CN211060295U - Cold and hot dual-purpose split type semiconductor air conditioner - Google Patents
Cold and hot dual-purpose split type semiconductor air conditioner Download PDFInfo
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- CN211060295U CN211060295U CN201922018045.2U CN201922018045U CN211060295U CN 211060295 U CN211060295 U CN 211060295U CN 201922018045 U CN201922018045 U CN 201922018045U CN 211060295 U CN211060295 U CN 211060295U
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Abstract
The utility model relates to the technical field of air conditioners, in particular to a cold and hot dual-purpose split type semiconductor air conditioner, which comprises a shell, wherein the shell consists of a left shell, a right shell and a connecting shell, the left shell is arranged at the left end of the right shell, the connecting shell is arranged between the left shell and the right shell, the connecting shell is respectively and fixedly connected with the left shell and the right shell, a semiconductor refrigerating sheet is fixedly connected inside the connecting shell, the left end of the semiconductor refrigerating sheet is a cold end, the right end of the semiconductor refrigerating sheet is a hot end, the cold and hot dual-purpose split type semiconductor air conditioner realizes refrigeration and heating through the semiconductor refrigerating sheet, and further can respectively draw cold energy and heat energy produced by the semiconductor refrigerating sheet for use, can finish refrigeration without a compressor and a refrigerant, and effectively reduces the volume and the weight of the semiconductor air conditioner, therefore, the problem that the air conditioner can only refrigerate or heat singly and has large power consumption by adopting a compressor to compress and refrigerate is solved.
Description
Technical Field
The utility model relates to an air conditioner technical field specifically is a cold and hot dual-purpose split type semiconductor air conditioner.
Background
Air conditioners, i.e. air conditioners, of the hanging type are units for supplying process air to an area of space, typically an enclosed area. Its function is to regulate the parameters of temperature, humidity, cleanliness and air flow rate of air in the room (or closed space, zone) so as to meet the requirements of human body comfort or technological process. The air conditioner has the same or different appearance, but the arrangement form and the adopted method of the control panel are different, and the number of the functions is more or less. Various functions and uses of the air conditioner should be familiar in order to properly master the starting and stopping methods of the air conditioner.
Most of the existing air conditioner equipment adopts a compressor and a refrigerant, and the structure of the existing air conditioner equipment mainly adopts a split structure form of an indoor unit and an outdoor unit. The compressor is used for compressing the refrigerant for refrigeration, so that the defects of large electric loss and large operation noise exist, the fluorine-containing refrigerant is often leaked to cause serious pollution to the atmospheric environment, and only single refrigeration or heating can be realized, so that the use is inconvenient.
SUMMERY OF THE UTILITY MODEL
Technical problem to be solved
An object of the present invention is to provide a split type semiconductor air conditioner for cooling and heating to solve the problem that the fluorine-containing refrigerant proposed in the background art often leaks to cause serious pollution to the atmospheric environment.
(II) technical scheme
In order to achieve the above purpose, the utility model provides a following technical scheme: a cold and hot dual-purpose split type semiconductor air conditioner comprises a shell, wherein the shell consists of a left shell, a right shell and a connecting shell, the left shell is arranged at the left end of the right shell, the connecting shell is arranged between the left shell and the right shell, the connecting shell is fixedly connected with the left shell and the right shell respectively, a semiconductor refrigerating sheet is fixedly connected inside the connecting shell, the left end of the semiconductor refrigerating sheet is a cold end, the right end of the semiconductor refrigerating sheet is a hot end, the left end of the semiconductor refrigerating sheet is fixedly connected with a first radiator, and the right end of the semiconductor refrigerating sheet is fixedly connected with a second radiator; the radiator comprises a radiator I, a radiator II, a fan I, a fan II, a first isolation cover fixedly connected with the upper end of the first isolation cover, a second isolation cover fixedly connected with the upper end of the second isolation cover, a first air inlet pipe fixedly connected with the lower end of the fan I, a second air inlet pipe fixedly connected with the upper end of the right shell, a first fan fixedly connected with the left end of the first isolation cover, a second fan fixedly connected with the right end of the second isolation cover, a first air pipe fixedly connected with the lower end of the fan I, a second air pipe fixedly connected with the lower end of the fan II, a left baffle plate fixedly connected with a screw, a right baffle plate fixedly connected with a right end of the right shell, a first air outlet pipe fixedly connected with the left end of the fan I, and a second air outlet pipe fixedly connected with the right end of the fan II.
