CN210981531U - Data center micromodule temperature field temperature measurement system - Google Patents
Data center micromodule temperature field temperature measurement system Download PDFInfo
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- CN210981531U CN210981531U CN201922386298.5U CN201922386298U CN210981531U CN 210981531 U CN210981531 U CN 210981531U CN 201922386298 U CN201922386298 U CN 201922386298U CN 210981531 U CN210981531 U CN 210981531U
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Abstract
The utility model relates to a data center micromodule temperature field temperature measurement system, it includes many thermoscopes and micromodule rotating ring collection host computer, every the real-time temperature value that the thermoscopes the preset number in real time and measures the temperature point, every the thermoscopes has the interface respectively, every the thermoscopes respectively with the micromodule rotating ring collection host computer passes through interface connection, and pass through the interface transmits the temperature data who gathers to the micromodule rotating ring collection host computer and unifies and present, effectively reduces the quantity of thermoscopes, practices thrift a large amount of wire rods, and the engineering is implemented simply, improves hardware stability, satisfies the construction needs when reduce cost.
Description
Technical Field
The utility model relates to a data center temperature acquisition technical field, concretely relates to data center micromodule temperature field temperature measurement system.
Background
The micromodule data center is designed according to the basic rules of high efficiency, energy conservation and optimized management, namely the whole data center is divided into a plurality of independent areas, and the scale, the power load, the configuration and the like of each area are designed according to a unified standard. The micromodule data center, refrigeration, power supply and distribution, network, wiring, monitoring, fire control and management system all need realize regionalization, micromodule, mutual noninterference, can independently operate, do not have the share part, improve data center's whole operation efficiency, realize quick deployment, elastic expansion and green energy-conservation, and the micromodule has brought a series of advantages for data center.
At present, a micromodule temperature field of a data center is high in construction cost and cannot meet construction requirements, in the existing scheme, a solution of the micromodule temperature field mainly adopts dozens of or even hundreds of temperature sensors, the temperature sensors are electrically connected through a large number of wires to acquire complete data, a temperature field cloud picture and the like are rendered through software, the cost of the scheme often needs tens of thousands of sensors, wires and the like, engineering implementation is complex and difficult, and the stability of hardware is low.
SUMMERY OF THE UTILITY MODEL
Accordingly, there is a need for a data center micro-module temperature field measurement system that does not require a large number of temperature sensors and has more temperature measurement points.
A micro-module temperature field temperature measurement system of a data center comprises a plurality of temperature measuring instruments and a micro-module moving ring acquisition host, wherein each temperature measuring instrument acquires real-time temperature values of a preset number of temperature measuring points in real time, each temperature measuring instrument is provided with an interface, each temperature measuring instrument is connected with the micro-module moving ring acquisition host through the interface, and acquired temperature data are transmitted to the micro-module moving ring acquisition host through the interfaces to be presented in a unified mode.
Preferably, each of the thermometers includes a CPU module and an infrared sensor, the infrared sensor has a photoelectric conversion unit, the infrared sensor is configured to collect an infrared signal and convert the infrared signal into a voltage signal through the photoelectric conversion unit, the infrared sensor is electrically connected to the CPU module and transmits the voltage signal to the CPU module, and the CPU module is configured to manage the thermometers to operate normally and convert the voltage signal transmitted by the infrared sensor into an actual temperature value.
Preferably, each of the thermometers further includes an L DO voltage conversion module, the L DO voltage conversion module is electrically connected to the CPU module, and the L DO voltage conversion module is configured to convert an external voltage into an internal voltage required by the thermometers.
Preferably, each temperature measuring instrument further comprises a key and a display screen, the key and the display screen are respectively electrically connected with the CPU module, the key is used for setting or operating the temperature measuring instrument, and the display screen is used for displaying a specific temperature value.
Preferably, the infrared sensor is further provided with an infrared probe, the infrared probe is electrically connected with the photoelectric conversion unit, and the infrared probe emits and receives at least 1024 infrared rays and is used for acquiring real-time temperature values of at least 1024 temperature measurement points in real time.
Preferably, the interface is an RS485 interface.
