CN210986573U - High heat dissipation printed wiring board - Google Patents
High heat dissipation printed wiring board Download PDFInfo
- Publication number
- CN210986573U CN210986573U CN201922195586.2U CN201922195586U CN210986573U CN 210986573 U CN210986573 U CN 210986573U CN 201922195586 U CN201922195586 U CN 201922195586U CN 210986573 U CN210986573 U CN 210986573U
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- CN
- China
- Prior art keywords
- heat dissipation
- heat
- circuit substrate
- box
- heat radiating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 95
- 239000000758 substrate Substances 0.000 claims abstract description 28
- 238000009434 installation Methods 0.000 claims abstract description 22
- 230000005855 radiation Effects 0.000 claims abstract description 4
- 239000010410 layer Substances 0.000 claims description 32
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 9
- 239000012790 adhesive layer Substances 0.000 claims description 9
- 239000011889 copper foil Substances 0.000 claims description 9
- 239000000853 adhesive Substances 0.000 claims description 3
- 230000001070 adhesive effect Effects 0.000 claims description 3
- 239000000919 ceramic Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 238000001816 cooling Methods 0.000 description 8
- 238000010438 heat treatment Methods 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 238000013461 design Methods 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Landscapes
- Structure Of Printed Boards (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a high heat dissipation printed circuit board, which comprises a circuit substrate, wherein the top of the circuit substrate is provided with a conductive layer, the bottom of the circuit substrate is provided with a heat conduction pad, the bottom of the heat conduction pad is provided with a heat dissipation plate, the bottom of the heat dissipation plate is provided with a plurality of heat dissipation blocks, the heat dissipation plate and the heat dissipation blocks are both arranged in a heat dissipation box, two side walls of the heat dissipation box are both provided with a plurality of first heat dissipation through holes, the outer sides of two ends of the heat dissipation box are both connected with a horizontally arranged connecting column, two ends of the bottom of the circuit substrate are both provided with installation blocks, the installation blocks are provided with installation grooves matched with one end of the connecting column, the heat dissipation box is internally and symmetrically provided with heat dissipation fans, the heat dissipation fans are arranged on a support frame, the bottom end of the support frame is connected on the bottom plate, the heat on the circuit board is reduced by the radiation of the heat radiation through holes.
Description
Technical Field
The utility model relates to a circuit board technical field specifically is a high heat dissipation printed wiring board and manufacturing method thereof.
Background
Printed wiring boards are providers of electrical connections for electronic components. Its development has been over 100 years old; the design of the method is mainly layout design; the circuit board has the main advantages of greatly reducing errors of wiring and assembly and improving the automation level and the production labor rate. When the circuit board is used, a plurality of electronic elements are added on the surface, heat is generated when the electronic elements work, and when the heat is too high, the heat dissipation speed of the circuit board is too low, so that the use of the electronic elements is influenced.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a high heat dissipation printed wiring board and manufacturing method to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a high heat dissipation printed wiring board, including the circuit substrate, circuit substrate top is provided with the conducting layer, circuit substrate bottom is provided with the heat conduction pad, the heat conduction pad bottom is provided with the heating panel, the heating panel bottom is provided with a plurality of radiating blocks, and heating panel and radiating block all set up at the heat dissipation incasement, all be provided with a plurality of first heat dissipation through-holes on the both sides wall of heat dissipation case, the spliced pole that the level set up is all connected in the both ends outside of heat dissipation case, circuit substrate bottom both ends all are provided with the installation piece, and be provided with on the installation piece with spliced pole one end complex mounting groove, the heat dissipation incasement symmetry is provided with cooling fan, cooling fan sets up on the support frame, the bottom of support frame is connected on.
Preferably, the conducting layer comprises a heat conducting layer, an adhesive layer and a copper foil layer, the heat conducting layer, the adhesive layer and the copper foil layer are sequentially overlapped from bottom to top, and the heat conducting layer is made of a ceramic heat conducting adhesive structure.
