CN210959238U

CN210959238U - Automobile control system host

Info

Publication number: CN210959238U
Application number: CN201921682171.1U
Authority: CN
Inventors: 冷衍勇; 冉辉; 陈海鸿
Original assignee: Yanfeng Visteon Chongqing Automotive Electronics Co Ltd
Current assignee: Yanfeng Visteon Chongqing Automotive Electronics Co Ltd
Priority date: 2019-10-09
Filing date: 2019-10-09
Publication date: 2020-07-07
Anticipated expiration: 2029-10-09

Abstract

The utility model discloses an automobile control system host computer. The automobile control system host comprises a first structural member, a fourth side plate and a bottom plate, wherein the first structural member consists of a top plate, a first side plate, a second side plate and a third side plate; the first structural member, the fourth side plate and the bottom plate are combined into a box body with a hexahedral structure; a plurality of radiating fins are arranged on the outer side surface of the top plate at intervals; the circuit board is cooled through the box body, the structure is simple, the equipment process is simplified, the cost is reduced, and the cooling effect is improved.

Description

Automobile control system host

Technical Field

The utility model relates to a host computer field, concretely relates to automobile control system host computer.

Background

The automobile comprises a plurality of control systems which can be divided into an entertainment system, a vehicle condition monitoring system, a vehicle safety control system and the like according to application scenes; control systems applied to entertainment aspects include audio systems and the like; the circuit board of the automobile control system host machine is provided with a large number of electronic components, and when some components (such as probability modules and the like) work, a large amount of heat can be generated. Higher temperature can influence the performance of components and parts, thereby influencing the normal operation of the host computer. Too high a temperature may even bring about a safety hazard. Therefore, when the structure of the host is designed, how to quickly radiate the heat of the host needs to be considered, and the safe operation of the host is ensured. The traditional automobile control system host has single function, only one circuit board is adopted, and the heat dissipation index can be achieved by using the heat dissipation fins to dissipate heat of the circuit board; along with the expansion of the functions of the main machine of the automobile control system, the functions of the main machine can be better realized only by adopting two circuit boards. For two circuit boards, the existing heat dissipation scheme is: one radiating fin is used for each circuit board, and because a plurality of radiating fins are used, the internal structure of the main machine box body is more, the installation is complex, and the box body is assembled and installed by adopting a single structural member, so that more parts are needed, the assembly is complex and the cost is high; and the radiating fins are arranged inside the host, so that the temperature inside the host is high, and the heat can not be well radiated.

Disclosure of Invention

The utility model aims to overcome among the prior art that the part that brings is dispelled the heat to the circuit board through the inside polylith radiating fin of box is many, and installation steps are complicated, and the heat that leads radiating fin from the chip can not distribute etc. not enough fast, provides an automobile control system host computer, and this host computer is through the heat-sinking capability who enlarges the box, improves the radiating effect, can no longer install radiating fin in the box simultaneously, simplifies the inside mounting structure of host computer to simplify and equip the process, reduce cost.

In order to realize the purpose of the utility model, the utility model provides a following technical scheme:

a main machine of an automobile control system comprises a first structural member, a fourth side plate and a bottom plate, wherein the first structural member consists of a top plate, a first side plate, a second side plate and a third side plate; the first structural member, the fourth side plate and the bottom plate are combined into a box body with a hexahedral structure; a plurality of radiating fins are arranged on the outer side surface of the top plate at intervals.

Preferably, the device further comprises a first circuit board and a second circuit board; the first circuit board is arranged in the box body through screws, and the first circuit board and the top plate are arranged at intervals; the second circuit board is installed in the box body through screws, and the second circuit board and the bottom plate are arranged at intervals.

Preferably, the material of the heat sink is ADC 12.

Preferably, the height of the radiating fins is 15mm, the thickness of the radiating fins is 1-3mm, and the distance between the two radiating fins is 4-6 mm.

Preferably, the radiating fins are uniformly laid on the outer side surface of the top plate.

Preferably, a plurality of vent holes are formed in the first side plate and the third side plate which are arranged in parallel; the bottom plate is provided with a plurality of vent holes.

Preferably, a plurality of interface mounting holes adapted to the circuit interface are formed in the fourth side plate.

Preferably, a first cavity and a second cavity are arranged on the inner side of the top plate; the first cavity is attached to the first circuit board; the second cavity is attached to the second circuit board.

Preferably, a plurality of heat conducting through holes are arranged on the second circuit board; and a heat-conducting colloid is filled between the second circuit board and the bottom plate.

Preferably, the bottom plate is provided with a protrusion, and a heat conducting colloid is filled between the second circuit board and the protrusion.

Compared with the prior art, the beneficial effects of the utility model are that:

1. through set up a plurality of fin on the lateral surface at the roof, improve the heat-sinking capability of box, reinforcing radiating effect, can no longer install radiating fin in the box simultaneously, simplify the inside mounting structure of host computer to simplify and equip the process, reduce cost.