Preferably, the micro-module moving-ring acquisition host is provided with an RK3288 main control module and a core acquisition program module which are electrically connected, the RK3288 main control module is used for managing normal work of the micro-module moving-ring acquisition host, and the core acquisition program module is used for analyzing and processing received temperature data, storing the received temperature data and rendering a temperature field in real time.
Preferably, the micro-module moving-ring acquisition host further has a plurality of serial ports, the serial ports are electrically connected with the RK3288 main control module, the serial ports include an RS485 interface, and the micro-module moving-ring acquisition host is connected with the temperature measuring instrument through the RS485 interface.
Preferably, the micro-module moving-ring acquisition host further comprises a multi-path acquisition module and a multi-path digital quantity control module, the multi-path acquisition module and the multi-path digital quantity control module are respectively and electrically connected with the RK3288 main control module, the acquisition module is used for external equipment, and the digital quantity control module is used for controlling the on and off of the external equipment.
Preferably, the micromodule moving loop acquisition host further comprises a host display screen for displaying a real-time temperature field, and the host display screen is electrically connected with the RK3288 main control module.
In the data center micro-module temperature field temperature measuring system, each temperature measuring instrument can acquire real-time temperature values of a preset number of temperature measuring points in real time, and the real-time temperature values are uniformly presented through the micro-module moving ring acquisition host, so that the temperature values can be more conveniently seen; the data center micro-module temperature field temperature measurement system can effectively reduce the number of temperature measuring instruments, saves a large number of wires, is simple in engineering implementation, improves hardware stability, reduces cost and meets construction requirements.
Drawings
Fig. 1 is a schematic block diagram of a data center micro-module temperature field temperature measurement system according to an embodiment of the present invention.
Fig. 2 is a schematic view of a temperature measuring instrument module of a data center micro-module temperature field temperature measuring system provided by the embodiment of the present invention.
Fig. 3 is a schematic diagram of a micro-module moving-ring acquisition host module of a data center micro-module temperature field temperature measurement system provided by the embodiment of the present invention.
Fig. 4 is a schematic view of a three-dimensional structure of a micro-module moving-ring acquisition host of a data center micro-module temperature field temperature measurement system provided by the embodiment of the present invention.
Detailed Description
The present invention will be described in detail with reference to the following embodiments and drawings.
Please refer to fig. 1, which illustrates a data center micro-module temperature field temperature measurement system 100 according to an embodiment of the present invention, which includes a plurality of thermometers 1 and a micro-module moving-ring acquisition host 2, each thermometer 1 acquires a predetermined number of real-time temperature values in real time, each thermometer 1 has an interface, each thermometer 1 respectively with the micro-module moving-ring acquisition host 2 passes through the interface connection, and through the interface transmits the acquired temperature data to the micro-module moving-ring acquisition host 2 for unified presentation. Further, in the embodiment of the present invention, each temperature measuring instrument 1 can at least collect temperature values of 1024 temperature measuring points in real time, and there are 4 temperature measuring instruments 1, 2 temperature measuring instruments 1 arranged in the cold channel of the data center micro module for being responsible for data collection of the cold channel and monitoring the states of 2048 temperature measuring points in the cold channel in real time; the 2 thermometers 1 are arranged in a hot channel of the data center micromodule and used for being responsible for data acquisition of the hot channel and monitoring the states of 2048 temperature measuring points in the hot channel in real time.
Referring to fig. 2, each of the thermometers 1 respectively includes a CPU module 11 and an infrared sensor 12, the infrared sensor 12 has a photoelectric conversion unit 121, the infrared sensor 12 is configured to collect an infrared signal and convert the infrared signal into a voltage signal through the photoelectric conversion unit 121, the infrared sensor 12 is electrically connected to the CPU module 11 and transmits the voltage signal to the CPU module 11, and the CPU module 11 is configured to manage the thermometers 1 to normally operate and convert the voltage signal transmitted by the infrared sensor 12 into an actual temperature value.
Preferably, each of the thermometers 1 further includes an L DO voltage conversion module 13, the L DO voltage conversion module 13 is electrically connected to the CPU module 11, and the L DO voltage conversion module 13 is configured to convert an external voltage into an internal voltage required by the thermometers 1, further, in an embodiment of the present invention, the L DO voltage conversion module 13 converts an external voltage of 5V to 24V into an internal voltage of 3.3V required by the CPU module 11 and the infrared sensor 12.