Preferably, the mounting block and the connecting column are both provided with screw holes in threaded connection with the connecting bolts, and the depth of the mounting groove in the mounting block is smaller than the thickness of the mounting block.
Preferably, the support frame is provided with an installation through hole, the cooling fan is installed in the installation through hole, the upper inner wall and the lower inner wall of the installation through hole are provided with a plurality of elastic columns, and the elastic columns are of rubber material structures.
Preferably, a plurality of second heat dissipation through holes are uniformly distributed on the front side wall and the rear side wall of the heat dissipation box, and the connecting column is arranged at the tops of the first heat dissipation through holes at the two ends of the heat dissipation box.
Preferably, the four corners of the circuit substrate are provided with mounting holes.
A manufacturing method of a high-heat-dissipation printed circuit board comprises the following steps:
s1, firstly, laying a conductive layer formed by sequentially overlapping a heat conduction layer, an adhesive layer and a copper foil layer on the top of the circuit substrate, then processing a mounting hole by using drilling equipment, and laying a heat conduction pad at the bottom of the circuit substrate;
s2, installing a heat dissipation fan into the installation through hole of the support frame, extruding the elastic column by the heat dissipation fan, clamping the heat dissipation fan by the elasticity of the elastic column, symmetrically arranging the support frame provided with the heat dissipation fan in a heat dissipation box, and arranging the heat dissipation plate and the heat dissipation block in an opening at the top of the heat dissipation box;
s3, inserting the assembled heat dissipation box into the mounting groove of the mounting block through the connecting columns at the two ends, locking by matching of the connecting bolts and the screw holes, and mounting the heat dissipation box at the bottom of the heat conduction pad;
s4, arranging a first heat dissipation through hole and a second heat dissipation through hole on the left, right, front and back of the heat dissipation box respectively.
Compared with the prior art, the beneficial effects of the utility model are that: the heat generated by the electronic element on the circuit board is timely conducted into the heat dissipation box through the heat conducting pad, the heat dissipation plate and the heat dissipation block arranged at the bottom of the circuit substrate and dissipated through the heat dissipation through hole, so that the heat on the circuit board is reduced, the element on the circuit board is protected from being damaged, the service life of the circuit board is prolonged, the heat dissipation fan arranged in the heat dissipation box accelerates the dissipation of the heat in the heat dissipation box, and the heat dissipation effect on the circuit board is improved.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is an enlarged view of A in FIG. 1;
fig. 3 is a cross-sectional view of the conductive layer of the present invention;
fig. 4 is a front view of the present invention;
fig. 5 is a schematic structural view of the circuit substrate and the conductive layer of the present invention;
fig. 6 is a schematic view of the structure of the mounting block of the present invention;
fig. 7 is a schematic view of the supporting frame of the present invention.
In the figure: 1. a circuit substrate; 2. a conductive layer; 21. a heat conductive layer; 22. an adhesive layer; 23. a copper foil layer; 3. a thermally conductive pad; 4. a heat dissipation plate; 5. a heat dissipating block; 6. a heat dissipation box; 61. a second heat dissipating through hole; 7. mounting holes; 8. a first heat dissipating through hole; 9. mounting blocks; 91. mounting grooves; 92. a screw hole; 10. connecting columns; 11. a connecting bolt; 12. a heat radiation fan; 13. a support frame; 131. mounting a through hole; 132. an elastic column.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "vertical", "upper", "lower", "horizontal", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention.