2. The first circuit board and the second circuit board are arranged in parallel up and down, and heat generated by the circuit is dissipated through the first structural member, the fourth side plate and the bottom plate, so that the structure of the control host is reduced, the installation and assembly processes are simplified, and the cost is saved.

3. Different heat dissipation structures are arranged on the first side plate, the third side plate and the bottom plate respectively, so that the heat dissipation capacity is improved;

4. through set up heat conduction through-hole on the second circuit board, conduct the heat to the bottom plate better through heat conduction colloid to dispel the heat more fast.

Description of the drawings:

fig. 1 is a diagram of a structure of a host of an automobile control system according to an exemplary embodiment 1 of the present invention;

fig. 2 is an exploded view of a vehicle control system host according to exemplary embodiment 1 of the present invention;

fig. 3 is a first structural member of exemplary embodiment 1 of the present invention;

fig. 4 is a second structural member of the first structural member according to exemplary embodiment 1 of the present invention;

fig. 5 is a cross-sectional view of a vehicle control system host according to exemplary embodiment 1 of the present invention;

FIG. 6 is an enlarged view of A in FIG. 5;

fig. 7 is a structural view of a fourth side plate of exemplary embodiment 1 of the present invention;

fig. 8 is a structural view of a base plate according to exemplary embodiment 1 of the present invention;

the labels in the figure are: 1-a first structural member, 11-a first side plate, 12-a second side plate, 13-a third side plate, 14-a top plate, 141-a first cavity, 142-a second cavity, 143-a heat sink, 2-a fourth side plate, 3-a bottom plate, 31-a protrusion, 4-a first circuit board, 5-a second circuit board, 51-a heat conduction through hole, 52-a chip, 6-a stud, 7-a heat conduction colloid, 8-a vent hole and 9-an interface mounting hole.

Detailed Description

The present invention will be described in further detail with reference to test examples and specific embodiments. However, it should not be understood that the scope of the above-mentioned subject matter is limited to the following embodiments, and all the technologies realized based on the present invention are within the scope of the present invention.

Example 1

As shown in fig. 1 to 3, the present embodiment provides an automobile control system host, which includes a first structural member 1, a fourth side plate 2, and a bottom plate 3, where the first structural member 1 is composed of a top plate 14, a first side plate 11, a second side plate 12, and a third side plate 13; the first structural member 1, the fourth side plate 2 and the bottom plate 3 are combined into a box body with a hexahedral structure; a plurality of fins 143 are provided at intervals on the outer surface of the top plate 14. Through set up a plurality of fin on the lateral surface at the roof, improve the heat-sinking capability of box, reinforcing radiating effect, can not install radiating fin in the box simultaneously, simplify the inside mounting structure of host computer to simplify and equip the process, reduce cost.

The automobile control system host further comprises a first circuit board 4 and a second circuit board 5; the first circuit board 4 is installed in the box body through screws, and the first circuit board 4 and the top plate 14 are arranged at intervals; the second circuit board 5 is installed in the box body through screws, and the second circuit board 5 and the bottom plate 3 are arranged at intervals.

The stud 6 arranged on the top plate is used for fixedly mounting the first circuit board and the second circuit board; the first circuit board and the second circuit board are arranged up and down in parallel, and heat generated by the circuit is dissipated through the first structural member 1, the fourth side plate 2 and the bottom plate 3, so that the internal structure of the box body is simplified. If the existing heat dissipation mode with a plurality of heat dissipation fins is adopted for heat dissipation, the internal structure of the box body is complex, the installation is complex, and the box body adopts an integrated manufacturing mode to simplify the box body components, so that the heat dissipation fins and other structures are inconvenient to install. The first circuit board and the second circuit board are arranged in parallel up and down, and heat generated by the circuit is dissipated through the first structural member 1, the fourth side plate 2 and the bottom plate 3, so that the structure of the control host is reduced, the installation and assembly processes are simplified, and the cost is saved.

The material of the heat sink 143 is ADC12, etc.; ADC12 is also called 12 # aluminum material, Al-Si-Cu alloy, is die-casting aluminum alloy, is suitable for cylinder head cover, sensor bracket, cylinder block, etc.; the radiating fins are made of materials with good radiating effect, and the radiating effect is optimized.

Wherein the height of the radiating fins 143 is 15mm, the thickness of the radiating fins is 1-3mm, and the distance between the two radiating fins is 4-6 mm; the height, the thickness and the distance of the radiating fins are optimized through thermal simulation analysis software, and the radiating capacity of the box body is improved.

Wherein, the radiating fins 143 are uniformly laid on the outer side surface of the top plate 14. The area of the radiating fins arranged on the outer side surface of the top plate is increased as much as possible, and the radiating capacity is improved.

Wherein, the first structural member 1, the fourth side plate 2 and the bottom plate 3 are connected by bolts, hinges, cements or other methods.

