CN211073966U

CN211073966U - Panel dislocation preventing device of panel splicing machine

Info

Publication number: CN211073966U
Application number: CN201921740574.7U
Authority: CN
Inventors: 郭迎祥
Original assignee: Foshan Jiyuan High Frequency Equipment Co ltd
Current assignee: Foshan Jiyuan High Frequency Equipment Co ltd
Priority date: 2019-10-16
Filing date: 2019-10-16
Publication date: 2020-07-24
Anticipated expiration: 2029-10-16

Abstract

The utility model discloses a plate dislocation prevention device of a plate splicing machine, which comprises a machine body and an adsorption plate, wherein the machine body is provided with an adsorption cavity, a vacuumizing mechanism is arranged in the adsorption cavity, and the vacuumizing mechanism is used for vacuumizing the adsorption cavity so as to form negative pressure in the adsorption cavity; the adsorption plate is packaged at the top end of the adsorption cavity; the adsorption plate is provided with a plurality of adsorption holes which are distributed at intervals along the movement direction of the workpiece and communicated with the adsorption cavity. The utility model discloses a panel dislocation preventing device of makeup machine, it can provide certain adsorption affinity to panel at the makeup in-process, prevents to splice in-process panel dislocation.

Description

Panel dislocation preventing device of panel splicing machine

Technical Field

The utility model relates to a makeup machine technical field especially relates to a panel anti-dislocation device of makeup machine.

Background

At present, the makeup machine mainly splices a plurality of small-width plates on the organism in proper order, and the point is glued between two adjacent plates, makes and fixes between board and the board, forms the great monoblock plate of width, and when splicing a plurality of small-width plates together, the makeup pressure of each small-width plate after the point is glued is exerted pressure to outermost plate through pressing from the side pressure cylinder, makes the relative workstation of panel slide and be close to each other to the veneer. In the process, the plate is easily separated from the workpiece table under the stress condition and stacked on another adjacent plate, so that the dislocation is caused, and the splicing width and quality of the plate are influenced.

SUMMERY OF THE UTILITY MODEL

In order to overcome the defects of the prior art, the utility model aims to provide a plate dislocation preventing device of a plate splicing machine, which can provide certain adsorption force for the plates in the plate splicing process and prevent the plates from being dislocated in the splicing process.

The purpose of the utility model is realized by adopting the following technical scheme:

A plate dislocation preventing device of a plate splicing machine comprises a machine body and an adsorption plate, wherein an adsorption cavity is arranged on the machine body, a vacuumizing mechanism is arranged in the adsorption cavity, and the vacuumizing mechanism is used for vacuumizing the adsorption cavity so as to form negative pressure in the adsorption cavity; the adsorption plate is packaged at the top end of the adsorption cavity; the adsorption plate is provided with a plurality of adsorption holes which are distributed at intervals along the movement direction of the workpiece and communicated with the adsorption cavity.

Furthermore, a lubricating layer is arranged on the surface of the adsorption plate, and the adsorption holes penetrate through the surface of the lubricating layer.

Further, a Teflon plate is arranged on the surface of the adsorption plate and forms the lubricating layer.

Further, the vacuum pumping mechanism is a vacuum pumping pump.

Furthermore, the adsorption plate is an electrode plate, and the electrode plate is used for being electrically connected with an external power supply and heating a glue seam between the workpiece and the adhesive seam.

Further, the electrode plate comprises a mounting frame and a plurality of electrode plates, wherein the plurality of electrode plates are fixedly connected in the mounting frame and are distributed at intervals in the length direction of the mounting frame; the adjacent two electrode plates are formed into the adsorption holes at intervals.

Compared with the prior art, the beneficial effects of the utility model reside in that: its when concatenation panel, will treat each panel of concatenation to place on the adsorption plate, then start evacuation mechanism, evacuation mechanism forms the negative pressure at the intracavity evacuation that adsorbs, adsorbs the panel on the adsorption plate through a plurality of absorption holes on the adsorption plate, so, when the concatenation is exerted pressure, because the adsorption affinity between panel and the adsorption plate, can prevent that the dislocation from appearing when the atress of panel, can not produce and overlap, improve concatenation efficiency and quality.

Drawings

Fig. 1 is a schematic structural diagram of the present invention.

In the figure: 10. a body; 11. an adsorption chamber; 20. an adsorption plate; 21. an adsorption hole; 30. a vacuum pumping mechanism; 40. a Teflon plate; 50. a plate material.

Detailed Description

The invention will be further described with reference to the accompanying drawings and specific embodiments:

As shown in fig. 1, the plate anti-displacement device of a plate splicing machine includes a machine body 10 and an adsorption plate 20, wherein an adsorption cavity 11 is provided on the machine body, specifically, a vacuum pumping mechanism 30 is provided in the adsorption cavity 11, and the vacuum pumping mechanism 30 can vacuum the adsorption cavity 11 to form a negative pressure in the adsorption cavity 11. The adsorption plate 20 is sealed at the top end of the adsorption chamber 11. The adsorption plate 20 is provided with a plurality of adsorption holes 21, and the plurality of adsorption holes 21 are distributed at intervals along the movement direction of the workpiece and are communicated with the adsorption cavity 11.