Further advantageously, the first heat sink is located inside the left portion housing and the second heat sink is located inside the right portion housing.
The radiator I, the radiator II and the semiconductor refrigerating sheet are connected with an external power supply.
The air inlet pipe I and the vent pipe I are communicated with the isolation cover I, and the air inlet pipe II and the vent pipe II are communicated with the isolation cover II.
The fan I and the fan II are both connected with an external power supply and are both composed of the exhaust fan and the protective shell.
The first ventilating pipe and the first exhaust pipe are communicated with the first fan, and the second ventilating pipe and the second exhaust pipe are communicated with the second fan.
(III) advantageous effects
Compared with the prior art, the utility model provides a cold and hot dual-purpose split type semiconductor air conditioner possesses following beneficial effect:
1. This kind of cold and hot dual-purpose split type semiconductor air conditioner, realize refrigeration and heating through the semiconductor refrigeration piece, thereby can draw the use with the heat to the cold volume that the semiconductor refrigeration piece was made respectively, the practicality of air conditioner has been improved, and do not need compressor and refrigerant just can accomplish the refrigeration, effectual volume and the weight that reduces the semiconductor air conditioner, and then effectively promoted the convenience that the air conditioner used, and can not cause the destruction to the environment because of the refrigerant leaks, and will refrigerate regional separately with heating the region through left part shell and right part shell, and then prevent that air conditioning and steam mix the refrigeration and the heating effect that influence the air conditioner.
2. This kind of cold and hot dual-purpose split type semiconductor air conditioner, it is more abundant with the heat exchange of radiator one and radiator two to make the air through two unifications of cage one and cage, and then make the refrigeration and the heating effect of air conditioner more ideal to improve the wholeness ability of air conditioner.
Drawings
FIG. 1 is an internal schematic view of the overall structure of the present invention;
Fig. 2 is the external schematic view of the semiconductor refrigeration sheet structure of the present invention.
Fig. 3 is an external schematic view of the housing structure of the present invention.
In the figure: the air conditioner comprises a shell 1, a left shell 2, a right shell 3, a connecting shell 4, a semiconductor refrigerating sheet 5, a first radiator 6, a second radiator 7, a first isolation cover 8, a second isolation cover 9, a first air inlet pipe 10, a second air inlet pipe 11, a first fan 12, a second fan 13, a first air vent pipe 14, a second air vent pipe 15, a first air vent pipe 16, a second air vent pipe 17, a hot end 18, a cold end 19, a left baffle 20 and a right baffle 21.
Detailed Description
The embodiments described below are only some embodiments of the present invention, but not all embodiments of the present invention, which are described in conjunction with the accompanying drawings of the embodiments of the present invention.
Referring to fig. 1-3, a split type semiconductor air conditioner for cold and hot use comprises a housing 1, the housing 1 is composed of a left housing 2, a right housing 3 and a connecting housing 4, the left housing 2 is disposed at the left end of the right housing 3, the connecting housing 4 is disposed between the left housing 2 and the right housing 3, the connecting housing 4 is fixedly connected with the left housing 2 and the right housing 3, respectively, a semiconductor refrigeration sheet 5 is fixedly connected inside the connecting housing 4, the left end of the semiconductor refrigeration sheet 5 is a cold end 19, the right end of the semiconductor refrigeration sheet 5 is a hot end 18, the left end of the semiconductor refrigeration sheet 5 is fixedly connected with a first radiator 6, the right end of the semiconductor refrigeration sheet 5 is fixedly connected with a second radiator 7, the first radiator 6 is disposed inside the left housing 2, the second radiator 7 is disposed inside the right housing 3, the first radiator 6, the second radiator 7 and the semiconductor refrigeration sheet 5 are all connected with an external power supply, when the device is used, the semiconductor refrigerating sheet 5 is electrified through an external power supply, and then the semiconductor refrigerating sheet 5 is electrified to work the cold end 19 to start refrigerating, the hot end 18 starts heating, then the cold quantity of the cold end 19 and the heat quantity of the hot end 18 are led out and distributed in the air around through the first radiator 6 and the second radiator 7, thereby respectively refrigerating or heating the air around, the practicability of the air conditioner is improved, the first radiator 6 and the second radiator 7 are respectively positioned inside the left shell 2 and the right shell 3, the cold air and the hot air distributed by the two can not be mixed together, and further the cold air and the hot air are prevented from being mixed to influence the refrigerating and heating effects of the air conditioner.
In this embodiment, a first isolation cover 8 is fixedly connected to the outer side of a first radiator 6, a second isolation cover 9 is fixedly connected to the outer side of a second radiator 7, a first air inlet pipe 10 extending to the outside of a left outer shell 2 is fixedly connected to the upper end of the first isolation cover 8, a second air inlet pipe 11 extending to the outside of a right outer shell 3 is fixedly connected to the upper end of the second isolation cover 9, a first blower 12 is fixedly connected to the left end of the first isolation cover 8, a second blower 13 is fixedly connected to the right end of the second isolation cover 9, a first vent pipe 14 is connected to the lower end of the first blower 8, a second vent pipe 15 is connected to the lower ends of the second blower 9 and the second blower 13, a left baffle 20 is fixedly connected to the left end of the left outer shell 2 through screws, a right baffle 21 is fixedly connected to the right end of the right outer shell 3 through screws, a first vent pipe 16 extending to the outer side of the left baffle 20 is, the air inlet pipe 10 and the vent pipe 14 are communicated with the first isolation cover 8, the air inlet pipe 11 and the vent pipe 15 are communicated with the second isolation cover 9, the first fan 12 and the second fan 13 are both connected with an external power supply, the first fan 12 and the second fan 13 are both composed of an exhaust fan and a protective shell, the vent pipe 14 and the vent pipe 16 are communicated with the first fan 12, the vent pipe 15 and the vent pipe 17 are communicated with the second fan 13, the first fan 12 and the second fan 13 are opened while the semiconductor refrigerating sheet 5 is opened for refrigerating and heating, further, cold air and hot air produced in the first isolation cover 8 and the second isolation cover 9 are pumped out by the first fan 12 and the second fan 13 through the vent pipe 14 and the vent pipe 15, and are discharged from the vent pipe 16 and the vent pipe 17 for refrigerating and heating external air, the first radiator 6 and the second radiator 7 are isolated from the outside through the first isolation cover 8 and the second isolation cover 9, and the air entering the first isolation cover 8 and the second isolation cover 9 from the first air inlet pipe 10 and the second air inlet pipe 11 can be in contact with the first radiator 6 and the second radiator 7 at a shorter distance, so that the heat exchange between the air and the first radiator 6 and the second radiator 7 is more sufficient, and the refrigerating and heating effects of the air conditioner are more ideal.
The housing 1, the left housing 2, the right housing 3, the connecting housing 4, the semiconductor refrigeration sheet 5, the first radiator 6, the second radiator 7, the first isolation cover 8, the second isolation cover 9, the first 10 air inlet pipe, the second 11 air inlet pipe, the first 12 fan, the second 13 fan, the first 14 air pipe, the second 15 air pipe, the first 16 air outlet pipe, the second 17 air outlet pipe, the hot 18 end, the cold 19 end, the left 20 baffle, and the right 21 baffle applied in the above embodiments can be obtained by market purchase or private customization.
Wherein the utility model discloses in instrument of using:
The model of the semiconductor refrigerating sheet is TEC-12708.
the type of the first radiator and the type of the second radiator are SR L.
The model of the first fan and the second fan is CY 150.