In the description of the present invention, it should also be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
Referring to fig. 1-7, the present invention provides a technical solution: the utility model provides a high heat dissipation printed wiring board, including circuit substrate 1, 1 top of circuit substrate is provided with conducting layer 2, 1 bottom of circuit substrate is provided with heat conduction pad 3, 3 bottoms of heat conduction pad are provided with heating panel 4, 4 bottoms of heating panel are provided with a plurality of radiating block 5, and heating panel 4 and radiating block 5 all set up in radiating box 6, all be provided with a plurality of first heat dissipation through-holes 8 on the both sides wall of radiating box 6, the spliced pole 10 that the level set up is all connected with in the both ends outside of radiating box 6, 1 bottom both ends of circuit substrate all are provided with installation piece 9, and be provided with on installation piece 9 with spliced pole 10 one end complex mounting groove 91, the symmetry is provided with cooling fan 12 in the radiating box 6, cooling fan 12 sets up on support frame 13, the bottom of support frame 13 is connected on the bottom plate of radiating box 6, cooling fan.
The conducting layer 2 comprises a heat conducting layer 21, an adhesive layer 22 and a copper foil layer 23, the heat conducting layer 21, the adhesive layer 22 and the copper foil layer 23 are sequentially overlapped from bottom to top, and the heat conducting layer 21 is made of a ceramic heat conducting adhesive structure.
All be provided with on installation piece 9 and the spliced pole 10 with connecting bolt 11 threaded connection's screw 92, and the mounting groove 91 degree of depth on the installation piece 9 is less than the thickness of installation piece 9, spliced pole 10 inserts in the mounting groove 91.
The support frame 13 is provided with an installation through hole 131, the heat dissipation fan 12 is installed in the installation through hole 131, the upper inner wall and the lower inner wall of the installation through hole 131 are provided with a plurality of elastic columns 132, the elastic columns 132 are made of rubber materials, and the heat dissipation fan 12 is clamped in the installation through hole 131 and clamped tightly through the elasticity of the elastic columns 132.
A plurality of second heat dissipation through holes 61 are uniformly distributed on the front side wall and the rear side wall of the heat dissipation box 6, the connecting columns 10 are arranged at the tops of the first heat dissipation through holes 8 at the two ends of the heat dissipation box 6, and heat in the heat dissipation box 6 is convenient to lose through the first heat dissipation through holes 8 and the second heat dissipation through holes 61.
The four corners of the circuit substrate 1 are provided with mounting holes 7, so that the printed circuit board can be conveniently mounted through the mounting holes 7.
A manufacturing method of a high-heat-dissipation printed circuit board comprises the following steps:
s1, firstly, laying a conductive layer 2 formed by sequentially overlapping a heat conduction layer 21, an adhesive layer 22 and a copper foil layer 23 on a circuit substrate 1 on the top of the circuit substrate 1, then processing a mounting hole 7 by using drilling equipment, and laying a heat conduction pad 3 on the bottom of the circuit substrate 1;
s2, installing the heat dissipation fan 12 into the installation through hole 131 of the support frame 13, extruding the elastic column 132 by the heat dissipation fan 12, clamping the heat dissipation fan 12 by the elasticity of the elastic column 132, symmetrically arranging the support frame 13 provided with the heat dissipation fan 12 in the heat dissipation box 6, and arranging the heat dissipation plate 4 and the heat dissipation block 5 in the top opening of the heat dissipation box 6;
s3, inserting the assembled heat dissipation box 6 into the mounting groove 91 of the mounting block 9 through the connecting columns 10 at the two ends, and locking by matching the connecting bolt 11 and the screw hole 92 to mount the heat dissipation box 6 at the bottom of the heat conduction pad 3;
s4, the first and second heat dissipating through- holes 8 and 61 are provided on the left and right and front and rear of the heat dissipating box 6, respectively.
The working principle is as follows: during the use, the heat that the printed wiring board produced transmits to heating panel 4 department through heat conduction pad 3, and radiating block 5 dispels the heat, dispels the heat through first heat dissipation through-hole 8 and the second heat dissipation through-hole 61 on the heat dissipation case 6, and the circular telegram for cooling fan 12 through the connecting wire, cooling fan 12 begins work, blows off the heat in the heat dissipation case 6, opens quick radiating effect.