Preferably, each of the thermometers 1 further includes a key 15 and a display screen 16, the key 15 and the display screen 16 are electrically connected to the CPU module 11, the key 15 is used to set or operate the thermometers 1, and the display screen 16 is used to display a specific temperature value.
Preferably, the infrared sensor 12 further has an infrared probe 122, the infrared probe 122 is electrically connected to the photoelectric conversion unit 122 to send detected data to the photoelectric conversion unit 121, the infrared probe 122 sends and receives at least 1024 infrared rays for acquiring real-time temperature values of at least 1024 temperature measurement points in real time, and the refresh rate reaches more than 200 ms.
Preferably, the interface is an RS485 interface 14.
Referring to fig. 3, the micro-module moving-ring acquisition host 2 has an RK3288 main control module 20 and a core acquisition program module 22 electrically connected to each other, the RK3288 main control module 20 is configured to manage normal operation of the micro-module moving-ring acquisition host 2, and the core acquisition program module 22 is configured to analyze and process received temperature data, store the received temperature data, and render a temperature field in real time, so as to obtain a real-time temperature display image.
Preferably, the micro-module moving-ring acquisition host 2 further has a plurality of serial ports 23, the plurality of serial ports 23 are electrically connected with the RK3288 main control module 20, the plurality of serial ports 23 include an RS485 interface and an RS232 interface, and the micro-module moving-ring acquisition host 2 is connected with the temperature measuring instrument 1 through the RS485 interface.
Preferably, the micro-module moving-ring acquisition host 2 further has a plurality of acquisition modules and a plurality of digital quantity control modules 24, the plurality of acquisition modules and the plurality of digital quantity control modules 24 are respectively electrically connected with the RK3288 main control module 20, the acquisition modules are used for external devices, and the digital quantity control modules 24 are used for controlling the on and off of the external devices. Further, the multichannel collection module includes multichannel analog quantity collection module 25 and multichannel digital quantity collection module 26, the multichannel analog quantity collection module 25 and multichannel digital quantity collection module 26 respectively with RK3288 main control module 20 electricity is connected, analog quantity collection module 25 is used for equipment such as external joint humiture, air conditioner, high voltage direct current, UPS, battery patrol appearance, camera, entrance guard or voltage transmitter, digital quantity collection module 26 is used for sensors such as external temperature, smoke, infrared induction and water sensor. The digital quantity control module 24 is used for controlling the on/off of an air conditioner, the opening and closing of a door of an entrance guard, the on/off of the air conditioner or the opening and closing of a fan and the like.
Referring to fig. 4 in conjunction with fig. 3, the micro-module moving-ring collection host 2 further has a host display screen 21 for displaying a real-time temperature field, and the host display screen 21 is electrically connected to the RK3288 main control module.
Further, the micro-module moving-ring acquisition host 2 further has a data reporting module 27, which is configured to report data to a third-party internet of things platform when needed, and the data reporting module 27 is electrically connected to the RK3288 main control module.
Further, the micro-module moving-ring acquisition host 2 further has an alarm notification module 28, which is configured to send an alarm notification, and the alarm notification module 28 is electrically connected to the RK3288 main control module.
Further, the micromodule dynamic loop acquisition host 2 based on the RK3288 platform can acquire micromodule power and environmental equipment data and alarms. The micro-module power and environment equipment comprises temperature and humidity, an air conditioner, high-voltage direct current, a UPS, a battery patrol instrument, a camera or access control equipment and the like. The temperature measuring instrument 1 reports data to the micro-module moving-ring acquisition host 2, and the core acquisition program module 22 can accurately draw a temperature field in real time and accurately judge a high-temperature part by combining the positions of the cabinet and the air-conditioning air outlet.
In the data center micromodule temperature field temperature measurement system 100, the daily acquisition of temperature does not need manual intervention, only 4 temperature measuring instruments 1 need to be installed, and each temperature measuring instrument 1 can obtain data of 1024 temperature measuring points, so that the data center micromodule temperature field temperature measurement system has obvious acquisition advantages, cost advantages and quantity advantages of the temperature measuring instruments 1; the micro-module moving ring acquisition host 2 can accurately judge a high-temperature part according to temperature information sent by the temperature measuring instrument 1 and by combining the positions of the cabinet and the air outlet of the air conditioner, and can solve the problem of difficult environmental abnormity early warning of the micro-module of the data center from the source.