The above embodiments are only used for further explanation of the present invention, and it is not understood that the present invention is limited by the protection scope of the present invention, and the technical engineers in the field are right according to the above contents of the present invention.
Claims (6)
1. A cold and hot dual-purpose split type semiconductor air conditioner, includes shell (1), its characterized in that: the shell (1) is composed of a left shell (2), a right shell (3) and a connecting shell (4), the left shell (2) is arranged at the left end of the right shell (3), the connecting shell (4) is arranged between the left shell (2) and the right shell (3), the connecting shell (4) is fixedly connected with the left shell (2) and the right shell (3) respectively, a semiconductor refrigerating sheet (5) is fixedly connected inside the connecting shell (4), the left end of the semiconductor refrigerating sheet (5) is a cold end (19), the right end of the semiconductor refrigerating sheet (5) is a hot end (18), the left end of the semiconductor refrigerating sheet (5) is fixedly connected with a first radiator (6), and the right end of the semiconductor refrigerating sheet (5) is fixedly connected with a second radiator (7); the outer side of the first radiator (6) is fixedly connected with a first isolation cover (8), the outer side of the second radiator (7) is fixedly connected with a second isolation cover (9), the upper end of the first isolation cover (8) is fixedly connected with a first air inlet pipe (10) extending to the outside of the left shell (2), the upper end of the second isolation cover (9) is fixedly connected with a second air inlet pipe (11) extending to the outside of the right shell (3), the left end of the first isolation cover (8) is fixedly connected with a first fan (12), the right end of the second isolation cover (9) is fixedly connected with a second fan (13), the first isolation cover (8) and the lower end of the first fan (12) are connected with a first vent pipe (14), the second isolation cover (9) and the lower end of the second fan (13) are connected with a second vent pipe (15), the left end of the left shell (2) is fixedly connected with a left baffle (20) through screws, and the right end of the right, the left end of the first fan (12) is fixedly connected with a first exhaust pipe (16) extending to the outer side of the left baffle (20), and the right end of the second fan (13) is fixedly connected with a second exhaust pipe (17) extending to the outer side of the right baffle (21).
2. A split type semiconductor air conditioner for both cold and hot use according to claim 1, characterized in that: the first radiator (6) is located inside the left shell (2), and the second radiator (7) is located inside the right shell (3).
3. A split type semiconductor air conditioner for both cold and hot use according to claim 1, characterized in that: the first radiator (6), the second radiator (7) and the semiconductor refrigerating sheet (5) are all connected with an external power supply.
4. A split type semiconductor air conditioner for both cold and hot use according to claim 1, characterized in that: the first air inlet pipe (10) and the first air vent pipe (14) are communicated with the first isolation cover (8), and the second air inlet pipe (11) and the second air vent pipe (15) are communicated with the second isolation cover (9).
5. A split type semiconductor air conditioner for both cold and hot use according to claim 1, characterized in that: the first fan (12) and the second fan (13) are both connected with an external power supply, and the first fan (12) and the second fan (13) are both composed of an exhaust fan and a protective shell.
6. A split type semiconductor air conditioner for both cold and hot use according to claim 1, characterized in that: the first ventilating pipe (14) and the first exhaust pipe (16) are communicated with the first fan (12), and the second ventilating pipe (15) and the second exhaust pipe (17) are communicated with the second fan (13).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922018045.2U CN211060295U (en) | 2019-11-20 | 2019-11-20 | Cold and hot dual-purpose split type semiconductor air conditioner |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922018045.2U CN211060295U (en) | 2019-11-20 | 2019-11-20 | Cold and hot dual-purpose split type semiconductor air conditioner |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211060295U true CN211060295U (en) | 2020-07-21 |
Family
ID=71588261
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922018045.2U Active CN211060295U (en) | 2019-11-20 | 2019-11-20 | Cold and hot dual-purpose split type semiconductor air conditioner |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211060295U (en) |
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2019
- 2019-11-20 CN CN201922018045.2U patent/CN211060295U/en active Active
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