The heat generated by the electronic element on the circuit board is timely conducted into the heat dissipation box through the heat conducting pad, the heat dissipation plate and the heat dissipation block arranged at the bottom of the circuit substrate and dissipated through the heat dissipation through hole, so that the heat on the circuit board is reduced, the element on the circuit board is protected from being damaged, the service life of the circuit board is prolonged, the heat dissipation fan arranged in the heat dissipation box accelerates the dissipation of the heat in the heat dissipation box, and the heat dissipation effect on the circuit board is improved.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The utility model provides a high heat dissipation printed wiring board, includes circuit substrate (1), its characterized in that: the top of the circuit substrate (1) is provided with a conductive layer (2), the bottom of the circuit substrate (1) is provided with a heat conducting pad (3), the bottom of the heat conducting pad (3) is provided with a heat radiating plate (4), the bottom of the heat radiating plate (4) is provided with a plurality of heat radiating blocks (5), the heat radiating plate (4) and the heat radiating blocks (5) are both arranged in a heat radiating box (6), two side walls of the heat radiating box (6) are both provided with a plurality of first heat radiating through holes (8), the outer sides of two ends of the heat radiating box (6) are both connected with connecting posts (10) which are horizontally arranged, two ends of the bottom of the circuit substrate (1) are both provided with mounting blocks (9), the mounting grooves (91) matched with one ends of the connecting posts (10) are arranged on the mounting blocks (9), heat radiating fans (12) are symmetrically arranged in the heat radiating box (6), the heat radiating fans (12) are arranged, the heat radiation fan (12) is connected with an external power supply through a connecting wire.
2. The high heat dissipation printed wiring board of claim 1, wherein: the conducting layer (2) comprises a heat conducting layer (21), an adhesive layer (22) and a copper foil layer (23), the heat conducting layer (21), the adhesive layer (22) and the copper foil layer (23) are sequentially overlapped from bottom to top, and the heat conducting layer (21) is made of a ceramic heat conducting adhesive structure.
3. The high heat dissipation printed wiring board of claim 1, wherein: the mounting block (9) and the connecting column (10) are both provided with screw holes (92) in threaded connection with the connecting bolts (11), and the depth of the mounting groove (91) on the mounting block (9) is smaller than the thickness of the mounting block (9).
4. The high heat dissipation printed wiring board of claim 1, wherein: the supporting frame (13) is provided with an installation through hole (131), the heat dissipation fan (12) is installed in the installation through hole (131), the upper inner wall and the lower inner wall of the installation through hole (131) are provided with a plurality of elastic columns (132), and the elastic columns (132) are of rubber material structures.
5. The high heat dissipation printed wiring board of claim 1, wherein: a plurality of second heat dissipation through holes (61) are uniformly distributed on the front side wall and the rear side wall of the heat dissipation box (6), and the connecting columns (10) are arranged at the tops of the first heat dissipation through holes (8) at the two ends of the heat dissipation box (6).
6. The high heat dissipation printed wiring board of claim 1, wherein: four corners of the circuit substrate (1) are provided with mounting holes (7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922195586.2U CN210986573U (en) | 2019-12-10 | 2019-12-10 | High heat dissipation printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922195586.2U CN210986573U (en) | 2019-12-10 | 2019-12-10 | High heat dissipation printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210986573U true CN210986573U (en) | 2020-07-10 |
Family
ID=71418000
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922195586.2U Expired - Fee Related CN210986573U (en) | 2019-12-10 | 2019-12-10 | High heat dissipation printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210986573U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114051314A (en) * | 2021-11-22 | 2022-02-15 | 深圳市鑫祥泰电子有限公司 | Multilayer heat conduction type flexible circuit board |
-
2019
- 2019-12-10 CN CN201922195586.2U patent/CN210986573U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114051314A (en) * | 2021-11-22 | 2022-02-15 | 深圳市鑫祥泰电子有限公司 | Multilayer heat conduction type flexible circuit board |
| CN114051314B (en) * | 2021-11-22 | 2024-01-12 | 深圳市鑫祥泰电子有限公司 | Multilayer heat-conducting flexible circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200710 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |