailed Description
In order to make the technical means, creation features, achievement purposes and functions of the present invention easy to understand, the present invention is further described below with reference to the following embodiments.
Referring to fig. 1-5, the present invention provides a technical solution of a demolding device for integrated circuit package product demolding: its structure includes base 1, template 2, mold core 3 and pillar 4, mold core 3 fixed mounting in 2 tops of template, 4 one end fixed connection of pillar in 2 bottom surfaces of template, 4 other end fixed connection of pillar with base 1, 1 middle part top surface fixed mounting of base has backing plate 5, be equipped with hydraulic pressure post 6 on the backing plate 5, 6 top fixed mounting of hydraulic pressure post has roof 7, roof 7 both sides all are equipped with loading and unloading mechanism 8, loading and unloading mechanism 8 includes connecting block 801, backup pad 802 and spring 803, spring 803 fixed mounting in the roof 7 top surface, connecting block 801 rotates with backup pad 802 to be connected, loading and unloading mechanism 8 goes up fixed mounting has demoulding mechanism 9, demoulding mechanism 9 through connection in template 2, demoulding mechanism 9 includes ejector pin 901, a top cylinder 902, demoulding mechanism 9, The ball 903 is embedded in the template 2, the ball 903 is arranged on the inner wall of the top barrel 902 in a rolling manner, the ball 903 surrounds the inner wall of the top barrel 902 and is arranged, the ball 903 is hinged to the inner wall of the top barrel 902, the half part of the ball 903 is arranged on the outer side of the inner wall of the top barrel 902 and tightly attached to the ejector rod 901, the top barrel 902 is sleeved on the ejector rod 901, the lower end of the ejector rod 901 is in threaded connection with the connecting block 801, the ejector rod 901 penetrates through the template 2 and extends to the top surface of the mold core 3, the top end of the ejector rod 901 is fixedly provided with an ejector block 904, the top surface of the mold core 3 is provided with a groove 905 corresponding to the ejector block 904, the ejector rod is made of stainless steel, and is firm and difficult to bend, and the ejector block is made of carbon.
The hydraulic column 6 is realized by hydraulic pump connection during lifting, the connection mode is common drive connection, the hydraulic column belongs to the known technology, and details are omitted here, the hydraulic column 6 adopts a DW8 model, and the hydraulic column has long service life and strong bearing capacity.
For example, a finished product is separated from a die cavity by pushing the ejector 901 to rise through the hydraulic column 6, the design of the ejector block 904 can increase the contact area, reduce the pressure and avoid the damage of the finished product, when the ejector 901 moves in the ejector barrel 902, the roller 903 on the inner wall rolls to reduce the friction force, so that the problem of jamming when the ejector 901 moves is reduced, when the ejector 901 is carelessly damaged, the spring is pressed down through the rotary connecting block 801, after the ejector 901 is separated from being fixed, the damaged ejector 901 is drawn out and replaced by a new ejector, and the rotary connecting block 801 is fixed.
The basic principles and the main features of the invention and the advantages of the invention have been shown and described above, it will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, but that the invention may be embodied in other specific forms without departing from the spirit or essential characteristics of the invention. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the invention being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present description refers to embodiments, not every embodiment may contain only a single embodiment, and such description is for clarity only, and those skilled in the art should integrate the description, and the embodiments may be combined as appropriate to form other embodiments understood by those skilled in the art.
Claims (3)
1. A demoulding device for demoulding of integrated circuit packaging products is characterized in that: the structure of the die comprises a base (1), a template (2), a die core (3) and a support column (4), wherein the die core (3) is fixedly installed at the top of the template (2), one end of the support column (4) is fixedly connected with the bottom surface of the template (2), the other end of the support column (4) is fixedly connected with the base (1), a backing plate (5) is fixedly installed on the top surface of the middle of the base (1), a hydraulic column (6) is arranged on the backing plate (5), a top plate (7) is fixedly installed at the top end of the hydraulic column (6), loading and unloading mechanisms (8) are arranged on two sides of the top plate (7), each loading and unloading mechanism (8) comprises a connecting block (801), a supporting plate (802) and a spring (803), the spring (803) is fixedly installed on the top surface of the top plate (7), the connecting block (801) is rotatably connected with the supporting plate (, the demolding mechanism (9) is connected in the template (2) in a penetrating mode, the demolding mechanism (9) comprises an ejector rod (901), a top barrel (902) and balls (903), the top barrel (902) is installed inside the template (2) in an embedded mode, the balls (903) are installed on the inner wall of the top barrel (902) in a rolling mode, the top barrel (902) is sleeved on the ejector rod (901), and the lower end of the ejector rod (901) is in threaded connection with the connecting block (801).
2. The integrated circuit package product demolding device as recited in claim 1, wherein: the ejector rod (901) penetrates through the template (2) and extends to the top surface of the mold core (3), an ejector block (904) is fixedly mounted at the top end of the ejector rod (901), and a groove (905) corresponding to the ejector block (904) is formed in the top surface of the mold core (3).
3. The integrated circuit package product demolding device as recited in claim 1, wherein: the ball (903) is arranged around the inner wall of the top cylinder (902), the ball (903) is hinged with the inner wall of the top cylinder (902), and the half part of the ball (903) is arranged on the outer side of the inner wall of the top cylinder (902) and clings to the ejector rod (901).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921918167.0U CN211074564U (en) | 2019-11-08 | 2019-11-08 | Demoulding device for demoulding integrated circuit packaging product |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921918167.0U CN211074564U (en) | 2019-11-08 | 2019-11-08 | Demoulding device for demoulding integrated circuit packaging product |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211074564U true CN211074564U (en) | 2020-07-24 |
Family
ID=71638319
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921918167.0U Active CN211074564U (en) | 2019-11-08 | 2019-11-08 | Demoulding device for demoulding integrated circuit packaging product |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211074564U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115214075A (en) * | 2022-08-25 | 2022-10-21 | 苏州道格实业有限公司 | Liquid silica gel injection system and method for producing liquid silica gel molded product |
-
2019
- 2019-11-08 CN CN201921918167.0U patent/CN211074564U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115214075A (en) * | 2022-08-25 | 2022-10-21 | 苏州道格实业有限公司 | Liquid silica gel injection system and method for producing liquid silica gel molded product |
| CN115214075B (en) * | 2022-08-25 | 2024-02-06 | 苏州道格实业有限公司 | Liquid silica gel injection system and method for producing liquid silica gel molded product |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN211074564U (en) | Demoulding device for demoulding integrated circuit packaging product | |
| CN107243537B (en) | A kind of quick stainless steel circular sheet origin shaping mechanism of demoulding | |
| CN218532528U (en) | Precision mold for mechanical part production | |
| CN108971379A (en) | A kind of rotary stamping die ejecting mechanism | |
| CN201960741U (en) | Demoulding mechanism for refrigerator inner liner vacuum forming mould | |
| CN105921570A (en) | Equipment for rolling storing cylinder and rolling method | |
| CN105058015A (en) | Bearing press-mounting device | |
| KR101986501B1 (en) | Reaction high forging molding device | |
| CN212042347U (en) | Quick die change device | |
| CN207808594U (en) | A kind of quickly mold changing load carrier | |
| CN208498100U (en) | A kind of metal memorial tablet surface imprint system | |
| CN209141807U (en) | It is a kind of with non-slip texture and wear-resisting luggage wheel | |
| CN207931168U (en) | A kind of carton production dewaxing drying equipment | |
| CN203556703U (en) | Edge roller for edge rolling of base of damper | |
| CN105058012A (en) | Simple bearing press-fit device | |
| CN206936765U (en) | A kind of engine housing bearing press-fitting device | |
| CN217622422U (en) | Automatic material returning device of hydraulic machine | |
| CN215467500U (en) | Special stamping equipment of box processing is stored to static wafer is prevented to stable form | |
| CN212401291U (en) | A processing transfer device for gilding, silver-plated mould | |
| CN204477078U (en) | A kind of convex surface taper roller bearing | |
| CN210707559U (en) | Give birth to bright goods rack convenient to remove | |
| CN207630397U (en) | A kind of secure mounting arrangements of phone mould | |
| CN203592374U (en) | Grinder with improved structure | |
| CN103057158B (en) | Large die traveling mechanism | |
| CN107973040B (en) | A kind of agricultural hygienic chamber structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20221205 Address after: Room 610-B, Floor 6, Building A, No. 800 Naxian Road, China (Shanghai) Pilot Free Trade Zone, Pudong New Area, Shanghai, 200120 Patentee after: Shanghai Beihu Ice Silicon Technology Co.,Ltd. Address before: No.15 Xiapu, Shangtang village, zhangban Town, Taiwan investment zone, Quanzhou City, Fujian Province, 362000 Patentee before: QUANZHOU XINDING HEDE TECHNOLOGY SERVICE Co.,Ltd. |