It should be noted that the present invention is not limited to the above embodiments, and other changes can be made by those skilled in the art according to the spirit of the present invention, and all the changes made according to the spirit of the present invention should be included in the scope of the present invention.
Claims (10)
1. The data center micro-module temperature field temperature measurement system is characterized by comprising a plurality of temperature measuring instruments and a micro-module moving ring acquisition host, wherein each temperature measuring instrument acquires real-time temperature values of a preset number of temperature measuring points in real time, each temperature measuring instrument is provided with an interface, each temperature measuring instrument is connected with the micro-module moving ring acquisition host through the interface, and acquired temperature data are transmitted to the micro-module moving ring acquisition host through the interfaces to be presented in a unified mode.
2. The data center micro-module temperature field measurement system according to claim 1, wherein each of the thermometers comprises a CPU module and an infrared sensor, the infrared sensor has a photoelectric conversion unit, the infrared sensor is configured to collect an infrared signal and convert the infrared signal into a voltage signal through the photoelectric conversion unit, the infrared sensor is electrically connected to the CPU module and transmits the voltage signal to the CPU module, and the CPU module is configured to manage the thermometers to operate normally and convert the voltage signal transmitted by the infrared sensor into an actual temperature value.
3. The data center micro-module temperature field thermometry system of claim 2, wherein each of the thermometers further comprises L DO voltage conversion module, L DO voltage conversion module is electrically connected to the CPU module, and the L DO voltage conversion module is configured to convert an external voltage into an internal voltage required by the thermometers.
4. The data center micro-module temperature field measurement system according to claim 3, wherein each of the thermometers further comprises a key and a display screen, the key and the display screen are electrically connected with the CPU module respectively, the key is used for setting or operating the thermometers, and the display screen is used for displaying a specific temperature value.
5. The data center micro-module temperature field measurement system according to claim 4, wherein the infrared sensor further comprises an infrared probe electrically connected to the photoelectric conversion unit, the infrared probe emitting and receiving at least 1024 infrared rays for real-time collecting real-time temperature values of at least 1024 temperature measurement points.
6. The data center micro-module temperature field measurement system of claim 4, wherein the interface is an RS485 interface.
7. The data center micro-module temperature field temperature measurement system of claim 1, wherein the micro-module moving loop acquisition host has an RK3288 main control module and a core acquisition program module electrically connected, the RK3288 main control module is configured to manage normal operation of the micro-module moving loop acquisition host, and the core acquisition program module is configured to perform parsing processing on the received temperature data, store the temperature data, and render the temperature field in real time.
8. The data center micro-module temperature field temperature measurement system of claim 7, wherein the micro-module moving ring acquisition host further comprises a plurality of serial ports, the plurality of serial ports are electrically connected with the RK3288 main control module, the plurality of serial ports comprise RS485 interfaces, and the micro-module moving ring acquisition host is connected with the temperature measurement instrument through the RS485 interfaces.
9. The data center micro-module temperature field measurement system according to claim 7, wherein the micro-module moving loop acquisition host further comprises a plurality of acquisition modules and a plurality of digital quantity control modules, the plurality of acquisition modules and the plurality of digital quantity control modules are respectively and electrically connected with the RK3288 main control module, the acquisition modules are used for external devices, and the digital quantity control modules are used for controlling the on-off of the external devices.
10. The data center micro-module temperature field temperature measurement system of claim 7, wherein the micro-module moving loop collection host further comprises a host display screen for displaying a real-time temperature field, and the host display screen is electrically connected with the RK3288 master control module.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201922386298.5U CN210981531U (en) | 2019-12-25 | 2019-12-25 | Data center micromodule temperature field temperature measurement system |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201922386298.5U CN210981531U (en) | 2019-12-25 | 2019-12-25 | Data center micromodule temperature field temperature measurement system |
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| CN210981531U true CN210981531U (en) | 2020-07-10 |
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| CN201922386298.5U Active CN210981531U (en) | 2019-12-25 | 2019-12-25 | Data center micromodule temperature field temperature measurement system |
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