On the basis of above-mentioned structure, use the utility model discloses a during dislocation device is prevented to panel of makeup machine, can put and the point is glued in proper order on adsorption plate 20 with the panel 50 of treating the concatenation, then start evacuation mechanism 30, evacuation mechanism 30 vacuums in absorption chamber 11 and forms the negative pressure, adsorb panel 50 on adsorption plate 20 through a plurality of absorption holes 21 on the adsorption plate 20, so, the side pressure hydro-cylinder on the organism 10 can exert pressure to the panel 50 that lies in the outside, under the effect of this pressure, panel 50 impels in proper order on the length direction of adsorption plate 20, need illustrate, the thrust that the side pressure hydro-cylinder was exerted on the organism 10 can overcome the adsorption affinity and make and be close to between panel 50 and the panel 50, extrude and bond the glue solution between panel 50 and the panel 50. However, due to the absorption force between the plate 50 and the absorption plate 20, when the plates 50 approach each other and are glued, the plate 50 has a force of approaching the absorption plate 20 downward, so that the plate 50 is not pushed away from the absorption plate 20 by a pushing force, and the plate 50 is prevented from being overlapped due to dislocation when being stressed, thereby improving the splicing efficiency and quality.

Further, a lubricating layer can be arranged on the surface of the adsorption plate 20, the adsorption holes 21 penetrate through the surface of the lubricating layer, and the lubricating layer has good lubricity and glue prevention performance, so that when the plates 50 are subjected to lateral thrust, the friction force between the plates 50 and the adsorption plate 20 can be reduced by the lubricating layer, the plates can be pushed against each other conveniently, and meanwhile, the glue residue extruded when the two adjacent plates 50 are spliced can be reduced.

More specifically, the surface of the adsorption plate 20 is provided with the teflon plate 40, the teflon plate 40 forms a lubricating layer, the teflon plate 40 has good self-lubricating property and glue-proof property, in the plate splicing process, the plate 50 moves on the surface, and the glue-proof property can enable the extruded glue to be taken out by the plate 50, so that the glue residue is prevented from being blocked.

Of course, a teflon coating or other coating such as a lubricant may be sprayed on the adsorption plate 20 to serve as a lubricating layer.

Further, the vacuum pumping mechanism 30 in the present embodiment may be preferably used as a vacuum pumping pump in the prior art, and the vacuum pumping pump may pump the inside of the adsorption cavity 11 to form a negative pressure.

Further, the adsorption plate 20 is an electrode plate, which is used for being electrically connected with an external power supply and generating heat, so that the electrode plate used as the adsorption plate 20 can also be electrically connected with the external power supply in the splicing process, and generate heat after being electrified, the adhesive liquid between the plate 50 and the plate 50 is heated to have stronger viscosity, and the plate 50 can be firmly bonded together after the adhesive liquid is cooled. At the same time, heat can be taken away by the vacuum mechanism 30 for cooling.

Further, above-mentioned plate electrode specifically includes the installing frame and a plurality of electrode slice, and a plurality of electrode slice rigid couplings are in the installing frame to at the length direction interval distribution of installing frame, the interval forms into absorption hole 21 between two adjacent electrode slices, so when evacuation adsorbs, can form the negative pressure at the interval between electrode slice and the electrode slice, accomplishes the absorption of panel 50, need not extra trompil and handles. When heating, the electrode plate is connected with an external power supply.

Specifically, during heating, the electrode plate can be connected with an external high-frequency oscillator, and the high-frequency oscillator can provide a high-frequency oscillation circuit to enable the electrode plate to generate electromagnetic waves, so that the glue solution is heated through the electromagnetic waves.

Of course, the absorption plate 20 can be made of a common plate with holes without heating.

Various other modifications and changes may be made by those skilled in the art based on the above-described technical solutions and concepts, and all such modifications and changes are intended to fall within the scope of the claims.

Claims

1. The plate dislocation preventing device of the plate splicing machine is characterized by comprising a machine body and an adsorption plate, wherein an adsorption cavity is arranged on the machine body, a vacuumizing mechanism is arranged in the adsorption cavity, and the vacuumizing mechanism is used for vacuumizing the adsorption cavity so as to form negative pressure in the adsorption cavity; the adsorption plate is packaged at the top end of the adsorption cavity; the adsorption plate is provided with a plurality of adsorption holes which are distributed at intervals along the movement direction of the workpiece and communicated with the adsorption cavity.

2. The board material dislocation preventing device of the board splicing machine as claimed in claim 1, wherein the surface of the adsorption plate is provided with a lubricating layer, and the adsorption holes penetrate through the surface of the lubricating layer.

3. The plate material dislocation preventing device of the plate splicing machine as claimed in claim 2, wherein a teflon plate is arranged on the surface of the adsorption plate, and the teflon plate forms the lubricating layer.

4. The board material displacement preventing device for the board splicing machine according to claim 1, wherein the vacuum pumping mechanism is a vacuum pumping pump.

5. The plate material dislocation preventing device of a plate splicing machine according to any one of claims 1 to 4, wherein the adsorption plate is an electrode plate which is used for being electrically connected with an external power supply and heating a glue seam between a workpiece and the workpiece.

6. The board material dislocation preventing device of the board splicing machine according to claim 5, wherein the electrode plates comprise a mounting frame and a plurality of electrode plates which are fixedly connected in the mounting frame and are distributed at intervals in the length direction of the mounting frame; the adjacent two electrode plates are formed into the adsorption holes at intervals.