As shown in fig. 4, the first side plate 11 and the third side plate 13 are arranged in parallel, and a plurality of ventilation holes are formed in the first side plate 11 and the third side plate 13; a plurality of vent holes are arranged on the bottom plate 3.

Different heat dissipation structures are arranged on the top plate, the first side plate, the third side plate and the bottom plate respectively, and heat dissipation capacity is improved. The first side plate and the third side plate which are arranged in parallel are provided with vent holes, and the first circuit board and the second circuit board are respectively arranged on the top plate and the bottom plate, so that a heat dissipation air duct is formed between the first circuit board and the second circuit board to better dissipate heat.

As shown in fig. 7, the fourth side plate 2 is provided with a plurality of interface mounting holes 9 adapted to the circuit interfaces. The control host needs to be connected with external facilities through interfaces, so that a plurality of interface mounting holes 9 matched with the circuit interfaces are formed in the fourth side plate 2 to mount various circuit interfaces.

Wherein, the inner side of the top plate 14 is provided with a first cavity 141 and a second cavity 142; the first cavity 141 is attached to the first circuit board 4; the second cavity 142 is attached to the second circuit board 5. The first cavity and the second cavity can support the first circuit board and the second circuit board and increase the heat dissipation area, so that the heat generated by the circuit board can be better dissipated.

As shown in fig. 5 and 6, the second circuit board 5 is provided with a plurality of heat conducting through holes 51, and the heat conducting through holes are disposed near a chip 52 of the second circuit board 5 to be cooled; and a heat-conducting colloid 7 is filled between the second circuit board 5 and the bottom plate 3. The heat conducting through holes conduct the heat of the chips on the front side of the circuit board to the copper-clad surface on the back side of the circuit board, and the heat is conducted to the bottom plate better through the heat conducting colloid so as to dissipate the heat more quickly.

Preferably, as shown in fig. 8, a bump 31 is disposed on the bottom plate 3, the position of the bump 31 corresponds to the position of the chip 52 of the second circuit board 5, which needs to dissipate heat, and a thermal conductive adhesive 7 is filled between the second circuit board 5 and the bump 31. Only the concentrated place of the chip that generates heat on the second circuit board 5 needs to dissipate heat, in order to reduce the waste of materials and save cost, the bottom plate is provided with the bulge, the position where the bulge is arranged corresponds to the position where the chip of the second circuit board needs to dissipate heat, and only the heat-conducting colloid is filled between the circuit board and the bulge to achieve the effects of saving materials and reducing cost.

The above description is only for the purpose of illustrating the embodiments of the present invention, and not for the purpose of limiting the same. Various substitutions, modifications and improvements may be made by those skilled in the relevant art without departing from the spirit and scope of the invention.

Claims

1. The automobile control system host is characterized by comprising a first structural member (1), a fourth side plate (2) and a bottom plate (3), wherein the first structural member (1) consists of a top plate (14), a first side plate (11), a second side plate (12) and a third side plate (13); the first structural member (1), the fourth side plate (2) and the bottom plate (3) are combined into a box body with a hexahedral structure; a plurality of radiating fins (143) are arranged on the outer side surface of the top plate (14) at intervals.

2. The vehicle control system host according to claim 1, further comprising a first circuit board (4) and a second circuit board (5); the first circuit board (4) is installed in the box body through screws, and the first circuit board (4) and the top plate (14) are arranged at intervals; the second circuit board (5) is installed in the box body through screws, and the second circuit board (5) and the bottom plate (3) are arranged at intervals.

3. The vehicle control system host of claim 1, wherein the material of the heat sink (143) is ADC 12.

4. The vehicle control system host machine according to claim 1, wherein the height of the heat sink (143) is 15mm, the thickness of the heat sink is 1-3mm, and the distance between the two heat sinks is 4-6 mm.

5. The vehicle control system host machine according to claim 1, characterized in that the heat sink fins (143) are uniformly laid on the outer side of the roof panel (14).

6. The automobile control system host machine according to claim 1, characterized in that a plurality of vent holes (8) are arranged on the first side plate (11) and the third side plate (13) which are arranged in parallel; and a plurality of vent holes (8) are formed in the bottom plate (3).

7. The vehicle control system host machine according to claim 1, characterized in that a plurality of interface mounting holes (9) adapted to the circuit interface are provided on the fourth side plate (2).

8. The vehicle control system main unit according to claim 2, wherein a first cavity (141) and a second cavity (142) are provided inside the roof panel (14); the first cavity (141) is attached to the first circuit board (4); the second cavity (142) is attached to the second circuit board (5).

9. The vehicle control system host machine according to claim 8, wherein a plurality of heat conducting through holes (51) are provided on the second circuit board (5); and a heat-conducting colloid is filled between the second circuit board (5) and the bottom plate (3).

10. The vehicle control system host machine according to claim 9, wherein a protrusion (31) is disposed on the bottom plate (3), and a heat conductive adhesive (7) is filled between the second circuit board (5) and the protrusion (31).